Thin film processing device and semiconductor production equipment

Abstract

The utility model discloses a film processing device and semiconductor production equipment, the film processing device comprises a driving mechanism, a transmission assembly and a polishing assembly, the polishing assembly is in driving connection with the driving mechanism through the transmission assembly, the transmission assembly comprises a first transmission assembly, the first transmission assembly comprises at least two transmission parts, and the transmission parts are connected with the polishing assembly. The polishing assembly comprises at least two polishing parts which are arranged in parallel, each polishing part is arranged on one transmission part in a sleeving mode, each polishing part rotates along with the sleeving transmission part, a to-be-treated film is placed between the at least two polishing parts, and the rotating directions of the polishing parts located on the two sides of the to-be-treated film are opposite; wherein the target transmission part is in driving connection with the driving mechanism, the other transmission parts are connected with the target transmission part, the target transmission part is any transmission part in the at least two transmission parts, and the other transmission parts are transmission parts except the target transmission part in the at least two transmission parts. The thin film polishing device can automatically polish the thin film, and the polishing quality and efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a thin film processing apparatus and semiconductor manufacturing equipment. Background Technology

[0002] PVD thin films are ultra-thin coatings formed on material surfaces using physical vapor deposition technology. They are widely used in various fields, including but not limited to electronics, optics, machinery, decoration, tools, and medical devices. In existing technologies, the production of PVD films requires pre-treatment and post-treatment. The post-treatment step involves deburring the PVD film, currently done manually. This process is time-consuming and labor-intensive, resulting in low efficiency and poor deburring quality. Utility Model Content

[0003] To address the aforementioned problems in the prior art, this utility model discloses a thin film processing apparatus and semiconductor manufacturing equipment, capable of automatically polishing thin films, removing burrs from the upper and lower surfaces of the film, and improving polishing quality and efficiency. The technical solution disclosed in this utility model is as follows:

[0004] This utility model provides a thin film processing device, which includes a driving mechanism, a transmission component, and a polishing component. The polishing component is drivenly connected to the driving mechanism through the transmission component.

[0005] The transmission assembly includes a first transmission assembly, which includes at least two transmission components. The grinding assembly includes at least two parallel grinding components, each grinding component being sleeved on a transmission component. Each grinding component rotates with the sleeved transmission component. The film to be processed is placed between the at least two grinding components, and the grinding components located on both sides of the film to be processed rotate in opposite directions.

[0006] The target transmission component is driven and connected to the drive mechanism, and other transmission components are connected to the target transmission component. The target transmission component is any one of the at least two transmission components, and the other transmission components are transmission components other than the target transmission component among the at least two transmission components.

[0007] Optionally, the at least two transmission components include a first transmission component and a second transmission component, and the at least two grinding components include a first grinding component and a second grinding component. The first transmission component corresponds to the first grinding component, and the second transmission component corresponds to the second grinding component. The first transmission component is drivenly connected to the driving mechanism, and the first transmission component is connected to the second transmission component.

[0008] The first grinding component rotates with the first transmission component, and the second grinding component rotates with the second transmission component. The film to be processed is placed between the first grinding component and the second grinding component, and the first grinding component and the second grinding component rotate in opposite directions.

[0009] Optionally, the first transmission component includes a first transmission wheel and a first rotating shaft, and the second transmission component includes a second transmission wheel and a second rotating shaft; one end of the first rotating shaft is drivenly connected to the driving mechanism, the other end of the first rotating shaft is connected to the first transmission wheel, the first transmission wheel is connected to the second transmission wheel, and the second transmission wheel is connected to the second rotating shaft;

[0010] The first grinding element is sleeved on the first rotating shaft and rotates with the first rotating shaft. The second grinding element is sleeved on the second rotating shaft and rotates with the second rotating shaft.

[0011] Optionally, the transmission assembly further includes a second transmission assembly and a third rotating shaft. The second transmission assembly includes a third transmission wheel, a fourth transmission wheel, and a connecting member. One end of the third rotating shaft is drivenly connected to the drive mechanism, and the other end of the third rotating shaft is connected to the third transmission wheel. The third transmission wheel and the fourth transmission wheel are connected through the connecting member, and one end of the first rotating shaft is connected to the fourth transmission wheel.

[0012] Optionally, the film processing apparatus further includes a film winding member, which is sleeved on the third rotating shaft, and the film processed by the at least two grinding members is wound onto the film winding member.

[0013] Optionally, the film processing apparatus further includes a limiting member disposed between the at least two grinding members and the film winding member, wherein the film processed by the at least two grinding members is wound onto the film winding member by the limiting member.

[0014] Optionally, the film processing device further includes a base and a support assembly. The support assembly is fixedly disposed on the base. The support assembly includes a first support member and a second support member, which are disposed opposite to each other. The third rotating shaft passes through the first support member and the second support member, and the film winding member is disposed between the first support member and the second support member.

[0015] Optionally, the thin film processing apparatus further includes a support assembly, which includes a third support member and a fourth support member, the third support member and the fourth support member being disposed opposite to each other, the first rotating shaft and the second rotating shaft both passing through the third support member and the fourth support member, and the first polishing member and the second polishing member both being disposed between the third support member and the fourth support member.

[0016] Optionally, the film processing apparatus further includes a cleaning component, which includes a first cleaning component, a first pipeline, and a first collection structure. The first cleaning component is disposed on one side of the film after it has been processed by the at least two abrasive elements, and the first cleaning component is connected to the first collection structure through the first pipeline.

[0017] The first cleaning component includes at least one first absorption structure, and each first absorption structure is connected to the first collection structure through the first conduit.

[0018] Optionally, the cleaning assembly further includes a second cleaning assembly and a second pipeline. The first cleaning assembly and the second cleaning assembly are respectively disposed on both sides of the film after it has been treated by the at least two abrasive elements. The second cleaning assembly is connected to the first collection structure through the second pipeline.

[0019] The second cleaning component includes at least one second absorption structure, each of which is connected to the first collection structure via the second conduit.

[0020] Optionally, each of the grinding parts has grinding flanges at both ends, and the film to be processed is placed between the grinding flanges of each grinding part.

[0021] Optionally, the thin film processing apparatus further includes a second collection structure disposed below each of the polishing elements.

[0022] This utility model also provides a semiconductor manufacturing apparatus, including the thin film processing device described in any of the above claims.

[0023] The technical solutions provided by the embodiments disclosed in this utility model have at least the following beneficial effects:

[0024] The thin film processing apparatus provided by this utility model includes a driving mechanism, a transmission assembly, and a polishing assembly. The polishing assembly is driven to the driving mechanism via the transmission assembly. The transmission assembly includes a first transmission component, which includes at least two transmission members. The polishing assembly includes at least two parallel polishing members, each polishing member being sleeved on one of the transmission members. Each polishing member rotates with the sleeved transmission member. The thin film to be processed is placed between at least two polishing members, and the polishing members located on both sides of the thin film to be processed rotate in opposite directions. The target transmission member is driven to the driving mechanism, and the other transmission members are connected to the target transmission member. The target transmission component is any one of at least two transmission components, and the other transmission components are any of the at least two transmission components other than the target transmission component. The target transmission component is driven to rotate by the drive mechanism, which in turn drives the corresponding grinding component to rotate. At the same time, the target transmission component drives the other transmission components to rotate in the opposite direction, and the corresponding grinding component rotates with the other transmission components. During the grinding process, the film is placed between at least two grinding components, and the grinding components on both sides of the film rotate in opposite directions, thereby realizing automatic grinding of the film, removing burrs from the upper and lower surfaces of the film, improving grinding quality and efficiency, and avoiding the time-consuming and labor-intensive manual grinding and cleaning, thus reducing the maintenance cost of the instrument.

[0025] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the disclosure of this utility model and, together with the description, serve to explain the principles disclosed herein, but do not constitute an undue limitation on the disclosure of this utility model.

[0027] Figure 1 This is a side view schematic diagram of a thin film processing device provided in an embodiment of this utility model;

[0028] Figure 2 This is a schematic diagram of a thin film processing apparatus provided in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of a partial structure A provided in an embodiment of the present utility model;

[0030] Figure 4 This is a bottom view schematic diagram of a thin film processing device provided in an embodiment of this utility model;

[0031] In the figure, the corresponding reference numerals are as follows: 1-base; 101-second collecting structure; 201-third rotating shaft; 202-third transmission wheel; 203-connector; 204-fourth transmission wheel; 205-film winding component; 206-drive mechanism; 207-first support component; 208-second support component; 301-second rotating shaft; 302-first polishing component; 303-polishing and flanging; 304-second transmission wheel; 305-first rotating shaft; 306-first transmission wheel; 307-third support component; 308-fourth support component; 309-second polishing component; 401-first absorption structure; 402-second absorption structure; 403-first collecting structure; 404-first pipeline; 501-limiting component; 6-film to be processed. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solutions disclosed in this utility model, the technical solutions in the disclosed embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0033] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0034] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

[0035] PVD (Physical Vapor Deposition) thin films are ultra-thin coatings formed on material surfaces using physical vapor deposition technology. This technology is widely used in various fields, including but not limited to electronics, optics, machinery, decoration, tools, and medical devices. The main principle of PVD films is to evaporate or sputter solid materials into gaseous atoms or molecules, which are then deposited onto the substrate surface in a vacuum to form a thin film with specific properties. In existing technologies, PVD film production requires pre-treatment and post-treatment. The post-treatment step involves deburring the PVD film, which is currently done manually, a time-consuming and labor-intensive process resulting in low efficiency and poor deburring quality. This invention provides a PVD film processing device that automatically removes burrs from the upper and lower surfaces of the PVD film without manual cleaning, thereby improving the quality and efficiency of PVD film deburring and reducing the maintenance costs of engineering machinery.

[0036] The technical solutions in the embodiments of this utility model are described below with reference to the accompanying drawings.

[0037] Please see Figure 1-4 This utility model provides a thin film processing device, including a driving mechanism 206, a transmission assembly, and a polishing assembly. The polishing assembly is driven to the driving mechanism 206 via the transmission assembly. The transmission assembly includes a first transmission assembly, which includes at least two transmission members. The polishing assembly includes at least two parallel polishing members, each polishing member being sleeved on a transmission member. Each polishing member rotates with the sleeved transmission member. The thin film 6 to be processed is placed between the at least two polishing members, and the polishing members on both sides of the thin film 6 to be processed rotate in opposite directions. The target transmission member is driven to the driving mechanism 206, and the other transmission members are connected to the target transmission member. The target transmission member is any one of the at least two transmission members, and the other transmission members are the transmission members other than the target transmission member among the at least two transmission members.

[0038] In one specific embodiment, the film to be processed 6 can be a PVD film, and the abrasive component is used to abrade the film to be processed 6 to remove burrs on the film 6. Specifically, the abrasive assembly can include two or more abrasive components, which are arranged parallel to each other. In the vertical direction, the abrasive components can be arranged perpendicularly or at different heights. The abrasive component can be a cylindrical roller structure.

[0039] In practical applications, the film to be processed 6 is placed between the target transmission component and the grinding components mounted on other transmission components. The drive mechanism 206 drives the target transmission component to rotate, causing the grinding components mounted on the target transmission component to rotate synchronously. Furthermore, the target transmission component drives other transmission components to rotate in the opposite direction to the target transmission component, causing the grinding components mounted on the other transmission components to rotate. Thus, the rotation directions of the target transmission component and the grinding components mounted on other transmission components (i.e., the grinding components located on both sides of the film to be processed 6) are opposite, which can realize automatic grinding of the film to be processed 6, remove burrs from the upper and lower surfaces of the film to be processed 6, and improve grinding quality and efficiency.

[0040] Optionally, each grinding component has grinding flanges 303 at both ends, and the film to be processed 6 is placed between the grinding flanges 303 of each grinding component. Specifically, the grinding flanges 303 can be used to grind and remove burrs on the sides of the film to be processed 6, which can improve the grinding effect of the film.

[0041] In some embodiments, the at least two transmission components include a first transmission component and a second transmission component, and the at least two grinding components include a first grinding component 302 and a second grinding component 309. The first transmission component corresponds to the first grinding component 302, and the second transmission component corresponds to the second grinding component 309. The first transmission component is driven and connected to the drive mechanism 206, and the first transmission component is connected to the second transmission component. The first grinding component 302 rotates with the first transmission component, and the second grinding component 309 rotates with the second transmission component. The film to be processed 6 is placed between the first grinding component 302 and the second grinding component 309, and the rotation directions of the first grinding component 302 and the second grinding component 309 are opposite.

[0042] In an optional embodiment, the first transmission component includes a first transmission wheel 306 and a first rotating shaft 305, and the second transmission component includes a second transmission wheel 304 and a second rotating shaft 301; one end of the first rotating shaft 305 is drivenly connected to the drive mechanism 206, and the other end of the first rotating shaft 305 is connected to the first transmission wheel 306, the first transmission wheel 306 is connected to the second transmission wheel 304, and the second transmission wheel 304 is connected to the second rotating shaft 301; a first grinding component 302 is sleeved on the first rotating shaft 305 and rotates with the first rotating shaft 305, and a second grinding component 309 is sleeved on the second rotating shaft 301 and rotates with the second rotating shaft 301.

[0043] In one specific embodiment, under the drive of the drive mechanism 206, the rotation of the first transmission wheel 306 can drive the second transmission wheel 304 to rotate in the opposite direction. Specifically, the first transmission wheel 306 and the second transmission wheel 304 can be meshing gears.

[0044] Optionally, the transmission assembly also includes a second transmission assembly and a third rotating shaft 201. The second transmission assembly includes a third transmission wheel 202, a fourth transmission wheel 204, and a connecting member 203. One end of the third rotating shaft 201 is drivenly connected to the drive mechanism 206, and the other end of the third rotating shaft 201 is connected to the third transmission wheel 202. The third transmission wheel 202 and the fourth transmission wheel 204 are connected through the connecting member 203. One end of the first rotating shaft 305 is connected to the fourth transmission wheel 204.

[0045] Specifically, the drive mechanism 206 is connected to one end of the third rotating shaft 201, the third transmission wheel 202 is sleeved on the other end of the third rotating shaft 201, the third rotating wheel is connected to the fourth transmission wheel 204 through the connecting member 203, the fourth transmission wheel 204 is sleeved on one end of the first rotating shaft 305, the first transmission wheel 306 is sleeved on the other end of the first rotating shaft 305, and the second transmission wheel 304 is sleeved on the same end of the second rotating shaft 301. The gears of the first transmission wheel 306 and the second transmission wheel 304 mesh. Specifically, the second transmission assembly can be a pulley structure, and correspondingly, the connecting member 203 can be a belt sleeved on the third transmission wheel 202 and the fourth transmission wheel 204.

[0046] In this embodiment, the drive mechanism 206 drives the third rotating shaft 201 to rotate, causing the third rotating wheel to rotate in the same direction, and the fourth transmission wheel 204 to rotate in the same direction, further causing the first rotating shaft 305 to rotate in the same direction, and causing the grinding component sleeved on the first rotating shaft 305 to rotate in the same direction, thereby causing the first transmission wheel 306 to rotate in the same direction. Further, it drives the second transmission wheel 304 to rotate in the opposite direction, and causes the second rotating shaft 301 to rotate in the same direction as the second transmission wheel 304, and causes the grinding component sleeved on the second rotating shaft 301 to rotate in the same direction, so that the grinding component on the first rotating shaft 305 and the grinding component on the second rotating shaft 301 rotate in opposite directions, thereby achieving automatic grinding of burrs on both sides of the film.

[0047] Optionally, the film processing apparatus further includes a film winding member 205, which is sleeved on the third rotating shaft 201, and the film after being processed by at least two grinding members is wound onto the film winding member 205.

[0048] Specifically, the film winding member 205 can be a cylindrical roller structure. The driving mechanism 206 drives the third rotating shaft 201 to rotate, causing the film winding member 205 sleeved on it to rotate in the same direction. The film to be processed 6 moves from the grinding member to the film winding member 205. During the movement, the grinding member grinds the film to be processed 6 synchronously. Then, the film after being ground by the grinding member is wound onto the film winding member 205.

[0049] Optionally, the film processing apparatus further includes a limiting member 501, which is disposed between at least two grinding members and the film winding member 205. The film processed by the at least two grinding members is wound onto the film winding member 205 via the limiting member 501. Specifically, the limiting member 501 can be fixedly disposed on the base 1 or a support assembly (such as the first support member 207 and the second support member 208). With the cooperation of the limiting member 501 and the film winding member 205, the film between the film winding member 205 and the grinding members can be kept straight, preventing the film from becoming tangled during the pulling process.

[0050] In an optional embodiment, the film processing apparatus further includes a base 1 and a support assembly. The support assembly is fixedly disposed on the base 1 and includes a first support member 207 and a second support member 208. The first support member 207 and the second support member 208 are disposed opposite to each other. A third rotating shaft 201 passes through the first support member 207 and the second support member 208, and a film winding member 205 is disposed between the first support member 207 and the second support member 208.

[0051] Optionally, the thin film processing apparatus further includes a support assembly, which includes a third support member 307 and a fourth support member 308. The third support member 307 and the fourth support member 308 are arranged opposite to each other. The first rotating shaft 305 and the second rotating shaft 301 both pass through the third support member 307 and the fourth support member 308. The first polishing member 302 and the second polishing member 309 are both disposed between the third support member 307 and the fourth support member 308.

[0052] In some embodiments, the film processing apparatus further includes a cleaning component, which includes a first cleaning component, a first conduit 404, and a first collection structure 403. The first cleaning component is disposed on one side of the film after it has been processed by at least two abrasive elements. The first cleaning component is connected to the first collection structure 403 through the first conduit 404. The first cleaning component includes at least one first absorption structure 401, and each first absorption structure 401 is connected to the first collection structure 403 through the first conduit 404.

[0053] In one specific embodiment, a cleaning component is disposed between the abrasive component and the film winding component 205. The cleaning component can be disposed on the base 1 or a support component (such as the third support component 307 and the fourth support component 308). Each first absorption structure 401 absorbs debris from one side of the film after abrasion by the abrasive component, and the debris enters the first collection structure 403 through the first conduit 404, thereby improving the cleanliness of the film surface and improving the quality of the abraded film. The cleaning component also includes a drive motor, which can be electrically connected to the aforementioned drive mechanism 206. When the drive mechanism 206 is activated and the film is abraded, the drive motor is simultaneously activated to clean the abraded film.

[0054] Optionally, the cleaning assembly further includes a second cleaning assembly and a second conduit. The first cleaning assembly and the second cleaning assembly are respectively disposed on both sides of the film after it has been treated by at least two abrasive elements. The second cleaning assembly is connected to the first collection structure 403 through the second conduit. The second cleaning assembly includes at least one second absorption structure 402, and each second absorption structure 402 is connected to the first collection structure 403 through the second conduit.

[0055] Specifically, the first absorption structure 401 and the second absorption structure 402 are located on both sides of the polished film, respectively. The first conduit 404 may have a Y-shaped structure, with two branches at one end connected to the first absorption structure 401 and the second absorption structure 402, and the other end connected to the first collection structure 403. The first absorption structure 401 and the second absorption structure 402 can absorb the debris on both sides of the film after polishing, improving the cleaning effect and further enhancing the quality of the polished film.

[0056] Optionally, the thin film processing apparatus further includes a second collection structure 101, which is disposed below each polishing element. Specifically, the second collection structure 101 can be used to collect debris and other contaminants that fall from the polishing element during the thin film polishing process, in order to keep the thin film processing apparatus clean.

[0057] The following describes the process of processing the thin film using the aforementioned thin film processing apparatus, including:

[0058] First, the drive mechanism 206 drives the third rotating shaft 201 to rotate, which in turn drives the third rotating wheel to rotate in the same direction, and drives the film winding member 205 sleeved on it to rotate in the same direction, so that the film to be processed 6 moves from the polishing member to the film winding member 205; the third rotating wheel drives the fourth transmission wheel 204 to rotate in the same direction, which further drives the first rotating shaft 305 to rotate in the same direction, and drives the polishing member sleeved on the first rotating shaft 305 to rotate in the same direction, which in turn drives the first transmission wheel 306 to rotate in the same direction. Furthermore, the second transmission wheel 304 is driven to rotate in the opposite direction, and the second rotating shaft 301 is driven to rotate in the same direction as the second transmission wheel 304, and the grinding component sleeved on the second rotating shaft 301 is driven to rotate in the same direction, so that the grinding component on the first rotating shaft 305 and the grinding component on the second rotating shaft 301 rotate in opposite directions. During the movement of the film 6 to be processed, the grinding component grinds the film 6 to be processed. With the cooperation of the limiting component 501 and the film winding component 205, the film between the film winding component 205 and the grinding component is kept in a straight state, and the film after being ground by the grinding component is wound onto the film winding component 205.

[0059] While the drive motor is turned on, the first absorption structure 401 and the second absorption structure 402 are driven synchronously. During the polishing process, the debris on both sides of the film after being polished by the polishing part is absorbed and enters the first collection structure 403 through the pipeline. The debris falling from the polishing part can be collected in the second collection structure 101.

[0060] By implementing the above embodiments of this utility model, the thin film processing device includes a driving mechanism, a transmission assembly, and a polishing assembly. The polishing assembly is driven to the driving mechanism via the transmission assembly. The transmission assembly includes a first transmission assembly, which includes at least two transmission members. The polishing assembly includes at least two parallel polishing members, each polishing member being sleeved on a transmission member. Each polishing member rotates with the sleeved transmission member. The thin film to be processed is placed between at least two polishing members, and the polishing members located on both sides of the thin film to be processed rotate in opposite directions. The target transmission member is driven to the driving mechanism, and the other transmission members are connected to the target transmission member. The target transmission component is any one of at least two transmission components, and the other transmission components are any of the at least two transmission components other than the target transmission component. The target transmission component is driven to rotate by the drive mechanism, which in turn drives the corresponding grinding component to rotate. At the same time, the target transmission component drives the other transmission components to rotate in the opposite direction, and the corresponding grinding component rotates with the other transmission components. During the grinding process, the film is placed between at least two grinding components, and the grinding components on both sides of the film rotate in opposite directions, thereby realizing automatic grinding of the film, removing burrs from the upper and lower surfaces of the film, improving grinding quality and efficiency, and avoiding the time-consuming and labor-intensive manual grinding and cleaning, thus reducing the maintenance cost of the instrument.

[0061] This utility model embodiment also provides a semiconductor manufacturing apparatus, including the above-described thin film processing device.

[0062] Regarding the aforementioned semiconductor manufacturing equipment, the specific setup and method of the thin film processing device have been described in detail in the foregoing embodiments, and will not be elaborated further here.

[0063] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations disclosed herein that follow the general principles disclosed herein and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0064] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A thin film processing apparatus, characterized in that, The thin film processing device includes a driving mechanism, a transmission component, and a polishing component, wherein the polishing component is drivenly connected to the driving mechanism through the transmission component. The transmission assembly includes a first transmission assembly, which includes at least two transmission components. The grinding assembly includes at least two parallel grinding components, each grinding component being sleeved on a transmission component. Each grinding component rotates with the sleeved transmission component. The film to be processed is placed between the at least two grinding components, and the grinding components located on both sides of the film to be processed rotate in opposite directions. The target transmission component is driven and connected to the drive mechanism, and other transmission components are connected to the target transmission component. The target transmission component is any one of the at least two transmission components, and the other transmission components are transmission components other than the target transmission component among the at least two transmission components.

2. The thin film processing apparatus according to claim 1, characterized in that, The at least two transmission components include a first transmission component and a second transmission component, and the at least two grinding components include a first grinding component and a second grinding component. The first transmission component corresponds to the first grinding component, and the second transmission component corresponds to the second grinding component. The first transmission component is drivenly connected to the driving mechanism, and the first transmission component is connected to the second transmission component. The first grinding component rotates with the first transmission component, and the second grinding component rotates with the second transmission component. The film to be processed is placed between the first grinding component and the second grinding component, and the first grinding component and the second grinding component rotate in opposite directions.

3. The thin film processing apparatus according to claim 2, characterized in that, The first transmission component includes a first transmission wheel and a first rotating shaft, and the second transmission component includes a second transmission wheel and a second rotating shaft; one end of the first rotating shaft is drivenly connected to the driving mechanism, the other end of the first rotating shaft is connected to the first transmission wheel, the first transmission wheel is connected to the second transmission wheel, and the second transmission wheel is connected to the second rotating shaft; The first grinding element is sleeved on the first rotating shaft and rotates with the first rotating shaft. The second grinding element is sleeved on the second rotating shaft and rotates with the second rotating shaft.

4. The thin film processing apparatus according to claim 3, characterized in that, The transmission assembly further includes a second transmission assembly and a third rotating shaft. The second transmission assembly includes a third transmission wheel, a fourth transmission wheel, and a connecting member. One end of the third rotating shaft is drivenly connected to the drive mechanism, and the other end of the third rotating shaft is connected to the third transmission wheel. The third transmission wheel and the fourth transmission wheel are connected through the connecting member. One end of the first rotating shaft is connected to the fourth transmission wheel.

5. The thin film processing apparatus according to claim 4, characterized in that, The film processing device further includes a film winding component, which is sleeved on the third rotating shaft, and the film processed by the at least two grinding components is wound onto the film winding component.

6. The thin film processing apparatus according to claim 5, characterized in that, The film processing apparatus further includes a limiting member disposed between the at least two grinding members and the film winding member, wherein the film processed by the at least two grinding members is wound onto the film winding member by the limiting member.

7. The thin film processing apparatus according to claim 5, characterized in that, The film processing device further includes a base and a support assembly. The support assembly is fixedly mounted on the base. The support assembly includes a first support member and a second support member, which are arranged opposite to each other. The third rotating shaft passes through the first support member and the second support member, and the film winding member is disposed between the first support member and the second support member.

8. The thin film processing apparatus according to claim 3, characterized in that, The thin film processing apparatus further includes a support assembly, which includes a third support member and a fourth support member. The third support member and the fourth support member are arranged opposite to each other. The first rotating shaft and the second rotating shaft both pass through the third support member and the fourth support member. The first grinding member and the second grinding member are both disposed between the third support member and the fourth support member.

9. The thin film processing apparatus according to any one of claims 1 to 8, characterized in that, The film processing apparatus further includes a cleaning component, which includes a first cleaning component, a first pipeline, and a first collection structure. The first cleaning component is disposed on one side of the film after it has been processed by the at least two abrasive elements, and the first cleaning component is connected to the first collection structure through the first pipeline. The first cleaning component includes at least one first absorption structure, and each first absorption structure is connected to the first collection structure through the first conduit.

10. The thin film processing apparatus according to claim 9, characterized in that, The cleaning assembly further includes a second cleaning assembly and a second pipeline. The first cleaning assembly and the second cleaning assembly are respectively disposed on both sides of the film after it has been treated by the at least two abrasive elements. The second cleaning assembly is connected to the first collection structure through the second pipeline. The second cleaning component includes at least one second absorption structure, each of which is connected to the first collection structure via the second conduit.

11. The thin film processing apparatus according to any one of claims 1 to 8, characterized in that, Each of the grinding parts has grinding flanges at both ends, and the film to be processed is placed between the grinding flanges of each grinding part.

12. The thin film processing apparatus according to any one of claims 1 to 8, characterized in that, The thin film processing apparatus further includes a second collection structure disposed below each of the polishing parts.

13. A semiconductor manufacturing apparatus, characterized in that, Includes the thin film processing apparatus as described in any one of claims 1 to 12.

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