Electric control device

Abstract

The utility model relates to the technical field of electronic equipment, in particular to an electric control device. The electric control device provided by the utility model comprises a heat dissipation device which comprises an insulating heat conduction surface and a mounting hole located in one side of the insulating heat conduction surface; the power device is arranged on the insulating heat conduction surface; the pressing block comprises a connecting part and an abutting part, the connecting part is provided with a through hole opposite to the mounting hole, and the abutting part is matched with the power device in an abutting mode; the connecting piece comprises a first rod section penetrating through the through hole and a second rod section penetrating through the mounting hole, the outer diameter of the first rod section is smaller than that of the second rod section so that a step surface perpendicular to the axial direction of the mounting hole can be formed in the connecting position of the first rod section and the second rod section, and the step surface is concaved in the insulating heat conduction surface in the axial direction of the mounting hole. According to the electric control device provided by the invention, the electrical insulation performance can be improved, so that the safety of the electric control device is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic control device. Background Technology

[0002] In modern power electronic equipment, electronic control devices are widely used in various fields, such as new energy vehicles, industrial automation, and photovoltaic power generation systems. Power devices, as one of the core components of these devices, can efficiently convert, control, and distribute electrical energy. Power devices, such as metal-oxide-semiconductor (MOS) transistors, generate a large amount of heat during operation. Therefore, heat dissipation devices are required in electronic control systems to cool these power devices.

[0003] In existing electronic control devices, power devices are usually mounted directly on heat dissipation devices, and heat is dissipated through the heat dissipation surface of the heat dissipation devices.

[0004] However, in existing electronic control devices, the creepage distance and clearance between power devices and heat dissipation devices, as well as between them and fixed connectors, are limited, which makes them prone to electrical breakdown and affects the safety of the electronic control device. Utility Model Content

[0005] This application provides an electrical control device that helps to increase the electrical insulation performance of the electrical control device, thereby increasing the safety of the electrical control device.

[0006] This application provides an electronic control device, including a heat dissipation device comprising an insulating heat-conducting surface and a mounting hole located on one side of the insulating heat-conducting surface; a power device disposed on the insulating heat-conducting surface; a pressure block comprising a connecting portion and a pressing portion, the connecting portion having a through hole opposite to the mounting hole, the pressing portion being press-fitted with the power device; and a connecting member comprising a first rod segment passing through the through hole and a second rod segment passing through the mounting hole, the outer diameter of the first rod segment being smaller than the outer diameter of the second rod segment, so as to form a stepped surface perpendicular to the axial direction of the mounting hole at the connection between the first rod segment and the second rod segment, the stepped surface being recessed into the insulating heat-conducting surface along the axial direction of the mounting hole.

[0007] In one possible implementation, the heat dissipation device includes: a heat dissipation body, the surface of which has an installation groove, the groove wall including a bottom wall, and the installation hole formed in the bottom wall; and an insulating heat-conducting element, which is fixedly disposed in the installation groove, the insulating heat-conducting surface being formed on the side of the insulating heat-conducting element facing away from the heat dissipation body, the stepped surface being recessed into the bottom wall, or the stepped surface being flush with the bottom wall.

[0008] In one possible implementation, the mounting groove has two mounting positions, which are located on opposite sides of the mounting hole; the insulating heat-conducting component corresponds to each mounting position, and the insulating heat-conducting component is disposed at the corresponding mounting position, with the mounting hole located on the middle side of the two mounting positions; each insulating heat-conducting component is provided with the power device.

[0009] In one possible implementation, the inner wall of the mounting hole is provided with an internal thread, and the outer wall of the second rod segment is provided with an external thread. The second rod segment and the mounting hole form a threaded engagement through the internal thread and the external thread.

[0010] In one possible implementation, the pressing part is provided with a clamping structure on the side facing the heat dissipation device, the clamping structure is located on opposite sides of the power device, and the clamping structure clamps and engages with the side wall of the power device.

[0011] In one possible implementation, the clamping structure includes a clamping arm and a pressing protrusion located on the side of the clamping arm facing the power device, the pressing protrusion abutting against the sidewall of the power device.

[0012] In one possible implementation, the power device includes a plurality of pins, and the electronic control device further includes a circuit board, which is disposed on the side of the pressure block facing away from the heat dissipation device. The circuit board has a plurality of connection holes corresponding one-to-one with the pins, and the pins pass through the corresponding connection holes and are electrically connected to the circuit board.

[0013] In one possible implementation, the side of the pressing part facing away from the heat dissipation device is provided with a supporting protrusion, and the circuit board is supported on the supporting protrusion; the heat dissipation device is also provided with a plurality of first fixing holes distributed along the periphery, and the circuit board is provided with a plurality of second fixing holes corresponding one-to-one with the first fixing holes; the electronic control device also includes fasteners, and the heat dissipation device and the circuit board are connected by the fasteners passing through the first fixing holes and the second fixing holes.

[0014] In one possible implementation, the connecting part is further provided with a limiting post on the side opposite to the heat dissipation device. The inner side of the limiting post defines a limiting groove, which communicates with the through hole. The connecting part also includes a connector, which is connected to the end of the first rod segment away from the second rod segment. The connector is embedded in the limiting groove.

[0015] In one possible implementation, the height of the limiting post is higher than the height of the supporting protrusion, and the circuit board is provided with a clearance hole for the limiting post to pass through; furthermore, the periphery of the limiting post is provided with a limiting protrusion, and the inner wall of the clearance hole is provided with a limiting groove that cooperates with the limiting protrusion, and the limiting protrusion is engaged in the limiting groove.

[0016] The electrical control device provided in this application achieves stable fixation of the power device and reduces its displacement and vibration during operation by providing a through hole opposite to the mounting hole on the connecting part of the pressure block, and by having a pressing part on the periphery of the connecting part to tightly press against the power device, and by having a connector passing through the through hole and the mounting hole. The design of the outer diameter of the first segment of the connector being smaller than the outer diameter of the second segment creates a stepped surface at the connection between the first and second segments. By recessing the stepped surface into the insulating and heat-conducting surface, the spatial distance between the connector and the power device perpendicular to the axial direction of the mounting hole is increased, thereby increasing the electrical clearance. Furthermore, the stepped surface and its recessed design into the insulating and heat-conducting surface increase the creepage path from the power device to the connector, thus improving the safety of the electrical control device. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] Figure 1 Exploded view of the electrical control device provided in this application;

[0019] Figure 2 This is a schematic diagram of the pressure block in the electrical control device provided in this application;

[0020] Figure 3 This is a schematic diagram of the power device in the electronic control device provided in this application;

[0021] Figure 4 This is a schematic diagram of the connecting parts in the electronic control device provided in this application;

[0022] Figure 5 A schematic diagram of the structure of the electronic control device provided in this application;

[0023] Figure 6 for Figure 5 Cross-sectional view along AA;

[0024] Figure 7 for Figure 6 Enlarged view of point B in the middle;

[0025] Figure 8 for Figure 5 A magnified view of point C in the middle.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1-Electrical control device;

[0028] 10-Heat dissipation device; 11-Heat dissipation body; 111-Mounting groove; 1111-Mounting position; 12-Insulating heat-conducting component; 121-Insulating heat-conducting surface; 13-Mounting hole; 14-First fixing hole;

[0029] 20 - Power device; 21 - Pin;

[0030] 30-Pressure block; 31-Connecting part; 311-Through hole; 3111-Limiting post; 3112-Limiting groove; 3113-Limiting protrusion; 32-Pressure part; 321-Clamping structure; 3211-Clamping arm; 3212-Pressure protrusion; 322-Supporting protrusion;

[0031] 40 - Connector; 41 - First segment; 42 - Second segment; 43 - Step surface; 44 - Connector head;

[0032] 50 - Circuit board; 51 - Connecting hole; 52 - Clearance hole; 521 - Limiting groove; 53 - Second fixing hole;

[0033] 60-Fasteners.

[0034] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0035] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0036] As the background section demonstrates, in existing electronic control devices, power devices are typically mounted directly on heat dissipation devices, with heat dissipated through the heat dissipation surface of the devices. However, in existing electronic control devices, the creepage distance and clearance between the power devices and the heat dissipation devices, as well as between the power devices and the fixed connectors, are limited, making them prone to electrical breakdown and affecting the safety of the electronic control device.

[0037] It's important to understand that creepage distance refers to the shortest distance between two conductive parts along an insulating surface, emphasizing the measurement along the surface of the insulating material. For example, on a circuit board, the shortest path length between two pins along the insulating material surface is the creepage distance. Clearance, on the other hand, refers to the shortest straight-line spatial distance between two conductive parts, measured in air without passing through any insulating material. For example, the air distance between the two prongs of a plug is the clearance.

[0038] In view of this, this application provides an electronic control device. By designing that the outer diameter of the first segment of the connector is smaller than that of the second segment, a stepped surface can be formed at the connection between the first and second segments. Furthermore, by recessing the stepped surface into the insulating and heat-conducting surface, the spatial distance between the connector and the power device perpendicular to the mounting hole axis can be increased, thereby increasing the electrical clearance. Moreover, the stepped surface and its recessed design into the insulating and heat-conducting surface increase the creepage path from the power device to the connector, effectively reducing the risk of electrical breakdown and thus improving the safety of the electronic control device.

[0039] The following is for reference. Figure 1 , Figure 6 , Figure 7 This application provides an electronic control device 1, including: a heat dissipation device 10, a power device 20, a pressure block 30, and a connector 40.

[0040] The power device 20 is the core component of the electronic control device 1, enabling functions such as power conversion and control. Its main function is to process and control electrical energy, such as performing voltage transformation and current regulation in the power supply circuit. For example, the power device 20 can be a MOSFET.

[0041] Since the power device 20 generates a lot of heat when it is working, it needs to be in contact with the insulating heat-conducting surface 121 of the heat dissipation device 10 to quickly conduct the heat generated by the power device 20 away, so as to ensure that the power device 20 works at a suitable temperature, avoid performance degradation or even damage due to excessive temperature, and thus extend the service life of the power device 20.

[0042] Specifically, the heat dissipation device 10 includes an insulating heat-conducting surface 121 and mounting holes 13. The mounting holes 13 are formed on one side of the insulating heat-conducting surface 121 and are used for mounting the power devices 20. Optionally, each mounting hole 13 may correspond one-to-one with a power device 20. Alternatively, multiple mounting holes 13 may correspond to multiple power devices 20.

[0043] The pressure block 30 includes a connecting portion 31 and a pressing portion 32. The pressing portion 32 can correspond to the position of the power device 20 and is connected to the connecting portion 31. Furthermore, the connecting portion 31 has a through hole 311. The through hole 311 can be arranged opposite to the mounting hole 13 to achieve the connection and fixation of one or more power devices 20. When the power device 20 is mounted on the insulating heat-conducting surface 121 of the heat dissipation device 10, the pressing portion 32 can press against the power device 20.

[0044] refer to Figure 4 The connector 40 includes a first segment 41 and a second segment 42. The connector 40 can pass through the through hole 311 and the mounting hole 13 to secure the power device 20. In this process, the first segment 41 of the connector 40 can be disposed in the through hole 311. The second segment 42 of the connector 40 can pass through the mounting hole 13. Furthermore, the outer diameter of the first segment 41 is smaller than the outer diameter of the second segment 42. Thus, a stepped surface 43 can be formed at the connection between the first segment 41 and the second segment 42. The stepped surface 43 can be perpendicular to the axial direction of the mounting hole 13. Further, along the axial direction of the mounting hole 13, the stepped surface 43 can be recessed into the insulating and heat-conducting surface 121. Optionally, the stepped surface 43 can be a plane. Alternatively, the stepped surface 43 can be a slope. Or, the stepped surface 43 can be a multi-stepped surface to further increase the creepage distance.

[0045] Understandably, by designing the outer diameter of the first segment 41 of the connector 40 to be smaller than the outer diameter of the second segment 42, a stepped surface 43 can be formed at the connection between the first segment 41 and the second segment 42. Furthermore, by recessing the stepped surface 43 into the insulating and heat-conducting surface 121, the spatial distance between the connector 40 and the power device 20 in the direction perpendicular to the mounting hole 13 can be increased, thereby increasing the electrical clearance. Moreover, the stepped surface 43 and its recessed design into the insulating and heat-conducting surface 121 increase the creepage path from the power device 20 to the connector 40, effectively reducing the risk of electrical breakdown and thus improving the safety of the electronic control device 1.

[0046] Specifically, refer to Figure 7In related technologies, the electrical clearance between the power device 20 and the connector 40 can be L2 (ignoring the distance from the heat sink of the power device 20 to the sidewall of the power device 20). In this embodiment, since the outer diameter of the first segment 41 of the connector 40 is smaller than the outer diameter of the second segment 42, a stepped surface 43 is formed at the connection between the two. When the connector 40 passes through the through hole 311 of the connecting portion 31 of the pressure block 30 and the mounting hole 13 on the insulating and heat-conducting surface 121 of the heat dissipation device 10 in sequence, the stepped surface 43 recessed in the insulating and heat-conducting surface 121 can increase the spatial distance between the connector 40 and the power device 20 in the axial direction perpendicular to the mounting hole 13. That is, the electrical clearance between the power device 20 and the connector 40 in this application can be L2+L3. From the perspective of the shortest electrical path from power device 20 to connector 40, the concave design of the stepped surface 43 increases the electrical clearance (from L2 to L2+L3), which may have been relatively short. The current needs to cross a greater distance of air from power device 20 to connector 40, thereby increasing the electrical clearance and reducing the risk of electrical breakdown.

[0047] Further reference Figure 7 In related technologies, the creepage distance between the power device 20 and the connector 40 can be L2. In this embodiment, since the stepped surface 43 is recessed into the insulating and heat-conducting surface 121, the path from the power device 20 to the connector 40 on the insulating medium surface 121 is changed due to the presence of the stepped surface 43. That is, the creepage distance between the power device 20 and the connector 40 in this application is L2+L1. Thus, the original creepage path (L2) is extended (from L2 to L2+L1) due to the presence of the stepped surface 43. In environments with dust, moisture, or other conditions that may reduce insulation performance, a longer creepage distance can effectively reduce the risk of leakage and avoid problems such as surface discharge and short circuits caused by insufficient creepage distance, thus ensuring the safe and stable operation of the electronic control device 1.

[0048] In one possible implementation, refer to Figure 1 , Figure 6 , Figure 7 The heat dissipation device 10 includes a heat dissipation body 11 and an insulating heat-conducting element 12. Optionally, the insulating heat-conducting element 12 can be a ceramic plate, a thermally conductive silicone plate, etc. A mounting groove 111 is formed on the surface of the heat dissipation body 11. The mounting groove 111 is used to mount the insulating heat-conducting element 12. The groove wall of the mounting groove 111 includes a bottom wall. A mounting hole 13 can be formed in the bottom wall. An insulating heat-conducting surface 121 is formed on the side of the insulating heat-conducting element 12 facing away from the heat dissipation body 11. The stepped surface 43 can be recessed into the bottom wall. Alternatively, the stepped surface 43 can be flush with the bottom wall.

[0049] Understandably, the insulating heat-conducting component 12 forms an insulating heat-conducting surface 121 on the side facing away from the heat dissipation body 11. This not only efficiently conducts the heat generated by the power device 20 to the heat dissipation body 11, achieving good heat dissipation, but also provides reliable electrical insulation, reducing safety hazards such as leakage. The stepped surface 43 can be recessed into or flush with the bottom wall of the mounting groove 111. This flexible arrangement allows for further optimization of the fit between the connector 40 and the mounting hole 13 according to different application scenarios and design requirements, effectively increasing creepage distance and clearance, and enhancing the electrical insulation performance of the electronic control device 1.

[0050] In one possible implementation, refer to Figure 1 , Figure 6 , Figure 7 The mounting groove 111 can be provided with two mounting positions 1111. The two mounting positions 1111 can be located on opposite sides of the mounting hole 13, in other words, the mounting hole 13 is located on the middle side of the two mounting positions 1111. The insulating heat-conducting element 12 can correspond one-to-one with the mounting position 1111, and the insulating heat-conducting element 12 is provided on the corresponding mounting position 1111. Furthermore, each insulating heat-conducting element 12 is provided with a power device 20. That is, in this embodiment, the mounting hole 13 can correspond to two power devices 20. The pressure block 30 can be connected to the two power devices 20 by the connector 40 passing through the mounting hole 13.

[0051] It is understandable that the two mounting positions 1111 are located on both sides of the mounting hole 13, and each of the two mounting positions 1111 carries an insulating heat-conducting component 12 and a corresponding power device 20, which can form a compact symmetrical structure and improve space utilization.

[0052] In one possible implementation, the inner wall of the mounting hole 13 is provided with internal threads. The outer wall of the second rod segment 42 is provided with external threads. In this way, the second rod segment 42 and the mounting hole 13 can form a threaded engagement through the internal and external threads.

[0053] In one possible implementation, refer to Figure 1 , Figure 3 , Figure 6 , Figure 7 The pressing portion 32 of the pressure block 30 may be provided with a clamping structure 321 for clamping the power device 20. Specifically, the clamping structure 321 may be provided on the side of the pressing portion 32 facing the heat dissipation device 10. Optionally, there may be two clamping structures 321. The two clamping structures 321 may be located on opposite sides of the power device 20, and thus may clamp and cooperate with the side wall of the power device 20. Optionally, the clamping structure 321 may be a flexible clamping arm structure, an adjustable clamping block structure, etc.

[0054] Understandably, the clamping structure 321 can effectively improve the stability of the power device 20 installation, prevent the power device 20 from being displaced or shaking due to vibration, impact or other factors during operation, ensure that the power device 20 and the heat dissipation device 10 always maintain good contact, thereby ensuring heat dissipation efficiency and extending the service life of the power device 20.

[0055] In one possible implementation, refer to Figure 3 , Figure 6 , Figure 7 The clamping structure 321 may include a clamping arm 3211 and a pressing protrusion 3212. The pressing protrusion 3212 may be located on the side of the clamping arm 3211 facing the power device 20. During installation, the clamping structure 321 can clamp the power device 20, keeping the power device 20 stable against the pressure block 30 for easy installation. During clamping, the pressing protrusion 3212 may abut against the side wall of the power device 20.

[0056] In one possible implementation, refer to Figure 2 , Figure 5 , Figure 8 The power device 20 has multiple pins 21. These pins 21 connect the internal circuitry of the power device 20 to the circuitry on the circuit board 50, enabling the transmission of electrical energy and signals. The electronic control device 1 also includes a circuit board 50. Specifically, the circuit board 50 can be located on one side of the pressure block 30, away from the heat sink 10. That is, the pressure block 30 is located between the circuit board 50 and the power device 20. The circuit board 50 has multiple connection holes 51 corresponding one-to-one with each pin 21. The pins 21 of the power device 20 pass through the corresponding connection holes 51 and are electrically connected to the circuit board 50 by soldering.

[0057] In one possible implementation, refer to Figure 1 , Figure 3 , Figure 6 , Figure 7 The pressing part 32 is further provided with a support protrusion 322. More specifically, the support protrusion 322 is located on the side of the pressing part 32 facing away from the heat dissipation device 10. The support protrusion 322 is used to support the circuit board 50. Optionally, the support protrusion 322 can be cylindrical, square-prism-shaped, frustum-cone-shaped, etc. Furthermore, the support protrusions 322 can be evenly distributed on the pressing part 32 to provide comprehensive and balanced support for the circuit board 50. Simultaneously, the distribution density can be adjusted according to actual needs. In edge areas or critical parts where the circuit board 50 is prone to deformation, the number of support protrusions 322 can be appropriately increased to improve the stability of the support; while in areas where the support requirements are not high, the distribution of support protrusions 322 can be reduced to lower costs.

[0058] Further, refer to Figure 1 The heat dissipation device 10 is also provided with a plurality of first fixing holes 14 distributed along its periphery. Correspondingly, the circuit board 50 is provided with a plurality of second fixing holes 53 corresponding one-to-one with the first fixing holes 14. Furthermore, the electronic control device 1 also includes fasteners 60. The heat dissipation device 10 and the circuit board 50 can be connected by the fasteners 60 passing through the first fixing holes 14 and the second fixing holes 53, that is, the power device 20, the pressure block 30 and the circuit board 50 can be stably connected by the fasteners 60 to ensure the structural stability between the heat dissipation device 10 and the circuit board 50.

[0059] In one possible implementation, refer to Figure 1 , Figure 3 , Figure 6 , Figure 7 A limiting post 3111 is also provided on the connecting part 31. The limiting post 3111 can be provided on the side of the connecting part 31 facing away from the heat dissipation device 10. The limiting post 3111 can limit the connection 40. Furthermore, a limiting groove 3112 is defined on the inner side of the limiting post 3111. The limiting groove 3112 can communicate with the through hole 311.

[0060] Further, refer to Figure 4 The connector 40 also includes a connector 44. The connector 44 can be connected to the end of the first segment 41 that is away from the second segment 42. During the installation of the power device 20, the connector 44 can be embedded in the limiting groove 3112.

[0061] In one possible implementation, refer to Figure 6 , Figure 7 The height of the limiting post 3111 should be higher than the height of the supporting protrusion 322. The circuit board 50 is provided with a clearance hole 52 for the limiting post 3111 to pass through.

[0062] Understandably, the higher limiting post 3111 can play a significant guiding role during installation. When the operator brings the circuit board 50 close to the pressure block 30, the limiting post 3111 can be inserted first into the clearance hole 52 on the circuit board 50, providing clear directional guidance for the installation of the circuit board 50. This allows the circuit board 50 to be accurately aligned with the support protrusion 322 and other installation positions, reducing deviations and adjustment time during installation and improving assembly efficiency.

[0063] Further, refer to Figure 3 , Figure 5 , Figure 6 , Figure 7 , Figure 8The limiting post 3111 is also provided with a limiting protrusion 3113 on its periphery. Correspondingly, the inner wall of the clearance hole 52 is provided with a limiting groove 521 that cooperates with the limiting protrusion 3113. The limiting protrusion 3113 can be locked in the limiting groove 521.

[0064] Understandably, the limiting post 3111, which is higher than the supporting protrusion 322, not only provides some support for the circuit board 50 in the vertical direction, but also restricts the movement of the circuit board 50 in the horizontal direction. The cooperation between the limiting protrusion 3113 and the limiting groove 521 further enhances this constraint effect, enabling the circuit board 50 to maintain a stable position when subjected to external forces such as vibration and impact, reducing the probability of component damage, loose solder joints, and other failures caused by the shaking of the circuit board 50.

[0065] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0066] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0067] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0068] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0069] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three cases: A exists alone, A and B exist simultaneously, and B exists alone.

[0070] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0071] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0072] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0073] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. An electrically controlled device (1), characterized in that, The application relates to a heat dissipation device (10) comprising an insulating and heat-conducting surface (121) and a mounting hole (13) located on one side of the insulating and heat-conducting surface (121); a power device (20) arranged on the insulating and heat-conducting surface (121); a pressing block (30) comprising a connecting part (31) with a through hole (311) opposite to the mounting hole (13) and a pressing part (32) in pressing cooperation with the power device (20); and a connecting piece (40) comprising a first rod segment (41) penetrating through the through hole (311) and a second rod segment (42) penetrating through the mounting hole (13), wherein the outer diameter of the first rod segment (41) is smaller than that of the second rod segment (42) so as to form a step surface (43) perpendicular to the axial direction of the mounting hole (13) at the connection between the first rod segment (41) and the second rod segment (42), and the step surface (43) is recessed in the insulating and heat-conducting surface (121) along the axial direction of the mounting hole (13). The heat dissipation device (10) comprises a heat dissipation main body (11) with a mounting groove (111) formed on the surface of the heat dissipation main body (11), a groove wall of the mounting groove (111) comprising a bottom wall, and the mounting hole (13) being formed in the bottom wall; and an insulating and heat-conducting part (12) fixedly arranged in the mounting groove (111), a side surface of the insulating and heat-conducting part (12) opposite to the heat dissipation main body (11) forming the insulating and heat-conducting surface (121). The step surface (43) is recessed in the bottom wall, or the step surface (43) is flush with the bottom wall. The mounting groove (111) is provided with two mounting positions (1111), and the two mounting positions (1111) are located on opposite sides of the mounting hole (13). The insulating and heat-conducting part (12) corresponds to the mounting position (1111) one by one, the insulating and heat-conducting part (12) is arranged in the corresponding mounting position (1111), and the mounting hole (13) is located on the middle side of the two mounting positions (1111).

2. The electric control device (1) according to claim 1, characterized in that The power device (20) is arranged on each insulating and heat-conducting part (12). The inner wall of the mounting hole (13) is provided with an internal thread, the outer wall of the second rod segment (42) is provided with an external thread, and the second rod segment (42) is in screw thread cooperation with the mounting hole (13) through the internal thread and the external thread. The side of the pressing part (32) facing the heat dissipation device (10) is provided with a clamping structure (321), the clamping structure (321) is located on opposite sides of the power device (20), and the clamping structure (321) is in clamping cooperation with the side wall of the power device (20). The clamping structure (321) comprises a clamping arm (3211) and a pressing convex part (3212) located on the side of the clamping arm (3211) facing the power device (20), and the pressing convex part (3212) is in abutment with the side wall of the power device (20).

3. An electric control device (1) according to claim 2, characterized in that The power device (20) comprises a plurality of pins (21), ​ ​ 4. The electric control device (1) according to claim 1, characterized in that ​ 5. The electric control device (1) according to any one of claims 1-4, characterized in that, ​ 6. An electric control device (1) according to claim 5, characterized in that ​ 7. An electric control device (1) according to any one of claims 1-4, characterized in that ​ The electric control device (1) further comprises a circuit board (50) arranged on the side of the pressing block (30) away from the heat dissipation device (10), and a plurality of connecting holes (51) corresponding to the pins (21) are arranged on the circuit board (50), the pins (21) are arranged in the corresponding connecting holes (51) and are electrically connected with the circuit board (50).

8. An electric control device (1) according to claim 7, characterized in that The side of the pressing part (32) away from the heat dissipation device (10) is provided with a supporting convex part (322), and the circuit board (50) is supported on the supporting convex part (322). A plurality of first fixing holes (14) are arranged on the heat dissipation device (10) along the circumference, A plurality of second fixing holes (53) corresponding to the first fixing holes (14) are arranged on the circuit board (50). The electric control device (1) further comprises a fastener (60), and the heat dissipation device (10) and the circuit board (50) are connected by the fastener (60) penetrating through the first fixing holes (14) and the second fixing holes (53).

9. An electric control device (1) according to claim 8, characterized in that The side of the connecting part (31) away from the heat dissipation device (10) is further provided with a limiting column (3111), the inner side of the limiting column (3111) defines a limiting groove (3112), and the limiting groove (3112) is in communication with the through hole (311), The connecting piece (40) further comprises a connecting head (44), the connecting head (44) is connected with the end of the first rod segment (41) away from the second rod segment (42), and the connecting head (44) is embedded in the limiting groove (3112).

10. An electric control device (1) according to claim 9, characterized in that The height of the limiting column (3111) is higher than the height of the supporting convex part (322), and the circuit board (50) is provided with an avoiding hole (52) through which the limiting column (3111) passes; Furthermore, the circumferential side of the limiting column (3111) is provided with a limiting protrusion (3113), the inner wall of the avoiding hole (52) is provided with a limiting groove (521) limiting matched with the limiting protrusion (3113), and the limiting protrusion (3113) is clamped in the limiting groove (521).

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