Flattening device and laser welding system
By using the rigid pressure plate and track assembly of the flattening device, the problem of poor laser welding effect caused by uneven wafer surface was solved, optical contact between wafers was achieved, and welding reliability and yield were improved.
Patent Information
- Application Number
- CN202423068777.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-12-12
AI Technical Summary
In the semiconductor field, unevenness and deformation of the wafer surface can cause excessive distance between the mating surfaces of two wafers, affecting the laser welding effect and reducing welding reliability and yield.
A flattening device is used, including a bottom platform and a pressing assembly. It utilizes a rigid pressure plate and multiple track assemblies, and a driving component makes the rigid pressure plate fit against the wafer surface, adjusting the distance between wafers to meet the requirements of laser welding.
By using a flattening device, the distance between the wafer bonding surfaces is reduced, improving the reliability and yield of laser welding, ensuring a flat wafer surface, and meeting the optical contact requirements.
Smart Images
Figure CN223776295U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and in particular to a flattening device and a laser welding system. Background Technology
[0002] In the semiconductor industry, there is a need to bond wafers together. Laser welding is a common method to join two stacked wafers together. Laser welding utilizes a laser to create a non-linear effect on the surfaces of the two wafers, thereby bonding the wafer materials together. When using laser welding, the distance between the mating surfaces of the two wafers must reach the optical contact distance, for example, less than 100 micrometers. However, wafer surfaces are not ideally flat, wafers can deform, and vibrations during manufacturing can cause the distance between the mating surfaces to become too large, affecting the laser welding effect.
[0003] Therefore, how to reduce the distance between the mating surfaces of two wafers to meet the requirements of laser welding and improve the reliability and yield of wafer welding is an urgent problem to be solved. Utility Model Content
[0004] According to a first aspect of the present disclosure, a flattening device is provided, the flattening device comprising: a bottom platform and a pressing assembly, the pressing assembly comprising a rigid pressure plate and N first track assemblies; the first track assembly comprising a first track, a first drive unit and a first slide; N is an integer greater than or equal to 2;
[0005] The bottom platform has a first flat surface for placing the object to be flattened;
[0006] The first track is arranged along a first direction perpendicular to the first plane, and the first driving unit drives the first slide to move along the first track;
[0007] The rigid pressure plate is fixedly connected to the first slide of each of the first track assemblies;
[0008] The rigid pressure plate is based on a second plane that is opposite to the first plane, and is used to flatten the object to be flattened in conjunction with the first plane when the first slide moves toward the first plane.
[0009] In conjunction with the embodiments of the first aspect, in some embodiments, the first drive unit includes a first stepper motor and a first screw, wherein,
[0010] The first screw is arranged along the first track;
[0011] The first screw is driven by the first stepper motor, and through the threaded engagement with the first slide, it drives the first slide to move along the first track.
[0012] In conjunction with the embodiments of the first aspect, in some embodiments, the flattening device further includes a second track assembly; the second track assembly includes a second track, a second drive unit, and a second slide.
[0013] The pressing assembly is fixedly connected to the second slide table;
[0014] The second track is arranged along a second direction parallel to the first plane, and the second drive unit drives the second slide to move the pressing assembly along the second track.
[0015] In conjunction with the embodiments of the first aspect, in some embodiments, the second track assembly has two components;
[0016] Each of the second slides is fixedly connected to at least one of the first tracks.
[0017] In conjunction with the embodiments of the first aspect, in some embodiments, the second drive unit includes a second stepper motor and a second screw, wherein,
[0018] The second screw is arranged along the second track;
[0019] The second screw is driven by the second stepper motor, and through the threaded engagement with the second slide, it drives the second slide to move along the second track.
[0020] In conjunction with the embodiments of the first aspect, in some embodiments, there are two second track assemblies, and the two second track assemblies are respectively arranged in parallel with the second tracks. The flattening device further includes at least two rigid support rods disposed between the two second tracks to maintain the distance between the two second tracks.
[0021] In conjunction with the embodiments of the first aspect, in some embodiments, there are two objects to be flattened, and they are stacked together;
[0022] The rigid pressure plate is provided with a window through which a laser can pass to reach the contact surface between the two objects to be flattened.
[0023] or,
[0024] The rigid pressure plate has a preset transparency so that the laser can pass through the rigid pressure plate to reach the contact surface between the two objects to be flattened.
[0025] According to a second aspect of the present disclosure, a laser welding system is provided, the laser welding system including a laser system and the flattening device described in the first aspect.
[0026] This embodiment provides a flattening device and a laser welding system. The flattening device includes a bottom platform and a pressing assembly. The pressing assembly includes a rigid pressure plate and N first track assemblies. Each first track assembly includes a first track, a first drive unit, and a first slide. N is an integer greater than or equal to 2. The bottom platform has a first plane for placing the object to be flattened. The first track is arranged along a first direction perpendicular to the first plane, and the first drive unit drives the first slide to move along the first track. The rigid pressure plate is fixedly connected to the first slide of each first track assembly. The rigid pressure plate is based on a second plane opposite to the first plane and is used to flatten the object to be flattened by combining with the first plane when the first slide moves toward the first plane. Two overlapping objects to be flattened are placed on the first plane. The rigid pressure plate, driven by the first drive unit, applies pressure to the two overlapping objects through the second plane. This causes the objects to be flattened to adhere to the first or second plane, thereby flattening the objects and reducing the distance between the contact surfaces of the two objects, meeting the requirements of laser welding, and thus improving welding reliability and yield during laser welding. On the other hand, each first track assembly has a first drive unit, which can be adjusted independently, improving the flexibility of pressure adjustment. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of a flattening device structure according to an exemplary embodiment;
[0028] Figure 2 This is a schematic diagram of a flattening device structure according to an exemplary embodiment;
[0029] Figure 3 This is a schematic diagram of a flattening device structure according to an exemplary embodiment;
[0030] Figure 4 This is a schematic diagram of a flattening device structure according to an exemplary embodiment;
[0031] Figure 5 This is a schematic diagram illustrating the working state of a flattening device according to an exemplary embodiment;
[0032] Figure 6 This is a schematic diagram illustrating the working state of a flattening device according to an exemplary embodiment;
[0033] Figure 7 This is a schematic diagram illustrating the working state of a flattening device according to an exemplary embodiment;
[0034] Figure 8 This is a schematic diagram illustrating the working state of a flattening device according to an exemplary embodiment;
[0035] Figure 9 This is a schematic diagram of a laser welding system structure according to an exemplary embodiment.
[0036] Explanation of reference numerals in the attached figures
[0037] 1. Flattening device; 10. Bottom platform; 11. First plane; 20. Pressing assembly; 200. First track assembly; 210. First track; 220. First drive unit; 221. First stepper motor; 222. First screw; 230. First slide; 30. Rigid pressure plate; 31. Second plane; 32. Window; 400. Second track assembly; 410. Second track; 420. Second drive unit; 421. Second stepper motor; 422. Second screw; 430. Second slide; 50. Flattened object; 60. Rigid support rod. Detailed Implementation
[0038] To make the technical solution and beneficial effects of this utility model more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.
[0039] This disclosure is not exhaustive, but merely illustrative of some embodiments, and is not intended to limit the scope of protection of this disclosure. Unless otherwise specified, each step in a particular embodiment can be implemented as an independent embodiment, and the steps can be arbitrarily combined. For example, a solution after removing some steps in a particular embodiment can also be implemented as an independent embodiment, and the order of the steps in a particular embodiment can be arbitrarily interchanged. Furthermore, the optional implementation methods in a particular embodiment can be arbitrarily combined; moreover, the embodiments can be arbitrarily combined, for example, some or all steps of different embodiments can be arbitrarily combined, and a particular embodiment can be arbitrarily combined with the optional implementation methods of other embodiments.
[0040] In each of the disclosed embodiments, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions of the embodiments are consistent and can be referenced by each other. Technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.
[0041] The terminology used in the embodiments of this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the scope of this disclosure.
[0042] In this disclosure, unless otherwise stated, elements expressed in the singular form, such as "a," "an," "the," "the," "the," "the," "the," "the," "this," etc., can mean "one and only one," or "one or more," "at least one," etc. For example, when using articles such as "a," "an," "the," etc. in translation, the noun following the article can be understood as either a singular or a plural expression.
[0043] In the embodiments disclosed herein, "multiple" refers to two or more.
[0044] In some embodiments, the terms “at least one of”, “one or more”, “a plurality of”, “multiple”, etc., may be used interchangeably.
[0045] In some embodiments, the notation "at least one of A and B", "A and / or B", "A in one case, B in another", "A in one case, B in another", etc., may include the following technical solutions depending on the situation: in some embodiments, A (A is executed regardless of B); in some embodiments, B (B is executed regardless of A); in some embodiments, execution is selected from A and B (A and B are selectively executed); in some embodiments, both A and B are executed. The same applies when there are more branches such as A, B, C, etc.
[0046] In some embodiments, the notation "A or B" may include the following technical solutions, depending on the situation: in some embodiments, A (execution of A regardless of B); in some embodiments, B (execution of B regardless of A); in some embodiments, selective execution from A and B (A and B are selectively executed). The same applies when there are more branches such as A, B, and C.
[0047] The prefixes "first," "second," etc., used in the embodiments of this disclosure are merely for distinguishing different descriptive objects and do not impose restrictions on the position, order, priority, value, or content of the descriptive objects. The description of the descriptive objects should be found in the claims or the context of the embodiments, and the use of prefixes should not constitute unnecessary restrictions. For example, if the descriptive object is a "field," the ordinal numbers preceding "field" in "first field" and "second field" do not restrict the position or order of the "fields." "First" and "second" do not restrict whether the "fields" they modify are in the same message, nor do they restrict the order of "first field" and "second field." Similarly, if the descriptive object is a "level," the ordinal numbers preceding "level" in "first level" and "second level" do not restrict the priority between "levels." Furthermore, the value of the descriptive object is not limited by ordinal numbers and can be one or more. For example, in "first device," the value of "device" can be one or more. Furthermore, the objects modified by different prefixes can be the same or different. For example, if the object being described is "device", then "first device" and "second device" can be the same device or different devices, and their types can be the same or different. Similarly, if the object being described is "information", then "first information" and "second information" can be the same information or different information, and their content can be the same or different.
[0048] In some embodiments, “including A,” “containing A,” “for indicating A,” and “carrying A” can be interpreted as directly carrying A or indirectly indicating A.
[0049] In some embodiments, terms such as “…”, “determine…”, “in the case of…”, “when…”, “when…”, “if…”, etc. can be used interchangeably.
[0050] In some embodiments, the terms “greater than,” “greater than or equal to,” “not less than,” “more than,” “more than or equal to,” “not less than,” “higher than,” “higher than or equal to,” “not lower than,” and “above” can be used interchangeably, as can the terms “less than,” “less than or equal to,” “not greater than,” “less than,” “less than or equal to,” “not more than,” “lower than,” “lower than or equal to,” “not higher than,” and “below”.
[0051] Furthermore, each element, each row, or each column in the table of this disclosure can be implemented as an independent embodiment, and any combination of any element, any row, or any column can also be implemented as an independent embodiment.
[0052] In wafer bonding processes, due to variations in wafer warpage and flatness between different wafer types, numerous additional checks are required before welding to ensure the wafers to be flattened are under suitable conditions for laser welding (e.g., the two stacked wafers need to meet the optical contact distance). Otherwise, poor welding results will occur. Furthermore, in large-area flattening processes, inconsistencies in the wafers' properties at different locations can easily lead to poor final processing yields.
[0053] like Figure 1 As shown, this disclosure provides a flattening device, including: a bottom platform and a pressing assembly, the pressing assembly including a rigid pressure plate and N first track assemblies; the first track assembly including a first track, a first driving part and a first slide; N is an integer greater than or equal to 2;
[0054] The bottom platform has a first flat surface for placing the object to be flattened;
[0055] The first track is arranged along a first direction perpendicular to the first plane, and the first driving unit drives the first slide to move along the first track;
[0056] The rigid pressure plate is fixedly connected to the first slide of each of the first track assemblies;
[0057] The rigid pressure plate is based on a second plane that is opposite to the first plane, and is used to flatten the object to be flattened in conjunction with the first plane when the first slide moves toward the first plane.
[0058] In one possible implementation, the flattening device includes a drive controller for controlling the first drive unit to drive the movement of the first slide.
[0059] In one possible implementation, two objects to be flattened are stacked on top of each other.
[0060] In one possible implementation, the object to be flattened may include a wafer.
[0061] Here, each first track assembly has an independent first drive unit. The drive controller can control each first track assembly to achieve synchronous drive, so that the rigid pressure plate can be raised and lowered in a parallel state with the first plane under the drive of each first slide, thereby improving the flattening effect.
[0062] In one possible implementation, the rigid pressure plate is rigidly connected to the first slide.
[0063] In one possible implementation, the drive controller can fine-tune at least one first drive unit to compensate for errors between the first track components. Here, the errors between the first track components may include tolerances between the first track components, tolerances of individual components within the first track components, etc.
[0064] In one possible implementation, the bottom platform and the first track are relatively fixed in position in the first direction. Therefore, when the rigid pressure plate moves along the first track, the object to be flattened on the first plane can be flattened.
[0065] Here, both the bottom platform and the rigid pressure plate can be made of rigid materials to reduce the deformation of the first and second planes and improve the flattening effect on the object to be flattened.
[0066] In one possible implementation, the second plane covers the projection of the object to be flattened along the first direction.
[0067] Specifically, two overlapping objects to be flattened are placed on a first plane. A rigid pressure plate, driven by a first drive unit, applies pressure to the two overlapping objects through a second plane. This causes the objects to be flattened to adhere to either the first or second plane, thereby flattening them and reducing the distance between the contact surfaces of the two objects, meeting the requirements of laser welding and improving welding reliability and yield. Furthermore, each first track assembly has a first drive unit that can be adjusted independently, increasing the flexibility of pressure adjustment.
[0068] In some embodiments, such as Figure 1 As shown, the first drive unit includes a first stepper motor and a first screw, wherein,
[0069] The first screw is arranged along the first track;
[0070] The first screw is driven by the first stepper motor, and through the threaded engagement with the first slide, it drives the first slide to move along the first track.
[0071] In one possible implementation, a guide groove extending along the first track is provided on the first track, and a first slide is provided with a protrusion extending into the guide groove, so that the first slide can move along the guide groove.
[0072] like Figure 1 As shown, the first slide has a through hole, and the inner wall of the through hole is threaded to match the thread on the surface of the first screw. The first stepper motor drives the first screw to rotate, causing the thread on the inner wall of the through hole of the first slide to be subjected to a force that moves along the axial direction of the first screw, thereby enabling the first slide to move along the first track.
[0073] The rigid pressure plate is rigidly connected to the first slide of each first track assembly. The drive controller can control each first step motor to synchronously drive its corresponding first screw, so that each first slide can move synchronously to achieve the flattening process of the object to be flattened.
[0074] In one possible implementation, the drive controller can control the driving force of each first stepper motor individually to compensate for errors between the first drive units. Here, the errors between the first drive units may include tolerances between the first screws, etc.
[0075] In one possible implementation, the drive controller can adjust the driving force of each stepper motor based on pressure indication parameters that indicate the pressure at different sensing positions of the object to be flattened.
[0076] Pressure indication parameters may include at least one of the following:
[0077] Pressure parameters sensed by the pressure sensor;
[0078] The drive current value of the first stepper motor;
[0079] The voltage value of the first stepper motor.
[0080] In one possible implementation
[0081] Here, the pressure sensor can be set on the first plane and / or the second plane to sense the pressure exerted on different positions of the object to be flattened by the first plane and / or to sense the pressure exerted on different positions of the object to be flattened by the second plane.
[0082] When the rigid pressure plate flattens the object to be flattened, it experiences a reaction force from the object. This reaction force is fed back to the first stepper motor via the first screw, causing a change in the current of the first stepper motor. The current of the first stepper motor is negatively correlated with the reaction force exerted on the rigid pressure plate by the object (for example, the current of the first stepper motor is at its maximum when it is stalled). Therefore, the drive controller can determine the reaction force on the second plane (i.e., the pressure on the object to be flattened) by observing the current of the first stepper motor.
[0083] A change in the current of the first stepper motor will also cause a change in its voltage. The current and voltage of the first stepper motor are negatively correlated. Therefore, the drive controller can determine the reaction force (i.e., the pressure on the object to be flattened) on the second plane by using the voltage value of the first stepper motor.
[0084] The controller can adjust the torque of each stepper motor based on the pressure received at different sensing locations, thereby adjusting the pressure on the object to be flattened.
[0085] In one possible implementation, the drive controller is used to control each stepper motor so that each stepper motor applies the same pressure to the rigid pressure plate.
[0086] Using a single stepper motor paired with a first screw for rigid platen motion control differs from using multiple independent clamps to fix the object to be flattened. Connecting the two first screws with a rigid platen and synchronizing the movement of the first stepper motor improves the synchronicity of the flattening device's vertical movement, resulting in a more even distribution of pressure on the object and preventing excessive force at any one point. Since the first screw itself has a certain tolerance, the two screws allow for fine-tuning, ensuring the rigid platen remains flat against the object, achieving the most even flattening effect. The deceleration effect of the first screw also prevents excessive vibration during pressing, thus avoiding displacement of the object.
[0087] In some embodiments, such as Figure 2 and Figure 3 As shown, the flattening device further includes a second track assembly; the second track assembly includes a second track, a second drive unit, and a second slide.
[0088] The pressing assembly is fixedly connected to the second slide table;
[0089] The second track is arranged along a second direction parallel to the first plane, and the second drive unit drives the second slide to move the pressing assembly along the second track.
[0090] In one possible implementation, the pressing component can move along a second track, allowing it to switch between at least a first position and a second position. When the pressing component is in the first position, the projections of the first plane and the second plane in the first direction overlap. In this position, the first and second planes are used to flatten the object to be flattened. Also in this position, the projections of the first and second planes in the first direction do not overlap. In this position, the user can place the object to be flattened from the first plane, or place an object to be flattened from the first plane.
[0091] The second track assembly allows the pressing assembly to be moved, facilitating the placement and removal of the object to be pressed and improving operational convenience.
[0092] In some embodiments, the second track assembly has two;
[0093] Each second slide is fixedly connected to at least one of the first tracks.
[0094] like Figure 2 and Figure 3 As shown, the first track assembly and the second track assembly each consist of two parts.
[0095] Two first tracks are each fixed to a second slide. A second stepper motor drives the rigid pressure plate to move above or remove it from the first surface.
[0096] In conjunction with the embodiments of the first aspect, in some embodiments, the second drive unit includes a second stepper motor and a second screw, wherein,
[0097] The second screw is arranged along the second track;
[0098] The second screw is driven by the second stepper motor, and through the threaded engagement with the second slide, it drives the second slide to move along the second track.
[0099] In one possible implementation, a guide groove is provided on the second track, extending along the second track, and a protrusion is provided on the second slide table, allowing the second slide table to move along the guide groove.
[0100] like Figure 4 As shown, the second slide has a through hole, and the inner wall of the through hole is threaded to match the thread on the surface of the second screw. The second stepper motor drives the second screw to rotate, causing the thread on the inner wall of the through hole of the second slide to be subjected to a force that moves along the axial direction of the second screw, thereby enabling the second slide to move along the second track.
[0101] In some embodiments, there are two second track assemblies, and the two second track assemblies are respectively arranged in parallel with the second tracks. The flattening device further includes at least two rigid support rods disposed between the two second tracks to maintain the distance between the two second tracks.
[0102] Here, rigid support rods can be set at predetermined intervals, and the rigid support rods are fixedly connected to two second tracks to fix the relative distance between the second tracks. This reduces the shaking of the pressing assembly caused by changes in the distance between the second tracks, thereby improving the flattening accuracy.
[0103] In some embodiments, there are two objects to be flattened, and they are stacked together;
[0104] The rigid pressure plate is provided with a window through which a laser can pass to reach the contact surface between the two objects to be flattened.
[0105] or,
[0106] The rigid pressure plate has a preset transparency so that the laser can pass through the rigid pressure plate to reach the contact surface between the two objects to be flattened.
[0107] like Figure 2 As shown, the rigid pressure plate has a window, and the rigid pressure plate flattens the object to be flattened through the edge position outside the window. Since the wafer to be flattened itself is very rigid, flattening it through the edge can also achieve the effect of flattening two wafers. The window is used to allow laser penetration, irradiating the contact surface between the two wafers through one wafer, thereby realizing the welding of the wafers.
[0108] Rigid pressure plates can also be made of transparent materials such as glass. The preset transparency can be set based on the laser's penetrating ability. The laser can penetrate transparent materials and shine through one wafer to the contact surface between two wafers, achieving wafer welding.
[0109] Here, the flattening device of this disclosure is described with reference to specific examples.
[0110] like Figures 1 to 4 As shown, the flattening device mainly consists of a Z-axis translation stage (i.e., the bottom platform) and a linear motion system. The linear motion system can be divided into a horizontal part (second track assembly) and a vertical part (second track assembly), with the two parts having the same composition and operation. On the vertical axis, the motion is powered by a first stepper motor, which is connected to the first track, which has a first slide. On the horizontal axis, to ensure that the left and right guide rails (first tracks) are parallel to each other, there are connecting plates (i.e., rigid support rods) at the front and rear for fixation. After connecting the first track of the vertical axis to the second slide of the horizontal axis, the linear motion system of the two axes is completed. Finally, the pressure plate (i.e., the rigid pressure plate) used to flatten the object to be flattened is fixed to the first slide of the vertical axis, completing the assembly of the entire flattening device. The pressure plate can be a hollow metal block or a transparent flat glass plate, depending on the usage requirements. The operation method of the flattening device is as follows: first, place the object to be flattened on the z-axis translation stage, then move the vertical axis directly above the object to be flattened, and finally move the pressure plate down to press down on the object to be flattened, thus completing the fixing and flattening of the object to be flattened.
[0111] Figures 5 to 8 for Figure 1 A partial view of dashed box a. Figure 5 and Figure 6 These are schematic diagrams of an object before and after being flattened, as shown below. Figure 5 As shown, before flattening, the upper and lower surfaces of the object to be flattened may be warped or have uneven surfaces, resulting in inconsistent welding effects between the middle and edge areas. Excessive gaps between the objects to be flattened also lead to poor welding results. For example... Figure 5 As shown, before flattening, the gaps between the objects to be flattened can be over 100 micrometers, at which point the objects have not yet reached optical contact. For example... Figure 6As shown, after using the flattening system, the gap between the objects to be flattened can be as low as 50 micrometers, achieving the conditions for optical contact, which is the most suitable state for laser welding.
[0112] Figure 7 and Figure 8 These are schematic diagrams showing the two objects to be flattened before and after flattening. The two objects adhere very well and have smooth surfaces, achieving optical contact. However, severe warping can still lead to inconsistent heights during the welding process. For example... Figure 5 The flattened object shown in the image is in a state that will affect the final welding result. This problem can also be solved by a flattening system, which keeps the entire surface of the object at the same height. To ensure even force distribution across the surface, multiple independent screws can be used to drive each force application point. The advantage is that each screw can be adjusted independently when needed to achieve the most even force distribution. After adjustment, each force application point can move up and down synchronously. If the surface of the object to be flattened has variations in thickness, the screw design also provides more adjustment options for this system, ensuring it is usable even if the surface of the object to be flattened is sloping, thus adapting to a wider range of applications.
[0113] This embodiment also provides a laser welding system, which includes a laser system and a flattening device as described in any of the above embodiments.
[0114] The structure of the flattening device is as described in any of the above embodiments and will not be repeated here.
[0115] In one possible implementation, such as Figure 9 The laser welding system described above is primarily based on laser welding. Figure 9 The overall architecture of the laser welding system mainly consists of a laser system A, an optical adjustment system B, a scanning galvanometer C, a motion system for the object to be flattened D, controllers for each component E (scanning processing controller, drive controller, and translation stage controller), and a central control computer F. The overall process is as follows: after the laser light is emitted from the laser system A, it passes through the optical adjustment system B for power and spot shape adjustment. Finally, the processing is completed at the object to be flattened by the multi-axis scanning galvanometer C. A flattening device 1 can be added to the motion system for the object to be flattened (block 8). After the object to be flattened is placed on the XYZ three-axis translation stage, the flattening system 1 fixes the object to be flattened and maintains it under optical contact conditions. Finally, laser welding is completed by the laser. By adding the flattening device 1 to flatten the object to be flattened, the quality and yield of laser welding can be effectively improved.
[0116] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.
[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A flattening device, characterized in that, The flattening device includes: a bottom platform and a pressing assembly, the pressing assembly including a rigid pressure plate and N first track assemblies; the first track assembly includes a first track, a first drive unit and a first slide; N is an integer greater than or equal to 2; The bottom platform has a first flat surface for placing the object to be flattened; The first track is arranged along a first direction perpendicular to the first plane, and the first driving unit drives the first slide to move along the first track; The rigid pressure plate is fixedly connected to the first slide of each of the first track assemblies; The rigid pressure plate is based on a second plane that is opposite to the first plane, and is used to flatten the object to be flattened in conjunction with the first plane when the first slide moves toward the first plane.
2. The apparatus according to claim 1, characterized in that, The first drive unit includes a first stepper motor and a first screw, wherein, The first screw is arranged along the first track; The first screw is driven by the first stepper motor, and through the threaded engagement with the first slide, it drives the first slide to move along the first track.
3. The apparatus according to claim 1 or 2, characterized in that, The flattening device further includes a second track assembly; the second track assembly includes a second track, a second drive unit, and a second slide. The pressing assembly is fixedly connected to the second slide table; The second track is arranged along a second direction parallel to the first plane, and the second drive unit drives the second slide to move the pressing assembly along the second track.
4. The apparatus according to claim 3, characterized in that, The second track assembly has two; Each of the second slides is fixedly connected to at least one of the first tracks.
5. The apparatus according to claim 3, characterized in that, The second drive unit includes a second stepper motor and a second screw, wherein, The second screw is arranged along the second track; The second screw is driven by the second stepper motor, and through the threaded engagement with the second slide, it drives the second slide to move along the second track.
6. The apparatus according to claim 3, characterized in that, The second track assembly has two parts, and the two second track assemblies are respectively arranged in parallel with the second track. The flattening device also includes at least two rigid support rods disposed between the two second tracks to maintain the distance between the two second tracks.
7. The apparatus according to claim 1 or 2, characterized in that, There are two objects to be flattened, and they are stacked together. The rigid pressure plate is provided with a window through which a laser can pass to reach the contact surface between the two objects to be flattened. or, The rigid pressure plate has a preset transparency so that the laser can pass through the rigid pressure plate to reach the contact surface between the two objects to be flattened.
8. A laser welding system, characterized in that, The laser welding system includes a laser system and a flattening device as described in any one of claims 1 to 7.