Evaporation material pretreatment device
By designing a pretreatment device for vapor deposition materials, the problem of material contact with the atmosphere in the vapor deposition process was solved, achieving efficient material pretreatment, improving material purity and production efficiency, reducing film defects, and enhancing product quality.
Patent Information
- Application Number
- CN202520199706.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-08
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2035-02-08
AI Technical Summary
In existing vapor deposition processes, vapor deposition materials come into contact with the atmosphere when placed in a container, causing moisture and impurities to enter, affecting material properties and vacuum levels, and reducing production efficiency and product yield.
Design a pretreatment device for vapor deposition materials, including a vacuum chamber, a vacuum pumping system, a heating and temperature control system, and a cooling system. The device removes water vapor and impurities through preheating treatment and simultaneously pumps air from multiple process chambers through a transition chamber. It is equipped with a detection system for monitoring.
It significantly improves the purity and performance of vapor deposition materials, reduces the mass of the film layer and production efficiency, and improves production efficiency while reducing the mass of the film layer and production efficiency.
Smart Images

Figure CN223766408U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of vapor deposition material processing devices, and in particular to a vapor deposition material pretreatment device. Background Technology
[0002] In the OLED (Organic Light Emitting Diode) panel display industry, vapor deposition is one of the core processes, playing a decisive role in the overall panel production yield. The main function of a vapor deposition machine is to evaporate luminescent materials and other functional materials to specific locations on the target substrate in an ultra-high vacuum environment through heating, thereby forming a thin film layer. However, in existing vapor deposition processes, the material inevitably comes into contact with the atmosphere when placed in the crucible or deposition container. Moisture, particles, and impurities from the air enter the container along with the material. During the heating process, moisture in the material oxidizes, leading to material failure; simultaneously, moisture inside the material sublimates and releases a large amount of gas during heating, causing leakage and vacuum fluctuations, thus severely affecting product yield.
[0003] Furthermore, existing vapor deposition processes typically involve placing the material in a specific container, heating the container to vaporize the material, and then using a high-speed gas flow generated by a vacuum to carry the gaseous material to the substrate to be coated. However, when the material is placed in the container, it comes into contact with the atmosphere, and moisture from the atmosphere enters the container along with the material. When directly placed into the vapor deposition chamber for heating and vapor deposition, this moisture evaporates onto the film layer, adversely affecting its quality. Since the material is usually powdery and fluffy, heating the powdery material in the vacuum chamber can cause it to be ejected into the vacuum chamber, generating impurities and affecting the quality of the film layer. In addition, during the heating process, a large amount of untreated material and gas is directly introduced into the vacuum chamber, preventing the vacuum level from reaching the set value quickly, thus prolonging the coating time and reducing production efficiency. Therefore, developing a device that can effectively pre-treat the vapor deposition material and pre-extract moisture and impurities from its interior or surface is of great significance for improving the production yield and capacity of OLED panels. Utility Model Content
[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a pretreatment device for vapor deposition materials.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] A pretreatment apparatus for vapor deposition materials, comprising:
[0007] At least one vacuum chamber;
[0008] A vacuum system, connected to the vacuum chamber, is used to extract and maintain the vacuum level within the vacuum chamber;
[0009] A heating and temperature control system is used to preheat the vapor-deposited material to remove moisture and impurities.
[0010] A cooling system is used to cool the vacuum chamber and / or the materials therein during or after heating to prevent overheating and damage;
[0011] The vacuum chamber includes at least two process chambers and a transition chamber. The process chambers are used to place vapor deposition materials and perform pretreatment. The transition chamber is used to connect the vacuum system to the at least two process chambers to achieve simultaneous evacuation of one or more process chambers.
[0012] Furthermore, a valve component is provided between each of the process chambers and the transition chamber.
[0013] Furthermore, there are four process chambers, each of which is connected to a transition chamber and the evacuation process is controlled by a slide gate valve.
[0014] Furthermore, the heating temperature control system includes an electric heating element and a heating control circuit, wherein the electric heating element is disposed inside the process chamber.
[0015] Furthermore, the heating element is configured as a plurality of spaced heating plates, which are adapted to divide the inner cavity of the process chamber into a plurality of placement units suitable for placing vapor deposition materials.
[0016] Furthermore, the heating temperature control system also includes a thermocouple and a temperature controller. The thermocouple is used to measure the heating temperature in real time, and the temperature controller is used to control the temperature and time of the heater.
[0017] Furthermore, the heating control circuit includes a high-voltage power supply and an overheat protection circuit electrically connected to each process chamber.
[0018] Furthermore, the cooling system includes a water storage tank, which receives water from four process chambers via water pipes.
[0019] Furthermore, the pretreatment device also includes a detection system configured to monitor the oxygen concentration, vacuum level, and water pressure within the vacuum chamber.
[0020] Furthermore, the detection system includes an oxygen concentration meter, a manual venting valve, a vacuum pressure switch, and a vacuum gauge, which are disposed on the outer wall of the process chamber 110.
[0021] Due to the adoption of the above technical solutions, this utility model has the following beneficial effects:
[0022] 1. The pretreatment device of this utility model can effectively pretreat materials before vapor deposition, removing moisture and impurities, and reducing downtime and adjustment time caused by material problems during vapor deposition. In addition, by setting at least two process chambers and one transition chamber, efficient pretreatment of vapor deposition materials is achieved. Multiple process chambers can work simultaneously or independently, greatly improving pretreatment efficiency and meeting the processing needs of different types and batches of vapor deposition materials. At the same time, the design of the transition chamber allows one or more process chambers to perform evacuation tasks simultaneously, further optimizing the vacuuming process and shortening the pretreatment cycle.
[0023] 2. The heating element in the heating temperature control system of this utility model is a plurality of spaced heating plates, which divide the inner cavity of the process chamber into a plurality of placement units, effectively fixing the vapor-deposited thin film material, preventing the material from spraying out during the heating process, reducing impurity contamination in the vacuum chamber, and improving the uniformity and performance of the film layer.
[0024] 3. The vacuum system and heating temperature control system of this utility model can be used simultaneously or separately. When the vacuum system is used alone, it can provide a vacuum storage environment and is blocked by the electric heating plate to prevent moisture in the air from entering the material and affecting the material performance. Attached Figure Description
[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings of the embodiments will be briefly introduced below. Obviously, the drawings described below only involve some embodiments of this utility model, and are not intended to limit this utility model.
[0026] Figure 1 This is the first three-dimensional structural diagram of this utility model.
[0027] Figure 2 This is the second three-dimensional structural diagram of this utility model.
[0028] Figure 3 This is the circuit structure diagram of this utility model.
[0029] Figure 4 This is a diagram showing the distribution of detection elements on the first side of the process chamber in the detection system of this utility model.
[0030] Figure 5 This is a diagram showing the distribution of detection elements on the second side of the process chamber in the detection system of this utility model.
[0031] Figure label:
[0032] In the diagram, 100 is the vacuum chamber; 110 is the process chamber; 120 is the transition chamber; 200 is the vacuum system; 300 is the heating and temperature control system; 310 is the heating plate; 320 is the placement unit; 400 is the cooling system; 410 is the water tank; 500 is the detection system; 510 is the oxygen concentration meter; 520 is the manual venting valve; 530 is the vacuum pressure switch; 540 is the vacuum gauge; 550 is the water flow meter; and 560 is the gas flow meter. Detailed Implementation
[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the utility model will be further described in detail below with reference to the accompanying drawings. The components of the embodiments of this utility model described and shown in the accompanying drawings can be arranged and designed in various different configurations. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0035] Unless otherwise defined, the technical or scientific terms used in this patent document shall have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "first," "second," and similar terms used in this utility model patent specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an," "a," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" indicate that the element or object preceding "comprising" encompasses the element or object listed following "comprising" or its equivalents, and do not exclude other elements or objects. Terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" are used only to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0037] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the features in the following embodiments can be combined with each other.
[0038] Please see Figure 1 This utility model discloses a pretreatment device for vapor deposition materials. The pretreatment device includes at least one vacuum chamber 100, a vacuum pumping system 200, a heating and temperature control system 300, a cooling system 400, and a detection system 500. Specifically, the vacuum chamber 100 is made of SUS304 stainless steel, and reinforcing ribs are welded to the surface of the chamber to ensure its strength and prevent deformation and leakage. The vacuum pumping system 200 is connected to the vacuum chamber 100 and is used to extract and maintain the vacuum level within the vacuum chamber 100. The heating and temperature control system 300 is used to preheat the vapor deposition material to remove moisture and impurities. The cooling system 400 is used to cool the vacuum chamber 100 and / or the material within it during or after heating to prevent overheating and damage. The detection system 500 is configured to monitor the oxygen concentration, vacuum level, and water pressure within the vacuum chamber 100 to ensure the stability and safety of the pretreatment process. The vacuum chamber 100 includes at least two process chambers 110 and a transition chamber 120. The process chambers 110 are used to place vapor deposition materials and perform pretreatment. The transition chamber 120 is used to connect the vacuum system to the at least two process chambers 110 to achieve simultaneous evacuation of one or more process chambers 110.
[0039] It is worth noting that this application significantly improves the purity and performance stability of the vapor-deposited thin film material by pre-treating it to remove moisture and impurities. The pre-treated vapor-deposited material exhibits better performance in subsequent vapor deposition processes, reducing film defects and impurity adhesion, significantly improving film quality and display effect, thereby enhancing the performance and reliability of the final product. Furthermore, the pre-treatment device in this application, through the design of the transition chamber 120, allows one or more process chambers 110 to simultaneously perform evacuation tasks. This design significantly reduces the time required for vacuuming, ensuring that each process chamber 110 can quickly reach and maintain the required vacuum level, which is beneficial for improving the consistency and efficiency of pre-treatment.
[0040] Please see Figure 2 In this embodiment, there are four process chambers 110, namely SP1, SP2, SP3, and SP4. Each process chamber 110 is connected to a transition chamber 120, and the evacuation process is controlled by a valve component, thereby achieving simultaneous evacuation of one or more chambers. In this embodiment, the valve component is a gate valve. This device has one transition chamber 120. Process chambers SP1, SP2, SP3, and SP4 are connected to the transition chamber via pipelines, and a gate valve is configured in the middle of the pipeline to control the simultaneous evacuation of one or more chambers. By controlling the cold pump installed at the bottom of the transition chamber 120, air is evacuated from the other four process chambers 110 to achieve the required vacuum in the process chambers.
[0041] The heating temperature control system 300 includes heating elements and a heating control circuit. The heating elements are disposed inside the process chamber 110. In this embodiment, the heating elements are configured as multiple spaced-apart heating plates 310, which are adapted to divide the inner cavity of the process chamber 110 into multiple placement units 320 suitable for placing vapor deposition materials. The heating temperature control system 300 also includes thermocouples and a temperature controller. The thermocouples are used to measure the heating temperature in real time. The heating temperature can be measured by the thermocouples and displayed in real time. Changes in the data can be observed in real time using the temperature controller or a touch screen status monitoring interface. The temperature controller controls the temperature and time of the heater. Specifically, the temperature controller uses a power regulator to adjust and monitor the control current and voltage of each heating plate 310 to change the heating temperature of the temperature controller. Please refer to [link to relevant documentation]. Figure 3 The heating control circuit includes a high-voltage power supply, which is electrically connected to each process chamber 110 via an overcurrent protection element. The heating control circuit also includes an overheat protection circuit, specifically, the overheat protection circuit includes a circuit breaker electrically connected to each process chamber 110, wherein a thyristor is provided between the circuit breaker and the process chamber 110.
[0042] In this embodiment, the cooling system 400 includes a water storage tank 410, through which water flows into four process chambers 110 via water pipes. Please refer to [link / reference]. Figure 4 , Figure 5 The detection system 500 includes an oxygen concentration meter 510, a manual venting valve 520, a vacuum pressure switch 530, a vacuum gauge 540, a water flow meter 550, and a gas flow meter 560. The oxygen concentration meter 510, the manual venting valve 520, the vacuum pressure switch 530, the vacuum gauge 540, the water flow meter 550, and the gas flow meter 560 are all disposed on the outer wall of the process chamber 110.
[0043] The method of using this application is as follows:
[0044] Place the vapor-deposited material into process chamber 110;
[0045] The vacuum system is activated, and the process chamber 110 is evacuated through the transition chamber 120 to achieve a vacuum state in the process chamber 110.
[0046] The heating temperature control system 300 is started to heat the vapor deposition material in the process chamber 110. The heating time and temperature are controlled by PID to perform degassing.
[0047] Start the cooling system 400 to cool and protect the process chamber 110;
[0048] The environmental parameters inside the process chamber 110 are monitored by the detection system 500 to ensure the stable operation of the pretreatment process.
[0049] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A vapor deposition material pretreatment device characterized by comprising: The application relates to a vacuum chamber system for pre-treating evaporation materials, comprising: at least one vacuum chamber; a vacuum system connected to the vacuum chamber for extracting and maintaining the vacuum degree in the vacuum chamber; a heating temperature control system for pre-heating the evaporation materials to remove water vapor and impurities, and a cooling system for cooling the vacuum chamber and / or the materials in the vacuum chamber during or after the heating process to prevent overheating and damage; wherein the vacuum chamber comprises at least two process chambers for placing the evaporation materials and pre-treating the evaporation materials, and a transition chamber for connecting the vacuum system with the at least two process chambers to realize the simultaneous air extraction task of the single or multiple process chambers.
2. The evaporation material pre-processing apparatus according to claim 1, characterized in that Valve members are arranged between each process chamber and the transition chamber.
3. The evaporation material pre-processing apparatus according to claim 1 or 2, characterized in that, The number of the process chambers is four, each process chamber is connected with the transition chamber, and the air extraction process is controlled by plug valves.
4. The evaporation material pre-processing apparatus according to claim 1, wherein The heating temperature control system comprises electric heating elements and a heating control circuit, and the electric heating elements are arranged in the process chambers.
5. The evaporation material pre-processing apparatus according to claim 4, characterized in that The electric heating elements are arranged as a plurality of spaced electric heating plates, and the spaced electric heating plates are suitable for separating the inner cavities of the process chambers into a plurality of placing units suitable for placing the evaporation materials.
6. The evaporation material pre-processing apparatus according to claim 4, wherein The heating temperature control system further comprises thermocouples for measuring the heating temperature in real time and temperature controllers for controlling the temperature and time of the heaters.
7. The evaporation material pre-processing apparatus according to claim 4, wherein The heating control circuit comprises a high-voltage power supply and an overheating protection circuit electrically connected with each process chamber.
8. The evaporation material pre-processing apparatus according to claim 3, wherein The cooling system comprises a water storage tank, and the water storage tank flows into the four process chambers through water pipes.
9. The evaporation material pre-processing apparatus according to claim 1, wherein The pre-treating device further comprises a detection system configured to monitor the oxygen concentration, the vacuum degree and the waterway pressure in the vacuum chamber.
10. The evaporation material pre-processing apparatus according to claim 9, wherein The detection system comprises an oxygen concentration meter, a manual air release valve, a vacuum pressure switch and a vacuum gauge, and the oxygen concentration meter, the manual air release valve, the vacuum pressure switch and the vacuum gauge are arranged on the outer sidewall of the process chamber.