Mounting structure for simulation platform

By employing a fixed column connection structure with multiple mounting plates and side plates in the simulation platform, airflow heat dissipation is enhanced, solving the problems of low heat dissipation efficiency and large space occupation of existing simulation platforms, and achieving efficient heat dissipation and convenient installation.

CN223786360UActive Publication Date: 2026-01-09BEIJING HYPERSTRONG TECH CO LTD
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Patent Information

Application Number
CN202423170565.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2026-01-09
Estimated Expiration
2034-12-20

AI Technical Summary

Technical Problem

Existing simulation platforms have inefficient heat dissipation methods that occupy a large space, affecting the installation and maintenance of devices.

Method used

The first enclosure structure includes multiple mounting plates and side plates. The mounting plates are connected by fixing columns. The side plates have holes to enhance airflow and heat dissipation. The mounting plates have through holes and auxiliary plates for fixing and wiring. The plug-in interface design facilitates connection and fixing. The fan can enhance the heat dissipation effect.

Benefits of technology

It improves the heat dissipation efficiency of the simulation platform, saves space, and simplifies the installation and maintenance process of devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of power electronic equipment, in particular to a mounting structure for a simulation platform. The installation structure is provided with the first box body, the installation plate and other structures, the first box body comprises the front panel, the handle is installed on the front panel, the whole first box body can be lifted through the handle, and the side face of the installation plate is fixedly connected with the inner wall of the first box body through the fixing column; the other mounting plates are also fixedly connected with the mounting plate on the next layer in a fixed column connection mode, the number of the mounting plates in the mounting group can be two or more, the mounting plates on the same layer can be fixed in a bolt connection mode so as to enlarge the size of the mounting plates, the mounting plates can be matched with main plates of different models, and the mounting plates are convenient to mount and dismount. The mounting plate is horizontally laid in the first box body, a through hole is formed in the side plate, a fan mounting position is reserved on one side of the side plate, natural airflow can penetrate through the through hole to flow through the wide face of the mounting plate, and the heat dissipation effect of the mounting plate can be improved when the airflow flows through the wide face of the mounting plate.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power electronic equipment, in particular to a mounting structure for a simulation platform. BACKGROUND

[0002] The internal devices of the simulation platform mainly include interface boards, main boards and adapter boards, and are designed with independent mounting plates, so that different simulation platform functions can be realized by mounting different main boards. The simulation platform is installed in a pull-out manner, the front panel is provided with a handle, the mounting fixed points are on the front two sides, and a plurality of module holes are arranged, so that the simulation platform can be freely mounted on data center cabinets with different module numbers.

[0003] In order to reduce the pollution that the platform main board may suffer, the heat dissipation mode of the existing simulation platform is mostly the heat dissipation mode of the shell. The heat dissipation is through the sealing of the shell, no ventilation hole is arranged, and the air in the shell exchanges heat with the outer shell to dissipate heat to the external air.

[0004] However, the heat dissipation efficiency of this heat dissipation mode is low, and the arrangement of the shell in the case seriously occupies the space. Content of the utility model

[0005] In order to solve the problems mentioned in the background art, improve the heat dissipation efficiency of the simulation platform main board, and reduce the space occupancy rate of the heat dissipation structure, the present application provides a mounting structure for a simulation platform, which comprises a first box body for mounting a main board, the first box body comprises a plurality of mounting plates for placing the main board and a side plate, at least two mounting plates form an installation group, the mounting plates in the installation group are connected with the inner wall of the first box body through fixing columns, and the mounting plates in the installation group are arranged in parallel with each other to save the occupied space. The side plate is arranged on one side of the mounting plate, a plurality of hole bodies are formed in the surface of the side plate, and air flows through the hole bodies to the wide surface of the mounting plate to improve the heat dissipation effect.

[0006] In this way, the first box is suitable for mounting a mainboard of a simulation platform, specifically, a simulation test platform of an energy storage system. The first box comprises a front panel, and a handle is arranged on the front panel. The handle can be used to lift the entire first box. In the embodiment provided in the application, four mounting plates are arranged in the first box. The side surface of the mounting plate is fixedly connected to the inner wall of the first box through a fixing column. The remaining mounting plates are also fixedly connected to the mounting plate of the next layer through the fixing column. It is worth mentioning that the mounting plates in the mounting group can also be two or more. The mounting plates in the same layer can also be fixed through bolt connection to expand the size of the mounting plate, so as to adapt to different types of mainboards. The mounting plate is horizontally arranged in the first box. The side plate is provided with a through hole, and the side plate is provided with a mounting position of the fan. Natural air flow can flow through the through hole and the wide surface of the mounting plate. Since the mainboard is arranged on the mounting plate and is horizontally arranged with the mounting plate, the air flow flowing through the wide surface of the mounting plate can improve the heat dissipation effect of the mounting plate. Even if the heat dissipation effect does not meet the standard, the fan can be additionally arranged to further improve the heat dissipation effect.

[0007] According to an embodiment provided in the application, the mounting plate is symmetrically provided with an auxiliary plate in the width direction. The auxiliary plate is provided with a hole, and the fixing column is arranged corresponding to the hole.

[0008] In this way, the auxiliary plate arranged on the side surface of the mounting plate is used for fixing and mounting the mounting plate. The auxiliary plate has a whole bending plate structure. The bending space left below the auxiliary plate is beneficial to facilitate wiring. Since the fixing column is arranged on the auxiliary plate, the space left by the fixing column and the bending part of the auxiliary plate is small, and the fixing column also has a certain fixing effect on the wire.

[0009] According to an embodiment provided in the application, the mounting plate comprises a first through hole and a first column. The first through holes are uniformly arranged on the surface of the mounting plate, and the first column is arranged corresponding to each first through hole.

[0010] In this way, the first column arranged on the mounting plate can be used to mount a bolt. The main purpose is to facilitate disassembly and fixation of the mainboard. In the embodiment provided in the application, a plurality of first through holes are arranged on the mounting plate. The positions of the first through holes are designed in reference to the specific structure of the plurality of mainboards. The mounting plate can be used to mount mainboards of different specifications, thereby improving the adaptability of the mounting plate.

[0011] According to an embodiment provided in the application, the mounting groups are connected to each other through the fixing columns, and the mounting groups are in a stacked state.

[0012] In this way, the stacked arrangement of the installation groups can further save the internal space of the first box, and the spacing generated by the stacked arrangement of the installation groups can further increase the speed of the airflow, thereby further improving the heat dissipation efficiency.

[0013] According to an embodiment provided by the present application, the first box further comprises a wire interface, and the wire interface is arranged on the outer surface of the first box and aligned with the installation plate in the first direction.

[0014] In this way, the installation plate further comprises a notch, and the wire interface has an interface plate extending into the first box, and the notch is arranged corresponding to the interface plate to limit the position of the wire interface.

[0015] In this way, the installation plate further comprises a notch, and the wire interface has an interface plate extending into the first box, and the notch is arranged corresponding to the interface plate to limit the position of the wire interface.

[0016] In this way, the first direction in the present application is perpendicular to the direction of the airflow passing through the side plate, and the wire interface is aligned with the installation plate in the horizontal direction, and the wire interface is used for plugging external lines. The interface plate extending into the wire interface is clamped at the position of the notch. On the one hand, the wires on the interface plate can be connected to the mainboard in a shorter path, reducing the use of wires and making the internal space of the first box more tidy. On the other hand, the clamping of the interface plate at the position of the notch can limit the deviation of the installation plate in the horizontal position, avoiding the deviation of the installation plate caused by frequent replacement of the mainboard.

[0017] According to an embodiment provided by the present application, one side of the first wire interface is provided with a power knob, and the first box is provided with a limiting groove corresponding to the power knob.

[0018] In this way, the limiting groove is provided with a connection wire required by the power knob and a circuit board for an external indicator light. The power knob is responsible for turning on and off the power supply. The power knob is provided with an indicator light on the side, which is used to display the on-off state of the current power supply and the working state of the test platform.

[0019] According to an embodiment provided by the present application, one end of the first box away from the wire interface is provided with an adapter plate.

[0020] According to an embodiment provided by the present application, one side of the adapter plate is provided with a power interface, and the power interface and one side of the adapter plate are provided with an inwardly extending connector.

[0021] In this way, the power interface is used to intervene in the external V power supply, the adapter plate is responsible for the information interaction of other semi-physical platform points, and the mainboard is responsible for receiving and issuing control instructions to simulate actual testing.

[0022] According to an embodiment provided by the application, a wire slot is arranged between the mounting plate and the inner wall of the first cabinet, and the wire slot is provided with at least two holes for separating the power lines connected to the power interface and the communication lines connected to the adapter plate.

[0023] In this way, the wire slot is arranged in the gap between the mounting plate and the first cabinet, and the power lines connected to the power interface and the communication lines connected to the adapter plate can be independently routed through the holes, avoiding mutual interference. This provides convenience for cleaning the interior of the first cabinet when replacing parts later.

[0024] The application is provided with a first cabinet and a mounting plate, etc. The first cabinet includes a front panel, and a handle is arranged at the front panel. The entire first cabinet can be lifted by the handle. The side surface of the mounting plate is fixedly connected to the inner wall of the first cabinet through a fixing column, and the remaining mounting plates are also fixedly connected to the mounting plates of the next layer through the fixing column. The mounting plates in the mounting group can also be provided as two or more, and the mounting plates in the same layer can also be fixed through bolt connection to expand the size of the mounting plate, so as to adapt to different models of mainboards. The mounting plate is horizontally laid in the first cabinet. The side plate is provided with a through hole, and the side plate is provided with a mounting position of a fan. Natural air flow can pass through the through hole and flow through the wide surface of the mounting plate. The air flow flowing through the wide surface of the mounting plate can improve the heat dissipation effect of the mounting plate. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0026] Figure 1 A front view of a mounting structure for a simulation platform provided by an embodiment of the application;

[0027] Figure 2 A top view of a mounting structure for a simulation platform provided by an embodiment of the application;

[0028] Figure 3 A side view of a mounting structure for a simulation platform provided by an embodiment of the application;

[0029] Figure 4 A rear view of a mounting structure for a simulation platform provided by an embodiment of the application;

[0030] Figure 5 An internal view of a mounting structure for a simulation platform provided by an embodiment of the application;

[0031] Figure 6 A front view of the mounting plate provided by the embodiment of the present application;

[0032] Figure 7 A side view of the mounting plate provided by the embodiment of the present application.

[0033] Legend of reference signs:

[0034] 100 - first box; 110 - mounting plate; 111 - first through hole; 112 - first column; 113 - notch; 120 - side plate; 130 - patch panel interface; 131 - power knob; 140 - adapter plate; 150 - power interface.

[0035] The specific embodiments of the present application have been shown by the above-mentioned drawings, and will be described in more detail hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application by any means, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be described clearly and completely below in combination with the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative work are within the scope of protection of the present application.

[0037] Firstly, those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application, and are not intended to limit the protection scope of the present application. Those skilled in the art can adjust them as needed in order to adapt to specific application occasions.

[0038] Secondly, it should be noted that in the description of the present application, the terms of direction or position relationship such as "front", "back", "left", "right", "up", "down", "inner", "outer" and the like are based on the direction or position relationship shown in the drawings, which is only for the convenience of description, and is not intended to indicate or imply that the device or member must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0039] In addition, it should be noted that in the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be the communication inside two members. Those skilled in the art can understand the specific meaning of the above-mentioned terms in the present application according to the specific circumstances.

[0040] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0041] The internal devices of the simulation platform mainly include interface boards, main boards, adapter boards and the like, and are designed with independent mounting plates, so that different simulation platform functions can be realized by mounting different main boards. The simulation platform is installed in a pull-out manner, the front panel is provided with a handle, the mounting fixed points are on the front two sides, there are a plurality of module holes, and the simulation platform can be freely mounted on data center cabinets with different module numbers.

[0042] In order to reduce the pollution that the platform main board may suffer, the heat dissipation mode of the existing simulation platform is mostly the mode of shell heat dissipation. The heat dissipation is through the sealing of the shell, no ventilation hole is set, and the air in the shell exchanges heat with the outer shell to dissipate heat to the external air.

[0043] However, the heat dissipation efficiency of this heat dissipation mode is low, and the setting of the shell seriously occupies the space in the case.

[0044] Figure 1 A front view of a mounting structure for a simulation platform provided by an embodiment of the present application; Figure 2 A top view of a mounting structure for a simulation platform provided by an embodiment of the present application; Figure 3 A side view of a mounting structure for a simulation platform provided by an embodiment of the present application; Figure 4 A rear view of a mounting structure for a simulation platform provided by an embodiment of the present application; Figure 5 An internal view of a mounting structure for a simulation platform provided by an embodiment of the present application; Figure 6 A front view of a mounting plate provided by an embodiment of the present application; Figure 7 A side view of a mounting plate provided by an embodiment of the present application.

[0045] Reference Figure 3 , Figure 5 , Figure 6 , Figure 7As shown, the application provides an installation structure for a simulation platform, which comprises a first box body 100 for installing a mainboard, the first box body 100 comprising a plurality of installation plates 110 for placing the mainboard and a side plate 120, at least one installation plate 110 forming an installation group, the installation plates 110 in the installation group being connected to the inner wall of the first box body 100 through fixing columns, and the installation plates 110 in the installation group being arranged in parallel to each other to save space, and the side plate 120 being arranged on one side of the installation plate 110, and a plurality of holes being formed on the surface of the side plate 120, and air flowing through the holes to flow through the wide surface of the installation plate 110 to improve the heat dissipation effect.

[0046] It should be noted that the first box body 100 is suitable for installing the mainboard of the simulation platform, specifically, the simulation test platform of the energy storage system. The first box body 100 comprises a front panel, and a handle is arranged on the front panel, and the entire first box body 100 can be lifted through the handle. In the embodiment provided in the application, four installation plates 110 are arranged in the first box body 100, the side surface of the installation plate 110 is fixedly connected to the inner wall of the first box body 100 through a fixing column, and the remaining installation plates 110 are also fixedly connected to the installation plate 110 of the next layer through the fixing column. It is worth mentioning that the installation plates 110 in the installation group can also be arranged as two or more, and the installation plates 110 in the same layer can also be fixed through the bolt connection to expand the size of the installation plate 110, which can adapt to different models of mainboards.

[0047] In addition, the installation plate 110 is horizontally arranged in the first box body 100, the side plate 120 is provided with a through hole, and the side plate 120 is provided with a mounting position of the fan on one side. Natural air flow can flow through the through hole to flow through the wide surface of the installation plate 110. Since the mainboard is arranged on the installation plate 110 and is arranged horizontally with the installation plate 110, the air flow flowing through the wide surface of the installation plate 110 can improve the heat dissipation effect of the installation plate 110. Even if the heat dissipation effect does not reach the standard, a fan can be additionally arranged to further improve the heat dissipation effect.

[0048] According to an embodiment provided in the application, the installation plate 110 is symmetrically provided with an auxiliary plate in the width direction, the auxiliary plate is provided with a hole, and the fixing column is arranged correspondingly to the hole.

[0049] It should be noted that the auxiliary plate arranged on the side surface of the installation plate 110 is used for the fixation and installation of the installation plate 110, and the auxiliary plate is in the form of a bent plate structure as a whole. The bent space left below the auxiliary plate is conducive to facilitating wiring, and since the fixing column is arranged on the auxiliary plate, the space left by the fixing column and the bent part of the auxiliary plate is small, and the fixing column also has a certain fixing effect on the electric wire.

[0050] According to an embodiment provided by the present application, the mounting plate 110 comprises first through holes 111 and first columns 112, the first through holes 111 are arranged on the surface of the mounting plate 110 uniformly, and the first columns 112 are arranged corresponding to each first through hole 111.

[0051] It should be noted that the first columns 112 arranged on the mounting plate 110 can be used for mounting bolts, and the main purpose is to facilitate disassembly and fixation of the mainboard. In the embodiment provided by the present application, the mounting plate 110 is provided with a plurality of first through holes 111, and the positions of the first through holes 111 are designed in reference to the specific structure of the plurality of mainboards, so that one mounting plate 110 can be used to mount mainboards of various specifications and types, and the adaptability of the mounting plate 110 is improved.

[0052] According to an embodiment provided by the present application, the mounting groups are connected with each other through the fixing columns, and the mounting groups are stacked.

[0053] It should be noted that the stacking of the mounting groups can further save the internal space of the first cabinet 100, and the spacing generated by the stacking of the mounting groups can further improve the speed of the airflow when passing through, thereby further improving the heat dissipation efficiency.

[0054] Referring to FIG. 1, Figure 1 According to an embodiment provided by the present application, the first cabinet 100 further comprises a wire interface 130, the wire interface 130 is arranged on the outer surface of the first cabinet 100 and is aligned with the mounting plate 110 in the first direction.

[0055] According to an embodiment provided by the present application, the mounting plate 110 further comprises a notch 113, the wire interface 130 has an interface plate extending into the first cabinet 100, and the notch 113 is arranged corresponding to the interface plate to limit the position of the wire interface 130.

[0056] It should be noted that the first direction in the present application is perpendicular to the direction of the airflow passing through the side plate 120, and the wire interface 130 is aligned with the mounting plate 110 in the horizontal direction, and the wire interface 130 is used for plugging external lines. The interface plate extending into the wire interface 130 is clamped at the position of the notch 113. On the one hand, the wires on the interface plate can be connected to the mainboard through a shorter path, reducing the use of wires and making the internal space of the first cabinet 100 more tidy. On the other hand, the clamping of the interface plate at the position of the notch 113 can limit the deviation of the mounting plate 110 in the horizontal position, avoiding the deviation of the mounting plate 110 caused by frequent replacement of the mainboard.

[0057] According to an embodiment provided by the application, one side of the first patch panel 130 is provided with a power knob 131, and a limiting groove is arranged at a position corresponding to the power knob 131 in the first cabinet 100.

[0058] It should be noted that the limiting groove is arranged with a connecting wire required by the power knob 131 and a circuit board for an external indicator light, the power knob 131 is responsible for turning on and off the power supply, and the indicator light arranged on the side of the power knob 131 is used to display the on-off state of the current power supply and the working state of the test platform.

[0059] Referring to FIG. 1, Figure 2 , Figure 4 According to an embodiment provided by the application, one end of the first cabinet 100 away from the patch panel 130 is provided with an adapter board 140.

[0060] According to an embodiment provided by the application, one side of the adapter board 140 is provided with a power interface 150, and the power interface 150 and the side of the adapter board 140 are provided with an inwardly extending connector.

[0061] It should be noted that the power interface 150 is used to intervene in the external 220V power supply, the adapter board 140 is responsible for information interaction of other semi-physical platform points, and the mainboard is responsible for receiving and issuing control instructions to simulate actual testing.

[0062] According to an embodiment provided by the application, a wire slot is arranged between the mounting plate 110 and the inner wall of the first cabinet 100, and the wire slot is provided with at least two holes for separating the wires connected to the power interface 150 and the adapter board 140.

[0063] It should be noted that the wire slot is arranged in the slit between the mounting plate 110 and the first cabinet 100, wherein the power supply wire connected to the power interface 150 and the communication wire connected to the adapter board 140 can be independently routed through the holes, avoiding mutual interference, and providing convenience for cleaning the inside of the first cabinet 100 for later replacement of components.

[0064] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. The specification and examples given are considered exemplary only, and the true scope and spirit of the application is indicated by the following claims.

[0065] It is to be understood that the application is not limited to the precise construction already described above and shown in the drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the application. The scope of the application should only be limited by the claims appended hereto.

Claims

1. A mounting structure for a simulation platform, characterized by, The utility model provides a first box (100) for installing mainboard, the first box (100) includes a plurality of installation plate (110) for placing mainboard and side plate (120), at least two installation plate (110) become an installation group, the installation plate (110) in the installation group is connected with the inner wall of first box (100) through fixed column, the installation plate (110) in the installation group is arranged mutually parallel to save the space occupied, One side of installation plate (110) is provided with side plate (120), a plurality of holes are formed on the surface of side plate (120), airflow passes through the wide surface of installation plate (110) through the hole, so as to improve the heat dissipation effect.

2. The mounting structure for an emulation platform of claim 1, wherein The installation plate (110) is provided with an auxiliary plate symmetrically along the width direction, the auxiliary plate is provided with a hole, and the fixed column is provided correspondingly to the hole.

3. The mounting structure for an emulation platform of claim 1, wherein The installation plate (110) includes a first through hole (111) and a first column (112), the first through hole (111) is uniformly arranged on the surface of the installation plate (110), and the first column (112) is provided correspondingly to each first through hole (111).

4. The mounting structure for an emulation platform of claim 2, wherein The installation group and the installation group are connected with each other through the fixed column, and the installation group and the installation group are in a stacked state.

5. The mounting structure for an emulation platform of claim 1, wherein The first box (100) further includes a wire interface (130), the wire interface (130) is arranged on the outer surface of the first box (100) and is aligned with the installation plate (110) in the first direction.

6. The mounting structure for an emulation platform of claim 5, wherein, The installation plate (110) further includes a notch (113), the wire interface (130) has an interface plate extending into the first box (100), and the notch (113) is arranged correspondingly to the interface plate to limit the position of the wire interface (130).

7. The mounting structure for an emulation platform of claim 6, wherein One side of the wire interface (130) is provided with a power knob (131), and the first box (100) is provided with a limiting groove correspondingly to the power knob (131).

8. The mounting structure for an emulation platform of claim 5, wherein, One end of the first box (100) away from the wire interface (130) is provided with an adapter plate (140).

9. The mounting structure for an emulation platform of claim 8, wherein, One side of the adapter plate (140) is provided with a power interface (150), and the power interface (150) and the adapter plate (140) are provided with an inwardly extending connector on one side.

10. The mounting structure for an emulation platform of claim 8, wherein, A wire groove is arranged between the installation plate (110) and the inner wall of the first box (100), and the wire groove is provided with at least two holes for separating the wires connected with the power interface (150) and the adapter plate (140).