Semiconductor part processing tool

Abstract

The utility model discloses a semiconductor part machining tool which comprises a machining base, and one side of the machining base is provided with a first machining groove used for containing a part blank and a second machining groove used for containing a part finished product. A plurality of first clamping devices used for clamping the part blank are detachably arranged in the first machining groove, and a plurality of second clamping devices used for clamping the part semi-finished product are detachably arranged in the second machining groove. According to the machining tool, the risk that semiconductor parts are scratched during circulation can be reduced, the semiconductor parts are not prone to being scratched in the machining process, machining steps are few, and machining efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of parts processing technology, specifically to a semiconductor parts processing fixture. Background Technology

[0002] Semiconductor components have high appearance requirements; high-surface-area semiconductor components must be free of any scratches. However, during machining, any metal contact between the semiconductor component surface and the tooling can cause scratches and damage, leading to poor appearance. Current semiconductor component manufacturing processes require multiple handling steps; after the semiconductor component blank is machined, it is transferred through a handling box before further processing, which increases the risk of scratches during handling. Therefore, a new technical solution is urgently needed to address at least one of the above-mentioned technical problems. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor component processing fixture that can reduce the risk of scratches during semiconductor component handling, prevent scratches during processing, reduce processing steps, and improve processing efficiency.

[0004] To achieve the above-mentioned technical objectives and requirements, the technical solution adopted by this utility model is: a semiconductor component processing fixture, characterized in that it includes a processing base, a first processing groove for placing a component blank and a second processing groove for placing a component semi-finished product are provided on one side of the processing base, a plurality of first clamping devices for clamping the component blank are detachably provided in the first processing groove, and a plurality of second clamping devices for clamping the component semi-finished product are detachably provided in the second processing groove.

[0005] As a preferred technical solution, a first boss and a second boss for placing the part blank are respectively provided at the two corners of the first processing groove, and the first boss and the second boss are arranged opposite to each other.

[0006] As a preferred technical solution, a first clamping device arranged longitudinally is provided between the first boss and the second boss.

[0007] As a preferred technical solution, two first clamping devices arranged in a transverse direction are provided between the first boss and one wall of the first processing groove, and two first clamping devices arranged in a transverse direction are provided between the second boss and one wall of the first processing groove.

[0008] As a preferred technical solution, a third boss and a fourth boss for placing the semi-finished part are respectively provided at the two corners of the second processing groove, and the third boss and the fourth boss are arranged opposite to each other.

[0009] As a preferred technical solution, a second clamping device arranged longitudinally is provided between the third boss and the fourth boss.

[0010] As a preferred technical solution, two second clamping devices arranged in a transverse direction are provided between the third boss and one wall of the second processing groove, and two second clamping devices arranged in a transverse direction are provided between the fourth boss and one wall of the second processing groove.

[0011] As a preferred technical solution, a fixing countersunk hole is provided through each of the four corners of the processing base, a first positioning countersunk hole is provided through the bottom surface of the first processing groove, and a second positioning countersunk hole is provided through the bottom surface of the second processing groove.

[0012] As a preferred technical solution, the second clamping device is provided with a buffer block on at least one side, and the buffer block and the processing base are made of polytetrafluoroethylene.

[0013] As a preferred technical solution, the first clamping device and the second clamping device are OK clamps.

[0014] The beneficial effects of this utility model are:

[0015] 1) First, place the part blank in the first processing groove, clamp the part blank with the first clamping device, process the part blank into a semi-finished product, and then directly flip it into the second processing groove, clamp the part semi-finished product with the second clamping device, and then continue to process the part semi-finished product into a finished product. This can reduce the risk of semiconductor parts being scratched during the process, semiconductor parts are not easily scratched during the process, there are fewer processing steps, and the processing efficiency is improved.

[0016] 2) One part blank is placed on the first boss and one on the second boss respectively, which can process two parts at the same time, thus improving processing efficiency;

[0017] 3) Two first clamping devices arranged in the transverse direction can clamp the part blank in the transverse direction, and one first clamping device arranged in the longitudinal direction can clamp the part blank in the longitudinal direction, with good clamping effect;

[0018] 4) The first and second positioning countersunk holes can perform rapid positioning and limiting, while the fixed countersunk hole can fix the machining base, improving machining stability.

[0019] 5) Polytetrafluoroethylene (PTFE) has good cushioning properties and will not scratch finished parts;

[0020] 6) The OK clamp is easy to operate and has a good clamping effect. Attached Figure Description

[0021] Figure 1 This is a structural diagram of a processing fixture provided in one embodiment of the present invention;

[0022] Figure 2 This is a partial structural diagram of the processing tooling provided in one embodiment of the present utility model;

[0023] Figure 3 This is a structural diagram of the second clamping device provided in one embodiment of the present invention.

[0024] exist Figures 1-3 In the middle, 1. Machining base; 101. First machining groove; 1011. First positioning countersunk hole; 102. Second machining groove; 1021. Second positioning countersunk hole; 103. First boss; 104. Second boss; 105. Third boss; 106. Fourth boss; 107. Fixing countersunk hole; 2. First clamping device; 3. Second clamping device; 301. Clamping nut; 302. First clamping block; 3021. First protrusion; 303. Second clamping block; 3031. Second protrusion; 304. Spring; 305. Bolt; 4. Buffer block; 5. Part blank; 6. Part semi-finished product. Detailed Implementation

[0025] The present invention will now be further described with reference to the accompanying drawings.

[0026] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "head," "tail," "top," "bottom," "left," "right," "front," "rear," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0027] Please see Figures 1-3This utility model provides a semiconductor component processing fixture, including a processing base 1. The processing base 1 has a first processing groove 101 for placing a component blank 5 and a second processing groove 102 for placing a component semi-finished product 6 on one side. Multiple first clamping devices 2 for clamping the component blank 5 are detachably disposed in the first processing groove 101, and multiple second clamping devices 3 for clamping the component semi-finished product 6 are detachably disposed in the second processing groove 102. The component blank 5 is first placed in the first processing groove 101, where the first clamping devices 2 clamp it. After processing the component blank 5 into a semi-finished product, it is directly flipped and placed into the second processing groove 102, where the second clamping devices 3 clamp it. Then, the component semi-finished product 6 is further processed to become the finished component. This design reduces the risk of scratches during semiconductor component handling, minimizes scratches during processing, reduces processing steps, and improves processing efficiency.

[0028] like Figures 1-3 As shown, a first boss 103 and a second boss 104 for placing the part blank 5 are respectively provided at the two corners of the first processing groove 101. The first boss 103 and the second boss 104 are arranged opposite to each other. One part blank 5 is placed on the first boss 103 and the second boss 104 respectively, which can process two parts at the same time and improve processing efficiency.

[0029] like Figures 1-3 As shown, a first clamping device 2 arranged longitudinally is provided between the first boss 103 and the second boss 104. The part blank 5 abuts against the groove wall of the first groove. If the first clamping device 2 is an OK clamp, the first clamping device 2 can clamp two part blanks 5 at the same time.

[0030] like Figures 1-3 As shown, two first clamping devices 2 arranged in a transverse direction are provided between the first boss 103 and one groove wall of the first processing groove 101, and two first clamping devices 2 arranged in a transverse direction are provided between the second boss 104 and one groove wall of the first processing groove 101. The two first clamping devices 2 arranged in a transverse direction can clamp the part blank 5 in the transverse direction, and the one first clamping device 2 arranged in a longitudinal direction can clamp the part blank 5 in the longitudinal direction, resulting in a good clamping effect.

[0031] like Figures 1-3 As shown, the second processing groove 102 has a third boss 105 and a fourth boss 106 at its two corners for placing the semi-finished part 6. The third boss 105 and the fourth boss 106 are arranged opposite to each other. After the part blank 5 is processed into the semi-finished part 6, it is placed on the third boss 105 and the fourth boss 106 respectively, and then processed into the finished part.

[0032] like Figures 1-3 As shown, a second clamping device 3 arranged longitudinally is provided between the third boss 105 and the fourth boss 106. If the second clamping device 3 is an OK clamp, the second clamping device 3 can clamp two finished parts at the same time.

[0033] like Figures 1-3 As shown, two second clamping devices 3 arranged in a transverse direction are provided between the third boss 105 and one groove wall of the second processing groove 102, and two second clamping devices 3 arranged in a transverse direction are provided between the fourth boss 106 and one groove wall of the second processing groove 102. The two second clamping devices 3 arranged in a transverse direction can clamp the part blank 5 in the transverse direction, and the one second clamping device 3 arranged in a longitudinal direction can clamp the part blank 5 in the longitudinal direction, resulting in a good clamping effect.

[0034] like Figures 1-3 As shown, a fixing countersunk hole 107 is provided through each of the four corners of the processing base 1. A first positioning countersunk hole 1011 is provided through the bottom surface of the first processing groove 101, and a second positioning countersunk hole 1021 is provided through the bottom surface of the second processing groove 102. The first positioning countersunk hole 1011 and the second positioning countersunk hole 1021 can perform rapid positioning and limiting. The fixing countersunk hole 107 can fix the processing base 1, improving processing stability.

[0035] like Figures 1-3 As shown, the second clamping device 3 has a buffer block 4 on at least one side. The buffer block 4 and the processing base 1 are made of polytetrafluoroethylene (PTFE). PTFE has low hardness and good buffering effect, and will not scratch the finished parts.

[0036] like Figures 1-3As shown, the first clamping device 2 and the second clamping device 3 are OK clamps. Taking the second clamping device 3 between the third boss 105 and the fourth boss 106 as an example, the second clamping device 3 includes an adjustable clamping nut 301, a first clamping block 302 and a second clamping block 303, and an annular spring 304. A bolt 305 is inserted into the clamping nut 301. A first protrusion 3021 is provided on one side of the first clamping block 302, and a second protrusion 3031 is provided on the same side of the second clamping block 303. One end of the spring 304 is sleeved on the first protrusion 3021, and the other end is sleeved on the second protrusion 3031. At the outlet 3031, a buffer block 4 is provided on the first clamping block 302 and the second clamping block 303 respectively. The clamping nut 301 is conically engaged with the first clamping block 302 and the second clamping block 303 respectively. When the downward adjusting bolt 305 is adjusted, the first clamping block 302 and the second clamping block 303 move in opposite directions, the spring 304 is stretched, and then the first clamping block 302 and the second clamping block 303 respectively abut against the semi-finished part 6 to form a clamp. When the upward adjusting bolt 305 is adjusted, the first clamping block 302 and the second clamping block 303 move relative to each other, the spring 304 is reset, and the second clamping device 3 is released from clamping.

[0037] The above embodiments are merely descriptions for clearly illustrating the present utility model, and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all implementations here, and the obvious variations or modifications derived therefrom are still within the protection scope of the present utility model.

Claims

1. A semiconductor component processing tool, characterized by, The utility model provides a processing base, one side of the processing base is provided with a first processing groove for placing a part blank and a second processing groove for placing a part semi-finished product, a plurality of first clamping devices for clamping the part blank are detachably arranged in the first processing groove, and a plurality of second clamping devices for clamping the part semi-finished product are detachably arranged in the second processing groove.

2. The semiconductor component processing tool of claim 1, wherein Two corners of the first processing groove are respectively provided with a first boss and a second boss for placing the part blank, and the first boss and the second boss are oppositely arranged.

3. The semiconductor device processing tool of claim 2, wherein: A first clamping device is arranged between the first boss and the second boss in a longitudinal direction.

4. The semiconductor device processing tool of claim 3, wherein: Two first clamping devices are arranged between the first boss and a groove wall of the first processing groove in a transverse direction, and two first clamping devices are arranged between the second boss and a groove wall of the first processing groove in a transverse direction.

5. The semiconductor device processing tool of claim 1, wherein: Two corners of the second processing groove are respectively provided with a third boss and a fourth boss for placing the part semi-finished product, and the third boss and the fourth boss are oppositely arranged.

6. The semiconductor device processing tool of claim 5, wherein: A second clamping device is arranged between the third boss and the fourth boss in a longitudinal direction.

7. The semiconductor device processing tool of claim 6, wherein: Two second clamping devices are arranged between the third boss and a groove wall of the second processing groove in a transverse direction, and two second clamping devices are arranged between the fourth boss and a groove wall of the second processing groove in a transverse direction.

8. The semiconductor device processing tool of claim 1, wherein: A fixing counterbore is arranged through each corner of the processing base, a first positioning counterbore is arranged through the bottom surface of the first processing groove, and a second positioning counterbore is arranged through the bottom surface of the second processing groove.

9. The semiconductor device processing tool of claim 6, wherein: At least one side of the second clamping device is provided with a buffer block, and the materials of the buffer block and the processing base are polytetrafluoroethylene.

10. The semiconductor device processing tool of claim 1, wherein, The first clamping device and the second clamping device are OK clamps.

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