Target material binding device

Abstract

The utility model discloses a target material binding device which comprises a base, a material moving assembly and a control module. The base is provided with a containing groove and a heating module, the heating module is used for heating the containing groove, the base is provided with a welding flux injection channel, and one end of the welding flux injection channel is communicated with the bottom of the containing groove; the material moving assembly comprises a position adjusting mechanism and a target material grabbing structure, the target material grabbing structure is arranged on the position adjusting mechanism, and the position adjusting mechanism can drive the target material grabbing structure to enter or be separated from the containing groove; the control module is electrically connected with the heating module and the material moving assembly. The control module is adopted to control the position adjusting mechanism to move the position of the target material grabbing structure, the size of a welding seam between the target material plate and the back plate is directly adjusted, and therefore the thickness of a welding flux layer is conveniently controlled and adjusted, and the target material binding process is simplified.

Description

TECHNICAL FIELD

[0001] The utility model relates to target material, especially a kind of target material binding device. BACKGROUND

[0002] In the field of electronic products and photovoltaic products, thin films can be prepared by using a magnetron sputtering planar target material. The existing silver alloy planar target material needs to be welded and bound with a backing plate during preparation. During production, a heating device is first used to preheat the backing plate and the target material plate, and liquid solder is coated on the welding surface of the backing plate and the welding surface of the target material plate. The liquid solder is usually metal indium. Then, a copper wire of a certain diameter is placed between the two. Subsequently, the welding surface of the backing plate and the welding surface of the target material plate are brought together and overlapped. The target material plate and the backing plate are continuously pressed by a weight. The thickness of the solder layer is controlled by the diameter of the copper wire. Then, the planar target material is cooled and formed. However, the above-mentioned target material plate binding process is relatively complex, and the thickness of the solder layer is not easy to adjust and control. SUMMARY

[0003] The utility model aims at at least solving one of the technical problems existing in the prior art. To this end, the utility model provides a target material binding device, which can conveniently control the thickness of the solder layer and simplify the target material binding process.

[0004] The target material binding device according to the utility model embodiment comprises a base, a material moving assembly and a control module. The base is provided with a containing groove and a heating module. The heating module is used to heat the containing groove. The base is provided with a solder injection channel. One end of the solder injection channel is in communication with the bottom of the containing groove. The material moving assembly comprises a position adjusting mechanism and a target material grabbing structure. The target material grabbing structure is arranged on the position adjusting mechanism. The position adjusting mechanism can drive the target material grabbing structure to enter or leave the containing groove. The control module is electrically connected with the heating module and the material moving assembly.

[0005] The target material binding device has the following beneficial effects: the back plate is placed on the bottom wall of the accommodating groove during use, the accommodating groove is heated by using the heating device, then the position adjusting mechanism of the material moving assembly moves the target material grabbing structure, the target material plate is grabbed and then moved into the accommodating groove, the control module adjusts the size of the weld joint between the target material plate and the back plate through the position adjusting mechanism, so that the size of the weld joint between the target material plate and the back plate reaches a predetermined value, then liquid solder is injected into the accommodating groove through the solder injection channel, so that the liquid solder immerses the weld joint, the target material grabbing structure is loosened and moved out of the accommodating groove after the heating device is turned off and the temperature in the accommodating groove is reduced, the content in the accommodating groove is taken out after complete cooling, and the planar target material is obtained after the excess solid solder is stripped; the position adjusting mechanism moves the position of the target material grabbing structure by using the control module, the size of the weld joint between the target material plate and the back plate is directly adjusted, so that the thickness of the solder layer is conveniently controlled and adjusted, and the target material binding process is simplified.

[0006] According to some embodiments of the present application, the target material grabbing structure comprises a mounting frame and at least two suction cups arranged in the front-rear direction at intervals, the suction cups are connected to the mounting frame, and the position adjusting mechanism is connected to the mounting frame.

[0007] According to some embodiments of the present application, the position adjusting mechanism is a multi-axis mechanical arm, one end of the multi-axis mechanical arm is connected to the target material grabbing structure.

[0008] According to some embodiments of the present application, a target material limiting mechanism is further included, the target material limiting mechanism is arranged on the base, the target material limiting mechanism has a target material placement position, and the target material placement position is located in the accommodating groove and is higher than the bottom wall of the accommodating groove.

[0009] According to some embodiments of the present application, the target material limiting mechanism comprises a first limiting piece and a second limiting piece, the first limiting piece and / or the second limiting piece are movably arranged on the side wall of the accommodating groove and can approach or move away from each other, and the target material placement position is between the first limiting piece and the second limiting piece.

[0010] According to some embodiments of the present application, one end of the first limiting piece close to the second limiting piece is provided with a first elastic pad, one end of the second limiting piece close to the first limiting piece is provided with a second elastic pad, the first elastic pad is opposite to the second elastic pad, and the target material placement position is formed between the first elastic pad and the second elastic pad.

[0011] According to some embodiments of the present application, the first limiting piece and the second limiting piece are movably connected to the side wall of the accommodating groove along the left-right direction, the first limiting piece is provided with at least two and is arranged in the front-rear direction, the first elastic pad is strip-shaped and extends along the front-rear direction, and one end of all the first limiting pieces close to the target material placement position is connected with the first elastic pad.

[0012] According to some embodiments of the present application, the first limiting piece and the second limiting piece are both bolts, the side wall of the accommodating groove is provided with a threaded hole, and the bolt is threadedly connected to the threaded hole.

[0013] According to some embodiments of the present application, the base comprises a heating table and a frame, the frame is detachably connected to the upper side of the heating table, the frame and the heating table enclose the accommodating groove, and a heating module is arranged on the heating table.

[0014] According to some embodiments of the present application, a liquid injection funnel is further arranged on the frame, the liquid injection funnel is provided with a liquid outlet hole, the frame is provided with the solder injection channel, and the liquid outlet hole is in communication with the other end of the solder injection channel.

[0015] The additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the following drawings of which:

[0017] Fig. 1 It is a top view schematic diagram of the target material binding device of the embodiment of the present application.

[0018] Fig. 2 It is a rear view schematic diagram of the target material binding device of the embodiment of the present application.

[0019] Fig. 3 It is an explosion schematic diagram of part of the structure of the target material binding device of the embodiment of the present application.

[0020] REFERENCE NUMERALS:

[0021] Base 100, accommodating groove 101, heating table 110, frame 120, solder injection channel 121.

[0022] Target material grabbing structure 200, mounting frame 210, suction cup 220;

[0023] Target material limiting mechanism 300, first limiting piece 310, second limiting piece 320, first elastic pad 330, second elastic pad 340;

[0024] Liquid injection funnel 400;

[0025] Target material plate 500;

[0026] Back plate 600. DETAILED DESCRIPTION

[0027] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are used only for explaining the present application, and cannot be understood as a limitation of the present application.

[0028] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application.

[0029] In the description of the present application, the plural means more than two. If there is a description of first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implying indicating the number of indicated technical features or implying indicating the sequence of indicated technical features.

[0030] In the description of the present application, unless otherwise explicitly limited, the words such as setting, mounting, connecting, etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0031] Reference Figs. 1 to 3 The target material binding device of the present application embodiment comprises a base 100, a material moving assembly and a control module. The base 100 is provided with a containing groove 101 and a heating module, the heating module is used for heating the containing groove 101, the base 100 is provided with a solder injection channel 121, one end of the solder injection channel 121 is communicated with the bottom of the containing groove 101; the material moving assembly comprises a position adjusting mechanism and a target material grabbing structure 200, the target material grabbing structure 200 is arranged on the position adjusting mechanism, the position adjusting mechanism can drive the target material grabbing structure 200 to enter or leave the containing groove 101; the control module is electrically connected with the heating module and the material moving assembly.

[0032] In use, the backplate is placed on the bottom wall of the receiving tank 101, and the receiving tank 101 is heated using a heating device. Then, the position adjustment mechanism of the transfer component moves the target material gripping structure 200 to grip the target material plate and move it into the receiving tank 101. The control module adjusts the weld size between the target material plate and the backplate through the position adjustment mechanism so that the weld size between the target material plate and the backplate reaches a predetermined value. Then, liquid solder is injected into the receiving tank 101 through the solder injection channel 121 so that the liquid solder submerges the weld. After the heating device is turned off and the temperature in the receiving tank 101 is reduced, the target material gripping structure 200 can be released from the target material plate and removed from the receiving tank 101. After complete cooling, the contents of the receiving tank 101 are removed, and the excess solid solder is peeled off to obtain a planar target material. The control module controls the position adjustment mechanism to move the target material gripping structure 200, directly adjusting the weld size between the target material plate and the backplate, thereby facilitating the control and adjustment of the solder layer thickness and simplifying the target bonding process.

[0033] In this embodiment, the target material gripping structure 200 includes a mounting frame 210 and three suction cups 220 spaced apart along the front-back direction. The suction cups 220 are connected to the mounting frame 210, and the position adjustment mechanism is connected to the mounting frame 210. By arranging the three suction cups 220 on the mounting frame 210, the target material plate can be relatively stably adsorbed along the front-back direction, making the weld size of the target material plate and the back plate relatively uniform, which is beneficial to improving the bonding and welding effect between the target material plate and the back plate. The suction cups 220 can grip thinner target material plates without easily damaging them.

[0034] It is conceivable that in other embodiments, the target gripping structure 200 may also include a mounting frame 210 and two, four or more suction cups 220 arranged at intervals in the front-back direction, or the target gripping structure 200 may include a mounting frame 210 and a plurality of suction cups 220 arranged in an array, which is not limited here; or the target gripping structure 200 may adopt a structure such as a gripper.

[0035] In this embodiment, the position adjustment mechanism is a multi-axis robotic arm, one end of which is connected to the target gripping structure 200. By using a multi-axis robotic arm to move and adjust the position of the target gripping structure 200, the weld size between the back plate and the target is controlled, resulting in relatively precise control and providing a physical basis for the automation of the target bonding device. It is conceivable that in other embodiments, the position adjustment mechanism could be other structures, such as a three-axis moving platform, to move the mounting frame 210 into or out of the receiving groove 101 and adjust the weld size between the target plate and the back plate.

[0036] In the embodiment, the target limiting mechanism 300 is further included, and the target limiting mechanism 300 is arranged on the base 100. The target limiting mechanism 300 has a target placement position, and the target placement position is located in the accommodation groove 101 and is higher than the bottom wall of the accommodation groove 101. When the target plate is placed in the accommodation groove 101, the target plate can be located at the target placement position. The target limiting mechanism 300 can limit the target plate, so that the target plate is not easy to shake, thereby improving the size stability of the solder layer between the target plate and the back plate, and being beneficial to the position alignment of the target plate and the back plate.

[0037] In the embodiment, the target limiting mechanism 300 includes a first limiting piece 310 and a second limiting piece 320. The first limiting piece 310 and the second limiting piece 320 are movably arranged on the side wall of the accommodation groove 101 and can approach or move away from each other. The target placement position is between the first limiting piece 310 and the second limiting piece 320. When the target plate is placed in the accommodation groove 101, the first limiting piece 310 and the second limiting piece 320 can approach each other to limit the side wall of the target plate, thereby limiting the target plate. The structure is simple and easy to implement. When the target plate needs to be disassembled, the first limiting piece 310 and the second limiting piece 320 can move away from each other, thereby reducing the disassembly obstruction to the planar target.

[0038] Specifically, the first limiting piece 310 and the second limiting piece 320 in the embodiment are movably arranged on the side wall of the accommodation groove 101. It can be imagined that in other embodiments, the first limiting piece 310 or the second limiting piece 320 can be movably arranged on the side wall of the accommodation groove 101.

[0039] In the embodiment, the first limiting piece 310 is provided with a first elastic pad 330 at one end close to the second limiting piece 320. The second limiting piece 320 is provided with a second elastic pad 340 at one end close to the first limiting piece 310. The first elastic pad 330 is opposite to the second elastic pad 340, and the target placement position is formed between the first elastic pad 330 and the second elastic pad 340. The first limiting piece 310 contacts the target plate through the first elastic pad 330, and the second limiting piece 320 contacts the target plate through the second elastic pad 340, thereby avoiding the risk of directly contacting and scratching the target plate by the first limiting piece 310 and the second limiting piece 320.

[0040] In the embodiment, the first limiting member 310 and the second limiting member 320 are movably connected to the side wall of the accommodating groove 101 along the left-right direction, the first limiting member 310 is provided with at least two and is arranged in the front-rear direction, the first elastic pad 330 is strip-shaped and extends along the front-rear direction, and one end of all the first limiting members 310 close to the target material placement position is connected with the first elastic pad 330; the second limiting member 320 is provided with at least two and is arranged in the front-rear direction, and one end of all the second limiting members 320 close to the target material placement position is connected with the second elastic pad 340. Since the size of the target material plate is large, the first limiting member 310 and the second limiting member 320 are arranged in the front-rear direction, and a plurality of the first limiting member 310 and the second limiting member 320 can be arranged to form a good limiting on each part of the target material plate; and one end of all the first limiting members 310 is connected with the first elastic pad 330, and one end of all the second limiting members 320 is connected with the second elastic pad 340, thereby reducing the number of the first elastic pad 330 and the second elastic pad 340 and simplifying the assembly structure of the target material binding device.

[0041] Specifically, the first limiting member 310 is provided with three and is arranged in the front-rear direction, the second limiting member 320 is also provided with three and is arranged in the front-rear direction, and the first limiting member 310 and the second limiting member 320 are one-to-one corresponding. It can be imagined that in other embodiments, the first limiting member 310 and the second limiting member 320 can also be provided with two, four or more, which is not limited here.

[0042] In the embodiment, the first limiting member 310 and the second limiting member 320 are both bolts, the side wall of the accommodating groove 101 is provided with a threaded hole, and the bolt is threadedly connected to the threaded hole; the first elastic pad 330 and the second elastic pad 340 are both polyurethane pads. The first limiting member 310 and the second limiting member 320 are both bolts, which are connected to the side wall of the accommodating groove 101 by thread connection, and the first limiting member 310 and the second limiting member 320 are made to approach or move away from each other by rotating the bolt, so that the structure is simple, practical and convenient, and the adjustment is relatively sensitive; the first elastic pad 330 and the second elastic pad 340 are both polyurethane pads, which have good protection performance and low cost.

[0043] It can be imagined that in other embodiments, the first limiting member 310 and the second limiting member 320 can also be other structures, such as studs, which are movably connected to the side wall of the accommodating groove 101 by thread connection; the first elastic pad 330 and the second elastic pad 340 can also be made of other materials, such as silica gel.

[0044] Specifically, the thickness of the first elastic pad 330 and the second elastic pad 340 is slightly larger than the thickness of the target material plate.

[0045] It can be imagined that in other embodiments, the target limiting mechanism 300 can also be other structures, for example, the target limiting mechanism includes an electric push rod and a limiting block, the electric push rod is installed on the base 100, the electric push rod can push the limiting block to move, and the limiting block can contact the target plate to limit the position of the target plate.

[0046] In embodiments, the base 100 includes a heating table 110 and a frame 120, the frame 120 is detachably connected to the upper side of the heating table 110, the frame 120 and the heating table 110 enclose to form a containing groove 101, and the heating module is arranged on the heating table 110. By placing the frame 120 on the heating table 110, the containing groove 101 is formed, which can accommodate the back plate, the target plate and the solder. After the solder solidifies, the frame 120 can be separated from the heating table 110, and then the solid solder can be peeled off together with the planar target plate to facilitate the disassembly process of the workpiece.

[0047] Specifically, the frame 120 is directly placed on the heating table 110 to realize detachable connection. It can be imagined that in other embodiments, the frame 120 and the heating table 110 can also be detachably connected through structures such as magnetic attraction, screw locking, clamping and the like.

[0048] Specifically, the heating module can be, for example, an electric heating disc, an electric heating rod or a burner, etc., which heats the heating table 110.

[0049] In embodiments, the liquid injection funnel 400 is arranged on the frame 120, the liquid injection funnel 400 is provided with a liquid outlet hole, the frame 120 is provided with a solder injection channel 121, and the other end of the solder injection channel 121 is communicated with the liquid outlet hole. By arranging the liquid injection funnel 400, the heated liquid solder can enter the solder injection channel 121 through the liquid injection funnel 400, which facilitates the injection of the liquid solder.

[0050] Specifically, one end of the solder injection channel 121 is communicated with the bottom of the containing groove 101, so that the liquid level of the liquid solder gradually immerses the weld joint between the back plate and the target plate from bottom to top, which can reduce the defects of the solder layer between the back plate and the target plate after the solder solidifies, and improve the binding rate of the back plate and the target plate.

[0051] Specifically, the control module can adopt a structure with a control circuit, such as a circuit board or a single-chip microcomputer.

[0052] Specifically, the first limiting member 310 and the second limiting member 320 are both screwed to the frame 120. During production, first, the frame 120 is placed on the heating table 110, then the back plate is placed into the frame 120, and the back plate contacts the heating table 110. Then the target plate is placed on the heating table 110, and the heating module is heated to about 210 DEG C, and the target plate and the back plate are preheated; then the target plate is grabbed by the target grabbing structure 200, and the target grabbing structure 200 is moved by the position adjusting mechanism, and the target plate is placed into the containing groove 101, and then the distance between the target plate and the back plate is adjusted to form a weld of appropriate size. Then the first limiting member 310 and the second limiting member 320 are close to each other, and the first elastic pad 330 and the second elastic pad 340 contact the target plate. Then the liquid solder is injected through the liquid injection funnel 400, and the liquid solder is usually metal indium, etc., and the liquid solder flows into the containing groove 101 and immerses the weld between the back plate and the target plate from bottom to top, and the liquid solder is higher than the weld by 3 to 5 mm. Then the heating device is turned off and cooled, and when the temperature of the solder is reduced to 150 DEG C, the target grabbing structure 200 releases the target plate, and the position adjusting mechanism moves the target grabbing structure 200 out of the containing groove 101. After the containing groove 101 is completely cooled, the frame 120 is taken away, and the planar target and the solid solder are peeled off, and then the solid solder is peeled off to obtain the planar target.

[0053] Specifically, the back plate in the utility model is a copper plate, and the target plate is a silver alloy target plate.

[0054] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0055] Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A target binding apparatus, comprising: The application relates to a target material loading device, which comprises the following parts: a base (100) provided with a containing groove (101) and a heating module for heating the containing groove (101), the base (100) being provided with a solder injection channel (121) with one end in communication with the bottom of the containing groove (101); a material moving assembly comprising a position adjusting mechanism and a target material grabbing structure (200), the target material grabbing structure (200) being arranged on the position adjusting mechanism, and the position adjusting mechanism being capable of driving the target material grabbing structure (200) to enter or leave the containing groove (101); a control module electrically connected with the heating module and the material moving assembly.

2. The target binding apparatus of claim 1, wherein: The target material grabbing structure (200) comprises a mounting rack (210) and at least two suction cups (220) arranged in the front-rear direction, the suction cups (220) being connected with the mounting rack (210), and the position adjusting mechanism being connected with the mounting rack (210).

3. The target binding apparatus of claim 1, wherein: The position adjusting mechanism is a multi-axis mechanical arm, one end of the multi-axis mechanical arm being connected with the target material grabbing structure (200).

4. The target binding apparatus of claim 1, wherein: The application further comprises a target material limiting mechanism (300) arranged on the base (100), the target material limiting mechanism (300) having a target material placement position, the target material placement position being located in the containing groove (101) and being higher than the bottom wall of the containing groove (101).

5. The target binding apparatus of claim 4, wherein: The target material limiting mechanism (300) comprises a first limiting piece (310) and a second limiting piece (320), the first limiting piece (310) and / or the second limiting piece (320) being movably arranged on the side wall of the containing groove (101) and being capable of moving close to or away from each other, and the target material placement position being between the first limiting piece (310) and the second limiting piece (320).

6. The target binding apparatus of claim 5, wherein: One end of the first limiting piece (310) close to the second limiting piece (320) is provided with a first elastic pad (330), one end of the second limiting piece (320) close to the first limiting piece (310) is provided with a second elastic pad (340), the first elastic pad (330) is opposite to the second elastic pad (340), and the target material placement position is formed between the first elastic pad (330) and the second elastic pad (340).

7. The target binding apparatus of claim 6, wherein: The first limiting piece (310) and the second limiting piece (320) are movably connected with the side wall of the containing groove (101) in the left-right direction, the first limiting piece (310) is provided with at least two pieces arranged in the front-rear direction, the first elastic pad (330) is in a strip shape and extends in the front-rear direction, and one end of all the first limiting pieces (310) close to the target material placement position is connected with the first elastic pad (330); the second limiting piece (320) is provided with at least two pieces arranged in the front-rear direction, and one end of all the second limiting pieces (320) close to the target material placement position is connected with the second elastic pad (340).

8. The target binding apparatus of claim 6, wherein: The first limiting piece (310) and the second limiting piece (320) are bolts, the side wall of the accommodating groove (101) is provided with a threaded hole, and the bolts are threadedly connected to the threaded hole; the first elastic pad (330) and the second elastic pad (340) are both polyurethane pads.

9. The target binding apparatus of claim 1, wherein: The base (100) comprises a heating table (110) and a frame body (120), the frame body (120) is detachably connected to the upper side of the heating table (110), the frame body (120) and the heating table (110) enclose the accommodating groove (101), and a heating module is arranged on the heating table (110).

10. The target binding apparatus of claim 9, wherein: The injection funnel (400) is arranged on the frame body (120), the injection funnel (400) is provided with a liquid outlet hole, the frame body (120) is provided with the solder injection channel (121), and the liquid outlet hole is in communication with the other end of the solder injection channel (121).

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