Aluminum-based circuit board and LED lamp

Abstract

The utility model relates to the technical field of circuit boards, in particular to an aluminum-based circuit board and an LED lamp. The aluminum-based circuit board comprises a base layer, a circuit layer, a solder mask layer and a silk-screen layer, wherein the base layer comprises at least two layers of aluminum base layers and insulating layers, and the aluminum base layers and the insulating layers are arranged alternately; the surface of the aluminum base layer is oxidized to form an oxide layer; the circuit layer is arranged on the outermost insulating layer; the solder mask layer is arranged on the circuit layer, a window is formed in the solder mask layer, and a bonding pad on the circuit layer is exposed in the window; the silk-screen layer is arranged on the solder mask. The aluminum-based circuit board is provided with at least two layers of aluminum-based layers and insulating layers, and the aluminum-based layers and the insulating layers are arranged alternately. Therefore, when the aluminum base layer and the insulating layers are laminated, the upper insulating layer and the lower insulating layer are matched, and uneven parts of the insulating layers are staggered and offset, so that the insulation level is improved, and an insulation and voltage resistance test is qualified. The oxidation layer has an insulation characteristic, and the oxidation layer is matched with the insulation layer, so that the insulation performance of the aluminum-based circuit board is better.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially is a kind of aluminum base circuit board and LED lamp. BACKGROUND

[0002] Aluminum substrate is a kind of metal-based copper-clad plate with good heat dissipation function, and a single-sided board is generally composed of three layers of structures, namely a circuit layer (copper foil), an insulating layer and a metal base layer. The aluminum base layer and the circuit layer need to be insulated, which is usually achieved by providing an insulating layer on the aluminum base layer.

[0003] However, it is found during production that the surface of the insulating layer is not flat, and when the insulating layer is pressed and adhered to the aluminum substrate, the uneven position of the insulating layer will be pressed and thinned, resulting in poor insulation performance, and there is a risk of breakdown at the thinned position of the insulating layer during insulation voltage test.

[0004] For example, the aluminum-based printed circuit board disclosed in Chinese Patent Application No. CN201220362328. The insulating layer on the aluminum substrate layer is not flat, and the uneven position of the insulating layer will be pressed and thinned, resulting in poor insulation performance, and there is a risk of breakdown at the thinned position of the insulating layer during insulation voltage test.

[0005] For example, the high-voltage-resistant and low-leakage aluminum-based circuit board disclosed in Chinese Patent Application No. CN202322375694.4. The insulating layer on the aluminum substrate layer is not flat, and the uneven position of the insulating layer will be pressed and thinned, resulting in poor insulation performance, and there is a risk of breakdown at the thinned position of the insulating layer during insulation voltage test. INVENTION CONTENTS

[0006] Therefore, the present utility model aims to overcome the shortcomings of the prior art by providing an aluminum-based circuit board that uses a multi-layer aluminum substrate and insulating layer to further improve insulation performance and prevent electrical breakdown.

[0007] To achieve the above-mentioned purpose, the present utility model adopts the following technical solutions:

[0008] The present application provides an aluminum-based circuit board, which comprises a base layer, a circuit layer, a solder resist layer and a silk screen layer. The base layer comprises at least two layers of aluminum base layer and insulating layer, and the aluminum base layer and the insulating layer are arranged alternately. The surface of the aluminum base layer is oxidized to form an oxide layer. The circuit layer is arranged on the outermost insulating layer. The solder resist layer is arranged on the circuit layer, and a window is formed on the solder resist layer. The solder pad on the circuit layer is exposed through the window. The silk screen layer is arranged on the solder resist layer.

[0009] Preferably, the insulation layers of adjacent layers are arranged in different directions; wherein the insulation layer of the lower layer is arranged towards a first direction, and the second insulation layer of the upper layer is arranged towards a second direction, the first direction and the second direction intersect.

[0010] Preferably, the aluminum base layer and the insulation layer each have two layers; the first insulation layer of the first layer is arranged transversely on the first aluminum base layer; and the second insulation layer of the second layer is arranged longitudinally on the second aluminum base layer.

[0011] Preferably, the circuit layer is a pattern-etched electrolytic copper foil layer or an electrolytic aluminum foil layer.

[0012] Preferably, the solder pad is plated with a protective layer, the protective layer being one of gold, nickel, palladium, and silver.

[0013] Preferably, the solder mask layer is one of epoxy resin, polyurethane, and acrylic resin.

[0014] Preferably, a heat-conducting layer made of metal or non-metal material is further arranged between the solder mask layer and the silk screen layer.

[0015] Preferably, the heat-conducting layer is one of aluminum oxide ceramic, lithium titanate, boron nitride silicon, beryllium oxide ceramic, and aluminum nitride.

[0016] Preferably, the thickness of the aluminum base layer is between 550-650 um, the thickness of the insulation layer is between 25-35 um, the thickness of the circuit layer is between 25-35 um, and the thickness of the solder mask layer is between 20-30 um.

[0017] The application provides an LED lamp comprising the aluminum base circuit board, the LED chip and the LED lamp bead being welded on the solder pad, the lamp bead being in a lampshade, and a lamp cover being arranged on the lampshade.

[0018] Compared with the prior art, the aluminum base circuit board has obvious advantages and beneficial effects, specifically, as known from the above technical solution, the aluminum base circuit board has at least two layers of aluminum base layer and insulation layer, and the aluminum base layer and the insulation layer are arranged alternately. Therefore, when the aluminum base layer and the insulation layer are pressed together, the upper and lower insulation layers cooperate, the uneven parts of the insulation layers are offset and cancelled, thereby improving the insulation level and passing the insulation voltage resistance test.

[0019] The oxide layer has insulation properties, and the oxide layer cooperates with the insulation layer, so that the insulation performance of the aluminum base circuit board is better. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a schematic diagram of the layered structure of embodiment one of the embodiment of the utility model.

[0021] Figure 2 is a schematic diagram of the layered structure of embodiment one of the embodiment of the utility model.

[0022] Figure 3 is an embodiment of the embodiment of the insulation layer setting direction schematic view of the utility model.

[0023] Figure 4 is an embodiment of the embodiment of the embodiment two layer structure schematic view of the utility model.

[0024] The drawing mark explanation:

[0025] 10, base layer; 11, aluminum base layer; 12, insulation layer; 13, oxidation layer; 20, circuit layer; 21, solder pad; 22, protective layer; 30, solder resist layer; 40, heat conduction layer; 50, silk screen layer. Specific embodiment

[0026] In order to further illustrate the technical means and effects adopted by the utility model to achieve the predetermined utility model purposes, the specific embodiment, structure, features and effects according to the utility model are described in detail as follows in combination with the drawings and preferred embodiments.

[0027] Embodiment one

[0028] Please refer to Figures 1 to 3 It shows the specific structure of the preferred embodiment of the utility model, which is an aluminum base circuit board.

[0029] The two aluminum base layers 11 and insulation layers 12 are arranged alternately, and the uneven parts of the upper and lower insulation layers 12 will be staggered with each other when the aluminum base layer 11 and the insulation layer 12 are pressed together, and even completely offset, thereby improving the insulation level and passing the insulation withstand voltage test.

[0030] The application provides an aluminum base circuit board, which comprises a base layer 10, a circuit layer 20, a solder resist layer 30 and a silk screen layer 50; wherein the base layer 10 comprises at least two aluminum base layers 11 and insulation layers 12, and the aluminum base layers 11 and the insulation layers 12 are arranged alternately; the surface of the aluminum base layer 11 is oxidized to form an oxidation layer 13; the circuit layer 20 is arranged on the outermost insulation layer 12; the solder resist layer 30 is arranged on the circuit layer 20, and a window is formed in the solder resist layer 30, and the solder pad 21 on the circuit layer 20 is exposed in the window; and the silk screen layer 50 is arranged on the solder resist layer 30. The base layer 10 has a certain bearing capacity and bending ability.

[0031] Circuit layer 20: It is equivalent to the copper clad board of ordinary PCB, and the thickness of the circuit copper foil is 1 oz to 10 oz. Insulating layer 12: The insulating layer 12 is a layer of low thermal resistance and heat conducting insulating material. Base layer 10: It is a metal substrate, which is generally aluminum or optionally copper. The aluminum-based copper clad board and the traditional epoxy glass cloth laminated board, etc. Solder resist layer 30 refers to a thin polymer coating on the circuit board used to protect the copper circuit from oxidation and corrosion. Its main function is to prevent solder from flowing into areas that do not need to be soldered during the soldering process, to protect the circuit board from environmental factors such as dust and other contaminants, thereby extending the service life of the circuit board. Silk screen layer 50 belongs to a layer in the PCB, which is usually called a text layer or character mark layer. It is mainly used to print the required mark pattern and text code on the upper and lower surfaces of the circuit board, such as component marking, nominal value, component outline shape, manufacturer's mark, production date, etc. In the present embodiment, the base layer 10 and the circuit layer 20 are adhered together by lamination. The insulating layer 12 can be printed, coated or pasted on the aluminum base layer 11. The solder resist layer 30 is usually fixed by hot melting or cold melting glue, and can be fixed by hot pressing or cold pressing. The solder resist layer 30 can also be set by printing process. The silk screen layer 50 is set on the solder resist layer 30 by printing process. More specifically, the silk screen layer 50 is usually made by silk screen printing technology. Silk screen printing is a traditional printing method, which uses epoxy ink to apply ink to the laminated board and dry it to obtain the print on the board. The oxidation layer 13 is aluminum oxide. Aluminum oxide is an insulating material with very low electrical conductivity, which has insulating properties. The oxidation layer 13 cooperates with the insulating layer 12 to make the insulating performance of the aluminum-based circuit board better.

[0032] Please refer to Figure 3 , the insulating layers 12 of adjacent layers are arranged in different directions; the insulating layer 12 of the lower layer is arranged in a first direction, and the second insulating layer 12 of the upper layer is arranged in a second direction, and the first direction and the second direction intersect. That is, the insulating layers 12 of the upper and lower layers are arranged in different directions. This design can stagger the uneven positions of the insulating layers 12 of the upper and lower layers, thereby improving the insulation performance.

[0033] Please refer to Figure 3 , more specifically, the aluminum base layer 11 and the insulating layer 12 in the present embodiment have two layers respectively; the first insulating layer 12 is arranged transversely on the first aluminum base layer 11; the second insulating layer 12 is arranged longitudinally on the second aluminum base layer 11. That is, the first insulating layer 12 is arranged in the y-axis direction on the first aluminum base layer 11, and the second insulating layer 12 is arranged in the y-axis direction on the second aluminum base layer 11. This design makes the uneven positions of the insulating layers 12 of the upper and lower layers staggered, and the circuit board has better insulation effect after pressing, and there is no voltage breakdown resistance.

[0034] Preferably, the circuit layer 20 is a pattern-etched electrolytic copper foil layer or an electrolytic aluminum foil layer. In this embodiment, the circuit layer 20 is an electrolytic copper foil layer, which has a certain thickness, good bending ability, and good electrical conductivity.

[0035] Preferably, the solder pad 21 is plated with a protective layer 22, which is one of gold, nickel, palladium, and silver. The protective layer 22 plated on the solder pad 21 can enhance corrosion resistance, increase resistivity and solderability, and improve signal transmission performance and reliability. In this embodiment, the protective layer 22 is nickel, which can effectively protect the surface of the circuit board from oxidation and corrosion; in high-frequency circuits, nickel plating can increase the resistivity of the circuit board, thereby improving signal transmission quality; nickel plating can make the surface of the circuit board easier to handle, increase the solderability, and ensure the smooth progress of the soldering process; the nickel plating layer has good electrical conductivity, which can reduce signal transmission loss and improve the overall performance of the circuit board; the nickel plating layer can increase the mechanical strength and reliability of the circuit board, prolong its service life, and make the component soldering more secure. The solder pad 21 on the aluminum-based circuit board refers to the metal contact point on the printed circuit board (PCB) for soldering components, which is usually made of copper foil. The solder pad 21 is formed by the copper cladding process and is located on the surface and inner layer of the PCB, providing a connection point between the component pins and the circuit board wires.

[0036] Preferably, the solder mask layer 30 is one of epoxy, polyurethane, and acrylic. The solder mask layer 30 has insulating properties. The solder mask layer 30 can also be one of a liquid epoxy solder mask layer 30, a liquid photoimageable solder mask layer 30 (LPSM), and a dry film solder mask layer 30 (DFSM). The setting method of the solder mask layer 30 is as follows: 1. Pre-treatment: First, clean and treat the circuit board to ensure that the surface is free of oxidation or other impurities, which is usually done by chemical solution, aluminum oxide solution, or suspended soapstone scrubbing. 2. Screen printing: Use a woven mesh to support the ink barrier pattern and print the solder mask ink onto the circuit board. This step can be done by screen printing, spraying, or curtain coating. 3. Pre-baking: After printing the ink, pre-bake to remove the solvent in the ink and make it initially solidify. 4. Exposure: For the liquid photoimageable solder mask layer 30 (LPSM), use a photolithography process for exposure. During exposure, the photomask defines the conductor area that needs to be exposed, while the other areas are covered by the solder mask 30. 5. Development: After exposure, remove the unexposed part to leave the desired solder mask 30 pattern. 6. Curing: Finally, heat cure the solder mask 30 to make it completely harden and fix on the circuit board. 7. Post-treatment: After curing, perform final inspection and treatment to ensure the quality and integrity of the solder mask 30.

[0037] Preferably, the aluminum base layer 11 is 550-650um thick; the insulating layer 12 is 25-35um thick; the circuit layer 20 is 25-35um thick; and the solder resist layer 30 is 20-30um thick.

[0038] Embodiment Two

[0039] As shown in Figure 4 Preferably, the solder resist layer 30 and the silk screen layer 50 are further provided with a heat-conducting layer 40 made of metal or non-metal material. The heat-conducting layer 40 in this embodiment is one of alumina ceramic, lithium titanate, boron nitride silicon, beryllium oxide ceramic, and aluminum nitride. The heat-conducting layer 40 has heat-conducting performance, can improve the heat dissipation capacity of the circuit board, helps to exert the performance of the circuit board, and improves the safety of the circuit board. The heat-conducting layer 40 in this embodiment can be provided by pressing, coating, or printing. The heat-conducting layer 40 can be in the form of a filament or a sheet. The fiber made of one of alumina ceramic, lithium titanate, boron nitride silicon, beryllium oxide ceramic, and aluminum nitride is provided on the solder resist layer 30 by one of printing, hot pressing, printing, and sticking. The heat-conducting layer 40 improves the heat dissipation capacity and safety of the circuit board, and helps to exploit the potential of the circuit board.

[0040] Embodiment Three

[0041] The application provides an LED lamp comprising the aluminum base circuit board, the LED chip and the LED lamp bead are welded on the solder pad 21, the lamp bead is in the lampshade, and the lamp cover is arranged on the lampshade. After the aluminum base circuit board is arranged on the LED lamp, the heat dissipation performance and safety of the LED are higher, and the insulation capacity is stronger.

[0042] In summary, the aluminum base circuit board has at least two aluminum base layers 11 and insulating layers 12, and the aluminum base layers 11 and the insulating layers 12 are arranged alternately. The upper and lower insulating layers 12 cooperate, the uneven parts of the insulating layers 12 are offset and cancelled, thereby improving the insulation level and passing the insulation withstand voltage test. Meanwhile, the oxidation layer 13 has insulation characteristics, and the oxidation layer 13 cooperates with the insulating layer 12, so that the insulation performance of the aluminum base circuit board is better.

[0043] The above merely describes preferred embodiments of the present application, and is not intended to limit the present application in any form. Although the present application has been disclosed with preferred embodiments, it is not intended to limit the present application. Any person skilled in the art can make minor changes or modifications to the disclosed technical content, or make equivalent embodiments with equivalent changes, without departing from the technical solution of the present application. Any modification, equivalent change or modification of the above embodiments, which does not depart from the technical solution of the present application, is still within the scope of the technical solution of the present application.

Claims

1. An aluminum-based circuit board, characterized by: The aluminum-based circuit board comprises a base layer, a circuit layer, a solder resist layer and a silk screen layer; the base layer comprises at least two aluminum base layers and insulating layers, and the aluminum base layers and the insulating layers are arranged alternately; the surface of the aluminum base layer is oxidized to form an oxide layer; The circuit layer is arranged on the outermost insulating layer; The solder resist layer is arranged on the circuit layer, and a window is formed in the solder resist layer, and the solder pad on the circuit layer is exposed in the window; The silk screen layer is arranged on the solder resist layer.

2. An aluminum-based circuit board as defined in claim 1, wherein: The insulating layers of adjacent layers are arranged in different directions; the insulating layer of the lower layer is arranged in a first direction, and the second insulating layer of the upper layer is arranged in a second direction, and the first direction and the second direction intersect.

3. An aluminum-based circuit board according to claim 1 or 2, characterized in that: The aluminum base layer and the insulating layer each have two layers; the first insulating layer is arranged transversely on the first aluminum base layer; and the second insulating layer is arranged longitudinally on the second aluminum base layer.

4. An aluminum-based circuit board as defined in claim 1, wherein: The circuit layer is an electrolytic copper foil layer or an electrolytic aluminum foil layer obtained by pattern etching.

5. An aluminum-based circuit board as claimed in claim 1 or 4, characterized in that: The solder pad is plated with a protective layer, and the protective layer is one of gold, nickel, palladium and silver.

6. An aluminum-based circuit board as defined in claim 1, wherein: The solder resist layer is one of epoxy resin, polyurethane and acrylic resin.

7. An aluminum-based circuit board as defined in claim 1, wherein: A heat-conducting layer made of metal or non-metal material is arranged between the solder resist layer and the silk screen layer.

8. An aluminum-based circuit board as defined in claim 7, wherein: The heat-conducting layer is one of aluminum oxide ceramic, lithium titanate, boron nitride silicon, beryllium oxide ceramic and aluminum nitride.

9. An aluminum-based circuit board according to any one of claims 1-8, characterized in that: The thickness of the aluminum base layer is between 550 and 650 um, the thickness of the insulating layer is between 25 and 35 um, the thickness of the circuit layer is between 25 and 35 um, and the thickness of the solder resist layer is between 20 and 30 um.

10. An LED lamp characterized by: The aluminum-based circuit board comprises a base layer, a circuit layer, a solder resist layer and a silk screen layer; the base layer comprises at least two aluminum base layers and insulating layers, and the aluminum base layers and the insulating layers are arranged alternately; the surface of the aluminum base layer is oxidized to form an oxide layer;

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