Zero blue LED lamp bead module device
By combining blue-cyan LED chips with green-red phosphors to create a zero-blue-light LED module, the problem of blue light damage to the eyes is solved, achieving efficient white light display and myopia prevention.
Patent Information
- Application Number
- CN202423000947.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-05
AI Technical Summary
Long-term use of existing MINI LED module backlights can lead to myopia, mainly due to the damage of blue light to the eyes.
A zero-blue LED module device is formed by using a combination of blue-green LED chips and green and red phosphors in a fluorescent adhesive, and then fabricating an inverted pyramid structure on the surface of the fluorescent adhesive using wet etching or nanoimprinting.
It effectively avoids the harmful effects of blue light on the eyes, improves display quality and white light emission, and prevents myopia.
Smart Images
Figure CN223798608U_ABST
Abstract
Description
[Technical Field]
[0001] This utility model application relates to the field of LED lamp bead technology, and more particularly to a zero-blue LED lamp bead module device for backlit LED displays. [Background Technology]
[0002] LED, or Light Emitting Diode, is a solid-state semiconductor device that directly converts electrical energy into light energy. Because LED chips are energy-saving, environmentally friendly, and safe, they are widely used in the lighting industry. Most current mini LED module backlights use blue LED chips to emit blue light, which then excites yellow phosphors to emit white light. While this method of emitting white light satisfies the purpose of current LED lights, prolonged use of such LED lights can easily cause some of the blue light emitted to damage the user's eyes, potentially leading to nearsightedness. [Utility Model Content]
[0003] In view of this, the technical problem to be solved by this utility model is to provide a zero-blue LED lamp bead module device that can prevent the occurrence of myopia in users' eyes.
[0004] To address the aforementioned technical problems, the present invention provides a zero-blue LED bead module device, comprising an LED metal bracket, an LED plastic bracket, and a receiving space formed between the upper surface of the LED metal bracket and the inner surface of the LED plastic bracket. A chip for soldering to the inner surface of the LED metal bracket is disposed within this receiving space. Gold wires are soldered between the surface of the LED metal bracket and the chip. A fluorescent adhesive is laid on the upper surface of the chip, and a light-transmitting sheet is disposed on the upper surface of the fluorescent adhesive. The lower surface of the light-transmitting sheet, the inner surface of the LED bracket, and the upper surface of the LED metal bracket form a closed receiving space. The chip, fluorescent adhesive, and gold wires are respectively disposed within this closed receiving space. Inside the closed receiving space, an inverted pyramid structure is fabricated on the surface of the fluorescent adhesive using wet etching or nanoimprinting, thereby constituting the LED bead module device.
[0005] Further specifying, the chip is composed of a blue-green LED chip, and the blue-green LED chip has a wavelength of 470nm or higher.
[0006] Further specified, the fluorescent adhesive contains a combination of green phosphor and red phosphor, with the green phosphor having an emission wavelength less than 545nm and the red phosphor having an emission wavelength greater than 620nm; the amount of green phosphor used is greater than the amount of red phosphor used.
[0007] Further defined, the gold wire includes a first gold wire and a second gold wire; one end of the first gold wire is welded to one side of the inside of the LED metal bracket, and the other end of the first gold wire is welded to one side of the chip; one end of the second gold wire is welded to the other side of the inside of the LED metal bracket, and the other end of the second gold wire is welded to the other side of the chip.
[0008] Furthermore, the LED metal bracket has an inverted T-shaped receiving groove on one side of its interior.
[0009] The beneficial technical effects of this invention are as follows: The LED lamp bead module uses blue-green LED chips combined with a phosphor composed of green and red phosphors to improve the display effect of zero-blue-light LEDs. Simultaneously, by using a phosphor in greater quantities than red phosphors to form a fluorescent adhesive, the white light emission effect of the zero-blue-light LED beads is enhanced, achieving the goal of emitting white light. This avoids the harmful blue light hazard to consumers' eyes, thereby preventing myopia in users.
[0010] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. [Attached Image Description]
[0011] Figure 1 This is a schematic diagram of a zero-blue MINI LED module device according to the present invention;
[0012] Figure 2 This is a cross-sectional schematic diagram of a zero-blue MINI LED module device according to the present invention.
Detailed Implementation Methods
[0013] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.
[0014] Please refer to Figure 1 and Figure 2 As shown in the figure, the following describes a zero-blue LED lamp bead module device with reference to the embodiment, which includes an LED metal bracket 1, an LED plastic bracket 2, a chip 3, a gold wire, a fluorescent adhesive 5, and a light-transmitting sheet 6.
[0015] The chip 3 is composed of a blue-cyan LED chip with a wavelength above 470nm. The phosphor 5 contains a combination of green and red phosphors, with the green phosphor emitting a wavelength less than 545nm and the red phosphor emitting a wavelength greater than 620nm; the amount of green phosphor used is greater than the amount of red phosphor. The gold wires include a first gold wire 4 and a second gold wire 7; one end of the first gold wire 4 is welded to one side of the inside of the LED metal bracket 1, and the other end of the first gold wire 4 is welded to one side of the chip 3; one end of the second gold wire 7 is welded to the other side of the inside of the LED metal bracket 1, and the other end of the second gold wire 7 is welded to the other side of the chip 3. An inverted T-shaped receiving groove is formed on one side of the inside of the LED metal bracket 1.
[0016] A receiving space is formed between the upper surface of the LED metal bracket 1 and the inner surface of the LED plastic bracket 2. The chip 3 is soldered to the inner surface of the LED metal bracket 1. The first gold wire 4 and the second gold wire 7 are respectively soldered to both sides of the chip 3. The corresponding phosphor adhesive 5 is placed on the upper outer periphery of the chip 3, the first gold wire 4, and the second gold wire 7. The light-transmitting sheet 6 is installed on the upper end face of the LED plastic bracket 2. The lower surface of the light-transmitting sheet 6, the inner surface of the LED plastic bracket 2, and the upper surface of the LED metal bracket 1 form a closed receiving space. The chip 3, the phosphor adhesive 5, and the gold wires are respectively disposed inside the closed receiving space. Inside the closed receiving space, an inverted pyramid structure is prepared on the surface of the phosphor adhesive by wet etching or nanoimprinting, thereby constituting the LED lamp bead module device.
[0017] The LED module uses blue-green LED chips combined with a phosphor composed of green and red phosphors to improve the display effect of zero-blue-light LEDs. Simultaneously, by using a higher proportion of green phosphor than red phosphor to form a fluorescent adhesive, the white light emitted by the zero-blue-light LED is enhanced, achieving the goal of displaying a white image. This avoids the harmful blue light that could damage consumers' eyes, thus preventing nearsightedness.
[0018] The chip 3 described in this case is composed of blue-cyan LED chips. White light emitters use blue-cyan LED chips with wavelengths above 470nm to avoid the harmful blue light band. The display effect of 470nm blue light combined with yellow phosphor is poor. Therefore, the LED chip module device described in this case uses a combination of green and red phosphors to improve the display effect of zero-blue LED chips. The emission wavelength of the green phosphor is less than 545nm, and the emission wavelength of the red phosphor is greater than 620nm. To achieve a white image, the amount of green phosphor used is greater than that of red phosphor. The cyan-cyan chip has slightly lower luminous efficacy than the blue chip. To improve the luminous efficacy of zero-blue LED chips, a layer of inverted pyramid structure is prepared on the surface of the phosphor using wet etching or nanoimprinting, which can improve the luminous efficacy by about 10%.
[0019] The preferred embodiments of this utility model have been described above with reference to the accompanying drawings, but this does not limit the scope of the utility model. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and essence of this utility model should be within the scope of the utility model.
Claims
1. A zero-blue LED bead module device, comprising an LED metal bracket and an LED plastic bracket, characterized in that: A receiving space is formed between the upper surface of the LED metal bracket and the inner surface of the LED plastic bracket. A chip for soldering to the inner surface of the LED metal bracket is disposed inside the receiving space. Gold wires are soldered between the surface of the LED metal bracket and the chip. A fluorescent adhesive is laid on the upper surface of the chip. A light-transmitting sheet is disposed on the upper surface of the fluorescent adhesive. The lower surface of the light-transmitting sheet, the inner surface of the LED bracket, and the upper surface of the LED metal bracket form a closed receiving space. The chip, fluorescent adhesive, and gold wires are disposed inside the closed receiving space. Inside the enclosed containment space, an inverted pyramid structure is prepared on the surface of the fluorescent adhesive using wet etching or nanoimprinting, thereby forming the LED lamp bead module device.
2. The zero-blue LED lamp bead module device according to claim 1, characterized in that: The chip is composed of blue-green LED chips with a wavelength of 470nm or higher.
3. The zero-blue LED lamp bead module device according to claim 1, characterized in that: The fluorescent adhesive contains a combination of green and red phosphors. The emission wavelength of the green phosphor is less than 545 nm, while the emission wavelength of the red phosphor is greater than 620 nm. The amount of green phosphor used is greater than that of red phosphor.
4. The zero-blue LED lamp bead module device according to claim 1, characterized in that: The gold wire includes a first gold wire and a second gold wire; one end of the first gold wire is welded to one side of the inside of the LED metal bracket, and the other end of the first gold wire is welded to one side of the chip; one end of the second gold wire is welded to the other side of the inside of the LED metal bracket, and the other end of the second gold wire is welded to the other side of the chip.
5. The zero-blue LED lamp bead module device according to claim 1, characterized in that: The LED metal bracket has an inverted T-shaped receiving groove on one side of its interior.