Chip detecting and sorting device

Abstract

The utility model relates to a chip detecting and sorting device, which belongs to the technical field of chip detecting and sorting machines and comprises a support, a discharging mechanism, an inspection feeding mechanism, an upper detecting mechanism, a carrying mechanism, a receiving mechanism, a lower detecting mechanism and a conveying mechanism, and the discharging mechanism, the inspection feeding mechanism, the upper detecting mechanism, the carrying mechanism and the receiving mechanism are fixed on the support at intervals. The discharging mechanism can release the contained chips; the lower detection mechanism is positioned below the inspection mechanism and is fixed on the bracket; and the conveying mechanism is fixed on the bracket. According to the utility model, the feeding mechanism, the inspection mechanism, the upper detection mechanism, the carrying mechanism and the material receiving mechanism are fixed on the bracket at intervals, and then the conveying part of the conveying mechanism is respectively arranged opposite to the feeding part, the inspection part, the upper detection part of the upper detection mechanism, the defective product carrying part and the material receiving part; discharging, lower surface detection and submission, lower surface detection, upper surface detection, defective product carrying and receiving work of chips can be continuously completed, and the chip detection and sorting efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip detection sorting machine technical field, especially chip detection sorting device. BACKGROUND

[0002] Because the individual difference exists in the production process of semiconductor or chip, the performance has high and low, the quality has good and bad, the appearance has flaw division, so, need promptly sorting in the production process Chip, complete the elimination of defective products and the timely replenishment of good products, ensure the normal production of subsequent production.

[0003] However, in the prior art, the testing and sorting of semiconductor or chip often need manual assistance, for example, workers need to put chips into the detection machine, use the detection machine to detect, and after detection, workers need to take out the chips, flip or put new chips in for detection again; then, after detection, workers need to manually classify the chips according to the test results. Therefore, the existing method has low automation degree, high work intensity of workers, and low production efficiency, which is not conducive to mass production.

[0004] In order to solve the above technical problems, some manufacturers have developed an automatic chip detection and sorting device, for example, a patent with the patent number 202210965405.3 and the patent name Chip Detection and Sorting Machine, which is mainly composed of a first feeding tray conveying mechanism, a second feeding tray conveying mechanism, a plurality of discharging tray conveying mechanisms, a tray flipping manipulator, a sorting manipulator, a first visual detection device, a second visual detection device and a third visual detection device. The first feeding tray conveying mechanism is used for feeding the tray loaded with chips. The second feeding tray conveying mechanism is used for feeding the empty tray. The discharging tray conveying mechanism is used for discharging the tray. The first visual detection device and the second visual detection device detect the chips on the tray in turn. The tray flipping manipulator is used for flipping and transferring the tray. The sorting manipulator is used for detecting the bottom surface of the chip by taking a photo and sorting and transferring the chip. In actual application, the chip detection and sorting machine can automatically sort and discharge after detecting the front and back surfaces of the chip by visual detection, fully automatic testing, reducing the labor intensity of workers and improving the production efficiency.

[0005] However, the above-mentioned chip detection and sorting machine first uses a flipping mechanism to transfer the chip between the first conveying mechanism and the second conveying mechanism, and then uses the corresponding first detection mechanism and second detection mechanism to detect the front and back surfaces of the chip. Although the rejection mechanism can also reject the defective chip, the first conveying mechanism and the second conveying mechanism will be stopped for a long time when the flipping mechanism transfers the chip, which prolongs the chip detection and sorting time and reduces the chip detection and sorting efficiency.

[0006] Therefore, how to design a chip detection and sorting device with short conveying downtime and high sorting efficiency is a problem that technicians in the field need to solve. Utility model content

[0007] The utility model provides a chip detection sorting device, solves the technical problem of low detection sorting efficiency of prior chip detection sorting machine.

[0008] The utility model solves the technical scheme of above -mentioned technical problem, a chip detection sorting device, include: support, discharge mechanism, send detection mechanism, upper detection mechanism, handling mechanism, material collecting mechanism, lower detection mechanism and conveying mechanism,

[0009] The fixed part of discharge mechanism, send detection mechanism, upper detection mechanism, handling mechanism and material collecting mechanism is fixed on the support along the direction of X axis, and the discharge part of discharge mechanism can release the filled chip, the handling mechanism has the defective product handling part that can reciprocatingly move along the direction of Y axis on it, and the material collecting part of material collecting mechanism reciprocatingly moves along the direction of Z axis,

[0010] The lower detection mechanism is located below the send detection mechanism and its fixed part is fixed on the support, and the send detection part of send detection mechanism reciprocatingly moves along the direction of Y axis and is arranged opposite the lower detection part of lower detection mechanism,

[0011] The conveying mechanism is located below discharge mechanism, send detection mechanism, upper detection mechanism, handling mechanism and material collecting mechanism and is placed on the side of lower detection mechanism corresponding the direction of Y axis, and its fixed part is fixed on the support, and its conveying part reciprocatingly moves along the direction of X axis and is arranged opposite the discharge part, send detection part, upper detection part of upper detection mechanism, defective product handling part and material collecting part respectively, to continuously complete the discharge of chip, lower face detection and send detection, lower face detection, upper face detection, defective product handling and material collecting.

[0012] The utility model has the advantages of improving the structure of traditional chip detection sorting device, first the fixed part of discharge mechanism, send detection mechanism, upper detection mechanism, handling mechanism and material collecting mechanism is fixed on the support along the direction of X axis, and the lower detection mechanism is located below the send detection mechanism and its fixed part is fixed on the support, and then the conveying part of conveying mechanism is arranged opposite the discharge part, send detection part, upper detection part of upper detection mechanism, defective product handling part and material collecting part respectively, can simplify mechanical structure, continuously complete the discharge of chip, lower face detection and send detection, lower face detection, upper face detection, defective product handling and material collecting, reduce manual operation, reduce the labor intensity of worker, shorten the waiting time of chip transportation, improve chip detection sorting efficiency.

[0013] On the basis of above technical scheme, the utility model still can make following improvement.

[0014] Further, the support frame comprises a base and a plurality of support rods, the plurality of support rods are fixed on the base along the X-axis direction; the fixed parts of the feeding mechanism, the sending mechanism, the upper detection mechanism, the carrying mechanism and the receiving mechanism are fixed on the plurality of support rods along the X-axis direction; the fixed part of the lower detection mechanism is fixed on the base; the fixed part of the conveying mechanism is fixed on the base.

[0015] Further, the feeding mechanism comprises a feeding plate, a cylinder, a feeding lifter, a feeding support plate and a lifting support plate, the feeding plate is the fixed part of the feeding mechanism, the feeding plate is parallelly distributed and fixed on the support frame; the chip is placed between the two feeding plates; the cylinder and the feeding lifter are fixed on the feeding plate, the telescopic end of the cylinder reciprocates along the Y-axis direction, the lifting end of the feeding lifter reciprocates along the Z-axis direction; the feeding support plate is fixed on the telescopic end of the cylinder, the lifting support plate is fixed on the lifting end of the feeding lifter, the feeding support plate and the lifting support plate can be converted to touch the bottom of the chip to continuously complete the feeding of the chip; the conveying part of the conveying mechanism can be placed below the two feeding plates to receive the released chip.

[0016] The above further beneficial effect is that the telescopic end of the cylinder drives the feeding support plate to reciprocate along the Y-axis direction, and then the lifting end of the feeding lifter drives the lifting support plate to reciprocate along the Z-axis direction, since the feeding support plate and the lifting support plate can be converted to touch the bottom of the chip, the chip stacked between the two feeding plates can be released one by one.

[0017] Further, the feeding mechanism further comprises a limiting plate, the limiting plate is two and fixed on the two feeding plates; the chip is placed between the two limiting plates.

[0018] The above further beneficial effect is that the two limiting plates are respectively fixed on the two feeding plates, which can prevent the chip between the two feeding plates from falling out.

[0019] Furthermore, the conveying mechanism includes a base plate, an X-axis motor, an X-axis slide, a clamping cylinder, a support, and a clamping plate. The base plate is the fixed part of the conveying mechanism, located below the feeding mechanism, the inspection mechanism, the upper inspection mechanism, the transport mechanism, and the receiving mechanism, and positioned on the side of the lower inspection mechanism corresponding to the Y-axis direction. The base plate is fixed to the bracket. The X-axis motor is fixed to the base plate, and its output shaft is arranged along the X-axis direction. An X-axis lead screw is fixed in the same direction on the output shaft of the X-axis motor. The X-axis slide has an X-axis threaded hole and is threadedly connected to the X-axis lead screw. Two clamping cylinders are hinged at intervals on the X-axis slide, and the telescopic ends of the two clamping cylinders reciprocate along the X-axis direction. Two supports are distributed on opposite sides of the two clamping cylinders, and both supports are fixed to the base plate. The clamping plate is the conveying part of the conveying mechanism. There are two clamping plates, one end of which is respectively hinged to the two supports, and a portion of each is hinged to the telescopic ends of the two clamping cylinders to slide with the X-axis slide and clamp the chip. They are arranged opposite to the inspection section, the upper inspection section of the upper inspection mechanism, the defective product handling section, and the receiving section.

[0020] The further beneficial effects of the above are as follows: First, two clamping cylinders are used to drive two clamping plates to move closer or further apart to complete the clamping or release of the chip. Then, the X-axis motor is used to drive the X-axis slide to move back and forth along the X-axis. Since the two clamping cylinders are hinged on the slide and the two clamping plates are hinged on the support, the chip can be clamped and moved along the X-axis. The chip is arranged opposite to the inspection section, the upper inspection section of the upper inspection mechanism, the defective product handling section and the receiving section, respectively, to complete the chip feeding, bottom inspection and feeding, bottom inspection, top inspection, defective product handling and receiving.

[0021] Furthermore, the inspection delivery mechanism consists of two parts spaced apart along the X-axis, and the inspection delivery parts of the two inspection delivery mechanisms can be switched to be arranged opposite to the lower inspection part of the lower inspection mechanism, so as to alternately complete the lower inspection delivery and return of the chip after the lower inspection is completed.

[0022] The further beneficial effect of adopting the above is that by using the inspection sections of the two inspection mechanisms to alternately complete the lower inspection and return of the chip after the lower inspection is completed, the transport section of the transport mechanism can be stopped, thus improving the work efficiency of inspection and sorting.

[0023] Furthermore, the inspection delivery mechanism and the transport mechanism have the same structure and both include a Y-axis motor, a Y-axis slide, a Z-axis motor, a Z-axis slide, and multiple suction nozzles. The Y-axis motor serves as the fixing part of both the inspection delivery mechanism and the transport mechanism. The Y-axis motor is fixed to the bracket, and its output shaft is arranged along the Y-axis direction. A Y-axis lead screw is fixed in the same direction on the output shaft of the Y-axis motor. The Y-axis slide has a Y-axis threaded hole and is threadedly connected to the Y-axis lead screw. The Z-axis motor is fixed to the Y-axis slide, and its output shaft is arranged along the Y-axis direction. A Z-axis lead screw is fixed in the same direction on the output shaft of the Z-axis motor. The Z-axis slide has a Z-axis threaded hole and is threadedly connected to the Z-axis lead screw. The multiple suction nozzles serve as the inspection delivery part of the inspection delivery mechanism and the defective product transport part of the transport mechanism. The multiple suction nozzles are fixed in an array on the Z-axis slide. The transport part of the conveying mechanism can be arranged opposite to the multiple suction nozzles.

[0024] The further beneficial effects of the above are: first, the Y-axis motor drives the Y-axis slide to move back and forth along the Y-axis direction, and then the Z-axis motor drives the Z-axis slide to move back and forth along the Z-axis direction. Since the Z-axis motor is fixed on the Y-axis slide and multiple nozzles are fixed in an array on the Z-axis slide, multiple nozzles can be driven to move back and forth along the Y-axis and Z-axis directions to complete the chip inspection or defective product handling.

[0025] Furthermore, the lower detection mechanism and the upper detection mechanism have the same structure and both include a fixed frame and an industrial camera. The fixed frame is the fixing part of the lower detection mechanism and the upper detection mechanism and is fixed on the bracket. The industrial camera is the lower detection part of the lower detection mechanism and the upper detection part of the upper detection mechanism and is fixed on the fixed frame. The conveying part of the conveying mechanism can be arranged opposite to the industrial camera.

[0026] Furthermore, the receiving mechanism includes a receiving plate, a receiving elevator, a receiving tray, and anti-drop plates. The receiving plate is the fixed part of the receiving mechanism, and there are two receiving plates arranged in parallel and fixed at intervals on the bracket. The conveying part of the conveying mechanism can be placed below the two receiving plates. The receiving elevator is fixed on the receiving plate and its lifting end reciprocates along the Z-axis. The receiving tray is the receiving part of the receiving mechanism, and the receiving tray is fixed on the lifting end of the receiving elevator and can touch the bottom of the chip being transported on the conveying part. There are two anti-drop plates, which are respectively hinged to the two receiving plates. The ends of the two anti-drop plates that are far apart from each other are elastically connected to the corresponding receiving plates by springs to prevent the chip from falling between the two receiving plates.

[0027] The further beneficial effects of the above are as follows: First, the lifting end of the receiving elevator is used to drive the receiving tray to move back and forth along the Z-axis, and it touches the bottom of the chip between the two receiving plates, thus completing the chip conversion between the conveying part of the conveying mechanism and the receiving part of the receiving mechanism; then, the anti-drop plate, which is hinged and elastically connected to the receiving plate, is used to switch between releasing or touching the chip, thus completing the chip storage.

[0028] Furthermore, it also includes a replenishment plate, which is located below the conveying mechanism and positioned on one side of the conveying mechanism corresponding to the Y-axis direction. The replenishment plate is fixed on the bracket, and its top surface is divided sequentially along the Y-axis direction into a good chip placement area, a defective chip placement area, and a chip placement area to be determined. The conveying part of the conveying mechanism can be arranged opposite to the good chip placement area, the defective chip placement area, and the chip placement area to be determined, respectively, to complete the conveying of defective chips and the replenishment of good chips.

[0029] The further beneficial effects of adopting the above are as follows: First, a replenishment plate is fixed below the conveying mechanism and on one side of the conveying mechanism corresponding to the Y-axis direction. Since the top surface of the replenishment plate is provided with good chip placement area, defective chip placement area and chip placement area to be determined at intervals along the Y-axis direction, and since the conveying part of the conveying mechanism can be arranged opposite to the good chip placement area, defective chip placement area and chip placement area to be determined respectively, it can not only collect defective chips, but also replenish good chips to the conveying part of the conveying mechanism, avoid empty spaces on the conveying mechanism, and improve the continuity and smoothness of the receiving mechanism. Attached Figure Description

[0030] Figure 1 This is a front-view three-dimensional structural diagram of a chip detection and sorting device according to the present invention;

[0031] Figure 2 This is a rear-view three-dimensional structural diagram of a chip detection and sorting device according to the present invention;

[0032] Figure 3 This is a three-dimensional structural diagram of the feeding mechanism for holding chips in a chip detection and sorting device according to the present invention.

[0033] Figure 4 This is a three-dimensional structural diagram of the feeding mechanism in a chip detection and sorting device according to the present invention;

[0034] Figure 5 This is a schematic diagram of the assembly of the X-axis slide, clamping cylinder, support and clamping plate in a chip detection and sorting device of this utility model.

[0035] Figure 6 This is a three-dimensional structural diagram of the conveying mechanism in a chip detection and sorting device according to the present invention;

[0036] Figure 7 This is a three-dimensional structural diagram of the receiving mechanism in a chip detection and sorting device according to the present invention;

[0037] Figure 8 This is a magnified schematic diagram of the structure at point 7A in the figure.

[0038] The attached diagram lists the components represented by each number as follows:

[0039] 1. Bracket, 11. Base, 12. Support rod, 2. Feeding mechanism, 21. Feeding plate, 22. Cylinder, 23. Feeding lift, 24. Feeding tray, 25. Lifting tray, 26. Limiting plate, 3. Conveying mechanism, 31. Base plate, 32. X-axis motor, 33. X-axis slide, 34. Clamping cylinder, 35. Support, 36. Clamping plate, 4. Inspection mechanism, 5. Lower inspection mechanism, 6. Upper inspection mechanism, 7. Handling mechanism, 8. Receiving mechanism, 81. Receiving plate, 82. Receiving lift, 83. Receiving tray, 84. Anti-fall plate, 9. Chip, 10. Replenishment plate, 13. Y-axis motor, 14. Y-axis slide, 15. Z-axis motor, 16. Z-axis slide, 17. Nozzle, 18. Y-axis lead screw, 19. Fixing frame, 110. Industrial camera. Detailed Implementation

[0040] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0041] like Figure 1 As shown, a chip inspection and sorting device includes: a support 1, a feeding mechanism 2, a feeding mechanism 4, an upper inspection mechanism 6, a conveying mechanism 7, a receiving mechanism 8, a lower inspection mechanism 5, and a conveying mechanism 3.

[0042] The coronal axis of the support 1 is the X-axis, the sagittal axis is the Y-axis, and the vertical axis is the Z-axis. The fixing parts of the feeding mechanism 2, the inspection feeding mechanism 4, the upper inspection mechanism 6, the conveying mechanism 7, and the receiving mechanism 8 are fixed to the support 1 at intervals along the X-axis direction. The feeding part of the feeding mechanism 2 can release the contained chip 9. The conveying mechanism 7 has a defective product conveying part that reciprocates along the Y-axis direction. The receiving part of the receiving mechanism 8 reciprocates along the Z-axis direction. The lower inspection mechanism 5 is located below the inspection feeding mechanism 4, and its fixing part is fixed to the support 1. The inspection feeding part of the inspection feeding mechanism 4 reciprocates along the Y-axis direction. The conveying mechanism 3 is located below the feeding mechanism 2, the sending mechanism 4, the upper detection mechanism 6, the handling mechanism 7, and the receiving mechanism 8, and is positioned on one side of the lower detection mechanism 5 in the Y-axis direction. Its fixed part is fixed on the bracket 1, and its conveying part moves back and forth along the X-axis direction and is arranged opposite to the feeding part, the sending part, the upper detection part of the upper detection mechanism 6, the defective product handling part, and the receiving part, so as to continuously complete the feeding, lower detection and sending, lower detection, upper detection, defective product handling, and receiving of the chip 9.

[0043] like Figure 1 As shown, in some specific embodiments, the support 1 may include a base 11 and multiple support rods 12, with the multiple support rods 12 fixed at intervals along the X-axis direction on the base 11; the fixing parts of the feeding mechanism 2, the inspection mechanism 4, the upper inspection mechanism 6, the conveying mechanism 7, and the receiving mechanism 8 are fixed at intervals along the X-axis direction on the multiple support rods 12; the fixing part of the lower inspection mechanism 5 is fixed on the base 11; and the fixing part of the conveying mechanism 3 is fixed on the base 11.

[0044] like Figure 3 and Figure 4 As shown, in some specific embodiments, the feeding mechanism 2 may include a feeding plate 21, a cylinder 22, a feeding elevator 23, a feeding tray 24, and a lifting tray 25. The feeding plate 21 is the fixed part of the feeding mechanism 2. There are two feeding plates 21 arranged in parallel and fixed to the bracket 1 at intervals. The chip 9 is placed between the two feeding plates 21. The cylinder 22 and the feeding elevator 23 are both fixed on the feeding plate 21. The telescopic end of the cylinder 22 moves back and forth along the Y-axis, and the lifting end of the feeding elevator 23 moves back and forth along the Z-axis. The feeding tray 24 is fixed to the telescopic end of the cylinder 22, and the lifting tray 25 is fixed to the lifting end of the feeding elevator 23. The feeding tray 24 and the lifting tray 25 can be switched to contact the bottom of the chip 9 to continuously feed the chip 9. The conveying part of the conveying mechanism 3 can be placed below the two feeding plates 21 to receive the released chip 9.

[0045] like Figure 3 and Figure 4As shown, in some specific embodiments, the feeding mechanism 2 may also include two limiting plates 26, which are fixed relative to each other on the two feeding plates 21; the chip 9 is placed between the two limiting plates 26.

[0046] like Figure 2 As shown, in some specific embodiments, the conveying mechanism 3 may include a base plate 31, an X-axis motor 32, an X-axis slide 33, a clamping cylinder 34, a support 35, and a clamping plate 36. The base plate 31 is the fixed part of the conveying mechanism 3. The base plate 31 is located below the feeding mechanism 2, the inspection mechanism 4, the upper inspection mechanism 6, the conveying mechanism 7, and the receiving mechanism 8, and is placed on the side of the lower inspection mechanism 5 corresponding to the Y-axis direction. The base plate 31 is fixed on the bracket 1. The X-axis motor 32 is fixed on the base plate 31, and its output shaft is arranged along the X-axis direction. An X-axis lead screw is fixed in the same direction on the output shaft of the X-axis motor 32. The X-axis slide 33 is provided with an X-axis threaded hole and threaded connection. It is connected to the X-axis lead screw; there are two clamping cylinders 34, which are hinged at intervals on the X-axis slide 33. The telescopic ends of the two clamping cylinders 34 reciprocate along the X-axis direction; there are two supports 35, which are distributed on the two sides of the two clamping cylinders 34 that are far apart from each other. The two supports 35 are fixed on the base plate 31; the clamping plate 36 is the conveying part of the conveying mechanism 3. There are two clamping plates 36, one end of which is respectively hinged to the two supports 35. The middle part is respectively hinged to the telescopic ends of the two clamping cylinders 34 so as to slide with the X-axis slide 33 and clamp the chip 9. They are arranged opposite to the inspection part, the upper inspection part of the upper inspection mechanism 6, the defective product handling part and the receiving part.

[0047] like Figure 1 As shown, in some specific embodiments, the inspection delivery mechanism 4 can be two that are spaced apart along the X-axis, and the inspection delivery parts of the two inspection delivery mechanisms 4 can be arranged opposite to the lower inspection part of the lower inspection mechanism 5, so as to alternately complete the lower inspection delivery of the chip 9 and the return after the lower inspection is completed.

[0048] like Figure 2As shown, in some specific embodiments, the inspection delivery mechanism 4 and the transport mechanism 7 have the same structure and can both include a Y-axis motor 13, a Y-axis slide 14, a Z-axis motor 15, a Z-axis slide 16, and multiple suction nozzles 17. The Y-axis motor 13 is the fixing part of both the inspection delivery mechanism 4 and the transport mechanism 7. The Y-axis motor 13 is fixed on the bracket 1 and its output shaft is arranged along the Y-axis direction. A Y-axis lead screw 18 is fixed in the same direction on the output shaft of the Y-axis motor 13. The Y-axis slide 14 is provided with a Y-axis threaded hole and The screw is threaded onto the Y-axis lead screw 18; the Z-axis motor 15 is fixed on the Y-axis slide 14 and its output shaft is arranged along the Y-axis direction, and the Z-axis lead screw is fixed in the same direction on the output shaft of the Z-axis motor 15; the Z-axis slide 16 is provided with a Z-axis threaded hole and is threaded onto the Z-axis lead screw; multiple suction nozzles 17 are the inspection part of the inspection mechanism 4 and the defective product handling part of the handling mechanism 7, and the multiple suction nozzles 17 are fixed in an array on the Z-axis slide 16; the conveying part of the conveying mechanism 3 can be arranged opposite to the multiple suction nozzles 17.

[0049] like Figure 2 As shown, in some specific embodiments, the lower detection mechanism 5 and the upper detection mechanism 6 have the same structure and can both include a fixing frame 19 and an industrial camera 110. The fixing frame 19 is the fixing part of the lower detection mechanism 5 and the upper detection mechanism 6 and is fixed on the bracket 1; the industrial camera 110 is the lower detection part of the lower detection mechanism 5 and the upper detection part of the upper detection mechanism 6 and is fixed on the fixing frame 19; the conveying part of the conveying mechanism 3 can be arranged opposite to the industrial camera 110.

[0050] like Figure 7 and Figure 8 As shown, in some specific embodiments, the receiving mechanism 8 may include a receiving plate 81, a receiving elevator 82, a receiving tray 83, and anti-drop plates 84. The receiving plate 81 is the fixed part of the receiving mechanism 8, and there are two receiving plates 81 arranged in parallel and fixed to the bracket 1 at intervals. The conveying part of the conveying mechanism 3 can be placed below the two receiving plates 81. The receiving elevator 82 is fixed on the receiving plate 81 and its lifting end moves back and forth along the Z-axis. The receiving tray 83 is the receiving part of the receiving mechanism 8, and the receiving tray 83 is fixed on the lifting end of the receiving elevator 82 and can touch the bottom of the chip 9 transported on the conveying part. There are two anti-drop plates 84, which are respectively hinged to the two receiving plates 81. The ends of the two anti-drop plates 84 that are far apart from each other are elastically connected to the corresponding receiving plates 81 by springs to prevent the chip 9 from falling between the two receiving plates 81.

[0051] like Figure 2As shown, in some specific embodiments, a replenishment plate 10 may also be included. The replenishment plate 10 is located below the conveying mechanism 7 and is placed on one side of the conveying mechanism 3 corresponding to the Y-axis direction. The replenishment plate 10 is fixed on the bracket 1 and its top surface is divided into a good chip placement area, a defective chip placement area and a chip placement area to be determined along the Y-axis direction. The conveying part of the conveying mechanism 7 may be arranged opposite to the good chip placement area, the defective chip placement area and the chip placement area to be determined, respectively, so as to complete the conveying of defective chips 9 and the replenishment of good chips.

[0052] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A chip detection and sorting device, characterized in that, include: The stent (1) has a coronal axis as the X-axis, a sagittal axis as the Y-axis, and a vertical axis as the Z-axis; The feeding mechanism (2), the inspection feeding mechanism (4), the upper inspection mechanism (6), the conveying mechanism (7), and the receiving mechanism (8) are provided. The fixing parts of the feeding mechanism (2), the inspection feeding mechanism (4), the upper inspection mechanism (6), the conveying mechanism (7), and the receiving mechanism (8) are fixed to the bracket (1) at intervals along the X-axis direction. The feeding part of the feeding mechanism (2) can release the contained chip (9). The conveying mechanism (7) has a defective product conveying part that reciprocates along the Y-axis direction. The receiving part of the receiving mechanism (8) reciprocates along the Z-axis direction. The lower detection mechanism (5) is located below the delivery mechanism (4) and its fixing part is fixed on the bracket (1); the delivery part of the delivery mechanism (4) moves back and forth along the Y-axis and can be arranged opposite to the lower detection part of the lower detection mechanism (5); The conveying mechanism (3) is located below the feeding mechanism (2), the inspection feeding mechanism (4), the upper inspection mechanism (6), the handling mechanism (7) and the receiving mechanism (8) and is placed on the side of the lower inspection mechanism (5) corresponding to the Y-axis direction. Its fixed part is fixed on the bracket (1), and its conveying part moves back and forth along the X-axis direction and is arranged opposite to the feeding part, the inspection feeding part, the upper inspection part of the upper inspection mechanism (6), the defective product handling part and the receiving part, so as to continuously complete the feeding, lower inspection and inspection, lower inspection, upper inspection, defective product handling and receiving of the chip (9).

2. The chip detection and sorting device according to claim 1, characterized in that, The support (1) includes a base (11) and multiple support rods (12), which are fixed at intervals along the X-axis on the base (11); the fixing parts of the feeding mechanism (2), the inspection mechanism (4), the upper inspection mechanism (6), the handling mechanism (7), and the receiving mechanism (8) are fixed at intervals along the X-axis on the multiple support rods (12); the fixing part of the lower inspection mechanism (5) is fixed on the base (11); and the fixing part of the conveying mechanism (3) is fixed on the base (11).

3. The chip detection and sorting device according to claim 1, characterized in that, The feeding mechanism (2) includes a feeding plate (21), a cylinder (22), a feeding elevator (23), a feeding tray (24), and a lifting tray (25). The feeding plate (21) is the fixed part of the feeding mechanism (2). There are two feeding plates (21) that are parallel to each other and fixed to the bracket (1) at intervals. The chip (9) is placed between the two feeding plates (21). The cylinder (22) and the feeding elevator (23) are both fixed to the feeding plate (21). The extension end of the cylinder (22) is along the Y-axis direction. The lifting end of the feeding elevator (23) moves back and forth along the Z-axis direction; the feeding tray (24) is fixed to the telescopic end of the cylinder (22), and the lifting tray (25) is fixed to the lifting end of the feeding elevator (23). The feeding tray (24) and the lifting tray (25) can be switched to contact the bottom of the chip (9) to continuously complete the feeding of the chip (9); the conveying part of the conveying mechanism (3) can be placed below the two feeding plates (21) to receive the released chip (9).

4. The chip detection and sorting device according to claim 3, characterized in that, The feeding mechanism (2) also includes two limiting plates (26), which are fixed to the two feeding plates (21); the chip (9) is placed between the two limiting plates (26).

5. The chip detection and sorting device according to claim 1, characterized in that, The conveying mechanism (3) includes a base plate (31), an X-axis motor (32), an X-axis slide (33), a clamping cylinder (34), a support (35), and a clamping plate (36). The base plate (31) is the fixed part of the conveying mechanism (3). The base plate (31) is located below the feeding mechanism (2), the inspection mechanism (4), the upper inspection mechanism (6), the conveying mechanism (7), and the receiving mechanism (8), and is placed on the side of the lower inspection mechanism (5) corresponding to the Y-axis direction. The base plate (31) is fixed on the bracket (1). The X-axis motor (32) is fixed on the base plate (31), and its output shaft is arranged along the X-axis direction. An X-axis lead screw is fixed in the same direction on the output shaft of the X-axis motor (32). The X-axis slide (33) is provided with an X-axis threaded hole and is threadedly connected to the support. The X-axis lead screw is described above; there are two clamping cylinders (34) that are hinged at intervals on the X-axis slide (33), and the telescopic ends of the two clamping cylinders (34) reciprocate along the X-axis direction; there are two supports (35) that are distributed on the two clamping cylinders (34) on opposite sides, and the two supports (35) are fixed on the base plate (31); the clamping plate (36) is the conveying part of the conveying mechanism (3), there are two clamping plates (36) and one end of each is hinged to the two supports (35), and some of them are hinged to the telescopic ends of the two clamping cylinders (34) to slide with the X-axis slide (33) and clamp the chip (9), and are respectively arranged opposite to the inspection part, the upper inspection part of the upper inspection mechanism (6), the defective product handling part and the receiving part.

6. The chip detection and sorting device according to claim 1, characterized in that, The inspection delivery mechanism (4) consists of two parts spaced apart along the X-axis, and the inspection delivery parts of the two inspection delivery mechanisms (4) can be switched to be arranged opposite to the lower inspection part of the lower inspection mechanism (5) to alternately complete the lower inspection delivery and return of the chip (9) after the lower inspection is completed.

7. The chip detection and sorting device according to claim 1, characterized in that, The inspection delivery mechanism (4) and the transport mechanism (7) have the same structure and both include a Y-axis motor (13), a Y-axis slide (14), a Z-axis motor (15), a Z-axis slide (16), and multiple suction nozzles (17). The Y-axis motor (13) is the fixing part of the inspection delivery mechanism (4) and the fixing part of the transport mechanism (7). The Y-axis motor (13) is fixed on the bracket (1) and its output shaft is arranged along the Y-axis direction. A Y-axis lead screw (18) is fixed in the same direction on the output shaft of the Y-axis motor (13). The Y-axis slide (14) is provided with a Y-axis threaded hole and is threaded to the Y-axis. On the lead screw (18); the Z-axis motor (15) is fixed on the Y-axis slide (14) and its output shaft is arranged along the Y-axis direction, and the Z-axis lead screw is fixed in the same direction on the output shaft of the Z-axis motor (15); the Z-axis slide (16) is provided with a Z-axis threaded hole and is threadedly connected to the Z-axis lead screw; the multiple suction nozzles (17) are the inspection part of the inspection mechanism (4) and the defective product handling part of the handling mechanism (7), and the multiple suction nozzles (17) are fixed in an array on the Z-axis slide (16); the conveying part of the conveying mechanism (3) can be arranged opposite to the multiple suction nozzles (17).

8. The chip detection and sorting device according to claim 1, characterized in that, The lower detection mechanism (5) and the upper detection mechanism (6) have the same structure and both include a fixing frame (19) and an industrial camera (110). The fixing frame (19) is the fixing part of the lower detection mechanism (5) and the upper detection mechanism (6) and is fixed on the bracket (1). The industrial camera (110) is the lower detection part of the lower detection mechanism (5) and the upper detection part of the upper detection mechanism (6) and is fixed on the fixing frame (19). The conveying part of the conveying mechanism (3) can be arranged opposite to the industrial camera (110).

9. A chip detection and sorting device according to claim 1, characterized in that, The receiving mechanism (8) includes a receiving plate (81), a receiving elevator (82), a receiving tray (83), and a fall prevention plate (84). The receiving plate (81) is the fixed part of the receiving mechanism (8), and there are two parallel receiving plates (81) fixed to the bracket (1) at intervals. The conveying part of the conveying mechanism (3) can be placed below the two receiving plates (81). The receiving elevator (82) is fixed to the receiving plate (81), and its lifting end reciprocates along the Z-axis direction. The receiving tray (83) is the receiving part of the receiving mechanism (8). The receiving tray (83) is fixed to the lifting end of the receiving elevator (82) and can touch the bottom of the chip (9) being transported on the conveying part. There are two anti-fall plates (84) and they are respectively hinged to the two receiving plates (81). The ends of the two anti-fall plates (84) that are far apart from each other are respectively elastically connected to the corresponding receiving plates (81) by springs to prevent the chip (9) from falling between the two receiving plates (81).

10. A chip detection and sorting device according to claim 1, characterized in that, It also includes a replenishment plate (10), which is located below the conveying mechanism (7) and placed on the side of the conveying mechanism (3) corresponding to the Y-axis direction. The replenishment plate (10) is fixed on the bracket (1) and its top surface is divided into a good chip placement area, a defective chip placement area and a chip placement area to be determined along the Y-axis direction. The conveying part of the conveying mechanism (7) can be arranged opposite to the good chip placement area, the defective chip placement area and the chip placement area to be determined, respectively, so as to complete the conveying of defective chips (9) and the replenishment of good chips.

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