Intermediate plate capable of accommodating wafer electroplating hanger

Abstract

The utility model discloses an intermediate plate capable of accommodating a wafer electroplating hanger, the intermediate plate comprises a splitter plate and a support assembly arranged on the splitter plate, the support assembly comprises support columns vertically arranged on two sides of the top of the splitter plate and water lifting plates arranged on two sides of the support columns, a wafer electroplating bath is formed between the water lifting plate and the supporting column, a guide surface, a pulley and a water injection nozzle are arranged on one side, facing the wafer electroplating bath, of the supporting column, and the water lifting plate is in sliding connection with the supporting column through a lifting rod. The wafer hanging tool is simple in structure and convenient to use, the wafer hanging tool is guided to enter the wafer electroplating bath through the arranged guide face and the pulley, and therefore friction between the wafer hanging tool and the middle plate is reduced, and the service life of the wafer hanging tool and the service life of the middle plate are prolonged.

Description

Technical Field

[0001] This application belongs to the field of wafer electroplating, and specifically relates to an intermediate plate that can accommodate wafer electroplating fixtures. Background Technology

[0002] A wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits, also known as a semiconductor wafer. Semiconductor integrated circuits and other semiconductor devices typically require electroplating during the manufacturing process to form various metal layers on their surface, thus enabling connection to electrical components. The metals used for electroplating usually include copper, nickel, tin, gold, and silver.

[0003] Currently, wafer electroplating equipment is mainly divided into two types based on the position of the anode and cathode: vertical electroplating units and horizontal electroplating units. In vertical electroplating units, during electroplating, the wafer needs to be placed vertically in the electroplating tank using a rack. Because the support columns on both sides of the electroplating tank are relatively close to the rack, friction can easily occur between the rack and the sides of the support columns during placement, leading to varying degrees of wear on both the support columns and the rack, reducing their service life. To address this issue, we provide an intermediate plate that can accommodate wafer electroplating racks. Utility Model Content

[0004] The purpose of this application is to provide an intermediate plate capable of accommodating wafer plating fixtures, in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] An intermediate plate capable of accommodating a wafer electroplating fixture includes a flow divider plate and a support assembly disposed on the flow divider plate. The support assembly includes support columns vertically disposed on both sides of the top of the flow divider plate and water lifting plates disposed on both sides of the support columns. A wafer electroplating tank is formed between the water lifting plates and the support columns. The support columns are provided with a guide surface, a pulley and a water spray nozzle on the side facing the wafer electroplating tank. The water lifting plates are slidably connected to the support columns via lifting rods.

[0007] To achieve the above technical solution, the guide surface is used to guide the wafer rack when it enters the wafer plating tank, while the pulley is used to move the wafer rack inside to reduce the friction between the wafer rack and the support columns on both sides. The spray nozzle is used to inject the plating solution into the wafer plating tank for wafer plating, and the lifting rod is used to drive the water lifting plate to move up and down on both sides of the wafer plating tank to agitate the plating solution in the wafer plating tank.

[0008] As a preferred embodiment of this application, the front and rear sides of the support column are provided with grooves for accommodating the water lifting plate, and one side of the grooves is connected to the wafer electroplating tank.

[0009] The above technical solution is implemented so that the water-lifting plates on both sides of the wafer electroplating tank can move in the chute.

[0010] As a preferred embodiment of this application, the chute is provided with a plurality of through guide grooves, the guide grooves are connected to a slider provided on the water lifting plate, and the slider is connected to the lifting rod.

[0011] The above technical solution facilitates the connection and fixation of the water-lifting plates on both sides of the support column via sliders, and also facilitates the movement and guidance of the sliders.

[0012] As a preferred embodiment of this application, the top of the support column is provided with a guide sleeve that is connected to the guide groove, and the guide sleeve is connected to the lifting rod.

[0013] The above technical solution is implemented to facilitate the movement of the lifting rod.

[0014] As a preferred embodiment of this application, the support column is provided with a water passage connecting the water nozzle and the diverter plate.

[0015] The above technical solution is implemented so that the electroplating solution entering the distributor plate can enter the spray nozzle through the water channel and be injected into the wafer electroplating tank.

[0016] As a preferred embodiment of this application, the guide surface is located on the upper side of the support column, and the pulley and water nozzle are located on the lower side of the guide surface.

[0017] The above technical solution is implemented so that the wafer rack can enter the wafer plating tank through the guide surface, and then the movement of the wafer rack is guided by the pulley, while the water spray nozzle is used to inject the plating solution into the wafer plating tank.

[0018] Compared with the prior art, the beneficial effects of this application are:

[0019] This application has a simple structure and is easy to use. By using a guide surface and pulleys, the wafer rack is guided into the wafer plating tank, thereby reducing the friction between the wafer rack and the support pillar and improving the service life of the wafer rack and the support pillar. Attached Figure Description

[0020] Figure 1 This is a top view related to this application.

[0021] Figure 2 This is an exploded view related to this application.

[0022] Figure 3 This is a schematic diagram of the support column involved in this application.

[0023] In the diagram: 1. Diverter plate; 2. Support column; 201. Guide surface; 202. Pulley; 203. Spray nozzle; 204. Slide groove; 205. Guide groove; 206. Guide sleeve; 3. Wafer plating tank; 4. Lifting plate; 5. Slider; 6. Lifting rod. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] Example:

[0026] An intermediate plate capable of accommodating wafer plating fixtures, as shown in the reference. Figure 1 , Figure 2 and Figure 3 The system includes a flow divider plate 1 and a support assembly mounted on the flow divider plate 1. The support assembly includes support columns 2 vertically mounted on both sides of the top of the flow divider plate 1 and water lifting plates 4 mounted on both sides of the support columns 2. A wafer plating tank 3 is formed between the water lifting plates 4 and the support columns 2, and the water lifting plates 4 are slidably connected to the support columns 2 via lifting rods 6. In this embodiment, a guide surface 201 is provided on the side of the support column 2 facing the wafer plating tank 3, and multiple pulleys 202 and water spray nozzles 203 connected to the side of the support column 2 are provided below the guide surface 201.

[0027] Reference Figure 2 and Figure 3 To facilitate the entry of the electroplating solution onto the diversion plate 1 into the spray nozzle 203, the electroplating solution is injected into the wafer electroplating tank 3 through the spray nozzle 203. In this embodiment, the support column 2 is provided with a water passage connecting the spray nozzle 203 and the diversion plate 1.

[0028] Reference Figure 2 and Figure 3 To facilitate the installation of the water-lifting plate 4 on the support column 2, in this embodiment, the support column 2 is provided with a groove 204 for accommodating the water-lifting plate 4, and one side of the groove 204 is connected to the wafer electroplating tank 3.

[0029] Reference Figure 2 and Figure 3 To facilitate the sliding of the water-lifting plates 4 on both sides, in this embodiment, a slider 5 is installed on the water-lifting plate 4, and multiple through guide grooves 205 are provided in the sliding groove 204 for the installation and movement guidance of the slider 5.

[0030] Reference Figure 2 and Figure 3To facilitate the movement of the lifting rod 6, in this embodiment, a guide sleeve 206 connected to the guide groove 205 is installed on the top of the support column 2, and the lifting rod 6 is placed in the guide sleeve 206 and connected to the slider 5.

[0031] Specifically, in actual use, the guide surface 201 is used to guide the wafer rack when it enters the wafer plating tank 3, while the pulley 202 is used to move the wafer rack in the wafer plating tank 3 to reduce the friction between the wafer rack and the support columns 2 on both sides. The spray nozzle 203 is used to inject plating solution into the wafer plating tank 3 to facilitate wafer plating. The lifting rod 6 is driven by external force to drive the connected slider 5, and the slider 5 drives the connected water lifting plate 4 to move up and down on both sides of the wafer plating tank 3 to agitate the plating solution in the wafer plating tank 3.

[0032] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An intermediate plate capable of accommodating a wafer electroplating hanger, comprising a shunt plate (1) and a support assembly provided on the shunt plate (1), characterized in that, The support assembly comprises support columns (2) vertically arranged on both sides of the top of the flow distribution plate (1) and water lifting plates (4) arranged on both sides of the support columns (2), a wafer electroplating tank (3) is formed between the water lifting plates (4) and the support columns (2), the side of the support column (2) facing the wafer electroplating tank (3) is provided with a guide surface (201), a pulley (202) and a water injection port (203), and the water lifting plate (4) is slidingly connected with the support column (2) through a lifting rod (6).

2. The intermediate plate capable of accommodating a wafer electroplating hanger according to claim 1, wherein, The front and back sides of the support column (2) are provided with sliding grooves (204) accommodating the water lifting plates (4), and one side of the sliding groove (204) is connected with the wafer electroplating tank (3).

3. An intermediate plate capable of accommodating a wafer electroplating hanger according to claim 2, wherein, A plurality of through guide grooves (205) are arranged in the sliding groove (204), the guide grooves (205) are connected with sliding blocks (5) arranged on the water lifting plate (4), and the sliding block (5) is connected with the lifting rod (6).

4. The intermediate plate capable of accommodating a wafer electroplating hanger according to claim 3, wherein, The top of the support column (2) is provided with a guide sleeve (206) connected with the guide groove (205), and the guide sleeve (206) is connected with the lifting rod (6).

5. The intermediate plate capable of accommodating a wafer electroplating hanger according to claim 1, wherein, The support column (2) is provided with a water channel connecting the water injection port (203) and the flow distribution plate (1).

6. The intermediate plate capable of accommodating a wafer electroplating hanger according to claim 1, wherein, The guide surface (201) is arranged on the upper side of the support column (2), and the pulley (202) and the water injection port (203) are arranged on the lower side of the guide surface (201). The guide surface (201) is arranged on the upper side of the support column (2), and the pulley (202) and the water injection port (203) are arranged on the lower side of the guide surface (201).

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