Silicon wafer conveying device and silicon wafer production system

Abstract

The utility model provides a silicon wafer conveying device and a silicon wafer production system, and the device comprises two conveying belt assemblies which are arranged side by side and are used for conveying silicon wafers; the driving part is located within the width range of the two conveying belt assemblies and drives the conveying belt assemblies to operate so as to convey the silicon wafers; and the frame body is located within the width range of the two conveying belt assemblies and provides support for the driving part. According to the technical scheme, the driving piece and the support are arranged in the width range of the conveying belt assembly, the width of the whole silicon wafer conveying device is reduced, the occupied space of the silicon wafer conveying device is reduced on the whole, the silicon wafer conveying device can be used in a smaller space, the plant layout is optimized, and the production efficiency is improved. The reduced space can be used for increasing production lines, the production capacity is improved, and the requirements of actual production can be better met.

Description

Technical Field

[0001] This disclosure relates to the field of photovoltaic equipment technology, and in particular to a silicon wafer conveying device and a silicon wafer production system. Background Technology

[0002] Silicon wafers are widely used in products such as solar cells, integrated circuits, and sensors. The production process involves wafer transport. However, with the decreasing size of equipment and space constraints, existing wafer transport devices occupy a large area, increasing factory space costs, limiting production layout, and failing to meet actual production needs. Utility Model Content

[0003] One of the technical problems that this disclosure aims to solve is that existing silicon wafer conveying devices occupy a large space, which increases the space cost of the factory, restricts the production layout, and cannot meet the actual production needs.

[0004] To address the aforementioned technical problems, this disclosure provides a silicon wafer conveying device, comprising:

[0005] Two conveyor belt assemblies arranged side by side are used to transport silicon wafers;

[0006] A drive unit, located within the width of the two conveyor belt assemblies, drives the conveyor belt assemblies to transport silicon wafers; and

[0007] The frame is located within the width of the two conveyor belt assemblies and provides support for the drive components.

[0008] In some embodiments, the conveyor belt assembly includes:

[0009] The conveyor belt body has silicon wafers placed on top of it, and the conveyor belt body can rotate to transport the silicon wafers.

[0010] The driving wheel, which can rotate under the drive of the driving components; and

[0011] Driven wheels are spaced apart above the driving wheels along the length of the conveyor belt body. The conveyor belt body is fitted over the driven wheels and the driving wheels. Driven wheels can rotate under the drive of the driving wheels to drive the conveyor belt body to rotate.

[0012] In some embodiments, the conveyor belt assembly further includes an adjusting wheel, which is offset from the driving wheel and the driven wheel in the horizontal and vertical directions. The conveyor belt body is sleeved outside the driving wheel and then sleeved outside the driven wheel via the adjusting wheel. The adjusting wheel is used to adjust the tension of the conveyor belt body.

[0013] In some embodiments, the adjusting wheel is located on the outside of the conveyor belt body.

[0014] In some embodiments, the drive unit has dual output shafts in opposite directions along the width direction of the conveyor belt assembly, and the output shafts are connected to the drive wheel.

[0015] In some embodiments, the frame includes:

[0016] The mounting section, drive unit, and conveyor belt assembly are mounted in the mounting section; and

[0017] The support part is located below the mounting part.

[0018] In some embodiments, the mounting section includes:

[0019] A first mounting section is symmetrically arranged on the inner sides of two conveyor belt bodies. A drive component is mounted on the inner side of the first mounting section. The first mounting section has an opening to allow the output shaft of the drive component to pass through, so that a drive wheel can be mounted on the outer side of the first mounting section.

[0020] The second mounting section is symmetrically arranged on the inner side of the two conveyor belt bodies and located above the first mounting section. The driven wheel is rotatably connected to the outer side of the second mounting section.

[0021] In some embodiments, the adjusting wheel is rotatably connected to the outside of the first mounting portion.

[0022] In some embodiments, a reinforcing connecting plate is provided between the second mounting parts.

[0023] Another aspect of this utility model provides a silicon wafer production system, including the aforementioned silicon wafer conveying device.

[0024] Through the above technical solution, the silicon wafer conveying device provided in this disclosure sets the drive unit and the support within the width range of the conveyor belt assembly, thereby reducing the width of the entire silicon wafer conveying device and reducing the space occupied by the silicon wafer conveying device. It can be used in a smaller space, optimizing the factory layout. The reduced space can be used to increase production lines, improve production capacity, and better meet the needs of actual production. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer conveying device disclosed in this embodiment;

[0027] Figure 2This is a front view of the silicon wafer conveying apparatus disclosed in this embodiment;

[0028] Figure 3 This is a top view of the silicon wafer conveying apparatus disclosed in this embodiment.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Frame; 11. Mounting section; 111. First mounting section; 112. Second mounting section; 113. Reinforcing connecting plate; 12. Support section; 2. Drive component; 3. Conveyor belt assembly; 31. Conveyor belt body; 32. Drive wheel; 33. Driven wheel; 34. Adjusting wheel. Detailed Implementation

[0031] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0032] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0033] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0034] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0035] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0036] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0037] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0038] To address the problems of existing silicon wafer conveying devices occupying large spaces, increasing factory space costs, restricting production layout, and failing to meet actual production needs, this disclosure provides a silicon wafer conveying device, such as... Figure 1 and Figure 3 As shown, the silicon wafer conveying device includes: two side-by-side conveyor belt assemblies 3, on which silicon wafers are placed and which can operate to convey silicon wafers; a drive unit 2, which is located within the width range of the two conveyor belt assemblies 3 and can drive the conveyor belt assemblies 3 to operate to convey silicon wafers; and a frame 1, which is located within the width range of the two conveyor belt assemblies 3, reducing the space occupied by the silicon wafer conveying device while providing support for the drive unit 2.

[0039] By using the above technical solution, both the drive unit 2 and the frame 1 are set within the width range of the conveyor belt assembly 3. The maximum width of the entire silicon wafer conveying device is the width of the conveyor belt assembly 3. This avoids the drive unit 2 and the frame 1 protruding beyond the conveyor belt assembly 3 and occupying extra space, thus reducing the width of the silicon wafer conveying device. Overall, this reduces the space occupied by the entire silicon wafer conveying device, allowing it to be used in a smaller space. This optimizes the factory layout, and the reduced space can be used to increase production lines, improve production capacity, and better meet the needs of actual production.

[0040] In some embodiments, such as Figure 1 and Figure 2As shown, the conveyor belt assembly 3 includes: a conveyor belt body 31 on which silicon wafers are placed, and the conveyor belt body 31 is rotatable to transport the silicon wafers; a drive wheel 32 that is rotatable under the drive of the drive member 2; and driven wheels 33 that are spaced above the drive wheel 32 along the length of the conveyor belt body 31. The conveyor belt body 31 is sleeved around the driven wheels 33 and the drive wheel 32, and the driven wheels 33 are rotatable under the drive of the drive wheel 32 to drive the conveyor belt body 31 to rotate. The two conveyor belt assemblies 3 have basically the same structure. Silicon wafers are placed on two side-by-side conveyor belt bodies 31, and the two conveyor belt bodies 31 operate synchronously to transport the silicon wafers.

[0041] In some embodiments, such as Figure 1 and Figure 2 As shown, the conveyor belt assembly 3 also includes an adjusting wheel 34. The adjusting wheel 34 is offset from the driving wheel 32 and the driven wheel 33 in both the horizontal and vertical directions. When the conveyor belt body 31 is fitted onto the driving wheel 32 and the driven wheel 33, it is fitted onto the driven wheel 33 outside the driving wheel 32 via the adjusting wheel 34. Because the adjusting wheel 34 is offset from the driving wheel 32 and the driven wheel 33 in both the horizontal and vertical directions, the tension of the conveyor belt body 31 can be adjusted when it passes through the adjusting wheel 34, so that the conveyor belt body 31 maintains a suitable friction force with the driving wheel 32 and the driven wheel 33, ensuring transmission efficiency.

[0042] In some embodiments, such as Figure 1 and Figure 2 As shown, the adjusting wheel 34 is located on the outside of the conveyor belt body 31. Of course, the wrapping direction of the conveyor belt body 31 can also be changed so that the adjusting wheel 34 is located on the inside of the conveyor belt body 31. The wrapping direction of the conveyor belt body 31 around the adjusting wheel 34 can be selected according to the actual situation.

[0043] In some embodiments, such as Figure 1 and Figure 3 As shown, the drive unit 2 has two output shafts in opposite directions along the width direction of the conveyor belt assembly 3. The two output shafts are respectively connected to the drive wheel 32, driving the drive wheel 32 to rotate and provide power to the entire silicon wafer conveying device. By configuring the drive unit 2 with two output shafts in opposite directions, and directly connecting the output shafts to the drive wheel 32, the excessive space occupied by the transmission device extending beyond the width of the conveyor belt assembly 3 when power is transmitted to the drive wheel is avoided. This also avoids energy loss caused by the transmission device, resulting in higher transmission efficiency. The drive unit 2 can be a dual-output shaft motor as used in the prior art.

[0044] In some embodiments, such as Figure 1As shown, the frame 1 includes: a mounting part 11, a drive component 2 and a conveyor belt assembly 3 mounted on the mounting part 11; and a support part 12, which supports the mounting part 11 from below. The frame 1 is disposed in the space between the two conveyor belt assemblies 3, which reduces the space occupied by the silicon wafer conveying device while providing support for the entire silicon wafer conveying device.

[0045] In some embodiments, such as Figure 1-3 As shown, the mounting portion 11 includes: a first mounting portion 111, symmetrically arranged inside the two conveyor belt bodies 31, with the drive member 2 mounted in the inner space of the first mounting portion 111; an opening on the first mounting portion 111 to allow the output shaft of the drive member 2 to pass through; and a drive wheel 32 mounted on the outer side of the first mounting portion 111; and a second mounting portion 112, symmetrically arranged inside the two conveyor belt bodies 31 and located above the first mounting portion 111; the second mounting portion 112 is arranged along the length direction of the conveyor belt bodies 31; and driven wheels 33 are spaced along the length direction of the second mounting portion 112 and mounted on the outer side of the second mounting portion 112, and rotatably connected to the second mounting portion 112. To minimize the width of the conveyor belt assembly 3, the space occupied by the fixed components on the outer sides of the drive wheel 32 and driven wheel 33 should be minimized. Specifically, the inner side of the drive wheel 32 is fixedly connected to the output shaft of the drive component 2 by keyway or thread connection, avoiding the need to set a fixing component on the outer side of the drive wheel 32 to widen the width of the conveyor belt assembly 3; the driven wheel 33 is rotatably connected to the second mounting part 112 by bearing, and the bearing is fixed on the outer side of the driven wheel 33 by snap ring to minimize the width of the conveyor belt assembly 3. Alternatively, other fixing methods that occupy less space in the width direction in the prior art can be used.

[0046] In some embodiments, such as Figure 1-3 As shown, the adjusting wheel 34 is rotatably connected to the outside of the first mounting part 111. The adjusting wheel 34 can adopt the same connection method as the driven wheel 33, using bearings and retaining rings to rotatably connect to the first mounting part 111, thereby minimizing the width of the conveyor belt assembly 3.

[0047] In some embodiments, such as Figure 1 and Figure 3 As shown, a reinforcing connecting plate 113 is provided between the two second mounting parts 112 to increase the stability of the connection between the driven wheel 33 and the second mounting part 112, thereby increasing the strength of the entire frame 1 and the stability of the entire silicon wafer conveying device.

[0048] In some embodiments, this disclosure also provides a silicon wafer production system, which includes the aforementioned silicon wafer conveying device. Specifically, during the silicon wafer production process, when the produced silicon wafers need to be inspected, an inspection device is installed on the aforementioned silicon wafer conveying device to inspect the continuously conveyed silicon wafers, thereby reducing the overall space occupied by the silicon wafer production system. The silicon wafer conveying device can also be applied to other steps in the silicon wafer production system that involve conveying silicon wafers, and can be used in conjunction with other components.

[0049] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0050] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A silicon wafer transport apparatus, comprising: The utility model relates to a silicon wafer conveying device, which comprises: two conveying belt assemblies (3) arranged side by side for conveying silicon wafers; a driving member (2) arranged in the width range of the two conveying belt assemblies (3) and driving the conveying belt assemblies (3) to run for conveying the silicon wafers; and a frame body (1) arranged in the width range of the two conveying belt assemblies (3) and providing support for the driving member (2).

2. The silicon wafer transport apparatus of claim 1, wherein, The conveying belt assembly (3) comprises: a conveying belt body (31) on which the silicon wafers are placed, the conveying belt body (31) being capable of rotating to convey the silicon wafers; a driving wheel (32) capable of rotating under the drive of the driving member (2); and a driven wheel (33) arranged above the driving wheel (32) along the length direction of the conveying belt body (31), the conveying belt body (31) being sleeved outside the driven wheel (33) and the driving wheel (32), the driven wheel (33) being capable of rotating under the drive of the driving wheel (32) to drive the conveying belt body (31) to rotate.

3. The silicon wafer transport apparatus of claim 2, wherein, The conveying belt assembly (3) further comprises an adjusting wheel (34) arranged in the horizontal direction and the vertical direction and staggered with the driving wheel (32) and the driven wheel (33), the conveying belt body (31) being sleeved outside the driving wheel (32) through the adjusting wheel (34) and sleeved outside the driven wheel (33), the adjusting wheel (34) being used for adjusting the tightness of the conveying belt body (31).

4. The silicon wafer transport apparatus of claim 3, wherein, The adjusting wheel (34) is located outside the conveying belt body (31).

5. The silicon wafer transport apparatus of claim 3, wherein, The driving member (2) is provided with double output shafts in opposite directions along the width direction of the conveying belt assembly (3), and the output shafts are connected to the driving wheel (32).

6. The silicon wafer transport apparatus of claim 5, wherein, The frame body (1) comprises: a mounting portion (11) on which the driving member (2) and the conveying belt assembly (3) are mounted; and a supporting portion (12) supported below the mounting portion (11).

7. The silicon wafer transport apparatus of claim 6, wherein, The mounting portion (11) comprises: a first mounting portion (111) symmetrically arranged inside the two conveying belt bodies (31), the driving member (2) being mounted inside the first mounting portion (111), the first mounting portion (111) being provided with an opening through which the output shaft of the driving member (2) passes to mount the driving wheel (32) outside the first mounting portion (111); and a second mounting portion (112) symmetrically arranged inside the two conveying belt bodies (31) and located above the first mounting portion (111), the driven wheel (33) being rotatably connected to the outside of the second mounting portion (112).

8. The silicon wafer transport apparatus of claim 7, wherein, The adjusting wheel (34) is rotatably connected to the outside of the first mounting portion (111).

9. The silicon wafer transport apparatus of claim 7, wherein, The second mounting portion (112) is provided with a reinforcing connecting plate (113) therebetween.

10. A silicon wafer manufacturing system, characterized in that, The silicon wafer production system comprises the silicon wafer conveying device according to any one of claims 1-9.

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