Open type material box feeding and discharging machine

Abstract

The utility model relates to the technical field of material box feeding and discharging equipment, and discloses an open type material box feeding and discharging machine which comprises a containing platform, a support is fixedly connected to the lower surface of the containing platform, a connecting plate is fixedly connected to the lower surface of the support, and a driving plate is fixedly connected to the upper surface of the connecting plate. A cylinder is fixedly arranged on the upper surface of the driving plate in a penetrating mode, a threaded rod is in threaded connection with the inner wall of the cylinder, a driving platform is rotationally connected with the surface of the threaded rod, and a supporting plate is fixedly connected with the upper surface of the driving platform. A first rotating rod rotates to drive a transmission belt to rotate through a first transmission wheel, the transmission belt rotates to drive a threaded rod to rotate, the threaded rod rotates to drive a platform to move downwards through downward movement of a cylinder, and therefore an electric push rod is driven to move downwards by one layer, a first motor is stopped, and then the electric push rod operates again to push semiconductor materials on the lower layer. Therefore, the equipment has the effect of conveniently pushing the double-layer semiconductor materials to accelerate the conveying efficiency.

Description

Technical Field

[0001] This application belongs to the technical field of material box loading and unloading equipment, specifically an open material box loading and unloading machine. Background Technology

[0002] Semiconductor open-cell loading and unloading machines are an important type of automated equipment in the semiconductor manufacturing industry. The following is a detailed introduction to them. They typically employ an automated control system, which uses sensors to detect the position and status of the cassette, and then drives robotic arms, push rods, suction cups, or grippers to pick up and unload semiconductor wafers, chips, and other materials from the open cassette. The materials are then placed into the corresponding processing or testing equipment for processing, and after processing, the materials are returned to the cassette or transferred to the next process.

[0003] Existing feeding machines can only transport a limited amount of semiconductor materials at a time, making it impossible to stack the materials for continuous transport. This results in low transport efficiency and affects work efficiency. Utility Model Content

[0004] The purpose of this application is to provide an open-type box loading and unloading machine to solve the problem that existing unloading machines have limited material capacity when conveying semiconductor materials, making it impossible to stack materials and continuously convey them, resulting in low conveying efficiency and affecting work efficiency.

[0005] The technical solution adopted in this application is as follows: An open-type material box loading and unloading machine includes a placement platform, a bracket fixedly connected to the lower surface of the placement platform, a connecting plate fixedly connected to the lower surface of the bracket, a driving plate fixedly connected to the upper surface of the connecting plate, a cylinder fixedly passing through the upper surface of the driving plate, a threaded rod threadedly connected to the inner wall of the cylinder, a driving platform rotatably connected to the surface of the threaded rod, a support plate fixedly connected to the upper surface of the driving platform, a limit component fixedly connected to the upper surface of the support plate, an electric push rod fixedly connected to the upper surface of the limit component, a first motor fixedly connected to the upper surface of the driving platform, a first rotating rod fixedly connected to the output end of the first motor, a first transmission wheel fixedly sleeved on the surface of both the first rotating rod and the threaded rod, a transmission belt provided on the surface of the first transmission wheel, and a horizontal plate fixedly connected to the back of the placement platform.

[0006] By adopting the above technical solution, semiconductor materials are first transported from the conveying module to the feeding box, or manually placed and stacked on the feeding box. Then, the second motor is turned on, which drives the second rotating rod to rotate. The rotation of the second rotating rod drives the second transmission wheel to rotate. The rotation of the second transmission wheel drives the lead screw to rotate via the conveyor belt. The rotation of the lead screw drives the conveying table to move on the surface of the slide rail. Then, the electric push rod is turned on, which pushes the semiconductor materials onto the conveying table. The conveying table carries the semiconductor materials for transport. After the upper layer of semiconductor materials is transported, the first motor is turned on, which drives the first rotating rod to rotate. The rotation of the first rotating rod drives the transmission belt to rotate via the first transmission wheel. The rotation of the transmission belt drives the threaded rod to rotate. The rotation of the threaded rod causes the cylinder to move downward, which in turn causes the platform to move downward, thereby moving the electric push rod down one layer. Then, the first motor is stopped, and then the electric push rod runs again to push the lower layer of semiconductor materials. Thus, the equipment has the effect of facilitating the transport of double-layer semiconductor materials and accelerating the conveying efficiency.

[0007] In a preferred embodiment, a conveying module is provided on the upper surface of the horizontal plate.

[0008] By adopting the above technical solution and setting up a conveying module, external semiconductor materials can be automatically conveyed into the feeding box. This is an existing structure and will not be described in detail here.

[0009] In a preferred embodiment, a slide rail is fixedly connected to the upper surface of the horizontal plate, a conveying platform is slidably sleeved on the surface of the slide rail, and a lead screw is threadedly connected to the side of the conveying platform.

[0010] By adopting the above technical solution and setting a lead screw, the screw can be rotated to drive the conveyor table to move, thereby transporting semiconductor materials.

[0011] In a preferred embodiment, a second motor is fixedly connected to the upper surface of the cross plate, a second rotating rod is fixedly connected to the output end of the second motor, a second transmission wheel is fixedly sleeved on the surface of the second rotating rod, the second transmission wheel is fixedly sleeved on the surfaces of both the second rotating rod and the lead screw, and a conveyor belt is provided on the surface of the second transmission wheel.

[0012] By adopting the above technical solution and setting a second motor, the second rotating rod can be driven to rotate after operation. The rotation of the second rotating rod drives the second transmission wheel to rotate. The rotation of the second transmission wheel drives the lead screw to rotate through the conveyor belt, thereby moving the conveyor table.

[0013] In a preferred embodiment, a material feeding box is fixedly connected to the upper surface of the placement platform.

[0014] By adopting the above technical solution and setting up a material box, semiconductor materials that can be automatically conveyed or manually handled can be placed.

[0015] In a preferred embodiment, a limiting rod is provided on the upper surface of the driving plate, and there are two limiting rods. The two limiting rods are arranged on both sides of the upper surface of the driving plate with the vertical center line of the side of the driving plate as the axis of symmetry.

[0016] By adopting the above technical solution and setting two horizontal plates, the deviation caused by the rotation of the threaded rod driving the platform can be reduced, thus ensuring stable movement of the platform.

[0017] In a preferred embodiment, the number of cylinders is three. The inner wall of the cylinder located in the middle of the upper surface of the driving plate is provided with threads, and the threaded rod is threadedly connected to the cylinder located in the middle of the upper surface of the driving plate through the threads on the inner wall of the cylinder. The cylinders located on both sides of the middle of the upper surface of the driving plate are respectively sleeved on the surface of the limiting rod.

[0018] By adopting the above technical solution, the cylinder in the middle position can drive the platform to move when the threaded rod rotates, thereby driving the electric push rod to move. By setting cylinders on both sides, the limit rod can be kept in a stable vertical direction.

[0019] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:

[0020] 1. In this application, semiconductor materials are first transported from the conveying module to the feeding box, or manually placed and stacked on the feeding box. Then, the second motor is turned on, which drives the second rotating rod to rotate. The rotation of the second rotating rod drives the second transmission wheel to rotate. The rotation of the second transmission wheel drives the lead screw to rotate via the conveyor belt. The rotation of the lead screw drives the conveying table to move on the surface of the slide rail. Then, the electric push rod is turned on, which pushes the semiconductor materials onto the conveying table. The conveying table carries the semiconductor materials for conveying. After the upper layer of semiconductor materials is conveyed, the first motor is turned on, which drives the first rotating rod to rotate. The rotation of the first rotating rod drives the transmission belt to rotate via the first transmission wheel. The rotation of the transmission belt drives the threaded rod to rotate. The rotation of the threaded rod causes the cylinder to move downward, which in turn causes the platform to move downward, thereby moving the electric push rod down one layer. Then, the first motor is stopped, and then the electric push rod runs again to push the lower layer of semiconductor materials, so that the device has the effect of facilitating the conveying of double-layer semiconductor materials and accelerating the conveying efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the main view structure of this application;

[0022] Figure 2 This is a top view of the structure of this application;

[0023] Figure 3This is a side view structural diagram of this application;

[0024] Figure 4 This is a schematic diagram of the structure from below in this application.

[0025] The markings in the diagram are: 1. Placement platform; 2. Material box; 3. Conveying module; 4. Support; 5. Driving plate; 6. Driving platform; 7. Cylinder; 8. Threaded rod; 9. First motor; 10. First transmission wheel; 11. First rotating rod; 12. Electric push rod; 13. Support plate; 14. Limiting assembly; 15. Second motor; 16. Slide rail; 17. Conveying table; 18. Conveyor belt; 19. Horizontal plate; 20. Second rotating rod; 21. Second transmission wheel; 22. Lead screw; 23. Connecting plate; 24. Transmission belt; 25. Limiting rod. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Example:

[0028] Referring to Figures 2-4, an open-type material box loading and unloading machine includes a placement platform 1. A support 4 is fixedly connected to the lower surface of the placement platform 1. A connecting plate 23 is fixedly connected to the lower surface of the support 4. A driving plate 5 is fixedly connected to the upper surface of the connecting plate 23. A cylinder 7 is fixedly threaded through the upper surface of the driving plate 5. A threaded rod 8 is threadedly connected to the inner wall of the cylinder 7. A driving platform 6 is rotatably connected to the surface of the threaded rod 8. A support plate 13 is fixedly connected to the upper surface of the driving platform 6. A limit assembly 14 is fixedly connected to the upper surface of the support plate 13. An electric push rod 12 is fixedly connected to the upper surface of the limit assembly 14. A first motor 9 is fixedly connected to the upper surface of the driving platform 6. A first rotating rod 11 is fixedly connected to the output end of the first motor 9. A first transmission wheel 10 is fixedly sleeved on the surfaces of both the first rotating rod 11 and the threaded rod 8. A transmission belt 24 is provided on the surface of the first transmission wheel 10. A horizontal plate 19 is fixedly connected to the back of the placement platform 1. Semiconductor materials are transported from the conveying module 3 to the material box 2, or... The semiconductor materials are manually placed and stacked on the material box 2. Then, the second motor 15 is turned on. The second motor 15 drives the second rotating rod 20 to rotate, which in turn drives the second transmission wheel 21 to rotate. The second transmission wheel 21 drives the lead screw 22 to rotate via the conveyor belt 18. The lead screw 22 drives the conveying table 17 to move on the surface of the slide rail 16. Then, the electric push rod 12 is turned on. The electric push rod 12 pushes the semiconductor materials onto the conveying table 17. The conveying table 17 carries the semiconductor materials for conveying. After the semiconductor materials of the previous layer are conveyed, the first motor 9 is turned on. The first motor 9 drives the first rotating rod 11 to rotate, which drives the transmission belt 24 to rotate via the first transmission wheel 10. The transmission belt 24 then drives the threaded rod 8 to rotate. The threaded rod 8 rotates and moves down using the cylinder 7. The threaded rod 8 moves down and moves the platform 6 down, thereby moving the electric push rod 12 down one layer. Then, the first motor 9 is stopped, and then the electric push rod 12 runs again to push the next layer of semiconductor materials.

[0029] Referring to Figure 2-3, a conveying module 3 is provided on the upper surface of the horizontal plate 19. By providing the conveying module 3, external semiconductor materials can be automatically conveyed into the feeding box 2. This is an existing structure and will not be described in detail here.

[0030] Referring to Figures 1-3, a slide rail 16 is fixedly connected to the upper surface of the horizontal plate 19. A conveying platform 17 is slidably mounted on the surface of the slide rail 16. A lead screw 22 is threadedly connected to the side of the conveying platform 17. By setting the lead screw 22, it can rotate and drive the conveying platform 17 to move, thereby transporting semiconductor materials.

[0031] Referring to Figure 2-3, a second motor 15 is fixedly connected to the upper surface of the horizontal plate 19. A second rotating rod 20 is fixedly connected to the output end of the second motor 15. A second transmission wheel 21 is fixedly sleeved on the surface of the second rotating rod 20. The second transmission wheel 21 is fixedly sleeved on the surfaces of both the second rotating rod 20 and the lead screw 22. A conveyor belt 18 is provided on the surface of the second transmission wheel 21. By setting the second motor 15, it can drive the second rotating rod 20 to rotate after running. The rotation of the second rotating rod 20 drives the second transmission wheel 21 to rotate. The rotation of the second transmission wheel 21 drives the lead screw 22 to rotate through the conveyor belt 18, thereby driving the conveyor table 17 to move.

[0032] Referring to Figure 1-2, a material box 2 is fixedly connected to the upper surface of the placement platform 1. By setting the material box 2, semiconductor materials that are automatically conveyed or manually handled can be placed.

[0033] Referring to Figure 2-3, a limiting rod 25 is provided on the upper surface of the driving plate 5, and there are two limiting rods 25. The two limiting rods 25 are arranged on both sides of the upper surface of the driving plate 5 with the vertical center line of the side of the driving plate 5 as the axis of symmetry. By setting two limiting rods 25, the deviation caused by the rotation of the threaded rod 8 driving the platform 6 to move can be reduced, so that the driving platform 6 can move stably.

[0034] Referring to Figure 2-4, there are three cylinders 7. The inner wall of the cylinder 7 located in the middle of the upper surface of the driving plate 5 is provided with threads, and the threaded rod 8 is threadedly connected to the cylinder 7 located in the middle of the upper surface of the driving plate 5 through the threads on the inner wall of the cylinder 7. The cylinders 7 located on both sides of the upper surface of the driving plate 5 are respectively sleeved on the surface of the limiting rod 25. By setting the cylinder 7 in the middle position, the driving platform 6 can be moved when the threaded rod 8 rotates, thereby driving the electric push rod 12 to move. By setting the cylinders 7 on both sides, the limiting rod 25 can be kept in a stable vertical direction.

[0035] The implementation principle of an open-type material box loading and unloading machine according to this application is as follows: First, semiconductor materials are transported from the conveying module 3 to the material box 2, or manually placed and stacked on the material box 2. Then, the second motor 15 is turned on, and the second motor 15 drives the second rotating rod 20 to rotate. The rotation of the second rotating rod 20 drives the second transmission wheel 21 to rotate. The rotation of the second transmission wheel 21 drives the lead screw 22 to rotate through the conveyor belt 18. The rotation of the lead screw 22 drives the conveying table 17 to move on the surface of the slide rail 16. Then, the electric push rod 12 is turned on, and the electric push rod 12 pushes the semiconductor materials onto the conveying table 17. The device conveys semiconductor materials. After the upper layer of semiconductor materials is conveyed, the first motor 9 is turned on. The first motor 9 drives the first rotating rod 11 to rotate. The rotation of the first rotating rod 11 drives the transmission belt 24 to rotate through the first transmission wheel 10. The rotation of the transmission belt 24 then drives the threaded rod 8 to rotate. The rotation of the threaded rod 8 causes the cylinder 7 to move downward. The downward movement of the threaded rod 8 drives the platform 6 to move downward, thereby driving the electric push rod 12 to move down one layer. Then the first motor 9 is stopped. Then the electric push rod 12 runs again to push the lower layer of semiconductor materials, so that the device can easily push double-layer semiconductor materials and speed up the conveying efficiency.

[0036] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An open-type material box loading and unloading machine, comprising a placement platform (1), characterized in that: A bracket (4) is fixedly connected to the lower surface of the placement platform (1). A connecting plate (23) is fixedly connected to the lower surface of the bracket (4). A driving plate (5) is fixedly connected to the upper surface of the connecting plate (23). A cylinder (7) is fixedly inserted through the upper surface of the driving plate (5). A threaded rod (8) is threadedly connected to the inner wall of the cylinder (7). A driving platform (6) is rotatably connected to the surface of the threaded rod (8). A support plate (13) is fixedly connected to the upper surface of the driving platform (6). The upper surface of the support plate (13) is... A limiting component (14) is fixedly connected. An electric push rod (12) is fixedly connected to the upper surface of the limiting component (14). A first motor (9) is fixedly connected to the upper surface of the driving platform (6). A first rotating rod (11) is fixedly connected to the output end of the first motor (9). A first transmission wheel (10) is fixedly sleeved on the surface of the first rotating rod (11) and the threaded rod (8). A transmission belt (24) is provided on the surface of the first transmission wheel (10). A horizontal plate (19) is fixedly connected to the back of the placement platform (1).

2. The open-type material box loading and unloading machine as described in claim 1, characterized in that: The upper surface of the horizontal plate (19) is provided with a conveying module (3).

3. The open-type material box loading and unloading machine as described in claim 1, characterized in that: The upper surface of the horizontal plate (19) is fixedly connected to a slide rail (16), and a conveying platform (17) is slidably sleeved on the surface of the slide rail (16). A lead screw (22) is threadedly connected to the side of the conveying platform (17).

4. The open-type material box loading and unloading machine as described in claim 1, characterized in that: The upper surface of the horizontal plate (19) is fixedly connected to a second motor (15), the output end of the second motor (15) is fixedly connected to a second rotating rod (20), the surface of the second rotating rod (20) is fixedly fitted with a second transmission wheel (21), the surfaces of the second rotating rod (20) and the lead screw (22) are both fixedly fitted with the second transmission wheel (21), and the surface of the second transmission wheel (21) is provided with a conveyor belt (18).

5. An open-type material box loading and unloading machine as described in claim 1, characterized in that: The upper surface of the placement platform (1) is fixedly connected to the material box (2).

6. The open-type material box loading and unloading machine as described in claim 1, characterized in that: The upper surface of the driving plate (5) is provided with a limiting rod (25), and there are two limiting rods (25). The two limiting rods (25) are arranged on both sides of the upper surface of the driving plate (5) with the vertical center line of the side of the driving plate (5) as the axis of symmetry.

7. An open-type material box loading and unloading machine as described in claim 6, characterized in that: The number of cylinders (7) is three. The inner wall of the cylinder (7) located in the middle of the upper surface of the driving plate (5) is provided with threads, and the threaded rod (8) is threadedly connected to the cylinder (7) located in the middle of the upper surface of the driving plate (5) through the threads of the inner wall of the cylinder (7). The cylinders (7) located on both sides of the upper surface of the driving plate (5) are respectively sleeved on the surface of the limiting rod (25).

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