Rounding loose pulley and quartz wafer rounding processing system adopting same

Abstract

The utility model relates to a rounding loose pulley and a quartz wafer rounding processing system using the same, the rounding loose pulley comprises a round pulley body, and the technical key points are as follows: the center of the round pulley body is provided with an inner gear ring structure, the round pulley body is provided with radial working hole groups which are arranged around the center of the round pulley body; the radial working hole set is composed of a plurality of radial working holes used for containing a to-be-ground crystal lump, the thickness of the rounding loose pulley is smaller than the target diameter of the to-be-ground crystal lump, the length of the radial working holes is larger than that of the to-be-ground crystal lump, and the width of the radial working holes is larger than the target diameter of the to-be-ground crystal lump. According to the quartz wafer rounding processing system adopting the rounding loose pulley, the wafer processing quality is remarkably improved, a crack layer generated when the quartz wafer is processed by a rounding grinding machine is effectively removed, meanwhile, the operation difficulty is greatly reduced, the production requirements of batch production, high precision and adjustable roughness can be met, and the production efficiency is remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of quartz wafer processing technology, specifically to a rounding wheel and a quartz wafer rounding processing system using the same, which is suitable for rounding quartz wafers. Background Technology

[0002] The traditional process of rounding quartz wafers is usually achieved by rounding grinding machines. However, the high-speed diamond grinding wheel can cause cracks on the thickness surface of the crystal, increasing the difficulty of subsequent processing. The controllability and adjustability of the roughness of the thickness surface (outer peripheral surface) of the wafer has become a technical challenge, which seriously affects the wafer processing quality, electrical performance, reduces equivalent resistance, and increases traction sensitivity.

[0003] Currently, to mitigate the aforementioned impacts, wafer manufacturers often use a rounding grinder to round the wafer bundle after bonding, and then manually round it to improve the surface roughness of the quartz wafer's thickness. (See [link to relevant documentation]). Figure 4 However, the following problems exist: 1. It requires high experience and skills from operators, is difficult to operate, and is prone to human error; 2. It cannot achieve mass production with high precision, resulting in low production efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a grinding wheel with a reasonable structure, simple operation, and reliable use that solves the above-mentioned problems, as well as a quartz wafer grinding system using the same. This significantly improves the quality of wafer processing, effectively removes the crack layer generated when the grinding machine processes quartz wafers, greatly reduces the difficulty of operation, and enables mass production, high precision, and adjustable roughness, thereby significantly improving production efficiency.

[0005] The technical solution of this utility model is:

[0006] A grinding wheel includes a circular wheel body. The key technical features are: an internal gear ring structure is provided at the center of the circular wheel body; a radial working hole group is arranged around the center of the circular wheel body; the radial working hole group consists of multiple radial working holes for inserting crystals to be ground; the thickness of the grinding wheel is less than the target diameter of the crystals to be ground; the length of the radial working holes is greater than the length of the crystals to be ground; and the width of the radial working holes is greater than the target diameter of the crystals to be ground.

[0007] The aforementioned grinding wheel has an annular material groove on its upper surface that communicates with each radial working hole, so as to facilitate the uniform dispersion of the grinding fluid into each radial working hole.

[0008] A quartz wafer grinding system employing the grinding wheel described above includes a grinding machine. The grinding machine includes a housing, a transmission mechanism, an upper grinding wheel and a lower grinding wheel connected to and arranged opposite to the transmission mechanism, and a sand guiding assembly fixed above the upper grinding wheel. The upper grinding wheel is provided with sand leakage holes, and the lower grinding wheel is evenly distributed with sand drop grooves. The key technical points are: a grinding wheel concentric with the upper and lower grinding wheels is provided between the upper and lower grinding wheels; a positioning gear that mates with the internal gear ring structure of the grinding wheel is provided at the center of the upper surface of the lower grinding wheel; a polishing film is attached to the lower surface of the upper grinding wheel, and the polishing film is provided with through holes corresponding to the sand leakage holes of the upper grinding wheel.

[0009] The aforementioned quartz wafer grinding system includes a sand guiding assembly comprising multiple guide tubes fixed to the upper surface of the upper grinding disc and sand guiding grooves connected to the upper ends of each guide tube. The sand leakage hole of the upper grinding disc is connected to the lower end of the guide tube.

[0010] The aforementioned quartz wafer grinding system further includes a sand supply unit, which includes a sand supply tank, a sand supply pump connected to the outlet of the sand supply tank, a return pipe connected to the inlet of the sand supply tank, and a sand supply pipe connected to the outlet of the sand supply pump. The end of the sand supply pipe is suspended above the sand guiding assembly. A sand collection trough surrounding the lower grinding disc is provided above the chassis, and the sand outlet of the sand collection trough is connected to the return pipe.

[0011] The aforementioned quartz wafer grinding system includes a transmission mechanism comprising a main shaft and a turntable concentric with the main shaft. The lower grinding disc is fixed above the turntable. The upper end of the main shaft is provided with a positioning base that passes through the turntable, the lower grinding disc, and the positioning gear. The upper grinding disc is connected and fixed to the positioning base.

[0012] The beneficial effects of this utility model are:

[0013] 1. Abandoning traditional manual rounding equipment, after rounding the crystal agglomerates using a rounding grinder, the agglomerates to be ground are placed one by one into the radial working holes of the grinding wheel, slightly protruding from the radial working holes. The drive source is started, and the upper and lower grinding discs rotate in opposite directions. The upper grinding disc is coated with a polishing film, while the lower grinding disc is not coated. Therefore, the frictional forces exerted by the two discs on the agglomerates to be ground differ. The polishing film on the lower surface of the upper grinding disc provides frictional power to the agglomerates, causing them to rotate at a uniform speed within the radial working holes. During this process, the abrasive supply unit delivers the grinding fluid (containing abrasive) to the abrasive guide assembly, and then through the abrasive leakage holes of the upper grinding disc and the through-holes of the polishing film into the various radial working holes of the upper grinding disc. The grinding fluid and the agglomerates generate relative displacement within the radial working holes, thereby achieving re-grinding of the outer circumference of the agglomerates. This effectively removes the crack layer generated during the processing of quartz wafers by the rounding grinder, significantly improving the processing quality of the wafers.

[0014] 2. Compared with traditional manual rounding, it greatly reduces the difficulty of operation, does not require much experience from operators, enables mass production, avoids human error, improves processing accuracy, and significantly improves production efficiency.

[0015] 3. By adjusting the ratio of grinding sand and grinding fluid, the surface roughness of the crystal mass to be processed can be controlled, making it widely applicable.

[0016] 4. The sand supply unit is used to achieve circulating sand addition, reducing waste and saving energy and protecting the environment.

[0017] 5. The grinding machine can be modified from a 4S / 4B type grinding machine. The 4S / 4B type grinding machine is generally used for grinding the flat surface of wafers. This utility model modifies it to be suitable for grinding the outer circle of wafers by adding a grinding wheel and other technical means, thus realizing the modification and upgrade. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is an exploded view of the sand guiding assembly, upper grinding disc, polishing film, grinding wheel and lower grinding disc of this utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the rounded cruise ship of this utility model;

[0021] Figure 4 This is a schematic diagram of the traditional process.

[0022] In the diagram: 1. Sand supply bucket, 2. Sand supply pump, 3. Sand supply pipe, 4. Sand guide trough, 5. Upper grinding disc, 6. Grinding wheel, 7. Lower grinding disc, 8. Sand collection trough, 9. Return pipe, 10. Chassis, 11. Guide pipe, 12. Positioning pin, 13. Polishing film, 14. Positioning base, 15. Positioning gear, 16. Radial working hole, 17. Annular material feeding trough, 18. Internal gear ring structure. Detailed Implementation

[0023] The present invention will be described in detail with reference to the accompanying drawings.

[0024] like Figures 1-3As shown, the quartz wafer grinding system includes a grinding machine and a sand supply unit. The grinding machine is a modified 4S / 4B type grinding machine, which includes a housing 10, a transmission mechanism, an upper grinding disc 5 and a lower grinding disc 7 connected to the transmission mechanism and arranged opposite to each other, and a sand guiding assembly fixed above the upper grinding disc 5. The upper grinding disc 5 is provided with sand leakage holes, and the lower grinding disc 7 is evenly distributed with sand drop grooves. The sand guiding assembly includes multiple guide pipes 11 fixed to the upper surface of the upper grinding disc 5, and sand guide grooves 4 communicating with the upper ends of each guide pipe 11. The sand leakage holes of the upper grinding disc 5 are connected to the lower ends of the guide pipes 11.

[0025] A grinding wheel 6, concentric with both the upper grinding disc 5 and the lower grinding disc 7, is provided between them. The grinding wheel 6 includes a circular body with an internal gear ring structure 18 at its center. A group of radial working holes arranged around the center of the circular body is provided, consisting of multiple radial working holes 16 for inserting the crystal agglomerate to be ground. The crystal agglomerate is inserted along the length of the radial working holes 16. The thickness of the grinding wheel 6 is less than the target diameter of the crystal agglomerate, the length of the radial working holes 16 is greater than the length of the crystal agglomerate, and the width of the radial working holes 16 is greater than the target diameter of the crystal agglomerate. An annular material distribution groove 17, communicating with each radial working hole 16, is provided on the upper surface of the grinding wheel 6 to facilitate the uniform dispersion of the grinding fluid into each radial working hole 16. A positioning gear 15, which mates with the internal gear ring structure 18 of the grinding wheel 6, is provided at the center of the upper surface of the lower grinding disc 7. A polishing film 13 is attached to the lower surface of the upper grinding disc 5, and the polishing film 13 has through holes corresponding to the sand leakage holes of the upper grinding disc 5.

[0026] The sand supply unit includes a sand supply tank 1, a sand supply pump 2 connected to the outlet of the sand supply tank 1, a return pipe 9 connected to the inlet of the sand supply tank 1, and a sand supply pipe 3 connected to the outlet of the sand supply pump 2. The end of the sand supply pipe 3 is suspended above the sand guide trough 4 of the sand guide assembly. A sand collection trough 8 surrounding the lower grinding disc 7 is provided above the housing 10, and the sand outlet of the sand collection trough 8 is connected to the return pipe 9. The transmission mechanism includes a main shaft and a turntable concentric with the main shaft. The lower grinding disc 7 is fixed above the turntable. A positioning base 14 passing through the turntable, the lower grinding disc 7, and the positioning gear 15 is provided at the upper end of the main shaft. The upper grinding disc 5 is connected and fixed to the positioning base 14.

[0027] In this embodiment, the thickness of the grinding wheel 6 is smaller than the target diameter of the crystal to be ground, with a difference of 0.1 to 0.2 mm; the gap between the grinding wheel 6 and the inner wall of the working hole 16 is 0.5 to 1 mm. The sand groove of the lower grinding disc 7 is preferably square, but can also be appropriately adjusted to a radar shape or a rhombus shape depending on the situation; the grinding sand used in the grinding fluid is designed and selected according to the roughness requirements.

[0028] Operating instructions:

[0029] 1. Mount the grinding wheel 6 onto the positioning gear 15. Under the action of gravity, the grinding wheel 6 will naturally adhere to the lower grinding disc 7. Place the prepared crystal lumps to be ground one by one into the corresponding radial working holes 16, filling them completely.

[0030] 2. Hold the grinding disc 5 in your hand and place it on top of the crystal to be ground through the protruding radial working hole 16, and use the positioning pin 12 to connect and fix it to the positioning base 14.

[0031] 4. Start the drive source. The upper grinding disc 5 and the lower grinding disc 7 rotate in opposite directions. The upper grinding disc 5 is covered with a polishing film 13, while the lower grinding disc 7 is not covered with a film. Therefore, the frictional force between the two on the crystal to be ground is different. The polishing film 13 provides frictional power to the crystal, causing the crystal to rotate at a constant speed in the radial working hole 16. At the same time, start the sand supply pump 2 to deliver the grinding fluid (containing grinding sand) to the sand guide assembly, and then enter the radial working holes 16 of the upper grinding wheel 6 through the sand leakage hole of the upper grinding disc 5 and the through hole of the polishing film 13. The grinding fluid and the crystal generate relative displacement in the radial working holes 16, thereby realizing the re-grinding of the outer peripheral surface of the crystal. After the set time, the grinding is completed, the machine is stopped and the crystal is removed.

[0032] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made within the scope of this utility model should still fall within the scope of this patent.

Claims

1. A rounded cruise ship, comprising a circular wheel body, characterized in that: The circular wheel has an internal gear ring structure at its center, and a radial working hole group is arranged around its center on the circular wheel. The radial working hole group consists of multiple radial working holes for inserting the crystal to be ground. The thickness of the grinding wheel is less than the target diameter of the crystal to be ground, the length of the radial working holes is greater than the length of the crystal to be ground, and the width of the radial working holes is greater than the target diameter of the crystal to be ground.

2. The rounded cruise ship according to claim 1, characterized in that: The upper surface of the rounded cruise wheel is provided with an annular fabric groove that communicates with each radial working hole.

3. A quartz wafer grinding system using a grinding wheel as described in claim 1 or 2, comprising a grinding machine, the grinding machine including a housing, a transmission mechanism, an upper grinding disc and a lower grinding disc connected to and arranged opposite to the transmission mechanism, and a sand guiding assembly fixed above the upper grinding disc, wherein the upper grinding disc is provided with sand leakage holes, and the lower grinding disc is provided with sand drop grooves evenly distributed, characterized in that: A grinding wheel concentric with both the upper and lower grinding discs is provided between them. A positioning gear that mates with the internal gear ring structure of the grinding wheel is provided at the center of the upper surface of the lower grinding disc. A polishing film is attached to the lower surface of the upper grinding disc, and a through hole corresponding to the sand leakage hole of the upper grinding disc is provided on the polishing film.

4. The quartz wafer grinding system according to claim 3, characterized in that: The sand guiding assembly includes multiple guide tubes fixed to the upper surface of the upper grinding disc and a sand guiding groove connected to the upper end of each guide tube. The sand leakage hole of the upper grinding disc is connected to the lower end of the guide tube.

5. The quartz wafer grinding system according to claim 3, characterized in that: It also includes a sand supply unit, which includes a sand supply tank, a sand supply pump connected to the outlet of the sand supply tank, a return pipe connected to the inlet of the sand supply tank, and a sand supply pipe connected to the outlet of the sand supply pump. The end of the sand supply pipe is suspended above the sand guiding assembly. A sand collection trough surrounding the lower grinding disc is provided above the machine housing. The sand outlet of the sand collection trough is connected to the return pipe.

6. The quartz wafer grinding system according to claim 3, characterized in that: The transmission mechanism includes a main shaft and a turntable concentric with the main shaft. The lower grinding disc is fixed above the turntable. The upper end of the main shaft is provided with a positioning base that passes through the turntable, the lower grinding disc, and the positioning gear. The upper grinding disc is connected and fixed to the positioning base.

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