LED support packaging structure, lamp bead and electronic equipment

Abstract

The utility model provides an LED support packaging structure, lamp bead and electronic equipment, the LED support packaging structure comprises a substrate, a first composite board body and a second composite board body, the substrate is connected with the first composite board body, the first composite board body encloses to form a first accommodating cavity, the second composite board body comprises a first sub-board body and a second sub-board body, and the first sub-board body is connected with the second sub-board body. The first composite board body is connected with the first sub-board body, the first sub-board body encloses to form a second containing cavity, the first sub-board body is connected with the sapphire layer and the second sub-board body, the second sub-board body encloses to form a third containing cavity, the sapphire layer is matched with the third containing cavity, and the sapphire layer and the second sub-board body are both connected with the box dam. By arranging the first sub-plate body and the second sub-plate body, a space is provided for arrangement of the sapphire layer, positioning is facilitated, the sapphire layer can block air and water vapor, the air tightness of packaging is greatly improved, and the box dam covers a gap at the joint of the sapphire layer and the second sub-plate body, so that the air tightness is further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an LED bracket packaging structure, LED beads, and electronic equipment. Background Technology

[0002] The existing LED bracket manufacturing process includes metal stamping to form a circuit board, plastic injection molding into a concave cup shape, die bonding, and encapsulation.

[0003] However, plastic and metal are different materials. The joint between the two materials is prone to problems such as insufficient strength and tightness. Tiny gaps at the joint can allow moisture and harmful elements such as sulfur and chloride to enter the LED beads. The airtightness of the LED bracket and its encapsulation is an important factor affecting the quality of the LED beads.

[0004] Existing LED brackets are usually molded as a single piece. The gaps are reduced by structural improvements to the solder pads and plastic brackets. However, there are still gaps at the joint between the fluorescent adhesive and the bracket cup, and the airtightness is still insufficient. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide an LED bracket packaging structure, LED beads and electronic devices, which aims to solve the problem of gaps and insufficient airtightness in the packaging of fluorescent adhesive and bracket in the prior art.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0007] An LED bracket packaging structure includes a substrate, a first composite plate, and a second composite plate. One side of the substrate is connected to the first composite plate. The first composite plate encloses a first receiving cavity for accommodating a plurality of LED chips. The second composite plate includes a first sub-plate and a second sub-plate. The side of the first composite plate facing away from the substrate is connected to the first sub-plate. The first sub-plate encloses a second receiving cavity. The side of the first sub-plate facing away from the first composite plate is connected to a sapphire layer and the second sub-plate. The second sub-plate encloses a third receiving cavity. The sapphire layer is adapted to the third receiving cavity. Both the side of the sapphire layer facing away from the first sub-plate and the side of the second sub-plate facing away from the first sub-plate are connected to a dam.

[0008] Compared with the prior art, the beneficial effects of this utility model are as follows: By setting the first sub-board and the second sub-board, space is provided for the setting of the sapphire layer, and it is easy to position. The sapphire layer is located above the LED bracket packaging structure, which can block air and water vapor, greatly improving the airtightness of the packaging. Moreover, the dam covers the gap at the connection between the sapphire layer and the second sub-board, further improving the airtightness. The setting of the first composite layer and the first sub-board increases the contact area between the bracket and the phosphor. If there is a gap due to processing error, the gap path is longer, and water vapor is not easy to enter the functional area. Furthermore, since the sapphire layer has a certain setting height under the positioning of the first sub-board and the second sub-board, it can prevent the leads in the functional area from contacting the sapphire and causing the lamp to fail. The lamp beads prepared using the LED bracket packaging structure have the characteristics of good airtightness, good light transmission, and high reliability.

[0009] Furthermore, fluorescent colloid is disposed in the first and second accommodating cavities.

[0010] Furthermore, the first composite board includes a BT layer and pads, the BT layer is connected to the substrate, and the side of the BT layer facing away from the substrate is connected to the pads and the first sub-board.

[0011] Furthermore, the projection of the first sub-plate onto the substrate is located within the projection of the first composite plate onto the substrate.

[0012] Furthermore, the projection of the second sub-plate onto the substrate lies within the projection of the first sub-plate onto the substrate.

[0013] Furthermore, the projection of the first receiving cavity onto the substrate lies within the projection of the second receiving cavity onto the substrate.

[0014] Furthermore, the LED chip is provided with a plurality of leads, the end of the leads away from the LED chip being connected to the pads or an adjacent LED chip, and the bottom surface of the sapphire layer is higher than the leads.

[0015] An LED chip includes an LED bracket packaging structure as described in the above technical solution.

[0016] An electronic device includes LED beads as described in the above technical solution. Attached Figure Description

[0017] Figure 1 This is a partial structural diagram of the LED bracket packaging structure in an embodiment of the present invention;

[0018] Figure 2This is a first-view structural schematic diagram of the LED bracket packaging structure in an embodiment of the present utility model;

[0019] Figure 3 This is a second-view structural schematic diagram of the LED bracket packaging structure in an embodiment of the present utility model;

[0020] Explanation of key component symbols:

[0021] substrate 100 LED chips 110 lead 120 BT layer 200 First receiving cavity 201 solder pads 210 First Subplate 310 Second receiving cavity 311 Second Sub-plate 320 Sapphire layer 400 Enclosure 500

[0022] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0023] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0024] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] Please see Figures 1 to 3The LED bracket packaging structure in this embodiment includes a substrate 100, a first composite plate, and a second composite plate. One side of the substrate 100 is connected to the first composite plate. The first composite plate forms a first receiving cavity 201 for accommodating a plurality of LED chips 110. The first composite plate includes a BT layer 200 and pads 210. The second composite plate includes a first sub-plate 310 and a second sub-plate 320. The BT layer 200 is connected to the substrate 100. The side of the BT layer 200 facing away from the substrate 100 is connected to the pads 210 and the first sub-plate 320. 10. A plurality of leads 120 are provided on the LED chip 110. One end of the lead 120 away from the LED chip 110 is connected to the pad 210 or an adjacent LED chip 110. The projection of the first sub-board 310 on the substrate 100 is located within the projection of the first composite board on the substrate 100. The first sub-board 310 surrounds and forms a second receiving cavity 311. The projection of the first receiving cavity 201 on the substrate 100 is located within the projection of the second receiving cavity 311 on the substrate 100. Phosphor colloid is disposed in the first receiving cavity 201 and the second receiving cavity 311. Preferably, the first sub-board 310 and the second sub-board 320 are both made of BT material. The BT layer 200, the first sub-board 310 and the second sub-board 320 are all machined by a milling machine, with through holes machined in the center of the board to form a board with a cavity in the middle. The diameter of the through hole on the BT layer 200 is 14.5 mm, the diameter of the through hole on the first sub-board 310 is 15.5 mm, and the diameter of the through hole on the second sub-board 320 is 15.9 mm. The BT layer 200 is bonded to the substrate 100 with adhesive. The BT layer 200, the first sub-board 310 and the second sub-board 320 are pressed together. The pad 210 includes a positive electrode pad and a negative electrode pad, which are respectively semi-circular. Understandably, the BT layer 200 and the first sub-board 310 form a step. If external moisture enters from the junction of the fluorescent colloid and the support, the path required is longer, making it more difficult to negatively impact the performance of the functional area. Furthermore, the pads 210 are provided on the BT layer 200, and the height of the first sub-board 310 provides additional space for the connection of the lead wire 120.

[0027] The side of the first sub-plate 310 facing away from the first composite plate is connected to the sapphire layer 400 and the second sub-plate 320. The bottom surface of the sapphire layer 400 is higher than the lead wire 120. The projection of the second sub-plate 320 on the substrate 100 is located within the projection of the first sub-plate 310 on the substrate 100. The second sub-plate 320 encloses and forms a third receiving cavity. The sapphire layer 400 is adapted to the third receiving cavity. Both the side of the sapphire layer 400 facing away from the first sub-plate 310 and the side of the second sub-plate 320 facing away from the first sub-plate 310 are connected to the dam 500. Preferably, fluorescent adhesive is added to the first receiving cavity 201 and the second receiving cavity 311, and then the sapphire layer 400 is placed into the third receiving cavity, that is, the edge of the sapphire layer 400 is placed on the step formed by the first sub-plate 310 and the second sub-plate 320, and then baked and cured. The dam 500 is filled with dam adhesive to fill the gap between the sapphire layer 400 and the second sub-plate 320 and form a protrusion, and then cured. Understandably, the projection of the second sub-plate 320 onto the substrate 100 is located within the projection of the first sub-plate 310 onto the substrate 100, that is, the projection of the second receiving cavity 311 onto the substrate 100 is located within the projection of the third receiving cavity onto the substrate 100. The sapphire layer 400 can cover the fluorescent colloid. Specifically, the sapphire layer 400 can block the gap between the fluorescent colloid and the first sub-plate 310, greatly improving the airtightness. The dam 500 further fills the gap between the sapphire layer 400 and the second sub-plate 320.

[0028] Preferably, in traditional sapphire encapsulation structures, a dammed adhesive is used to cover the pads, forming a cup-shaped support structure. Phosphor adhesive is injected into the cavity area enclosed by the pad dam, and then the sapphire is placed on the phosphor adhesive. However, the pad dam does not provide positioning for the sapphire, which can easily lead to deviation. Furthermore, the edge of the sapphire does not cover the gap between the phosphor adhesive and the pad dam, resulting in poor hermeticity. Due to the unstable placement of the sapphire, it is easy to touch the wires, posing a risk of LED failure. Understandably, the LED support encapsulation structure described in this application has good hermeticity, and the connection of the sapphire layer 400 is stable and reliable. The lead wire 120 connects to the pad 210 in the space provided by the stepped structure, ensuring that it never touches the sapphire and preventing the risk of LED failure.

[0029] Another embodiment of this utility model also provides an LED bead, which includes the LED bracket packaging structure as described in the above embodiments.

[0030] Another embodiment of this utility model also provides an electronic device, which includes the lamp beads as described in the above embodiments.

[0031] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0032] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED support package structure, characterized by, The LED support packaging structure comprises a substrate, a first composite plate body and a second composite plate body, one side of the substrate is connected with the first composite plate body, the first composite plate body is enclosed to form a first accommodating cavity for accommodating a plurality of LED chips, the second composite plate body comprises a first sub-plate body and a second sub-plate body, one side of the first composite plate body away from the substrate is connected with the first sub-plate body, the first sub-plate body is enclosed to form a second accommodating cavity, one side of the first sub-plate body away from the first composite plate body is connected with a sapphire layer and the second sub-plate body, the second sub-plate body is enclosed to form a third accommodating cavity, the sapphire layer is matched with the third accommodating cavity, one side of the sapphire layer away from the first sub-plate body and one side of the second sub-plate body away from the first sub-plate body are both connected with a dam.

2. The LED support package structure of claim 1, wherein, A fluorescent colloid is arranged in the first accommodating cavity and the second accommodating cavity.

3. The LED support package structure of claim 1, wherein, The first composite plate body comprises a BT layer and a pad, the BT layer is connected with the substrate, one side of the BT layer away from the substrate is connected with the pad and the first sub-plate body.

4. The LED support package structure of claim 1, wherein, The projection of the first sub-plate body on the substrate is located in the projection of the first composite plate body on the substrate.

5. The LED support package structure of claim 1, wherein, The projection of the second sub-plate body on the substrate is located in the projection of the first sub-plate body on the substrate.

6. The LED support package structure of claim 1, wherein, The projection of the first accommodating cavity on the substrate is located in the projection of the second accommodating cavity on the substrate.

7. The LED support package structure of claim 3, wherein, A plurality of leads are arranged on the LED chip, one end of the lead away from the LED chip is connected with the pad or the adjacent LED chip, and the bottom surface of the sapphire layer is higher than the lead.

8. A lamp bead, characterized by The LED lamp bead comprises the LED support packaging structure as claimed in any one of claims 1 to 7.

9. An electronic device, comprising: The LED lamp bead comprises the LED support packaging structure as claimed in claim 8.

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