Anti-electromagnetic interference four-layer plate regulator

Abstract

The utility model discloses an anti-electromagnetic interference four-layer board regulator, which comprises a PCB (Printed Circuit Board), the PCB has four layers, and the thickness of each layer is 1.4 mm; the central area of the PCB is provided with three through holes which are convenient for the hot melting columns to pass through, and the three through holes are arranged in a triangle shape. The PCB is provided with a B + end anti-electromagnetic interference circuit, an L end anti-electromagnetic interference circuit, an S end anti-electromagnetic interference circuit, an IG end anti-electromagnetic interference circuit, a DFM end anti-electromagnetic interference circuit, an L end protection circuit, a phase signal voltage boosting circuit, a W end short-circuit protection circuit and a half-bridge driving circuit; the PCB is provided with a via hole. According to the utility model, the limitation that a conventional regulator uses a double-sided PCB for layout is broken through, and the design of a four-layer circuit board is developed, so that the layout space is increased, and the EMC requirement is met: electronic components are subjected to block layout according to functional modules, signal lines are subjected to layered routing processing, ground wires of the same functional module are designed in the same functional area, and via holes adopt double-via-hole layout; and positioning holes are added in corresponding areas of the PCB, so that the reliability is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of automotive regulator technology, specifically a four-layer plate regulator that is resistant to electromagnetic interference. Background Technology

[0002] With the advancement of technology and the rapid development of the automotive industry, in-vehicle electronic devices are becoming increasingly common. In-vehicle entertainment systems, car audio systems, Bluetooth communication, airbags, and satellite positioning all emit various signals to the outside world. These signals can cause vehicles to enter areas of strong interference, making them prone to malfunction due to the high sensitivity of in-vehicle electronic systems. This can range from minor driving malfunctions to serious accidents, endangering lives. Therefore, automotive EMC (electromagnetic compatibility) design standards and specifications have become extremely important.

[0003] Regulators with electromagnetic interference (EMI) immunity typically have complex circuitry and a wide variety of components, requiring relatively large layout and routing space to meet EMI requirements. This increases the PCB area and cost. Because the size and shape of the regulator are influenced by the external installation environment, such as generators and rectifier bridges, the space available for circuit layout is limited. Existing regulators, while meeting product functional requirements, rarely have extra space for EMC (Electromagnetic Compatibility) design.

[0004] To address this, a four-layer plate regulator with electromagnetic interference resistance is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a four-layer board regulator that resists electromagnetic interference, breaking through the limitations of previous regulators that used double-sided PCB layouts. A four-layer board design has been developed to increase the layout space and meet EMC requirements: electronic components are laid out in blocks according to functional modules, signal lines are routed in layers, ground lines of the same functional module are designed in the same functional area, electronic components are distributed on the top single layer of the PCB, vias adopt a double via layout, and positioning holes are added to the corresponding areas of the PCB to enhance reliability.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An electromagnetic interference resistant four-layer board regulator includes a PCB board, wherein the PCB board has four layers, each layer having a thickness of 1.4 mm;

[0008] The PCB board has three through holes arranged in a triangle to facilitate the passage of hot melt pillars in the central area;

[0009] The PCB board is equipped with B+ terminal electromagnetic interference suppression circuit, L terminal electromagnetic interference suppression circuit, S terminal electromagnetic interference suppression circuit, IG terminal electromagnetic interference suppression circuit, DFM terminal electromagnetic interference suppression circuit, L terminal protection circuit, phase signal voltage boosting circuit, W terminal short circuit protection circuit, and half-bridge drive circuit.

[0010] The PCB board has vias.

[0011] Furthermore, the PCB board is made of FR-4TG170 material.

[0012] Furthermore, the PCB board has dimensions of 23*32.5*1.4mm.

[0013] Furthermore, the through hole has a size of φ1.5mm.

[0014] Furthermore, the diameter of the via is 0.36mm-0.41mm.

[0015] Furthermore, the diameter of the via pad is 0.61-0.81 mm.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] The PCB board was designed as a four-layer board to solve the problem of insufficient space for the regulator.

[0018] The circuit is strictly laid out according to the module classification, and the inner layer wiring is also strictly divided, with power lines, signal lines and ground lines running in layers to meet EMC functions.

[0019] Ensure that the corresponding components of each functional module are located within the corresponding grounding area;

[0020] Due to the harsh working environment of the regulator, in order to avoid the regulator failure caused by the breakage of the four-layer board, two vias are placed at each layer's wiring point;

[0021] The main operating circuit of the regulator is placed on the top layer of the board to avoid the regulator's basic functions being unable to be met due to via failure.

[0022] While maintaining the same controller layout space, the electromagnetic interference-resistant four-layer board controller layout design of this invention effectively solves the problem of insufficient space and improves the reliability of the controller; moreover, it is feature-rich, possessing both the protection functions of ordinary multi-functional controllers and meeting EMC-related requirements. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the functional module block layout structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the distribution structure of the important electronic components of this utility model;

[0025] Figure 3 This is a schematic diagram of the through-hole structure of this utility model. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0027] Example 1:

[0028] This utility model provides a technical solution:

[0029] A four-layer PCB layout design for an electromagnetic interference (EMI)-resistant regulator includes a PCB board, and EMI-resistant circuits mounted on the PCB board at the B+, L, S, IG, and DFM ends, as well as an L-end protection circuit, a phase signal voltage boosting circuit, a W-end short-circuit protection circuit, and a half-bridge drive circuit. This invention overcomes the limitations of previous regulators using double-sided PCB layouts by developing a four-layer PCB design to increase layout space and meet EMC requirements. Electronic components are arranged in blocks according to functional modules, signal lines are routed in layers, ground lines for the same functional module are designed in the same functional area, electronic components are distributed on the top single layer of the PCB board, vias are arranged in a double-via layout, and positioning holes are added to corresponding areas of the PCB board to enhance reliability.

[0030] The aforementioned PCB is made of FR-4TG170 material and is a four-layer PCB measuring 23*32.5*1.4mm. Three φ1.5mm through-holes are placed in the center of the board, forming a triangular shape to facilitate the passage of the hot melt pillars for hot melt positioning. Larger electronic components are designed on the front side of the PCB, while smaller, lighter components are designed on the back side. Back-side components are mounted first and then reflow soldered to secure them before the front-side components are mounted. This ensures that the smaller, lighter back-side components are firmly adhered to the solder paste during the second reflow soldering, facilitating production. The layout of the front-side components strictly adheres to the no-go zones of the ceramic soldering iron tip to facilitate the installation and soldering of bottom-layer inserts.

[0031] like Figure 1 As shown, electronic components are arranged in blocks according to functional modules. Surface mount components are placed on both sides, making great use of the PCB layout space. The wiring follows the signal line layer routing process. In the GND inner layer design of the PCB, the power and ground lines are placed on the outside in an enclosed shape to reduce the impact of signal interference. The electronic components and wiring design of the same functional module are designed in the same functional area, which enhances the anti-EMC capability.

[0032] like Figure 2As shown, important electronic components are located on the top layer of the PCB. Because the regulator operates in a harsh environment, often exposed to extreme temperatures and humidity, it is prone to failure due to via open circuits. Placing the regulator's essential functional components on the top layer of the PCB ensures that even if the layer malfunctions, the regulator's basic voltage regulation function remains unaffected, preventing issues caused by via failure that could prevent the regulator from fulfilling its basic functions.

[0033] like Figure 3 As shown, in the via design of a 4-layer PCB, vias with a diameter of 0.36mm / 0.61mm (pad) / 1.02mm are typically selected. For signal lines with special requirements, such as power lines and ground lines, vias with diameters of 0.41mm / 0.81mm / 1.32mm are generally used. To avoid four-layer board breakage caused by copper wall fracture, wear, or other abnormal production applications in the vias, which could lead to regulator failure, two vias are placed at each layer's trace location to reduce the risk. Additionally, vias should be avoided under surface mount components as much as possible to prevent solder loss and to prevent vias from being contaminated by flux and dirt, making them difficult to clean.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electromagnetic interference resistant four-layer board regulator comprising a PCB board, characterized in that: the PCB board is four layers, each layer being 1.4 mm thick; three through holes are arranged in a triangular shape in the central region of the PCB board to facilitate the passage of heat stakes; the PCB board is provided with a B+ end electromagnetic interference resistant circuit, an L end electromagnetic interference resistant circuit, an S end electromagnetic interference resistant circuit, an IG end electromagnetic interference resistant circuit, a DFM end electromagnetic interference resistant circuit, an L end protection circuit, a phase signal voltage lifting circuit, a W end short circuit protection circuit, and a half-bridge drive circuit; the PCB board is provided with a via hole.

2. The four-layer board regulator of claim 1, wherein: The material of the PCB board is FR-4TG170.

3. The four-layer board regulator of claim 1, wherein: The size of the PCB board is 23*32.5*1.4 mm.

4. The four-layer board regulator of claim 1, wherein: The size of the through hole is φ1.5 mm.

5. The four-layer board regulator of claim 1, wherein: The aperture of the via hole is 0.36-0.41 mm.

6. The four-layer board regulator of claim 1, wherein: The pad diameter of the via hole is 0.61-0.81 mm.

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