SMT (Surface Mount Technology) steel mesh structure applied to PINs with dense spacing

Abstract

The embodiment of the utility model belongs to the technical field of steel meshes. The utility model also relates to an SMT steel mesh structure applied to the dense spacing PIN, which comprises a steel mesh main body, the steel mesh main body is provided with a plurality of steel mesh holes, and the steel mesh holes are arranged in a wide-end-up manner. According to the invention, the steel mesh holes with the wide upper parts and the narrow lower parts are arranged, and the arrangement of the steel mesh holes with the wide upper parts and the narrow lower parts can achieve the increase of the distance between the soldering tin of the PINs, can reduce the situation that the soldering tin between the adjacent PINs is connected due to the collapse of the solder paste between the PINs, and further solves the defect of tin connection.

Description

TECHNICAL FIELD

[0001] The utility model relates to steel net technical field more particularly, relate to a kind of application in dense spacing PIN foot SMT steel net structure. BACKGROUND

[0002] In the manufacturing field of electronic products, SMT (Surface Mount Technology) has become an indispensable efficient assembly process, which mainly through the accurate mounting of various electronic components to the specified position of printed circuit board (PCB), and then welding, to build a complete circuit system, the widespread application of this technology greatly improves the production efficiency and assembly accuracy of electronic products.

[0003] However, in the SMT welding process, a common technical problem is the tin connection between the dense spacing PIN feet (especially the pins of components such as BMU socket). Tin connection refers to the situation that, due to the collapse or excess of solder paste during the welding process, the PIN feet that should be independent of each other are connected by solder, forming an unnecessary conductive path, which not only affects the normal function of the circuit, but also may cause damage to the components, and even cause failure of the entire electronic product. Therefore, we improve it and propose a dense spacing PIN foot SMT steel net structure. SUMMARY

[0004] The technical problem to be solved by the embodiments of the utility model is the collapse or excess of solder paste, which causes the PIN feet that should be independent of each other to be connected by solder, forming an unnecessary conductive path, which not only affects the normal function of the circuit, but also may cause damage to the components.

[0005] To solve the above technical problems, the utility model adopts the technical solutions as follows:

[0006] A dense spacing PIN foot SMT steel net structure, comprising: a steel net body, a plurality of steel net openings are formed in the steel net body, the steel net openings are arranged in a manner of being wide at the top and narrow at the bottom; the steel net openings arranged in a manner of being wide at the top and narrow at the bottom can increase the spacing of PIN foot soldering, reduce the situation that the solder paste collapses between PIN feet and causes the solder between adjacent PIN feet to be connected, and thus solve the tin connection defect.

[0007] As an improved way of the utility model, the arrangement of the steel net openings in a manner of being wide at the top and narrow at the bottom is used to increase the spacing of PIN foot soldering, which clearly indicates the key design point of the application and strengthens the user's awareness of its importance. In actual production and application, the operator can more clearly understand the advantages of this structure, which facilitates focusing on this feature during the selection, use and maintenance of the steel net.

[0008] As an improved mode of the utility model, the steel mesh opening includes a wide opening and a narrow opening, and the narrow opening is communicated with the wide opening 201.

[0009] As an improved mode of the utility model, the wide opening and the narrow opening are connected at two sides of the arc-shaped transition slope.

[0010] As an improved mode of the utility model, the arc range of the arc-shaped transition slope is 30° to 60°.

[0011] As an improved mode of the utility model, the outer surface of the steel mesh body is provided with a protective piece, the protective piece is used for protecting the steel mesh body, the protective piece sets up a reliable physical barrier for the steel mesh body, effectively resists various physical damages, such as collision, scratching, falling, etc., which may be suffered by the side of the steel mesh body in the transportation, storage and use process; in the transportation link, the deformation, edge damage, etc. caused by extrusion or collision with other articles can be prevented, in the use process, accidental injuries of the steel mesh caused by the misoperation of the operator or the equipment failure are reduced, it is very important to maintain the original shape and size precision of the steel mesh opening, because it is directly related to the quality and consistency of the solder paste printing, once the steel mesh body and the steel mesh opening are damaged, the printing amount and distribution of the solder paste will be affected, and then the welding quality is reduced, and defects such as continuous soldering, virtual welding and missing welding are caused, through the protection of the protective piece, the service life of the steel mesh body is prolonged, and the replacement frequency of the steel mesh body is reduced.

[0012] As an improved mode of the utility model, the protective piece is arranged around the outer circumferential side of the steel mesh body.

[0013] As an improved mode of the utility model, the protective piece is a protective strip, and the protective strip is fixedly connected to the outer circumferential side of the steel mesh body.

[0014] As an improved mode of the utility model, the width of the narrow opening is 0.32 mm, and the width of the wide opening is 0.3840 mm.

[0015] As an improved mode of the utility model, the length of the steel mesh opening is 2.24 mm.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] To solve the problem that the tin paste collapses or is excessive in the prior art, the originally independent PIN feet are connected by the solder, and an unnecessary conductive path is formed, which not only affects the normal function of the circuit, but also may cause damage to the components, the steel mesh opening is provided to be wide at the top and narrow at the bottom, the steel mesh opening provided to be wide at the top and narrow at the bottom can increase the soldering tin spacing of the PIN feet, the collapse of the tin paste between the PIN feet can be reduced, the soldering tin between the adjacent PIN feet is connected, and the tin connection defect is solved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A structure schematic view of the application is provided in the structure of the SMT steel mesh structure of the close pitch PIN feet.

[0019] Figure 2 A structure schematic view of the protective strip of the application is provided in the structure of the SMT steel mesh structure of the close pitch PIN feet.

[0020] Figure 3 A size view of the steel mesh opening is provided.

[0021] Figure 4 A size view of the existing PCB pad is provided.

[0022] Figure 5 A size comparison view of the steel mesh opening and the PCB pad is provided.

[0023] Indications in the figure are as follows:

[0024] 1, steel mesh body; 2, steel mesh opening; 201, wide opening; 202, narrow opening; 203, arc-shaped transition slope; 3, protective strip. DETAILED DESCRIPTION

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the specification herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. Where an embodiment is described herein as comprising a particular component, steps, or characteristic, it is understood that the embodiment can also comprise additional components, steps, or characteristics. Reference herein to an embodiment means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one implementation of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. It is expressly understood that the embodiments described herein with the aid of the Figures are merely example embodiments and that the application is understood to encompass any and all embodiments within the scope of the following claims.

[0026] As described in the background section, a common technical challenge in SMT soldering is solder bridging between closely spaced pins (especially the pins of components such as BMU sockets). Solder bridging occurs when, during soldering, the collapse or excess of solder paste causes the pins, which should be independent, to be connected by solder, forming an unwanted conductive path. This not only affects the normal function of the circuit but may also damage the components or even cause the entire electronic product to malfunction.

[0027] To solve this technical problem, this utility model provides an application for SMT operations on PCB pad pins in a fine-pitch PIN SMT stencil structure.

[0028] For details, please refer to Figures 1-2 The specific applications of fine-pitch pin SMT stencil structures include:

[0029] The main body of the steel mesh 1 has several steel mesh openings 2, which are wider at the top and narrower at the bottom.

[0030] This utility model provides an application in SMT stencil structures with closely spaced pins. By setting a stencil opening 2 that is wider at the top and narrower at the bottom, the stencil opening 2 can increase the solder spacing between the pins, reduce the situation where solder paste collapses between the pins and causes solder to connect between adjacent pins, and thus solve the solder bridging defect.

[0031] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0032] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0033] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0034] Example 1 of the application of this utility model in a close-pitch PIN SMT stencil structure

[0035] Please refer to Figures 1-2This utility model, applied to a close-pitch PIN SMT stencil structure, includes: a stencil body 1, on which a plurality of stencil openings 2 are formed, the stencil openings 2 being wider at the top and narrower at the bottom; by setting the stencil openings 2 to be wider at the top and narrower at the bottom, this application effectively increases the solder spacing between the PINs, avoiding the problem of solder paste collapsing excessively between the PINs and connecting. This not only greatly reduces the risk of solder bridging, but also provides a stable and reliable foundation for subsequent soldering processes. From a product quality perspective, reducing solder bridging defects directly improves the electrical performance and stability of the product, reducing... It reduces the incidence of signal transmission failures and short circuits caused by poor soldering, enabling products to maintain good performance even in complex working environments. In terms of production efficiency, it reduces rework, repairs, and scrap disposal caused by solder bridging, greatly improving production efficiency and shortening the production cycle. This allows companies to produce more qualified products in the same amount of time, enhancing their market competitiveness. From a cost control perspective, it reduces the waste of raw materials, increased labor costs, and equipment wear and tear caused by poor soldering, effectively saving production costs and improving the company's economic benefits.

[0036] Furthermore, the stencil opening 2, which is wider at the top and narrower at the bottom, is designed to increase the solder spacing of the PINs, clarifying the key design points of this application and reinforcing users' awareness of its importance. In actual production applications, operators can more clearly understand the advantages of this structure, making it easier to focus on this characteristic during the selection, use, and maintenance of the stencil, ensuring that it is always in optimal working condition. This helps to maintain the stability and consistency of welding quality in large-scale production.

[0037] Example 2 of this utility model applied to a close-pitch PIN SMT stencil structure

[0038] This utility model is further applied to SMT stencil structures with close-pitch PINs, such as... Figure 2 As shown, the stencil opening 2 includes a wide opening 201 and a narrow opening 202, which are connected to the wide opening 201. Designing the stencil opening 2 in this way further optimizes the solder paste flow control. The wide opening 201 acts like a solder paste reservoir, quickly accommodating a large amount of solder paste in the early stages of printing, ensuring sufficient solder supply to the pins and avoiding cold solder joints caused by insufficient solder paste. The narrow opening 202, on the other hand, acts as a flow limiter and guide. When the solder paste flows from the wide opening 201 to the narrow opening 202 under the pressure of the squeegee, it can be accurately and evenly deposited at specific locations on the pins, greatly improving the precision and uniformity of the solder, and significantly enhancing the reliability and stability of the product.

[0039] Furthermore, such as Figure 2As shown, arc-shaped transition slopes 203 are provided on both sides of the connection between the wide opening 201 and the narrow opening 202. During the process of solder paste flowing from the wide opening 201 to the narrow opening 202, the arc-shaped transition slopes 203 can make the flow of solder paste more stable and smooth, avoiding unstable flow phenomena such as turbulence and vortex caused by sudden changes in cross-section. This effectively prevents solder paste from accumulating, clogging, or forming uneven flow velocity distribution at the connection. This not only ensures that the solder paste can be continuously and stably supplied to the narrow opening 202 and then accurately deposited on the pin, but also makes the distribution of solder more uniform and consistent throughout the stencil opening 2, improving the quality and consistency of the solder joint, reducing the scrap rate and rework rate, and improving production efficiency and product qualification rate.

[0040] Furthermore, the arc of the curved transition slope 203 ranges from 30 to 60°.

[0041] Example 3 of this utility model applied to a close-pitch PIN SMT stencil structure

[0042] This utility model is further applied to the SMT stencil structure with close-pitch PINs. A protective component is provided on the outer surface of the stencil body 1. This component protects the stencil body 1, creating a reliable physical barrier that effectively resists various physical damages that may occur to its edges during transportation, storage, and use, such as collisions, scratches, and drops. During transportation, it prevents deformation and edge damage caused by squeezing or colliding with other items. During use, it reduces accidental damage to the stencil caused by operator error or equipment malfunction, maintaining the original shape and size of the stencil openings 2. The degree of solder paste printing is crucial because it directly affects the quality and consistency of solder paste printing. Once the stencil body 1 and stencil openings 2 are damaged, the amount and distribution of solder paste printing will be affected, leading to a decline in soldering quality and defects such as solder bridging, cold solder joints, and missing solder joints. The protection of the stencil body 1 extends its service life, reduces the replacement frequency of the stencil body 1, and reduces the raw material procurement costs and production downtime caused by damage to the stencil body 1. This not only improves the continuity and efficiency of production, but also helps to ensure the stability of product quality, reduces quality risks, and provides strong support for the stable production and sustainable development of enterprises.

[0043] Furthermore, such as Figure 2As shown, protective components are arranged around the outer periphery of the stencil body 1, achieving comprehensive protection for the stencil body 1. This design can minimize the impact of external factors on the stencil body 1, especially providing effective protection for vulnerable parts such as the edges and corners of the stencil body 1. The edges and corners are more susceptible to collisions and friction during handling and use. Once damaged, it will not only affect the overall structural strength of the stencil body 1, but may also lead to changes in the shape and size of the stencil openings 2, thereby affecting the printing effect of solder paste and the soldering quality. Through comprehensive protection, the stencil body 1 can maintain good integrity and stability under various working conditions, providing a reliable foundation for SMT processes. In actual production, this helps to reduce production interruptions and product quality fluctuations caused by stencil problems, improves production efficiency and product qualification rate, reduces production costs and quality risks, and enhances the company's production management capabilities and market competitiveness.

[0044] Furthermore, such as Figure 2 As shown, the protective component is a protective strip 3, which is fixedly connected to the outer periphery of the steel mesh body 1. The protective strip 3 can be made of rubber. By using the protective strip 3 as a protective component, the protective strip 3 can fit tightly against the outer periphery of the steel mesh body 1. Through a reliable fixed connection method (such as adhesive), a stable protective structure is formed, providing stable protection for the steel mesh body 1. This design not only meets the functional requirements for the protection of the steel mesh body 1 in actual production, but also takes into account the convenience and economy of production. It is conducive to its widespread application and promotion in large-scale production, thereby improving the production efficiency and economic benefits of enterprises.

[0045] Example 4 of this utility model applied to a close-pitch PIN SMT stencil structure

[0046] This utility model is further applied to SMT stencil structures with close-pitch PINs, such as... Figure 3 As shown, the width of the narrow opening 202 is 0.32 mm, the width of the wide opening 201 is 0.3840 mm, and the length of the wide opening 201 is 0.8 mm.

[0047] Furthermore, such as Figure 3 As shown, the length of the steel mesh opening 2 is 2.24 mm.

[0048] by Figure 4 Taking the PCB pad dimensions shown as an example, Figure 4 The PCB pads shown are 0.448 mm wide and 2.112 mm long. The stencil body 1 is placed over the PCB pads, so that the stencil openings 2 correspond to the PCB pads. A 0.096 mm gap is left between the bottom of the stencil opening 2 and the PCB pad, and a 0.224 mm gap is left between the top of the PCB pad and the top of the stencil opening 2. Figure 5As shown, an SMT process is then performed to apply solder to the PCB pads.

[0049] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A close pitch pin (SMT) steel mesh structure, characterized in that, Include: The steel mesh body (1) is provided with a plurality of steel mesh openings (2), and the steel mesh openings (2) are provided with a wide upper and narrow lower.

2. The application of close pitch PIN-lead SMT steel mesh structure according to claim 1, characterized in that, The steel mesh opening (2) is provided with a wide upper and narrow lower to increase the spacing of the PIN pin soldering.

3. The application of close pitch PIN-lead SMT steel mesh structure according to claim 1 or 2, characterized in that, The steel mesh opening (2) includes a wide opening (201) and a narrow opening (202) in communication with the wide opening (201).

4. The application of close pitch PIN-lead SMT steel mesh structure according to claim 3, characterized in that, The two sides of the wide opening (201) and the narrow opening (202) are provided with arc transition slopes (203).

5. The application of close pitch PIN-lead SMT steel mesh structure according to claim 4, characterized in that, The arc range of the arc transition slope (203) is 30° to 60°.

6. The application of close pitch PIN-lead SMT steel mesh structure according to claim 1, characterized in that, The outer surface of the steel mesh body (1) is provided with a protective piece, which is used for the protection of the steel mesh body (1).

7. The application of close pitch PIN-lead SMT steel mesh structure according to claim 6, characterized in that, The protective piece is arranged around the outer circumferential side of the steel mesh body (1).

8. The application of close pitch PIN-lead SMT steel mesh structure according to claim 7, characterized in that, The protective piece is a protective strip (3) fixedly connected to the outer circumferential side of the steel mesh body (1).

9. The application of close pitch PIN-lead SMT steel mesh structure according to claim 3, characterized in that, The width of the narrow opening (202) is 0.32mm, and the width of the wide opening (201) is 0.3840mm.

10. The application of close pitch PIN-lead SMT steel mesh structure according to claim 1 or 9, characterized in that, The length of the steel mesh opening (2) is 2.24mm.

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