Light diffusion type SMD (Surface Mount Device) LED lamp bead

By using a combination of concave mirrors, convex mirrors, and wave reflectors in diffused surface-mount LED chips, the problems of insufficient brightness and overheating caused by excessive total internal reflection of light are solved, achieving high brightness and effective heat dissipation.

CN223795115UActive Publication Date: 2026-01-13GUANGDONG XINTEMEI TECH CO LTD
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Patent Information

Application Number
CN202520126576.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-20
Publication Date
2026-01-13
Estimated Expiration
2035-01-20

AI Technical Summary

Technical Problem

In existing technologies, the large difference in refractive index at the interface between the astigmatic lens and the encapsulating resin causes excessive total internal reflection of light within the encapsulation, leading to overheating and insufficient brightness of the LED chips in high-power light sources or high-brightness applications.

Method used

By combining concave and convex mirrors with a wave reflector and acrylic plate, the brightness of light is improved through multiple reflections and refractions. The wave reflector and heat dissipation grooves are used for heat dissipation, thus optimizing the light distribution and heat dissipation.

Benefits of technology

It improves the utilization rate and brightness of light, solves the problem of insufficient brightness of LED beads under high brightness requirements, and effectively dissipates heat through heat dissipation slots to avoid overheating of LED beads.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of LEDs (light-emitting diodes), in particular to an astigmatism type SMD (surface mount device) LED lamp bead, which is characterized in that a cover plate is fixedly mounted in a shell, an astigmatism mechanism is fixedly mounted in the cover plate, the astigmatism mechanism comprises a concave mirror, a convex mirror is fixedly mounted in the concave mirror, and a plane mirror is fixedly mounted in the concave mirror; a wave reflecting plate for reflecting light rays is fixedly installed in the shell, a first magnet is fixedly installed at the bottom of the cover plate, a second magnet is fixedly installed in the shell, when light generated by the LED lamp beads passes through the concave mirror, the concave mirror gathers the light rays, when the gathered light rays pass through the convex mirror, the light rays are diverged again, and in the light ray diverging process, the light rays are reflected by the concave mirror. When a part of light is reflected back, the light penetrates through the acrylic plate to be emitted to the surface of the wave reflecting plate, the wave reflecting plate reflects the light again, the light is emitted into the concave mirror again, the utilization rate of the light is increased, and therefore the function of dispersing the light is achieved.
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Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to a diffused surface-mount LED chip. Background Technology

[0002] LED chips are light-emitting diodes. Their working principle is as follows: the voltage across the PN junction forms a potential barrier. When a forward bias voltage is applied, the barrier decreases, and the majority carriers in the P and N regions diffuse to each other. In practical applications, diffused surface-mount LED chip equipment typically requires the following technologies:

[0003] 1. LED chip: It is the core component for light emission and determines the basic light emission performance of the LED bead, such as color and brightness;

[0004] 2. Astigmatism Lens: This is the key component for achieving the astigmatism effect. Its shape and material allow the light emitted by the LED chip to be refracted and scattered, thereby achieving the purpose of astigmatism.

[0005] 3. Electrodes: including positive and negative electrodes, used to connect to an external power source to power the LED chip.

[0006] For example, a Chinese patent discloses an LED chip lamp bead (patent number: CN218763086U). A pin is inserted into a socket. When the pin is inserted, a retaining rod passes through with it. Pressure continues to be applied when a second spring contacts the circuit board, causing the second spring to gain elastic potential energy and compress the circuit board. When the pressure is stopped, the second spring and the retaining rod simultaneously exert opposite forces on the circuit board, firmly fixing the LED chip lamp bead to the circuit board. This method is time-saving, labor-saving, and prevents short circuits. To remove the LED chip lamp bead, simply pull the pull ring to retract the retaining rod. It is simple and easy to operate, facilitating the replacement of LED chip lamp beads.

[0007] However, during the implementation of the above technical solution, at least the following technical problems were found: As mentioned above, the device achieves the scattering effect by installing a scattering lens on the light-emitting chip path, but the refractive index difference between the lens and the encapsulation resin interface is large, and the light is prone to excessive total internal reflection in the encapsulation, resulting in problems such as overheating of the lamp beads and insufficient brightness in high-power light source or high-brightness demand scenarios. Utility Model Content

[0008] To address the shortcomings of existing technologies, this utility model provides a diffused surface-mount LED bead, which solves the technical problem that while the device achieves diffused light by installing a diffused lens on the path of the light-emitting chip, the large difference in refractive index at the interface between the lens and the encapsulating resin makes it easy for light to undergo excessive total internal reflection within the encapsulation, leading to overheating and insufficient brightness of the LED bead in high-power light sources or high-brightness demand scenarios.

[0009] To achieve the above objectives, this utility model provides the following technical solution:

[0010] A diffused surface-mount LED bead includes a housing, a cover plate fixedly installed inside the housing, a diffused light mechanism fixedly installed inside the cover plate, the diffused light mechanism including a concave mirror, a convex mirror for focusing light fixedly installed inside the concave mirror, a plane mirror for blocking dust fixedly installed inside the concave mirror, and a wave reflector for reflecting light fixedly installed inside the housing.

[0011] Preferably, a first magnet is fixedly installed at the bottom of the cover plate, and a second magnet is fixedly installed inside the outer shell.

[0012] Preferably, the housing has heat dissipation grooves inside, and the housing has a slidingly mounted fitting electrode inside.

[0013] Preferably, an LED circuit board is fixedly mounted on the top of the bonding electrode, and an acrylic plate is fixedly mounted inside the outer casing.

[0014] Preferably, the acrylic sheet is located at the bottom of the cover plate, and LED beads are fixedly installed on the top of the acrylic sheet.

[0015] Preferably, the wave reflector is located at the bottom of the acrylic plate, the LED circuit board is located at the bottom of the wave reflector, and wire holes are provided inside both the wave reflector and the acrylic plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. When the light generated by the LED beads passes through the concave mirror, the concave mirror will focus the light. When the focused light passes through the convex mirror, it will be dispersed again. In the process of dispersing the light, the brightness of the light is maximized. When some light is reflected back, the light passes through the acrylic plate and hits the surface of the wave reflector. The wave reflector will reflect the light again and send the light back into the concave mirror, improving the utilization rate of the light and thus achieving the function of dispersing the light.

[0018] 2. During use, attach the bonding electrode to the mounting base. The bonding electrode transmits power to the LED circuit board, which then transmits power to the LED beads through the circuit. During prolonged use, the LED beads and LED circuit board will generate heat. The LED beads will transfer some of the heat to the wave reflector, and the wave reflector and LED beads will dissipate heat through the heat dissipation grooves, thereby achieving the function of heat dissipation for the device. Attached Figure Description

[0019] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a structural diagram of the bonding electrode of this utility model;

[0022] Figure 3 This is a structural diagram of the wave reflector of this utility model;

[0023] Figure 4 This is a structural diagram of the convex mirror of this utility model.

[0024] Legend: 11. Outer shell; 12. Cover plate; 13. Concave mirror; 14. Convex mirror; 15. Plane mirror; 16. Wave reflector; 17. First magnet; 18. Second magnet; 19. Heat dissipation groove; 21. Bonding electrode; 22. LED circuit board; 23. Acrylic plate; 24. LED beads; 16. Wave reflector; 26. Wire hole. Detailed Implementation

[0025] This application provides a diffused surface-mount LED chip that effectively solves the problem of excessive total internal reflection caused by the large refractive index difference between the lens and the encapsulating resin at the interface of the LED chip. This leads to overheating and insufficient brightness in high-power or high-brightness applications. The solution involves a concave mirror that focuses the light, which then diverges again when it passes through a convex mirror. This divergence maximizes brightness. When some light is reflected back, the brightness is further enhanced. The light passes through the acrylic plate and hits the surface of the wave reflector. The wave reflector reflects the light again, directing it into the concave mirror, thus improving light utilization and achieving the function of light dispersion. During use, the bonding electrode is attached to the mounting base, and the bonding electrode transmits power to the LED circuit board. The LED circuit board then transmits power to the LED beads through the circuit. During prolonged use, the LED beads and LED circuit board will generate heat. The LED beads transfer some of this heat to the wave reflector, and the wave reflector and LED beads dissipate heat through the heat dissipation grooves, thus achieving the function of heat dissipation for the device. Example

[0026] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the technical solution in this application embodiment effectively solves the technical problem that the device achieves a diffused light effect by installing a diffuser lens on the path of the light-emitting chip, but the refractive index difference between the lens and the encapsulating resin is large, and the light is prone to excessive total internal reflection within the encapsulation, resulting in overheating of the LED bead and insufficient brightness in high-power light source or high-brightness demand scenarios. The overall idea is as follows: A diffused surface-mount LED bead includes a housing 11, a cover plate 12 fixedly installed inside the housing 11, a diffused light mechanism fixedly installed inside the cover plate 12, and a concave mirror 13, with a convex mirror 14 fixedly installed inside the concave mirror 13. A plane mirror 15 is fixedly installed inside the concave mirror 13, and a wave reflector 16 for reflecting light is fixedly installed inside the outer shell 11. When the light generated by the LED beads 24 passes through the concave mirror 13, the concave mirror 13 will focus the light. When the focused light passes through the convex mirror 14, it will be dispersed again. In the process of dispersing the light, the brightness of the light is maximized. When some light is reflected back, the light passes through the acrylic plate 23 and hits the surface of the wave reflector 16. The wave reflector 16 will reflect the light again and send the light back into the concave mirror 13, thereby improving the utilization rate of the light and achieving the function of dispersing the light.

[0027] A first magnet 17 is fixedly installed at the bottom of the cover plate 12, a second magnet 18 is fixedly installed inside the outer shell 11, a heat dissipation groove 19 is formed inside the outer shell 11, a bonding electrode 21 is slidably installed inside the outer shell 11, an LED circuit board 22 is fixedly installed on the top of the bonding electrode 21, an acrylic plate 23 is fixedly installed inside the outer shell 11, the acrylic plate 23 is located at the bottom of the cover plate 12, an LED lamp bead 24 is fixedly installed on the top of the acrylic plate 23, a wave reflector 16 is located at the bottom of the acrylic plate 23, and the LED circuit board 22 is located at the bottom of the cover plate 12. At the bottom of the wave reflector 16, the bonding electrode 21 is attached to the mounting base during use. The bonding electrode 21 transmits power to the LED circuit board 22, which in turn transmits power to the LED beads 24 through the circuit. During prolonged use, the LED beads 24 and the LED circuit board 22 will generate heat. The LED beads 24 will transfer some of the heat to the wave reflector 16, and the wave reflector 16 and the LED beads 24 will dissipate heat through the heat dissipation groove 19, thereby achieving the function of heat dissipation for the device.

[0028] Both the wave reflector 16 and the acrylic plate 23 have wire holes 26 inside to improve the heat dissipation efficiency of the device.

[0029] To address the problems existing in the prior art, this utility model provides a diffused surface-mount LED bead. When the light generated by the LED bead 24 passes through the concave mirror 13, the concave mirror 13 focuses the light. When the focused light passes through the convex mirror 14, it is diffused again. During the diffusion process, the light brightness is maximized. When some light is reflected back, it passes through the acrylic plate 23 and hits the surface of the wave reflector 16. The wave reflector 16 reflects the light again, and the light is then directed back into the concave mirror 13, further enhancing the brightness. The utilization rate of the line is improved to achieve the function of dispersing light. During use, the bonding electrode 21 is attached to the mounting base. The bonding electrode 21 transmits power to the LED circuit board 22. The LED circuit board 22 transmits power to the LED beads 24 through the line. When used for a long time, the LED beads 24 and the LED circuit board 22 will generate heat. The LED beads 24 will transfer some of the heat to the wave reflector 16. The wave reflector 16 and the LED beads 24 will dissipate heat through the heat dissipation groove 19, thereby achieving the function of heat dissipation of the device.

[0030] Outer shell 11: As the external protective structure of the entire LED bead, it provides space for the installation and support of internal components, and at the same time plays a certain protective role, such as preventing external physical damage and the intrusion of dust and moisture.

[0031] Cover plate 12: It is fixedly installed inside the outer shell 11, providing a mounting base for the diffuser mechanism and playing a certain role in sealing and protecting the internal structure;

[0032] Concave mirror 13: When the light generated by the LED bead 24 passes through, it focuses the light and initially adjusts the direction of light propagation and intensity distribution;

[0033] Convex mirror 14: Located inside concave mirror 13, it re-diversifies the light rays that have been focused by concave mirror 13, maximizing the brightness of the light rays during the divergence process and achieving optimized light distribution.

[0034] Plane mirror 15: Installed inside the concave mirror 13, it blocks dust from entering the light path, ensures the purity of light transmission, and reduces the scattering and absorption of light by dust.

[0035] Wave reflector 16: Fixed inside the housing 11, when some light is reflected back, it reflects the light again and directs the light back to the concave mirror 13, thereby improving the utilization rate of light and enhancing the diffused light effect.

[0036] First magnet 17: Installed at the bottom of cover plate 12, it cooperates with second magnet 18 inside outer shell 11 to fix and connect cover plate 12 and outer shell 11, ensuring the stability of the structure.

[0037] The second magnet 18 is located inside the outer shell 11 and attracts the first magnet 17 to complete the fixed connection between the cover plate 12 and the outer shell 11.

[0038] Heat dissipation groove 19: It is formed inside the housing 11 to provide a heat dissipation channel for the heat generated by the LED beads 24, LED circuit board 22 and wave reflector 16, which helps to keep the beads within the normal operating temperature range and improve service life and performance stability.

[0039] Adhesive electrode 21: Slidably mounted inside the housing 11, connected to an external power source, and transmits power to the LED circuit board 22 to power the LED beads;

[0040] LED circuit board 22: mounted on top of bonding electrode 21, receives power transmitted from bonding electrode 21, and transmits power to LED beads 24 through lines. It may also contain control circuitry to regulate the working state of the beads.

[0041] Acrylic sheet 23: It is fixedly installed inside the outer shell 11 and located at the bottom of the cover plate 12. It plays the role of light transmission and uniform light scattering, making the light softer and more uniform.

[0042] LED light bead 24: Installed on top of acrylic plate 23, it is the core element for emitting light;

[0043] Wire hole 26: It is opened inside the wave reflector 16 and the acrylic plate 23 to provide space for the wires connecting the LED beads 24, LED circuit board 22 and other components to pass through, while avoiding the wires from obstructing the light transmission and heat dissipation, thus improving the layout rationality and heat dissipation efficiency of the device.

[0044] Working principle:

[0045] The first step involves attaching the bonding electrode 21 to the mounting base during use. The bonding electrode 21 transmits power to the LED circuit board 22, which then transmits power to the LED beads 24 via circuitry. During prolonged use, the LED beads 24 and the LED circuit board 22 will generate heat. The LED beads 24 will transfer some of this heat to the wave reflector 16, which will then dissipate heat through the heat dissipation groove 19, thus achieving the function of heat dissipation for the device.

[0046] In the second step, when the light generated by the LED bead 24 passes through the concave mirror 13, the concave mirror 13 will focus the light. When the focused light passes through the convex mirror 14, it will be dispersed again. In the process of dispersing the light, the brightness of the light is maximized. When some light is reflected back, the light passes through the acrylic plate 23 and hits the surface of the wave reflector 16. The wave reflector 16 will reflect the light again and send the light back into the concave mirror 13, thereby improving the utilization rate of the light and achieving the function of dispersing the light.

[0047] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A diffused light type patch LED lamp bead, comprising a shell (11), a cover plate (12) is fixedly installed inside the shell (11), and a light dispersing mechanism for dispersing light is fixedly installed inside the cover plate (12), characterized in that, The astigmatism mechanism comprises a concave mirror (13), a convex mirror (14) for converging light rays is fixedly installed inside the concave mirror (13), and a plane mirror (15) for blocking dust is fixedly installed inside the concave mirror (13). The shell (11) is fixedly installed with a wave reflection plate (16) inside for reflecting light rays.

2. The diffused surface-mount LED bead as described in claim 1, characterized in that, The bottom of the cover plate (12) is fixedly installed with a first magnet (17). The shell (11) is fixedly installed with a second magnet (18) inside.

3. The diffused surface-mount LED bead as described in claim 2, characterized in that, The shell (11) is internally provided with a heat dissipation groove (19). The shell (11) is internally slidably installed with a contact electrode (21).

4. The light diffusing type patch LED lamp bead according to claim 3, characterized in that, The top of the contact electrode (21) is fixedly installed with an LED circuit board (22). The shell (11) is fixedly installed with an acrylic plate (23) inside.

5. The light diffusing type patch LED lamp bead according to claim 4, characterized in that, The acrylic plate (23) is located at the bottom of the cover plate (12). The top of the acrylic plate (23) is fixedly installed with an LED lamp bead (24).

6. A diffused surface-mount LED bead as described in claim 5, characterized in that, The wave reflection plate (16) is located at the bottom of the acrylic plate (23), and the LED circuit board (22) is located at the bottom of the wave reflection plate (16). The wave reflection plate (16) and the acrylic plate (23) are internally provided with wire holes (26).

Citation Information

Patent Citations

  • LED SMD lamp bead

    CN218763086U