Intelligent detection equipment applied to semiconductor test probe

Abstract

The utility model relates to an intelligent detection device applied to a semiconductor test probe, which comprises a casing, a workbench is arranged in the casing, the workbench is provided with a central control rotary table, a material placing module, an image taking module, a material loading module and a material receiving module, the image taking module is connected with the material loading module, and the material receiving module is connected with the material loading module. The feeding module and the receiving module are arranged on the side face of the center control rotating table, and the discharging module is arranged on the surface of the center control rotating table. According to the equipment, the central control rotating table, the discharging module, the image taking module, the feeding module and the receiving module are arranged, so that the semiconductor test probes can be rapidly and comprehensively detected, meanwhile, after detection, the detected semiconductor test probes can be classified, defective products are removed, the working efficiency of the equipment is improved, and the working efficiency of the equipment is improved. The dependence on personnel in a product circulation link and a circulation process is reduced, and manpower is saved; and the problem that defective products flow out due to errors easily caused by personnel participation is solved.

Description

Technical Field

[0001] This utility model relates to the field of testing equipment, and in particular to an intelligent testing device applied to semiconductor test probes. Background Technology

[0002] Semiconductor test probes are essential electronic components in electronic information circuits. After production, semiconductor test probes must undergo necessary visual inspections to ensure quality before packaging and transportation. Currently, most manufacturers rely on manual visual inspection for the visual inspection of semiconductor test probes, resulting in poor consistency, low efficiency, and high labor costs. Utility Model Content

[0003] The purpose of this invention is to provide a semiconductor test probe that operates at high speed and efficiency, is manufactured with high precision, and is stable and controllable, which greatly reduces factory labor costs, reduces the labor intensity of workers, and improves production efficiency.

[0004] To achieve the above objectives, this utility model provides an intelligent testing device for semiconductor test probes, including a housing, a worktable inside the housing, a central control rotary table, a feeding module, an image acquisition module, a loading module, and a receiving module on the worktable, wherein the image acquisition module, the loading module, and the receiving module are located on the side of the central control rotary table, and the feeding module is located on the surface of the central control rotary table.

[0005] Furthermore, the casing is also equipped with a control panel, warning lights, and a display screen.

[0006] Furthermore, the central control rotary table includes a rotating disk and a drive motor for driving the rotating disk to rotate, and the feeding module includes multiple units, all of which are fixedly installed on the rotating disk.

[0007] Furthermore, the feeding module includes a feeding robot and a flexible vibrating disc.

[0008] Furthermore, the image acquisition module includes multiple camera brackets fixedly mounted on the worktable, and cameras are mounted on the camera brackets.

[0009] Furthermore, the receiving module includes at least one good product receiving mechanism and at least one defective product receiving mechanism.

[0010] Furthermore, the feeding module includes a base plate fixedly mounted on a rotating disk, a platform on the base plate, and a clamping through hole for placing a probe on the platform.

[0011] Furthermore, the worktable is equipped with a rolling drive device capable of driving the probe to rotate.

[0012] The present invention provides an intelligent detection device for semiconductor test probes, the advantages of which are:

[0013] This utility model provides an intelligent inspection device for semiconductor test probes, which has the following advantages: Compared with existing equipment, this device, by setting up a central control rotary table, a feeding module, an image acquisition module, a loading module, and a receiving module, can quickly and comprehensively inspect semiconductor test probes. At the same time, after inspection, it can classify the inspected semiconductor test probes, thereby removing defective products, improving the working efficiency of the equipment, reducing the product flow links and the dependence on personnel during the flow process, and saving manpower; it also overcomes the problem of defective products flowing out due to errors caused by human intervention. Attached Figure Description

[0014] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0015] Figure 1 This is a schematic diagram of the structure of the testing equipment described in this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of the workbench described in this utility model.

[0017] Figure 3 This is a schematic diagram of the feeding module described in this utility model.

[0018] Figure 4 This is a schematic diagram of the structure of the central control rotary table described in this utility model.

[0019] Figure 5 yes Figure 4 A magnified view of a portion of point A in the middle.

[0020] Figure 6 This is a schematic diagram of the structure of the good product receiving mechanism described in this utility model.

[0021] Figure 7 This is a schematic diagram of the material feeding module described in this utility model.

[0022] Figure 8 This is a schematic diagram of the feeding module described in this utility model from another perspective.

[0023] In the diagram: 1. Machine housing; 2. Workbench; 3. Warning light; 4. Control panel; 5. Display screen; 6. Central control rotary table; 7. Feeding module; 8. Image acquisition module; 9. Receiving module; 10. Feeding robot; 11. Flexible vibrating disc; 12. Camera bracket; 13. Camera; 14. Rolling drive device; 15. Defective product receiving mechanism; 16. Good product receiving mechanism; 17. Unloading module; 18. Lifting cylinder. 19. Motor mounting block; 20. Drive motor; 21. Active turntable; 22. Passive turntable; 23. Platform; 24. Axle; 25. Active bevel gear; 26. Passive bevel gear; 27. Electric gripper; 28. Rotating disc; 29. ​​Didi motor; 30. Good product receiving box; 31. Feed inlet; 32. Air nozzle; 33. Clamping through hole; 34. Male clamp; 35. Female clamp; 36. Auxiliary rotating shaft. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0025] Combination Figure 1-8 This application provides an intelligent testing device for semiconductor test probes, including a housing 1. An electronic control module and a workbench 2 electrically connected to the electronic control module are housed within the housing 1. The housing 1 also includes a control panel 4, a warning light 3, and a display screen 5, all electrically connected to the electronic control module. The housing is hexagonal, and a cabinet door (not shown in the figure) is hinged to the housing.

[0026] The worktable 2 is equipped with a central control rotary table 6, a feeding module 17, an image acquisition module 8, a loading module 7, and a receiving module. The image acquisition module 8, the loading module 7, and the receiving module are located on the side of the central control rotary table 6, and the feeding module comprises multiple modules, which are evenly distributed on the surface of the central control rotary table 6.

[0027] Specifically, the feeding module 7 includes a feeding robot 10 and a flexible vibrating plate 11 fixedly mounted on the workbench 2. The feeding robot 10 is equipped with an electric gripper 27 for gripping test probes on the flexible vibrating plate. The flexible vibrating plate 11 is located on one side of the feeding robot 10, and the feeding module 7 is located on one side of the central control rotary table 6.

[0028] The central control rotary table 6 includes a rotating disk 28 and a drive motor for driving the rotating disk 28 to rotate. In this embodiment, the drive motor is a dizzying motor 29. The dizzying motor 29 is fixedly mounted on the worktable 2 by a motor fixing bracket. The drive shaft of the dizzying motor is fixedly connected to the rotating disk 28, thereby driving the rotation of the rotating disk 28. Meanwhile, the feeding module includes multiple units, which are evenly fixedly mounted on the upper surface of the rotating disk 28.

[0029] Meanwhile, in this embodiment, the imaging module 8 includes multiple camera brackets 12 fixedly mounted on the worktable 2. In this embodiment, four camera brackets 12 are provided, and each camera bracket 12 is equipped with a camera 13. The imaging direction of the camera 13 is directed from different directions toward the feeding module 17 on the rotating disk 28, so that the test probes in the feeding module 17 can be photographed and detected from different directions.

[0030] In this embodiment, the receiving module 9 includes at least one good product receiving mechanism and at least one defective product receiving mechanism 15 disposed on the workbench 2. In this embodiment, four good product receiving mechanisms and one defective product receiving mechanism 15 are provided.

[0031] Specifically, the good product receiving mechanism 16 includes a good product receiving box 30 fixedly installed on the workbench 2. The good product receiving box 30 has an inlet 31 and a hollow structure inside. The good product receiving box is also equipped with an air blowing assembly. Specifically, the air blowing assembly includes an air pipe and an air nozzle 32 connected to the air pipe. One end of the air pipe is connected to a solenoid valve, and the other end is connected to the air nozzle 32. The spray direction of the air nozzle 32 is towards the inlet 31 of the good product receiving box. At the same time, the clamping through hole is located between the air outlet of the air nozzle and the inlet 31.

[0032] The defective product receiving mechanism 15 includes a defective product receiving box fixedly installed on the workbench 2. The defective product receiving box has an internal cavity and an inlet on its surface. An air blowing assembly is installed on the defective product receiving box. The air blowing assembly includes a solenoid valve installed on the defective product receiving box and an air nozzle connected to the solenoid valve. The air nozzle sprays towards the inlet of the defective product receiving box, and a through hole is located between the air outlet and the inlet of the air nozzle.

[0033] Meanwhile, in this application, the feeding module includes a base plate fixedly mounted on a rotating disk. The base plate has multiple bolt holes, and the rotating disk has corresponding bolt holes, thereby fixing the base plate by bolts.

[0034] A platform 23 is fixedly provided on the base plate. The upper surface of the platform 23 is provided with a clamping through hole 33 for placing chip probes. The chip probes are placed through the clamping through hole 33. A rotating hole communicating with the clamping through hole 33 is provided below the clamping through hole. The radius of the rotating hole is smaller than the radius of the chip probe, so that the chip probe will not fall out of the rotating hole.

[0035] The worktable is equipped with a rolling drive device 14 capable of driving a chip probe placed in the clamping through hole 33 to roll. The rolling drive device includes a wheel axle 24 rotatably disposed in the stage, and the wheel axle contacts the lower half of the chip probe through a rotation hole.

[0036] A drive shaft is fixedly connected to the axle 24. The drive shaft passes through the rear surface of the platform 23 and extends to the outside of the platform 23. A passive bevel gear 26 is fixedly installed on the end of the drive shaft away from the axle 24.

[0037] When the axle 24 rotates, the surface of the axle 24 can contact the surface of the test probe placed in the clamping through hole and generate friction, thereby driving the test probe to rotate 360° and thus completing the detection operation.

[0038] The rolling drive device also includes a lifting drive module and a rotation drive module. The number of lifting drive modules and rotation drive modules is the same as the number of cameras, and the lifting drive modules and rotation drive modules are located on the side of the cameras.

[0039] The lifting drive module includes a lifting cylinder 18 fixed on the worktable 2. A rotation drive module is connected to the output shaft of the lifting cylinder 18. The rotation drive module includes a motor mounting block 19 mounted on the output shaft of the lifting cylinder 18. A drive motor 20 is mounted on the motor mounting block 19. The output shaft of the drive motor 20 passes through the motor mounting block 19 and is connected to an active turntable 21. A male clamp is provided on the surface of the active turntable 21. The rotation drive module also includes an auxiliary rotating shaft 36 that passes through and rotates on the rotating disk. One end of the auxiliary rotating shaft is provided with an active bevel gear 25 that meshes with the passive bevel gear 26, and the other end is provided with a passive turntable 22. The passive turntable 22 is also provided with a female clamp 35 that cooperates with the male clamp 34. When the output shaft of the lifting cylinder 18 is in the retracted state, the male clamp 34 and the female clamp 35 are in the separated state. This method ensures that the probe rotates only when the camera is detecting, preventing it from constantly rotating and flying off when the air nozzle blows.

[0040] In practice, the probes to be tested are placed on a flexible vibrating disc for feeding. Then, a loading robot removes the probes and places them into the clamping holes of the unloading module. The rotating disc is driven by a tick motor along... Figure 2 The module rotates clockwise. When the probe placement module moves to the camera, the lifting drive module drives the rotation drive module to rise. The open part on the rotation drive module engages with the mother card, thereby driving the drive motor to rotate the active turntable, which in turn drives the passive turntable, auxiliary shaft, active bevel gear and passive bevel gear to rotate in sequence. Finally, it drives the wheel axle to rotate, which in turn drives the probe to rotate, allowing the camera to capture 360° images of the probe. When the probe is found to be a good product, it is blown into the good product receiving box through an air nozzle. When the probe is found to be a defective product, it is blown into the defective product receiving box through an air nozzle. This process is repeated until all probes have been inspected.

[0041] In the description of the embodiments of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0042] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. An intelligent test equipment applied to a semiconductor test probe, characterized in that: The machine shell is internally provided with a workbench, the workbench is provided with a central control rotary table, a feeding module, an image taking module, a feeding module and a material receiving module, wherein the image taking module, the feeding module and the material receiving module are arranged on the side surface of the central control rotary table, and the feeding module is arranged on the surface of the central control rotary table, The material receiving module comprises at least one good product material receiving mechanism and at least one defective product material receiving mechanism, the feeding module comprises a bottom plate fixedly arranged on the rotary disc, the bottom plate is provided with a loading platform, the loading platform is provided with a clamping through hole for placing a probe, and the workbench is provided with a rolling driving device capable of driving the probe to rotate, The rolling driving device comprises a wheel shaft rotatably arranged in the loading platform, and the wheel shaft is in contact with the lower half of the chip probe through a rotating hole, The wheel shaft is fixedly connected with a driving shaft, the driving shaft penetrates through the rear surface of the loading platform and extends to the outside of the loading platform, and the end of the driving shaft away from the wheel shaft is fixedly provided with a passive bevel gear, The rolling driving device further comprises a jacking driving module and a rotating driving module, wherein the jacking driving module comprises a jacking cylinder fixed on the workbench, the output shaft of the jacking cylinder is connected with the rotating driving module, the rotating driving module comprises a motor mounting block mounted on the output shaft of the jacking cylinder, a driving motor is mounted on the motor mounting block, the output shaft of the driving motor penetrates through the motor mounting block and is connected with a driving turntable, the surface of the driving turntable is provided with a male clamping piece, and the rotating driving module further comprises an auxiliary shaft penetrating through and rotatably arranged on the rotary disc, one end of the auxiliary shaft is provided with a driving bevel gear meshing with the passive bevel gear, and the other end is provided with a passive turntable, and the passive turntable is also provided with a female clamping piece matched with the male clamping piece, and when the output shaft of the jacking cylinder is in a retracted state, the male clamping piece and the female clamping piece are in a separated state.

2. The intelligent test equipment applied to the semiconductor test probe according to claim 1, characterized in that: The machine shell is further provided with a control console, a warning light and a display screen.

3. The intelligent test equipment for semiconductor test probes of claim 1, wherein: The central control rotary table comprises a rotary disc and a driving motor driving the rotary disc to rotate, and the feeding module comprises a plurality of feeding modules fixedly installed on the rotary disc.

4. The intelligent test equipment for semiconductor test probes of claim 1, wherein: The feeding module comprises a feeding manipulator and a flexible vibrating tray.

5. The intelligent test equipment for semiconductor test probes of claim 1, wherein: The image taking module comprises a plurality of camera supports fixedly arranged on the workbench, and the camera supports are provided with cameras.

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