Slide glass probe station with full-automatic function

Abstract

The utility model discloses a slide glass probe station with a full-automatic function, which is compatible with feeding of a 2-inch vacuum adsorption waffle box and a 4-inch vacuum adsorption waffle box, and comprises an equipment main body, a feeding and discharging port positioned on the front side surface of the equipment main body, a state indicating lamp positioned on the top surface of the equipment main body, and a control module positioned on the front side surface of the equipment main body, a control assembly corresponding to the feeding and discharging port is arranged in the equipment body, the main control displayer is arranged and located on the surface, on one side of the control assembly, of the equipment body, and the auxiliary control displayer is arranged and located at one end, on the other side of the control assembly, of the equipment body. And the operation button is positioned on the outer surface of the equipment main body corresponding to the control assembly. According to the utility model, a large amount of manual operation can be reduced, the automation degree is ultrahigh, and the test efficiency and the test accuracy are extremely high.

Description

Technical Field

[0001] This utility model relates to the field of microelectronics technology, specifically a wafer probe station with fully automated functions. Background Technology

[0002] Carrier wafers are new types of products produced by new processes. Common types include stacked, silicon-based, BGA packaged, and monolithic wafers. They have advantages such as miniaturization, high integration, and low cost.

[0003] Probe stations are essential testing equipment in the semiconductor industry, widely used for precision electrical measurements of complex, high-speed devices. They aim to ensure quality and reliability while reducing R&D time and device manufacturing costs. Because the test points (Pads) on the wafer are exposed on the wafer surface, and due to material consistency and manufacturing process variations, the final Pad positions on the wafer are inconsistent and irregularly arranged; even the height of the Pads may vary.

[0004] Currently, probe stations on the market are mainly used for wafer inspection, chip development, and fault analysis in the wafer manufacturing process. They cannot be directly used for testing wafer-mounted products. Some technical solutions are mainly divided into manual and tooling-based types, specifically:

[0005] Manual testing involves placing the product on a manual probe stage, magnifying the image of the product through a microscope, locating each pad point, and then operating the probe to perform the test. Due to the cumbersome operation and reliance on the operator's skill and senses, it is not suitable for large-scale testing and is prone to damaging the device.

[0006] The tooling-based method mainly relies on separate test fixtures. The product to be tested is first connected to the fixture through bonding, crimping, or other methods. Then, the fixture is connected to the testing equipment to complete the test. This method requires different fixtures for different products and adds process steps.

[0007] Based on this, a fully automated wafer probe station is now provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0008] The purpose of this invention is to provide a slide probe station with fully automated functions to solve the problems in the background art.

[0009] To achieve the above objectives, a fully automated slide probe station is proposed according to this utility model, characterized in that the probe station is compatible with 2-inch vacuum adsorption waffle box and 4-inch vacuum adsorption waffle box feeding, and the probe station includes: a main body of the equipment;

[0010] - Loading and unloading ports, which are located on the front side of the main body of the equipment;

[0011] - Status indicator light, which is located on the top surface of the main body of the device;

[0012] - Control component: The main body of the equipment is provided with a control component corresponding to the loading and unloading ports. The control component includes: a material transfer component for moving materials and a test component for testing materials.

[0013] - Main control display, which is disposed on and located on the surface of the device body on one side of the control component;

[0014] - A secondary control display, wherein the secondary control display is disposed and located at one end of the main body of the device on the other side of the control component;

[0015] - Operation button, the operation button is located on the outer surface of the device body corresponding to the control component;

[0016] - A loading / unloading assembly, wherein the loading / unloading assembly is disposed inside the main body of the equipment corresponding to the loading / unloading port, the loading / unloading assembly comprising:

[0017] - Feeding hopper, which is fixedly connected inside the main body of the equipment;

[0018] - A vision probe, which is located at the bottom of the inside of the main body of the device;

[0019] -OK hopper, wherein the OK hopper is located on one side of the feeding hopper;

[0020] - Processing station, which is located on the other side of the feeding hopper.

[0021] In some examples of this utility model, the transfer assembly includes:

[0022] - Transfer Y-axis, wherein the transfer Y-axis is fixedly connected to one end surface of the inner wall of the equipment body;

[0023] - Transfer X-axis, wherein the transfer X-axis is slidably connected to one end surface of the transfer Y-axis;

[0024] - Transfer Z-axis, which is slidably connected to the surface of the transfer X-axis, and the surface of the transfer Z-axis is provided with a material pick-and-place working head.

[0025] In some examples of this utility model, the test component includes:

[0026] -Chuck tray, which is installed on one side of the OK hopper;

[0027] - Superconducting magnetic plate, the superconducting magnetic plate being disposed on the side of the Chuck disk away from the OK hopper;

[0028] - Several electric needle holders, wherein the electric needle holders are disposed on one end surface of the superconducting magnetic plate;

[0029] - Manual needle holder, wherein the manual needle holder is disposed on the surface of the superconducting magnetic plate where the electric needle holder is located;

[0030] - Intelligent vision component, wherein the intelligent vision component is disposed at the center position of the circle surrounding the electric needle seat;

[0031] - A six-axis adjustment assembly, which is connected to one end surface of the intelligent vision assembly; - A superconducting magnetic plate, on the surface of which the six-axis adjustment assembly is connected.

[0032] In some examples of this utility model, the other end of the superconducting magnetic plate is provided with a high-precision motion component that moves the Chuck disk to a position concentrically below the intelligent vision component.

[0033] In some examples of this utility model, a movable module is provided inside the main body of the device, and a placement component is provided inside the movable module.

[0034] In some examples of this utility model, the placement component includes:

[0035] - Component base, which is slidably connected to the inside of the mobile module;

[0036] -socket fixture, wherein the socket fixture is located at the center of one end of the component base near the mobile module;

[0037] - Adjustment knob, which is located around the socket fixture;

[0038] - Servo pressure head, the servo pressure head is located at the top of the inner wall of the moving module.

[0039] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0040] 1. This utility model achieves automatic loading and unloading through an automatic hopper, significantly reducing manual operation. It boasts a high degree of automation, extremely high testing efficiency and accuracy, and features a highly compatible chuck that can accommodate various types of materials, such as stacked, silicon-based, BGA packaged, and monolithic materials.

[0041] 2. This utility model is compatible with both 2-inch and 4-inch vacuum adsorption waffle boxes, providing excellent compatibility and improving efficiency. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the overall external structure of this utility model.

[0043] Figure 2 This is a schematic diagram of the overall internal structure of this utility model.

[0044] Figure 3 This is a schematic diagram of the socket fixture of this utility model.

[0045] Figure label annotations:

[0046] 1. Main body of the equipment; 2. Loading and unloading ports; 3. Control components; 4. Main control display; 5. Sub-control display; 6. Operation buttons; 7. Status indicator lights; 8. Material handling head; 9. Transfer Z-axis; 10. Transfer Y-axis; 11. Transfer X-axis; 12. Loading hopper; 13. OK hopper; 14. Processing table; 15. Chuck tray; 16. Six-axis adjustment component; 17. Intelligent vision component; 18. Electric needle holder; 19. Manual needle holder; 20. Superconducting magnetic plate; 21. High-precision motion component; 22. Moving module; 23. Servo pressure head; 24. Socket fixture; 25. Adjustment knob; 26. Component base; 27. Vision probe. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0048] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0049] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0050] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0051] Example 1

[0052] In one embodiment, such as Figures 1-3 As shown, a fully automated wafer probe station includes a main body 1. A loading / unloading port 2 is located on the surface of the main body 1. A control component 3 is located inside the main body 1 corresponding to the surface of the loading / unloading port 2. The control component 3 includes a material transfer component for moving materials and a testing component for testing the materials. A main control display 4 is located on the surface of the main body 1 on one side of the control component 3, and a secondary control display 5 is located at one end of the main body 1 on the other side of the control component 3. Operation buttons 6 are located on the outer surface of the main body 1 corresponding to the control component 3. A status indicator light 7 for displaying the current status of the device is installed on the upper surface of the main body 1.

[0053] In one embodiment, such as Figure 2 As shown, the material transfer assembly includes a transfer Y-axis 10 fixedly connected to one end surface of the inner wall of the equipment body 1. A transfer X-axis 11 is slidably connected to one end surface of the transfer Y-axis 10, and a transfer Z-axis 9 is slidably connected to the surface of the transfer X-axis 11. A material handling head 8 is provided on the surface of the transfer Z-axis 9. An loading / unloading assembly is provided inside the equipment body 1 corresponding to the loading / unloading port 2. The loading / unloading assembly includes a loading hopper 12 fixedly connected inside the equipment body 1. An OK hopper 13 is provided on one side of the loading hopper 12. A vision probe 27 is provided at the bottom of the equipment body 1. A processing table 14 is provided on the other side of the loading hopper 12. The transfer X-axis 11, transfer Y-axis 10, and transfer Z-axis 9 constitute a three-axis gantry mechanism. Of course, existing mature three-axis gantry mechanisms can also be selected here. This embodiment does not specifically limit this.

[0054] Typically, the pick-and-place head 8 can be operated as needed to move the carrier from the set point to the designated loading and unloading area within the range. The operator puts the material to be tested into the loading hopper 12, and the pick-and-place head 8 automatically transfers the material from the loading hopper 12 to the processing table 14 for targeted operation. Then, the pick-and-place head 8 normally picks up the material and transfers it to the position of the vision probe 27, where the material will pass through the vision probe 27 for position and angle correction.

[0055] After the test is completed, the material handling head 8 automatically places the qualified materials onto the empty material tray according to the test results, and puts the unqualified materials back onto the loading tray or the designated position. Then, the tray of qualified materials is put back into the OK hopper 13, and the tray of unqualified materials is put back into the loading hopper 12.

[0056] Example 2

[0057] The difference from Example 1 is that, as Figure 2 and Figure 3 As shown, the test assembly includes a Chuck 15 installed on one side of the OK hopper 13. A superconducting magnetic plate 20 is provided on the side of the Chuck 15 away from the OK hopper 13. Several electric needle holders 18 are arranged around one end surface of the superconducting magnetic plate 20. Manual needle holders 19 are provided on the surface of the superconducting magnetic plate 20 where the electric needle holders 18 are located. A smart vision component 17 is provided at the center of the circle around the electric needle holders 18. The six-axis adjustment component 16 is connected to one end surface of the superconducting magnetic plate 20. The six-axis adjustment component 16 is connected to one end surface of the smart vision component 17. A high-precision motion component 21 is provided at the other end of the superconducting magnetic plate 20 to move the Chuck 15 to a position concentrically below the smart vision component 17. A moving module 22 is provided inside the main body 1 of the device. A placement component is provided inside the moving module 22.

[0058] Typically, the material handling head 8 places the material onto the Chuck 15, and then the high-precision motion component 21 moves the Chuck 15 to a position concentrically below the intelligent vision component 17. The intelligent vision component 17 takes a picture of the material directly below it and processes the relevant data to obtain the position and height data of its Pad point. Then, based on this data, the electric needle holder 18, which is magnetically mounted on the superconducting magnetic plate 20, moves the probe to the position of the Pad point to start the test. The six-axis adjustment component 16 makes it convenient to adjust the picture position for different materials.

[0059] Example 3

[0060] The difference from Examples 1 and / or 2 is that, as Figure 1As shown, the component placement includes a component base 26 that is slidably connected inside the mobile module 22. A socket fixture 24 is provided at the center of one end of the component base 26 near the mobile module 22. Adjustment knobs 25 are arranged around the socket fixture 24. A servo pressure head 23 is provided at the top of the inner wall of the mobile module 22.

[0061] During operation, first, the socket fixture 24 is fixed to the designated position by adjusting the knob 25. The material handling head 8 places the material on the socket fixture 24. Then, the moving module 22 drives the servo pressure head 23 to move above the material to press down, and then the test is performed.

[0062] The above embodiment discloses a fully automated wafer probe station, wherein the transfer X-axis 11, transfer Y-axis 10 and transfer Z-axis 9 constitute a three-axis gantry mechanism. The pick-and-place head 8 can be operated as needed to move the wafer from a set point to a designated loading and unloading area within the range. The operator puts the material to be tested into the loading bin 12, and the pick-and-place head 8 automatically transfers the material from the loading bin 12 to the processing table 14 for targeted operation. Then, the pick-and-place head 8 normally picks up the material and transfers it to the position of the vision probe 27, where the material will pass through the vision probe 27 for position and angle correction.

[0063] After the test is completed, the material handling head 8 automatically places qualified materials onto the empty material tray according to the test results, and returns unqualified materials to the loading tray or designated position. Then, the tray of qualified materials is returned to the OK hopper 13, and the tray of unqualified materials is returned to the loading hopper 12. The material handling head 8 places the material onto the Chuck 15, and then the high-precision motion component 21 moves the Chuck 15 to a position concentrically below the intelligent vision component 17. The intelligent vision component 17 takes a picture of the material directly below it and processes the relevant data to obtain the position and height data of its Pad point, and then uses this data.

[0064] Typically, the electric needle holder 18, which is magnetically mounted on the superconducting magnetic plate 20, moves the probe to the Pad point to begin testing. The six-axis adjustment assembly 16 allows for easy adjustment of the imaging position for different materials. During operation, the socket fixture 24 is first fixed to the designated position by adjusting the knob 25. The material handling head 8 places the material on the socket fixture 24. Then, the moving module 22 drives the servo pressure head 23 to move above the material for pressing down, and then the test is performed.

[0065] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0066] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A slide probe station with fully automated functions, characterized in that, The probe station is compatible with both 2-inch and 4-inch vacuum adsorption waffle box loading. The probe station includes: -Main body of the equipment; - Loading and unloading ports, which are located on the front side of the main body of the equipment; - Status indicator light, which is located on the top surface of the main body of the device; - Control component: The main body of the equipment is provided with a control component corresponding to the loading and unloading ports. The control component includes: a material transfer component for moving materials and a test component for testing materials. - Main control display, which is disposed on and located on the surface of the device body on one side of the control component; - A secondary control display, wherein the secondary control display is disposed and located at one end of the main body of the device on the other side of the control component; - Operation button, the operation button is located on the outer surface of the device body corresponding to the control component; - A loading / unloading assembly, wherein the loading / unloading assembly is disposed inside the main body of the equipment corresponding to the loading / unloading port, the loading / unloading assembly comprising: - Feeding hopper, which is fixedly connected inside the main body of the equipment; - A vision probe, which is located at the bottom of the inside of the main body of the device; -OK hopper, wherein the OK hopper is located on one side of the feeding hopper; - Processing station, which is located on the other side of the feeding hopper.

2. The slide probe station with fully automated function according to claim 1, characterized in that, The transfer assembly includes: - Transfer Y-axis, wherein the transfer Y-axis is fixedly connected to one end surface of the inner wall of the equipment body; - Transfer X-axis, wherein the transfer X-axis is slidably connected to one end surface of the transfer Y-axis; - Transfer Z-axis, which is slidably connected to the surface of the transfer X-axis, and the surface of the transfer Z-axis is provided with a material pick-and-place working head.

3. A slide probe station with fully automated functions according to claim 1, characterized in that, The test components include: -Chuck tray, which is installed on one side of the OK hopper; - Superconducting magnetic plate, the superconducting magnetic plate being disposed on the side of the Chuck disk away from the OK hopper; - Several electric needle holders, wherein the electric needle holders are disposed on one end surface of the superconducting magnetic plate; - Manual needle holder, wherein the manual needle holder is disposed on the surface of the superconducting magnetic plate where the electric needle holder is located; - Intelligent vision component, wherein the intelligent vision component is disposed at the center position of the circle surrounding the electric needle seat; - A six-axis adjustment assembly, which is connected to one end surface of the intelligent vision assembly; - A superconducting magnetic plate, on the surface of which the six-axis adjustment assembly is connected.

4. A slide probe station with fully automated function according to claim 3, characterized in that, The other end of the superconducting magnetic plate is equipped with a high-precision motion component that moves the Chuck disk to a position concentrically below the intelligent vision component.

5. A slide probe station with fully automated functions according to claim 1, characterized in that, The main body of the device is equipped with a mobile module, and the mobile module is equipped with a placement component.

6. A slide probe station with fully automated functions according to claim 5, characterized in that, The placement component includes: - Component base, which is slidably connected to the inside of the mobile module; -socket fixture, wherein the socket fixture is located at the center of one end of the component base near the mobile module; - Adjustment knob, which is located around the socket fixture; - Servo pressure head, the servo pressure head is located at the top of the inner wall of the moving module.

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