Laser repairing device and laser repairing equipment

Abstract

The utility model relates to a laser repairing device and equipment, and the laser repairing device comprises a pressing mechanism which comprises a pressing assembly and a pressure sensing assembly, the pressing assembly is located above a to-be-repaired workpiece, the pressure sensing assembly is connected to the pressing assembly, and the pressure sensing assembly can detect the pressure generated when the pressing assembly presses the to-be-repaired workpiece; a transparent material is arranged in the middle of the pressing assembly, and the pressure sensing assembly is of a hollow structure. The lifting unit is connected to the pressing mechanism; the sliding table mechanism is connected to the lifting unit and can drive the lifting unit to move relative to the sliding table mechanism in the length direction and the width direction of the sliding table mechanism; the laser device is located above the sliding table mechanism, and laser beams output by the laser device can penetrate through the pressure sensing assembly and the pressing assembly to irradiate the to-be-repaired workpiece. According to the laser repairing device, the problem that the repairing speed is low due to the fact that manual operation is needed in the laser repairing process is effectively solved, and then the higher requirement of laser application in the chip production process is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser, in particular to a laser repairing device and a laser repairing equipment. BACKGROUND

[0002] With the continuous progress of laser technology and the continuous diversification of laser product application scenarios, the requirements for laser application are getting higher and higher. In the chip processing process, various defects such as impurities, cracks and short circuits may occur on the chip due to human operation, material defects or equipment failure, so chip defect repair is crucial to ensure the quality and reliability of the chip.

[0003] The common chip defect repair technology is to repair the detected defects by laser repairing equipment, but the repair process needs manual operation, and the repair speed is slow, which is difficult to meet the mass production demand of chips. CONTENT OF THE INVENTION

[0004] Therefore, it is necessary to provide a laser repairing device and a laser repairing equipment aiming at the above technical problems.

[0005] A laser repairing device comprises:

[0006] A pressing mechanism comprises a pressing assembly and a pressure sensing assembly. The pressing assembly is located above a workpiece to be repaired. The pressure sensing assembly is connected to the pressing assembly. The pressure sensing assembly can detect the pressure when the pressing assembly is pressed against the workpiece to be repaired. The middle part of the pressing assembly is provided with a transparent material. The pressure sensing assembly is a hollow structure.

[0007] A lifting unit is connected to the pressing mechanism.

[0008] A sliding table mechanism is connected to the lifting unit. The lifting unit can move along the length direction and the width direction of the sliding table mechanism relative to the sliding table mechanism.

[0009] A laser is located above the sliding table mechanism. The laser beam output by the laser can irradiate the workpiece to be repaired through the pressure sensing assembly and the pressing assembly.

[0010] In one embodiment, the laser repairing device further comprises:

[0011] A detection camera is located above the sliding table mechanism. The detection light output by the detection camera can irradiate the workpiece to be repaired through the pressure sensing assembly and the pressing assembly.

[0012] A light path adjusting unit is located in the transmission direction of the laser beam output by the laser and the detection light output by the detection camera. The light path adjusting unit can adjust the transmission light path of the laser beam output by the laser and the detection light output by the detection camera.

[0013] In one of the embodiments, the light path adjusting unit comprises a first mirror, a second mirror, a beam splitter and an objective lens, the objective lens is located above the workpiece to be repaired, the beam splitter can receive the laser beam transmitted by the first mirror and the detection light transmitted by the second mirror and transmit to the objective lens.

[0014] In one of the embodiments, the pressing assembly comprises a transparent boss, a limiting piece and a connecting piece, the edge of the transparent boss is limited by the limiting piece, a connecting hole is formed on the side of the limiting piece away from the workpiece to be repaired, and the connecting piece is connected to the pressure sensing assembly through the connecting hole.

[0015] In one of the embodiments, the pressure sensing assembly comprises a pressure sensor and a sensor mounting part, the sensor mounting part is provided with a connecting through hole, the middle part of the pressure sensor is provided with a light path through hole, and the edge of the pressure sensor is limited by the sensor mounting part.

[0016] In one of the embodiments, the lifting unit comprises a vertical sliding seat, a vertical driving part and a vertical mounting part, the output end of the vertical driving part is connected to the vertical sliding seat, and the vertical driving part is arranged on the vertical mounting part.

[0017] In one of the embodiments, the sliding table mechanism comprises a horizontal sliding table assembly and a longitudinal sliding table assembly, the horizontal sliding table assembly is connected to the longitudinal sliding table assembly, the horizontal sliding table assembly can move relative to the sliding table mechanism along the length direction of the sliding table mechanism, and the longitudinal sliding table can move relative to the sliding table mechanism along the width direction of the sliding table mechanism.

[0018] In one of the embodiments, the horizontal sliding table assembly comprises a horizontal sliding table, a horizontal driving part and a horizontal mounting part, the output end of the horizontal driving part is connected to the horizontal sliding table, and the horizontal driving part is arranged on the horizontal mounting part.

[0019] In one of the embodiments, the longitudinal sliding table assembly comprises a longitudinal sliding table, a longitudinal driving part and a longitudinal mounting part, the output end of the longitudinal driving part is connected to the longitudinal sliding table, and the longitudinal driving part is arranged on the longitudinal mounting part.

[0020] A laser repair device comprises:

[0021] The laser repair device as described above.

[0022] The technical effects of the embodiments provided in the present application are as follows:

[0023] The laser repair device is characterized in that the lifting unit connected to the pressing mechanism is used to adjust the height of the pressing mechanism along the height direction of the lifting unit, the sliding table mechanism connected to the lifting unit is used to drive the lifting unit to move along the length and width direction of the sliding table mechanism relative to the sliding table mechanism, that is, the position of the pressing mechanism is adjusted along the height direction and the horizontal direction at the same time, the pressing assembly in the pressing mechanism located above the workpiece to be repaired (such as a chip with defects) is close to and pressed against the upper surface of the workpiece to be repaired, the pressure sensing assembly arranged in the pressing mechanism is used to detect the pressure when the pressing assembly is pressed against the workpiece to be repaired, and the laser beam output by the laser located above the sliding table mechanism passes through the pressure sensing assembly of the hollow structure and the transparent material arranged in the middle of the pressing assembly and then irradiates the workpiece to be repaired, so that the workpiece to be repaired is repaired. While improving the accuracy of laser repair, the problem of slow repair speed caused by manual operation in the laser repair process is effectively solved, thereby ensuring the efficiency of the laser repair process, thereby meeting the repair demand of a large number of chips in the chip production process, and further meeting the higher requirements of laser application in the chip production process. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0025] Figure 1 It is a structural schematic diagram of the laser repair device in an embodiment.

[0026] Figure 2 It is an exploded structural schematic diagram of the laser repair device in an embodiment.

[0027] Figure 3 It is a structural schematic diagram of the laser repair device in an embodiment. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present application more clear, the following will further describe the present application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0029] It should be noted that when an element is referred to as "fixed to" or "arranged on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0030] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate directions or positions based on the directions or positions shown in the drawings, and are used only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0031] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0032] Figure 1 , it is a structural schematic diagram of a laser repair device in an embodiment.

[0033] In the present embodiment, as shown in Figure 1 , the laser repair device can be used for repairing the machining defects existing on the workpiece to be repaired (such as LED chip), and the laser repair device comprises a pressing mechanism 10, a lifting unit 20, a sliding table mechanism 30, a laser, a detection camera and a light path adjusting unit.

[0034] As shown in Figure 2 , the pressing mechanism 10 comprises a pressing assembly 110 and a pressure sensing assembly 120, the pressing assembly 110 is located above the workpiece to be repaired, the pressure sensing assembly 120 is connected to the pressing assembly 110, the pressure sensing assembly 120 can detect the pressure when the pressing assembly 110 is pressed to the workpiece to be repaired, and the middle part of the pressing assembly 110 is provided with a transparent material, and the pressure sensing assembly 120 is a hollow structure.

[0035] The pressing mechanism 10 can be located above the workpiece to be repaired and connected to the lifting unit 20, and can be close to and pressed to the workpiece to be repaired under the driving action of the lifting unit 20 and detect the pressure when the pressing assembly 110 is pressed to the workpiece to be repaired. The pressure sensing assembly 120 can be located above the workpiece to be repaired and connected to the pressing assembly 110 and the lifting unit 20, and can be close to the workpiece to be repaired under the driving action of the lifting unit 20 and detect the pressure when the pressing assembly 110 is pressed to the workpiece to be repaired. The pressing assembly 110 can be connected to the pressure sensing assembly 120 and located above the workpiece to be repaired, and can be close to and pressed to the workpiece to be repaired under the driving action of the lifting unit 20 and contact the workpiece to be repaired.

[0036] The pressing assembly 110 comprises a transparent boss 1110, a limiting piece 1120, and a connecting piece. The edge of the transparent boss 1110 is limited by the limiting piece 1120. The limiting piece 1120 is provided with a connecting hole on the side away from the workpiece to be repaired. The connecting piece is connected to the pressure sensing assembly 120 through the connecting hole. The pressure sensing assembly 120 comprises a pressure sensor 1210 and a sensor mounting component 1220. The sensor mounting component 1220 is provided with a connecting through hole. The middle part of the pressure sensor 1210 is provided with a light path through hole. The edge of the pressure sensor 1210 is limited by the sensor mounting component 1220.

[0037] The transparent boss 1110 can be located above the workpiece to be repaired and limited by the limiting piece 1120. It can follow the lifting unit 20 to approach and press the contact workpiece to be repaired. The limiting piece 1120 can be arranged around the transparent boss 1110, which can limit the edge of the transparent boss 1110. The connecting piece can be connected between the limiting piece 1120 and the pressure sensing assembly 120, which can connect the limiting piece 1120 and the transparent boss 1110 limited to the pressure sensing assembly 120. The pressure sensor 1210 can be connected between the connecting piece and the sensor mounting component 1220, which can detect the pressure when the pressing assembly 110 presses the workpiece to be repaired. The sensor mounting component 1220 can be connected to the lifting unit 20 and the pressure sensor 1210, which can support the pressure sensor 1210 and drive the pressure sensor 1210 to move with the lifting unit 20.

[0038] Optionally, the transparent boss 1110 can be a glass boss. The limiting piece 1120 can be a glass snap ring or a glass sleeve. The connecting piece can be a screw or a screw and other fixed connecting pieces. The sensor mounting component 1220 can be a mounting plate or a mounting block with a reinforcing plate structure.

[0039] The lifting unit 20 is connected to the pressing mechanism 10. The lifting unit 20 comprises a vertical sliding seat 210, a vertical driving piece 220, and a vertical mounting component 230. The output end of the vertical driving piece 220 is connected to the vertical sliding seat 210. The vertical driving piece 220 is arranged on the vertical mounting component 230.

[0040] The lifting unit 20 can be a functional unit connected to the pressing mechanism 10 and the sliding table mechanism 30, capable of moving the pressing mechanism 10 along the length direction and the width direction of the sliding table mechanism 30 relative to the sliding table mechanism 30 under the action of the sliding table mechanism 30, and driving the pressing mechanism 10 to adjust the height along the height direction of the lifting unit 20. The vertical sliding seat 210 can be a sliding seat connected to the pressing mechanism 10 and the vertical driving member 220, capable of adjusting the height of the pressing mechanism 10 along the height direction of the lifting unit 20 under the action of the vertical driving member 220. The vertical mounting component 230 can be a functional component connected to the sliding table mechanism 30, capable of moving the pressing mechanism 10 along the length direction and the width direction of the sliding table mechanism 30 relative to the sliding table mechanism 30 under the action of the sliding table mechanism 30. The vertical driving member 220 can be a driving member connected to the vertical sliding seat 210 and the vertical mounting component 230, capable of driving the vertical sliding seat 210 to adjust the height along the height direction of the lifting unit 20.

[0041] Optionally, the vertical driving member 220 can be a voice coil motor arranged along the height direction of the lifting unit 20. The voice coil motor adopts a grating and has extremely high resolution. Subdivision can be very small and can be more accurate.

[0042] Through the transparent boss 1110 (such as a glass boss) in the pressing assembly 110, the pressure sensor 1210 in the pressure assembly 120, and the vertical driving member 220 (such as a voice coil motor) in the lifting unit 20, the real-time feedback and control of the unit pressing amount of the transparent boss 1110 (such as a glass boss) in the pressing assembly 110 can be realized. That is, when the transparent boss 1110 is pressed to contact the workpiece to be repaired (such as a LED chip with defects), the vertical driving member 220 will generate how much pressure every 1mm. For example, when the transparent boss 1110 does not press to contact the workpiece to be repaired, the pressure sensor 1210 feedbacks a value of 0N. When the transparent boss 1110 just contacts the workpiece to be repaired, the pressure sensor 1210 feedbacks a value of 0.11N. Then, the vertical driving member 220 moves the transparent boss 1110 downward by 0.01mm every time to observe the corresponding feedback difference of the pressure sensor 1210. The corresponding pressure value after each movement of the vertical driving member 220 is compared and written into the control program to realize the control of the pressing amount and the pressing force. At the same time, the test can also measure how much pressing force is needed to press and explode the workpiece to be repaired.

[0043] Meanwhile, the downward pressure is soft-limited by the pressure sensor 1210, and if the pressure exceeds a set upper limit, the downward pressing action is immediately stopped and an alarm is given; that is, the voice coil motor moves in the vertical direction, a short-stroke high-response speed built-in grating feedback forms a closed-loop control, and is matched with the pressure sensor 1210 to realize precise control of the downward pressure, effectively improving the problem of crushing the chip due to uncontrollable pressure or false welding due to not being pressed into place.

[0044] The sliding table mechanism 30 is connected to the lifting unit 20 and can drive the lifting unit 20 to move relative to the sliding table mechanism 30 in the length direction and the width direction of the sliding table mechanism 30. The sliding table mechanism 30 includes a transverse sliding table assembly 310 and a longitudinal sliding table assembly 320, the transverse sliding table assembly 310 is connected to the longitudinal sliding table assembly 320, the transverse sliding table assembly 310 can move relative to the sliding table mechanism 30 in the length direction of the sliding table mechanism 30, and the longitudinal sliding table 3210 can move relative to the sliding table mechanism 30 in the width direction of the sliding table mechanism 30.

[0045] The sliding table mechanism 30 can be located above the workpiece to be repaired and connected to the lifting unit 20, and can drive the lifting unit 20 and the pressing mechanism 10 to move relative to the sliding table mechanism 30 in the length direction and the width direction of the sliding table mechanism 30 to drive the pressing mechanism 10 to adjust the position in the horizontal direction. The transverse sliding table assembly 310 can be connected to the lifting unit 20 and can drive the lifting unit 20 to move relative to the sliding table mechanism 30 in the length direction of the sliding table mechanism 30 to drive the pressing mechanism 10 to adjust the position in the horizontal transverse direction. The longitudinal sliding table assembly 320 can be connected to the lifting unit 20 and can drive the lifting unit 20 to move relative to the sliding table mechanism 30 in the width direction of the sliding table mechanism 30 to drive the pressing mechanism 10 to adjust the position in the horizontal longitudinal direction.

[0046] Optionally, the transverse sliding table assembly 310 can be a driving assembly arranged in the length direction of the sliding table mechanism 30. The longitudinal sliding table assembly 320 can be a driving assembly arranged in the width direction of the sliding table mechanism 30.

[0047] The transverse sliding table assembly 310 includes a transverse sliding table 3110, a transverse driving member 3120, and a transverse mounting component 3130, the output end of the transverse driving member 3120 is connected to the transverse sliding table 3110, and the transverse driving member 3120 is arranged on the transverse mounting component 3130. The longitudinal sliding table assembly 320 includes a longitudinal sliding table 3210, a longitudinal driving member 3220, and a longitudinal mounting component 3230, the output end of the longitudinal driving member 3220 is connected to the longitudinal sliding table 3210, and the longitudinal driving member 3220 is arranged on the longitudinal mounting component 3230.

[0048] The lateral driving member 3120 can be a functional member connected to the lateral sliding table 3110 and capable of driving the lateral sliding table 3110 to move along the height direction of the lateral mounting member 3130 relative to the lateral mounting member 3130. The lateral mounting member 3130 can be a functional member connected to the lateral driving member 3120 and capable of providing support for the lateral driving member 3120. The longitudinal driving member 3220 can be a functional member connected to the longitudinal sliding table 3210 and capable of driving the longitudinal sliding table 3210 to move along the height direction of the longitudinal mounting member 3230 relative to the longitudinal mounting member 3230. The longitudinal mounting member 3230 can be a functional member connected to the longitudinal driving member 3220 and capable of providing support for the longitudinal driving member 3220.

[0049] Optionally, the lateral driving member 3120 can be a driver arranged along the length direction of the sliding table mechanism 30. The longitudinal driving member 3220 can be a driver arranged along the width direction of the sliding table mechanism 30. The lateral mounting member 3130 can be a mounting plate or mounting block arranged along the length direction of the sliding table mechanism 30. The longitudinal mounting member 3230 can be a mounting plate or mounting block arranged along the width direction of the sliding table mechanism 30.

[0050] By the lateral sliding table 3110 in the lateral sliding table assembly 310 and the longitudinal sliding table 3210 in the longitudinal sliding table assembly 320 arranged in the length direction and the width direction of the sliding table mechanism 30, the movement control along the length direction and the width direction of the sliding table mechanism 30 can be realized, i.e. the position adjustment of the transparent boss 1110 (such as a glass boss) in the pressing assembly 110 along the length direction and the width direction of the sliding table mechanism 30 can be realized, which can ensure that the automatic adjustment center of the transparent boss 1110 (such as a glass boss) is coaxial with the laser beam center, thereby ensuring the machining center and further ensuring the high machining precision.

[0051] The laser is located above the sliding table mechanism 30, and the laser beam output by the laser can irradiate the workpiece to be repaired through the pressure sensing assembly 120 and the pressing assembly 110. Optionally, the laser can be a fiber laser.

[0052] The detection camera is located above the sliding table mechanism 30, and the detection light output by the detection camera can irradiate the workpiece to be repaired through the pressure sensing assembly 120 and the pressing assembly 110; the light path adjusting unit is located in the transmission direction of the laser beam output by the laser and the detection light output by the detection camera, and is capable of adjusting the transmission light path of the laser beam output by the laser and the detection light output by the detection camera.

[0053] The detection camera can be an image acquisition camera located above the sliding table mechanism 30, capable of outputting detection light to detect the workpiece to be repaired. The light path adjusting unit can be a functional unit arranged close to the laser and the detection camera, capable of adjusting the transmission light path of the laser beam output by the laser and the detection light output by the detection camera.

[0054] The light path adjusting unit includes a first mirror, a second mirror, a beam splitter and an objective lens, the objective lens is located above the workpiece to be repaired, and the beam splitter can receive the laser beam transmitted by the first mirror and the detection light transmitted by the second mirror and transmit them to the objective lens.

[0055] Optionally, the objective lens can be a high-power objective lens, which usually has a short working distance and is suitable for high-precision and fine laser processing. After the laser beam is focused through the objective lens, the energy density will increase and a smaller focused spot can be generated. For example, the current conventional LED chip size is 15*30um, and the normal laser spot is several millimeters or even tens of millimeters. Such a focused spot cannot be directly used for processing. The use of a high-power objective lens can magnify the LED chip to make the observation more careful and achieve more precise processing.

[0056] The transmission light path of the laser beam output by the laser is reflected by the mirror, transmitted through the beam splitter, and then reaches the surface of the workpiece to be repaired after passing through the objective lens. The transmission light path of the detection light output by the detection camera is reflected by the mirror, reflected by the beam splitter, and then observed by the objective lens to the surface of the workpiece to be repaired.

[0057] It should be noted that the surface of the beam splitter lens is coated with a special coating or layer to reflect part of the light and allow part of the light to pass through. The anti-reflection lens can reflect the laser beam back to the laser source or direct it to other safe areas, thereby avoiding direct irradiation of the laser beam onto the detection camera lens, which helps to protect the detection from damage by the laser beam and prolongs its service life. The detection camera can capture image information during the laser processing process, allowing real-time monitoring of the processing effect. Combined with image processing technology and algorithms, the processing process can be accurately controlled to improve processing precision and efficiency. In addition, filters such as optical filters and polarizing filters can be installed in front of the detection camera to reduce the direct irradiation intensity of the laser on the lens. By adjusting the angle and position of the anti-reflection lens, the reflection direction of the laser beam can be changed, allowing the detection camera to capture details from different angles during the laser processing process, providing important information for analyzing and optimizing the processing process, and achieving concentricity between the detection light output by the detection camera and the laser beam output by the laser. Through the mirror and the beam splitter, processing, observation and imaging can be achieved simultaneously.

[0058] For example, Figure 3As shown, after the to-be-repaired workpiece is positioned and the code is read by the detection camera, the slide table mechanism 30 and the lifting unit 20 are used to move the to-be-repaired workpiece (such as a chip with defects) that needs to be solidified to the middle of the field of view of the detection camera and the field of view. After the to-be-repaired workpiece (such as a chip with defects) is positioned again by the detection camera, the glass boss is pressed down, and the pressure sensor 1210 feeds back whether the pressing is in place. After the to-be-repaired workpiece (such as a chip with defects) is heated by the laser light emitted by the laser, the solder at the bottom of the to-be-repaired workpiece (such as a chip with defects) is melted, so that the to-be-repaired workpiece (such as a chip with defects) and the back plate are electrically connected. After solidification is completed, the transparent boss 1110 is lifted, and the bottom shaft moves the second to-be-repaired workpiece (such as a chip with defects) that needs to be welded to the detection camera field of view until the to-be-repaired workpiece (such as a chip with defects) on the substrate is completely repaired, and the process is completed. The above process improves the accuracy of laser repair while effectively improving the problem of slow repair speed caused by manual operation in the laser repair process, thereby ensuring the efficiency of the laser repair process. The distance between the objective lens and the to-be-repaired workpiece in the height direction is generally a preset value, which is 15mm in this application.

[0059] The application also provides a laser repair device, which comprises the laser repair apparatus in the above embodiments.

[0060] The division of each module in the above laser repair apparatus is only for illustration, and in other embodiments, the laser repair apparatus can be divided into different modules as needed to complete all or part of the functions of the above laser repair apparatus.

[0061] The laser repair apparatus and the laser repair device provided in the above embodiments adjust the height of the pressing mechanism along the height direction of the lifting unit, and drive the lifting unit to move relative to the slide table mechanism along the length and width directions of the slide table mechanism, that is, to adjust the position of the pressing mechanism along the height direction and also along the horizontal direction. The pressing assembly in the pressing mechanism is close to and pressed against the upper surface of the to-be-repaired workpiece (such as a chip with defects). The pressure sensing assembly arranged in the pressing mechanism detects the pressure when the pressing assembly is pressed against the to-be-repaired workpiece. The laser beam output by the laser located above the slide table mechanism passes through the transparent material arranged in the middle of the pressure sensing assembly and the pressing assembly, and then irradiates the to-be-repaired workpiece to repair the to-be-repaired workpiece. The above process improves the accuracy of laser repair while effectively improving the problem of slow repair speed caused by manual operation in the laser repair process, thereby ensuring the efficiency of the laser repair process, meeting the repair needs of a large number of chips in the chip production process, and meeting the higher requirements of laser application in the chip production process, which has important economic value and practical value.

[0062] Any combination of the technical features in the above-described embodiments can be made. For the sake of brevity, the foregoing description is not intended to be exhaustive or to limit the scope of the application to the precise form disclosed. Modifications and alterations can occur to others upon reading and understanding the disclosure. Accordingly, the scope of the application is intended to be limited only by the appended claims.

[0063] The above-described embodiments are merely illustrative of several embodiments of the present application, and the description is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the scope of the patent of the present application should be subject to the appended claims.

Claims

1. A laser repair apparatus, characterized by, The laser repair device comprises: a pressing mechanism, which comprises a pressing assembly and a pressure sensing assembly, the pressing assembly is located above the workpiece to be repaired, the pressure sensing assembly is connected to the pressing assembly, the pressure sensing assembly can detect the pressure when the pressing assembly is pressed against the workpiece to be repaired, the middle part of the pressing assembly is provided with a transparent material, and the pressure sensing assembly is a hollow structure; a lifting unit connected to the pressing mechanism; a sliding table mechanism connected to the lifting unit, which can drive the lifting unit to move along the length direction and width direction of the sliding table mechanism relative to the sliding table mechanism; a laser located above the sliding table mechanism, and the laser beam output by the laser can irradiate the workpiece to be repaired through the pressure sensing assembly and the pressing assembly.

2. The laser repair device of claim 1, wherein, The laser repair device further comprises: a detection camera located above the sliding table mechanism, and the detection light output by the detection camera can irradiate the workpiece to be repaired through the pressure sensing assembly and the pressing assembly; a light path adjusting unit located in the transmission direction of the laser beam output by the laser and the detection light output by the detection camera, which can adjust the transmission light path of the laser beam output by the laser and the detection light output by the detection camera.

3. The laser repair device of claim 2, wherein, The light path adjusting unit comprises a first mirror, a second mirror, a beam splitter and an objective lens, the objective lens is located above the workpiece to be repaired, and the beam splitter can receive the laser beam transmitted through the first mirror and the detection light transmitted through the second mirror and transmit them to the objective lens.

4. The laser repair device of claim 1, wherein, The pressing assembly comprises a transparent boss, a limiting piece and a connecting piece, the edge of the transparent boss is limited by the limiting piece, a connecting hole is formed in the side of the limiting piece away from the workpiece to be repaired, and the connecting piece passes through the connecting hole and is connected to the pressure sensing assembly.

5. The laser repair device of claim 1, wherein, The pressure sensing assembly comprises a pressure sensor and a sensor mounting part, the sensor mounting part is provided with a connecting through hole, the middle part of the pressure sensor is provided with a light path through hole, and the edge of the pressure sensor is limited by the sensor mounting part.

6. The laser repair device of claim 1, wherein, The lifting unit comprises a vertical sliding seat, a vertical driving part and a vertical mounting part, the output end of the vertical driving part is connected to the vertical sliding seat, and the vertical driving part is arranged on the vertical mounting part.

7. The laser repair device of claim 1, wherein, The sliding table mechanism comprises a horizontal sliding table assembly and a vertical sliding table assembly, the horizontal sliding table assembly is connected to the vertical sliding table assembly, the horizontal sliding table assembly can move along the length direction of the sliding table mechanism relative to the sliding table mechanism, and the vertical sliding table can move along the width direction of the sliding table mechanism relative to the sliding table mechanism.

8. The laser repair device of claim 7, wherein, The horizontal sliding table assembly comprises a horizontal sliding table, a horizontal driving part and a horizontal mounting part, the output end of the horizontal driving part is connected to the horizontal sliding table, and the horizontal driving part is arranged on the horizontal mounting part.

9. The laser repair device of claim 7, wherein, The vertical sliding table assembly comprises a vertical sliding table, a vertical driving part and a vertical mounting part, the output end of the vertical driving part is connected to the vertical sliding table, and the vertical driving part is arranged on the vertical mounting part.

10. A laser repair apparatus, characterized by, The laser repair device comprises: The laser repair device of any one of claims 1 to 9.

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