Automatic heating device for degumming quartz wafer

Abstract

The utility model discloses an automatic heating device for degumming quartz wafers, which belongs to the technical field of quartz wafer production and comprises a working box. Placing the panel; the lifting assembly comprises a lifting rod, a linkage rod, a rotating gear and a rotating screw rod, one end of the lifting rod is rotationally connected to the placement panel, the other end of the lifting rod is rotationally connected with the linkage rod, the linkage rod is arranged to be in an L shape, and the other end of the linkage rod is fixedly connected to the rotating gear; a heating assembly; a degumming assembly; a clamping assembly; according to the utility model, through the arrangement of the lifting assembly, the rotating screw rotates around the axial direction of the rotating screw, so that the linkage rod rotates around the axial direction of the rotating gear, the lifting rod moves upwards synchronously, and the placing panel and the wafer are lifted upwards to be close to the heating gun; therefore, the placing panel and the wafer are slowly lifted to be close to the heating gun, and the heating temperature of the heating gun to the wafer is slowly increased, so that the wafer is prevented from being possibly deformed due to thermal stress at an over-high temperature.

Description

Technical Field

[0001] This utility model belongs to the field of quartz wafer production technology, specifically relating to an automatic heating device for debinding quartz wafers. Background Technology

[0002] Quartz wafers are thin sheets made of high-purity quartz and are widely used in optics, precision instruments and other fields. Since wafers need to be temporarily fixed on a carrier for processing operations such as cutting, grinding and drilling, they are usually coated with glue or other adhesives to ensure the stability of the wafer on the carrier. At the same time, in order to avoid the adhesive from affecting the electrical properties of the quartz wafer, the wafer needs to be de-adhesive after processing.

[0003] The wafer to be debonded is first placed in a suitable position; then the operator uses a heating device (such as a hot air gun, infrared heater, etc.) to heat the wafer evenly to soften the adhesive; finally, the softened adhesive is removed from the wafer using tools.

[0004] However, if the temperature of the heating device is too high or the heating is uneven, it will cause changes in the physical properties of the wafer, and the wafer may even crack due to thermal stress. In addition, if the operator is not careful during the heating process, the wafer may move, tilt or fall, causing physical damage. Therefore, an automatic heating device for debonding quartz wafers is needed to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide an automatic heating device for debinding quartz wafers, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an automatic heating device for debinding quartz wafers, comprising:

[0007] Work box;

[0008] A placement panel is installed inside the work box;

[0009] A lifting assembly is provided, wherein multiple lifting assemblies are installed at intervals on the placement panel. Each lifting assembly includes a lifting rod, a linkage rod, a rotating gear, and a rotating screw meshing with the rotating gear. One end of the lifting rod is rotatably connected to the placement panel, and the other end of the lifting rod is rotatably connected to the linkage rod. The linkage rod is L-shaped, and the other end of the linkage rod is fixedly connected to the rotating gear. The rotating screw is rotatably installed between the multiple rotating gears along its own axial direction.

[0010] A heating assembly is installed inside the work box and positioned above the placement panel;

[0011] A degumming assembly is installed inside the work box and positioned between the placement panel and the lifting assembly;

[0012] A clamping assembly is mounted on the placement panel.

[0013] As a preferred embodiment, the clamping assembly includes a clamping plate, a rotating member, a rotating rod, and a moving block. The placement panel forms a groove for the moving block to slide in. The rotating member is rotatably mounted on the lower surface of the placement panel. Two clamping plates are provided, positioned on opposite sides of the placement panel, with the opposite sides of the two clamping plates being arc-shaped. The moving block is placed on the lower surface of the clamping plate. One end of the rotating rod is rotatably connected to the moving block, and the other end of the rotating rod is rotatably connected to the rotating member.

[0014] As a preferred embodiment, the heating assembly includes heating guns and support rods. Multiple heating guns are provided, and the multiple heating guns are rotatably mounted on the support rods at intervals. Four support rods are provided, and the two ends of the four support rods are connected to the adjacent side walls of the work box.

[0015] As a preferred embodiment, the degumming assembly includes a first slide rod, a first telescopic rod, and a scraping blade. The opposite side walls of the working box form a slide rail. Both ends of the first slide rod are slidably placed in the slide rail. One end of the first telescopic rod is connected to the lower surface of the first slide rod, and the other end of the first telescopic rod is connected to the scraping blade.

[0016] As a preferred embodiment, the degumming assembly further includes a second slide bar, a second telescopic bar, and a wiping component. The two ends of the second slide bar are slidably placed in the slide rail, one end of the second telescopic bar is connected to the lower surface of the second slide bar, and the other end of the second telescopic bar is connected to the wiping component.

[0017] As a preferred embodiment, the work box further includes a telescopic door, a door handle, and a storage slot, with one end of the telescopic door installed in the storage slot and the door handle installed at the other end of the telescopic door.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] This invention features a lifting assembly comprising a lifting rod, a linkage rod, a rotating gear, and a rotating screw. One end of the lifting rod is rotatably connected to a placement panel, and the other end is rotatably connected to the linkage rod, which is L-shaped. The other end of the linkage rod is fixedly connected to the rotating gear. The rotating screw rotates around its own axis, causing the linkage rod to rotate around the rotating gear axis. One end of the linkage rod moves upward, and the lifting rod moves upward simultaneously, lifting the placement panel and the wafer closer to the heating gun. The higher the placement panel and wafer are lifted and the closer they are to the heating gun, the higher the heating temperature of the wafer's surface to be debonded from the heating gun. This allows the placement panel and wafer to be lifted slowly and approach the heating gun slowly, gradually increasing the heating temperature of the wafer to prevent deformation due to thermal stress at excessively high temperatures.

[0020] This invention utilizes a clamping assembly comprising a clamping plate, a rotating component, a rotating rod, and a shifting block. A placement panel forms a sliding groove. The rotating component is rotatably mounted on the lower surface of the placement panel, and the shifting block is placed on the lower surface of the clamping plate. One end of the rotating rod is rotatably connected to the shifting block, and the other end is rotatably connected to the rotating component. The rotating component rotates around the center of the placement panel, causing the two ends of the rotating rods furthest from the rotating component to move closer together. This causes the two shifting blocks to move in the sliding groove towards each other, thereby simultaneously moving the two clamping plates towards the center of the placement panel. In this way, the wafer placed on the placement panel is fixed by the two clamping plates, preventing the wafer from shifting and being damaged during the debonding process. Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0022] Figure 2 This is a structural diagram of the present invention from one angle;

[0023] Figure 3 For the present utility model Figure 2 A magnified view of part A in the middle;

[0024] Figure 4 This is a structural diagram of the present invention from another angle;

[0025] Figure 5 This is a top view of the present invention;

[0026] Figure 6 This is a cross-sectional view of the present invention.

[0027] In the diagram: 1. Work box; 11. Slide rail; 12. Telescopic door; 13. Door handle; 14. Storage slot; 2. Placement panel; 21. Slide rail; 3. Lifting assembly; 31. Lifting rod; 32. Linkage rod; 33. Rotating gear; 34. Rotating screw; 4. Heating assembly; 41. Heating gun; 42. Support rod; 5. Degumming assembly; 51. First slide rod; 52. First telescopic rod; 53. Scraping blade; 54. Second slide rod; 55. Second telescopic rod; 56. Wiping component; 6. Clamping assembly; 61. Clamping plate; 62. Rotating component; 63. With rotating rod; 64. With moving block. Detailed Implementation

[0028] The present invention will be further described below with reference to the embodiments.

[0029] The following embodiments are used to illustrate the present invention, but should not be used to limit the scope of protection of the present invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the premise of the concept of the present invention are all within the scope of protection claimed by the present invention.

[0030] Please see Figure 1-6 This utility model provides an automatic heating device for debinding quartz wafers, comprising:

[0031] Workbox 1;

[0032] Placement panel 2 is installed inside the work box 1;

[0033] Lifting assembly 3, multiple lifting assemblies 3 are provided, and multiple lifting assemblies 3 are installed at intervals on the placement panel 2. The lifting assembly 3 includes a lifting rod 31, a linkage rod 32, a rotating gear 33, and a rotating screw 34 meshing with the rotating gear 33. One end of the lifting rod 31 is rotatably connected to the placement panel 2, and the other end of the lifting rod 31 is rotatably connected to the linkage rod 32. The linkage rod 32 is L-shaped, and the other end of the linkage rod 32 is fixedly connected to the rotating gear 33. The rotating screw 34 is rotatably installed between multiple rotating gears 33 along its own axis.

[0034] Heating component 4 is installed inside the work box 1 and positioned above the placement panel 2;

[0035] Degumming component 5 is installed inside the work box 1 and is positioned between the placement panel 2 and the lifting component 3;

[0036] Clamping assembly 6 is mounted on placement panel 2;

[0037] The clamping assembly 6 includes a clamping plate 61, a rotating member 62, a rotating rod 63, and a moving block 64. The placement panel 2 forms a groove 21 for the moving block 64 to slide. The rotating member 62 is rotatably mounted on the lower surface of the placement panel 2. Two clamping plates 61 are provided, and the two clamping plates 61 are placed on opposite sides of the placement panel 2, and the opposite sides of the two clamping plates 61 are arc-shaped. The moving block 64 is placed on the lower surface of the clamping plate 61. One end of the rotating rod 63 is rotatably connected to the moving block 64, and the other end of the rotating rod 63 is rotatably connected to the rotating member 62.

[0038] The heating assembly 4 includes heating guns 41 and support rods 42. Multiple heating guns 41 are provided, and multiple heating guns 41 are rotatably mounted on the support rods 42 at intervals. There are four support rods 42, and the two ends of the four support rods 42 are connected to the adjacent side walls of the working box 1.

[0039] The degumming assembly 5 includes a first slide rod 51, a first telescopic rod 52, and a scraping blade 53. The opposite side walls of the work box 1 form a slide rail 11. The two ends of the first slide rod 51 are slidably placed in the slide rail 11. One end of the first telescopic rod 52 is connected to the lower surface of the first slide rod 51, and the other end of the first telescopic rod 52 is connected to the scraping blade 53.

[0040] The degumming assembly 5 also includes a second slide bar 54, a second telescopic rod 55, and a wiping component 56. The two ends of the second slide bar 54 are slidably placed in the slide rail 11. One end of the second telescopic rod 55 is connected to the lower surface of the second slide bar 54, and the other end of the second telescopic rod 55 is connected to the wiping component 56.

[0041] The work box 1 also includes a telescopic door 12, a door handle 13, and a storage slot 14. One end of the telescopic door 12 is installed in the storage slot 14, and the door handle 13 is installed in the other end of the telescopic door 12.

[0042] Working principle and usage process of this utility model:

[0043] The wafer to be de-adhesive is placed horizontally on the placement panel 2, with the side of the wafer without adhesive in contact with the upper surface of the placement panel 2; the rotating member 62 rotates around the center of the placement panel 2, causing the two ends of the two rotating rods 63 that are away from the rotating member 62 to move closer to each other, so that the two moving blocks 64 move in the slide groove 21 in the direction of moving closer to each other, thereby causing the two clamping plates 61 to move simultaneously towards the center of the placement panel 2. In this way, the wafer placed on the placement panel 2 is fixed by the two clamping plates 61, preventing the wafer from shifting and being damaged during the de-adhesive process;

[0044] Subsequently, the screw 34 rotates around its own axis, causing the linkage rod 32, which is fixedly connected to the rotating gear 33, to rotate around the axis of the rotating gear 33. The end of the linkage rod 32 connected to the lifting rod 31 moves upward, and the lifting rod 31 also moves upward in sync, so that the placement panel 2 and the wafer are lifted upward to be close to the heating gun 41.

[0045] It is understandable that the higher the placement panel 2 and the wafer are lifted, the closer they are to the heating gun 41, and the higher the heating temperature of the wafer surface to be debonded from the heating gun 41. In this way, by setting the lifting component 3, the placement panel 2 and the wafer are slowly lifted and slowly approached the heating gun 41, and the heating temperature of the wafer by the heating gun 41 increases slowly, so as to prevent the wafer from deforming due to thermal stress at excessively high temperatures.

[0046] Furthermore, as the heating guns 41 rotate around the support rod 42, the closer the air outlet of the heating gun 41 is to the center of the placement panel 2, the more concentrated the heating range of the heating gun 41 on the wafer becomes; conversely, as the heating gun 41 rotates around the support rod 42, the further the air outlet of the heating gun 41 is from the center of the placement panel 2, the more dispersed the heating range of the wafer becomes. This achieves the purpose of heating adhesives of different area sizes coated on the wafer, improving the applicability of the equipment.

[0047] After the adhesive on the wafer is softened by the heating component 4, the rotating screw 34 rotates and moves the placement panel 2 and the wafer down to below the de-adhesion component 5; the first telescopic rod 52 moves the scraping blade 53 down to the adhesive on the wafer; then, the first slide rod 51 moves the first telescopic rod 52 and the scraping blade 53 along the axial direction of the slide rail 11, so that the scraping blade 53 removes the adhesive on the wafer.

[0048] After the adhesive on the wafer is removed by the scraping blade 53, the second telescopic rod 55 moves the wiping element 56 down to be close to the wafer; then, the second slide rod 54 moves the second telescopic rod 55 and the wiping element 56 to slide along the axial direction of the slide rail 11 to wipe away the impurities remaining on the wafer.

[0049] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic heating device for debinding quartz wafers, characterized in that, include: Workbox (1); Placement panel (2), which is installed inside the work box (1); A lifting assembly (3) is provided in multiple units, and the multiple lifting assemblies (3) are installed at intervals on the placement panel (2). The lifting assembly (3) includes a lifting rod (31), a linkage rod (32), a rotating gear (33), and a rotating screw (34) meshing with the rotating gear (33). One end of the lifting rod (31) is rotatably connected to the placement panel (2), and the other end of the lifting rod (31) is rotatably connected to the linkage rod (32). The linkage rod (32) is L-shaped, and the other end of the linkage rod (32) is fixedly connected to the rotating gear (33). The rotating screw (34) is rotatably installed between the multiple rotating gears (33) along its own axial direction. Heating assembly (4), which is installed inside the work box (1) and positioned above the placement panel (2); Degumming assembly (5), which is installed inside the work box (1) and positioned between the placement panel (2) and the lifting assembly (3); A clamping assembly (6) is mounted on the placement panel (2).

2. The automatic heating device for debinding quartz wafers according to claim 1, characterized in that: The clamping assembly (6) includes a clamping plate (61), a rotating member (62), a rotating rod (63), and a moving block (64). The placement panel (2) forms a groove (21) for the moving block (64) to slide. The rotating member (62) is rotatably mounted on the lower surface of the placement panel (2). There are two clamping plates (61), which are placed on opposite sides of the placement panel (2) and are arc-shaped. The moving block (64) is placed on the lower surface of the clamping plate (61). One end of the rotating rod (63) is rotatably connected to the moving block (64), and the other end of the rotating rod (63) is rotatably connected to the rotating member (62).

3. The automatic heating device for debinding quartz wafers according to claim 2, characterized in that: The heating assembly (4) includes a heating gun (41) and a support rod (42). Multiple heating guns (41) are provided, and multiple heating guns (41) are rotatably mounted on the support rod (42) at intervals. Four support rods (42) are provided, and the two ends of the four support rods (42) are connected to the adjacent side walls of the work box (1).

4. The automatic heating device for debinding quartz wafers according to claim 3, characterized in that: The degumming assembly (5) includes a first slide rod (51), a first telescopic rod (52), and a scraping blade (53). The opposite side walls of the work box (1) form a slide rail (11). The two ends of the first slide rod (51) are slidably placed in the slide rail (11). One end of the first telescopic rod (52) is connected to the lower surface of the first slide rod (51), and the other end of the first telescopic rod (52) is connected to the scraping blade (53).

5. The automatic heating device for debinding quartz wafers according to claim 4, characterized in that: The degumming assembly (5) further includes a second slide bar (54), a second telescopic rod (55), and a wiping component (56). The two ends of the second slide bar (54) are slidably placed in the slide rail (11). One end of the second telescopic rod (55) is connected to the lower surface of the second slide bar (54), and the other end of the second telescopic rod (55) is connected to the wiping component (56).

6. The automatic heating device for debinding quartz wafers according to claim 5, characterized in that: The work box (1) also includes a telescopic door (12), a door handle (13) and a storage slot (14). One end of the telescopic door (12) is installed in the storage slot (14), and the door handle (13) is installed in the other end of the telescopic door (12).

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