Support for laser trepanning

By designing clamping and pushing components, the problem of laser-cutting brackets being unable to flexibly clamp semiconductor materials has been solved, achieving stable clamping and improved safety.

CN223762419UActive Publication Date: 2026-01-06SUZHOU ASEN SEMICON CO LTD
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Patent Information

Application Number
CN202520260619.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-19
Publication Date
2026-01-06
Estimated Expiration
2035-02-19

AI Technical Summary

Technical Problem

Existing laser drilling brackets cannot flexibly clamp semiconductor materials, which can easily cause damage, and there is a risk of accidental injury when materials are placed manually.

Method used

It employs clamping and pushing components, including hydraulic telescopic rods, fixed clamps, springs, and sliding plates, to achieve stable clamping and fine-tuning of semiconductor materials, reducing the risk of damage.

Benefits of technology

It effectively prevents semiconductor materials from moving during the opening process, reduces the risk of damage, improves safety, and reduces the risk of accidental damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of laser processing, and discloses a support for laser trepanning, which comprises a clamping assembly and a pushing assembly, the clamping assembly is arranged on one side of the pushing assembly, the clamping assembly comprises an outer shell, a laser head is arranged in the outer shell, the inner side of the outer shell is connected with a first fixing clamping block, and the first fixing clamping block is connected with a second fixing clamping block. A first clamping groove is formed in the first fixing clamping block, a hydraulic telescopic rod is connected to the inner side of the outer shell, a connecting plate is connected to one end of the hydraulic telescopic rod, a first spring is connected to the connecting plate, and a second fixing clamping block is connected to one end of the first spring. According to the utility model, the semiconductor material can be effectively prevented from moving in the perforating process, the risk of damage to the semiconductor material can be effectively reduced, and the semiconductor material can be placed below the laser head through a tool, so that the risk of accidental injury caused by manual placement of the semiconductor material is reduced, and the safety during laser perforating is improved.
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Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, specifically to a support for laser drilling. Background Technology

[0002] In the fields of electronic manufacturing and precision machining, laser drilling technology is widely used due to its high precision and efficiency. With the advancement of technology, especially the breakthrough in the field of laser technology, the performance of laser drilling equipment has been continuously improved, making PCBs with laser holes or micro-hole designs increasingly popular. These tiny holes can achieve higher density wiring, thereby enabling more functions on PCBs of the same size.

[0003] Existing laser aperture holders still have some shortcomings in use: they often cannot flexibly clamp semiconductor materials, which are usually brittle, such as silicon wafers, and can easily be damaged during clamping. In addition, existing laser aperture holders often require manual placement of the semiconductor material under the laser head for aperture making, which carries the risk of accidental injury. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a support for laser drilling.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a bracket for laser drilling, comprising a clamping assembly and a pushing assembly. The clamping assembly is disposed on one side of the pushing assembly, and the clamping assembly includes a housing. A laser head is disposed inside the housing, and a first fixing block is connected to the inner side of the housing. The first fixing block has a first slot. A hydraulic telescopic rod is connected to the inner side of the housing, and a connecting plate is connected to one end of the hydraulic telescopic rod. A first spring is connected to the connecting plate. A second fixing block is connected to one end of the first spring, and a second slot is provided on the second fixing block. A telescopic column is connected to one side of the second fixing block.

[0006] As a further description of the above technical solution:

[0007] The laser head is positioned above the outer casing, and one end of the first fixing block is fixed to one side of the outer casing via a connecting rod, and the first slot is located on the first fixing block.

[0008] As a further description of the above technical solution:

[0009] One end of the hydraulic telescopic rod is fixed to one side of the outer casing, and the other end of the hydraulic telescopic rod is fixed to the connecting plate, and one side of the connecting plate is fixed to the first spring.

[0010] As a further description of the above technical solution:

[0011] The end of the first spring away from the connecting plate is fixed to one side of the second fixed clamping block, and the second slot is provided on the second fixed clamping block.

[0012] As a further description of the above technical solution:

[0013] One end of the telescopic column is fixed to the connecting plate, and the end of the telescopic column away from the connecting plate is fixed to the second fixed clamping block, and the first spring is sleeved on the telescopic column.

[0014] As a further description of the above technical solution:

[0015] The pushing component includes a sliding plate, with a sliding groove connected to one side of the sliding plate and a fixed shaft connected to the other side of the sliding plate. The fixed shaft is connected to a first clamping block, with a rubber block connected to one end of the first clamping block and an anti-slip pad connected to the other end of the first clamping block. A second spring is connected to the lower side of the first clamping block, and a second clamping block is connected to one end of the second spring.

[0016] As a further description of the above technical solution:

[0017] One end of the sliding plate is slidably connected to the sliding groove, and the sliding groove is located on the inner side of the outer shell, and the fixed shaft is fixedly connected to one end of the sliding plate.

[0018] As a further description of the above technical solution:

[0019] The lower side of the first clamping block is rotatably connected to the fixed shaft, and the rubber block is fixed to one end of the first clamping block, while the anti-slip pad is fixed to the other end of the first clamping block.

[0020] As a further description of the above technical solution:

[0021] The upper end of the second spring is fixed to the lower side of the first clamping block, and the end of the second spring away from the first clamping block is fixed to the second clamping block, and the second clamping block is rotatably connected to the fixed shaft.

[0022] This utility model has the following beneficial effects:

[0023] 1. By activating the hydraulic telescopic rod, the hydraulic telescopic rod drives the connecting plate to move. The movement of the connecting plate drives the second fixed clamping block to move to one side of the first fixed clamping block through the first spring and the telescopic column, thereby clamping the semiconductor material in the first and second slots. This effectively prevents the semiconductor material from moving during the drilling process and effectively reduces the risk of damage to the semiconductor material.

[0024] 2. By pushing the first clamping block, the sliding plate slides inward in the groove, moving the material between the first and second fixed clamping blocks. By bending the first clamping block up or down, the clamped material can be deflected up or down for fine-tuning the angle. This allows the semiconductor material to be placed under the laser head using a tool, thereby reducing the risk of accidental injury when manually placing the semiconductor material and improving the safety of laser drilling. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of a laser aperture support proposed in this utility model;

[0026] Figure 2 This is a partial structural diagram of a laser aperture support proposed in this utility model. Figure 1 ;

[0027] Figure 3 This is a partial structural diagram of a laser aperture support proposed in this utility model. Figure 2 ;

[0028] Figure 4 This is a partial structural diagram of a laser aperture support proposed in this utility model. Figure 3 .

[0029] Legend:

[0030] 1. Clamping assembly; 2. Pushing assembly; 101. Outer shell; 102. Laser head; 103. First fixing clamping block; 104. First slot; 105. Hydraulic telescopic rod; 106. Connecting plate; 107. First spring; 108. Telescopic column; 109. Second fixing clamping block; 110. Second slot; 201. Sliding plate; 202. Slide groove; 203. Fixed shaft; 204. First clamping block; 205. Rubber block; 206. Anti-slip pad; 207. Second spring; 208. Second clamping block. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1-4 This utility model provides a bracket for laser drilling, including: a clamping component 1 and a pushing component 2.

[0033] Specifically, the clamping assembly 1 is located on one side of the pushing assembly 2, and the clamping assembly 1 includes a housing 101, a laser head 102 is provided inside the housing 101, a first fixing block 103 is connected to the inner side of the housing 101, and a first slot 104 is provided on the first fixing block 103. A hydraulic telescopic rod 105 is connected to the inner side of the housing 101, and a connecting plate 106 is connected to one end of the hydraulic telescopic rod 105. A first spring 107 is connected to the connecting plate 106, and a second fixing block 109 is connected to one end of the first spring 107. The second fixing block 109 is provided with... The push assembly 2 includes a sliding plate 201, with a sliding groove 202 connected to one side of the sliding plate 201 and a fixed shaft 203 connected to one side of the sliding plate 201. The fixed shaft 203 is connected to a first clamping block 204, with a rubber block 205 connected to one end of the first clamping block 204 and an anti-slip pad 206 connected to the other end of the first clamping block 204. A second spring 207 is connected to the lower side of the first clamping block 204, and a second clamping block 208 is connected to one end of the second spring 207.

[0034] In this embodiment, the clamping component 1 and the pushing component 2 constitute the laser aperture support involved in this application, realizing stable aperture opening of semiconductor material.

[0035] In this embodiment, the laser head 102, also known as the laser head, is a key component in the laser device, used to emit and control the laser beam.

[0036] In this embodiment, the first fixing block 103 and the second fixing block 109 have the same shape and structure, and the first fixing block 103 and the second fixing block 109 are symmetrically arranged to clamp the semiconductor material.

[0037] Specifically, the laser head 102 is positioned above the outer casing 101, and one end of the first fixing clamp 103 is fixed to one side of the outer casing 101 via a connecting rod. A first slot 104 is provided on the first fixing clamp 103. One end of the hydraulic telescopic rod 105 is fixed to one side of the outer casing 101, and the other end of the hydraulic telescopic rod 105 is fixed to the connecting plate 106. One side of the connecting plate 106 is fixed to the first spring 107. The end of the first spring 107 away from the connecting plate 106 is fixed to one side of the second fixing clamp 109, and a second slot 110 is provided on the second fixing clamp 109. One end of the telescopic column 108 is fixed to the connecting plate 106, and the end of the telescopic column 108 away from the connecting plate 106 is fixed to the second fixing clamp 109. The first spring 107 is sleeved on the telescopic column 108.

[0038] In a preferred embodiment, when the second fixing block 109 clamps the semiconductor material, the first spring 107 prevents excessive pressure during clamping from damaging the material.

[0039] In a preferred embodiment, the first spring 107 is sleeved on the telescopic column 108, so that when the first spring 107 contracts, the telescopic column 108 can also contract, preventing the first spring 107 from bending and losing its buffering function.

[0040] Specifically, one end of the sliding plate 201 is slidably connected to the slide groove 202, and the slide groove 202 is located on the inner side of the outer shell 101. The fixed shaft 203 is fixedly connected to one end of the sliding plate 201. The lower side of the first clamping block 204 is rotatably connected to the fixed shaft 203. The rubber block 205 is fixedly connected to one end of the first clamping block 204. The anti-slip pad 206 is fixedly connected to the other end of the first clamping block 204. The upper end of the second spring 207 is fixedly connected to the lower side of the first clamping block 204. The end of the second spring 207 away from the first clamping block 204 is fixedly connected to the second clamping block 208. The second clamping block 208 is rotatably connected to the fixed shaft 203.

[0041] In a preferred embodiment, the rubber block 205 is fixed to one end of the first clamping block 204 used to clamp the semiconductor material, which can prevent the material from being damaged when the first clamping block 204 clamps.

[0042] It should be noted that the anti-slip pad 206 is fixed to the end of the first clamping block 204 that is used for hand gripping, thereby increasing the friction between the first clamping block 204 and the hand.

[0043] In use, when drilling holes in semiconductor materials, manually pull the first clamping block to slide the sliding plate to the outermost side of the groove. Manually grip the anti-slip pad and the second clamping block to retract the second spring. Then, place the semiconductor material under the rubber block and stop gripping the anti-slip pad and the second clamping block. The rebound force of the second spring will clamp the material in place. Then, push the first clamping block to slide the sliding plate inward in the groove, moving the material between the first and second fixed clamping blocks. By moving the first clamping block up or down, the clamped material can be deflected up or down for fine-tuning the angle. Then, activate the hydraulic telescopic rod, which drives the connecting plate to move. The movement of the connecting plate, through the first spring and the telescopic column, moves the second fixed clamping block to one side of the first fixed clamping block, thereby clamping the semiconductor material in the first and second slots. Finally, activate the laser head to perform the drilling operation on the semiconductor material.

[0044] The laser drilling bracket of this invention can effectively prevent the semiconductor material from moving during the drilling process and can effectively reduce the risk of damage to the semiconductor material. Furthermore, the semiconductor material can be placed under the laser head using a tool, thereby reducing the risk of accidental injury when manually placing the semiconductor material and improving the safety of laser drilling.

[0045] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0046] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A support for laser drilling, characterized by: Including clamping assembly (1) and push assembly (2), the clamping assembly (1) is arranged on one side of the push assembly (2), and the clamping assembly (1) comprises an outer shell (101), a laser head (102) is arranged in the outer shell (101), a first fixed clamping block (103) is connected to the inner side of the outer shell (101), a first clamping groove (104) is arranged on the first fixed clamping block (103), a hydraulic telescopic rod (105) is connected to the inner side of the outer shell (101), one end of the hydraulic telescopic rod (105) is connected with a connecting plate (106), the connecting plate (106) is connected with a first spring (107), one end of the first spring (107) is connected with a second fixed clamping block (109), a second clamping groove (110) is arranged on the second fixed clamping block (109), and one side of the second fixed clamping block (109) is connected with a telescopic column (108).

2. The support for laser drilling according to claim 1, characterized in that: The laser head (102) is arranged above the outer shell (101), one end of the first fixed clamping block (103) is fixedly connected to one side of the outer shell (101) through a connecting rod, and the first clamping groove (104) is arranged on the first fixed clamping block (103).

3. The support for laser drilling according to claim 2, characterized in that: One end of the hydraulic telescopic rod (105) is fixedly connected to one side of the outer shell (101), the other end of the hydraulic telescopic rod (105) is fixedly connected to the connecting plate (106), and one side of the connecting plate (106) is fixedly connected to the first spring (107).

4. The support for laser drilling according to claim 3, characterized in that: One end of the first spring (107) away from the connecting plate (106) is fixedly connected to one side of the second fixed clamping block (109), and the second clamping groove (110) is arranged on the second fixed clamping block (109).

5. The support for laser drilling according to claim 4, characterized in that: One end of the telescopic column (108) is fixedly connected to the connecting plate (106), the other end of the telescopic column (108) away from the connecting plate (106) is fixedly connected to the second fixed clamping block (109), and the first spring (107) is sleeved on the telescopic column (108).

6. The support for laser drilling according to claim 5, characterized in that: The push assembly (2) comprises a sliding plate (201), one side of the sliding plate (201) is connected with a sliding groove (202), one side of the sliding plate (201) is connected with a fixed shaft (203), the fixed shaft (203) is connected with a first clamping block (204), one end of the first clamping block (204) is connected with a rubber block (205), the other end of the first clamping block (204) is connected with an anti-skid pad (206), the lower side of the first clamping block (204) is connected with a second spring (207), and one end of the second spring (207) is connected with a second clamping block (208).

7. The support for laser drilling according to claim 6, characterized in that: One end of the sliding plate (201) is slidably connected in the sliding groove (202), the sliding groove (202) is arranged on the inner side of the outer shell (101), and the fixed shaft (203) is fixedly connected to one end of the sliding plate (201).

8. The support for laser drilling according to claim 7, characterized in that: The lower side of the first clamping block (204) is rotatably connected to the fixed shaft (203), the rubber block (205) is fixedly connected to one end of the first clamping block (204), and the anti-skid pad (206) is fixedly connected to the other end of the first clamping block (204).

9. The support for laser drilling according to claim 8, characterized in that: The upper end of the second spring (207) is fixed to the lower side of the first clamping block (204), and the end of the second spring (207) away from the first clamping block (204) is fixed to the second clamping block (208), and the second clamping block (208) is rotationally connected to the fixed shaft (203).