Vacuum equipment and conveying device

Abstract

The utility model provides a vacuum device and a conveyer, the vacuum device is connected with an adsorption assembly, the vacuum device comprises a first pipeline providing a first transmission path, the first pipeline is provided with a first end and a second end, and the first end of the first pipeline is connected with the adsorption assembly; the second pipeline provides a second transmission path, the second pipeline is provided with a first end and a second end, and the first transmission path is communicated with the second transmission path; the separation assembly is respectively communicated with the second end of the first pipeline and the first end of the second pipeline, provides a chamber with a closed environment, and separates and accommodates a specific medium in gas; and the vacuum generator is communicated with the second end of the second pipeline and is used for sucking the gas along the first transmission path and the second transmission path. According to the technical scheme, the stability of the wafer conveying process can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a vacuum device and a conveying apparatus. Background Technology

[0002] In the semiconductor manufacturing process, a transfer device is required to transfer wafers between different process equipment.

[0003] In some transport scenarios, wafers need to be flipped or lifted. To improve the stability of the wafers during transport, a vacuum environment needs to be provided at the contact point between the wafer and the transport device.

[0004] However, in some manufacturing processes, residual solutions remain on the wafer surface. The presence of these solutions reduces adhesion and poses a risk of wafer detachment. Against this backdrop, providing technical solutions to improve the stability of the wafer transport process has become a pressing technical problem for those skilled in the art. Utility Model Content

[0005] In view of this, the present invention provides a vacuum device and a conveying apparatus that can improve the stability of the wafer conveying process.

[0006] This utility model provides a vacuum device connected to an adsorption assembly, the vacuum device comprising:

[0007] A first conduit providing a first transmission path, the first conduit having a first end and a second end, the first end of the first conduit being connected to the adsorption component;

[0008] A second pipe provides a second transmission path, the second pipe having a first end and a second end, and the first transmission path and the second transmission path are connected;

[0009] The separation component is connected to the second end of the first pipe and the first end of the second pipe respectively, providing a chamber with a sealed environment, and separating and containing a specific medium in the gas.

[0010] A vacuum generator that connects to the second end of the second pipe and draws the gas along the first and second transmission paths.

[0011] Optionally, the separation component includes:

[0012] A container having the chamber and communicating with the first pipe and the second pipe respectively;

[0013] A cooling pipe is wound around the outer wall of the container to allow the flow of a cooling medium. The cooling pipe has a cooling medium inlet and a cooling medium outlet, and the coolant is used to separate the liquid in the gas.

[0014] Optionally, along the winding direction of the cooling pipe, the cooling medium outlet is located above the cooling medium inlet.

[0015] Optionally, the vacuum device satisfies one or more of the following:

[0016] The first pipe is equipped with a first switch for selecting the first transmission path;

[0017] The second pipe is equipped with a second switch for selecting the second transmission path;

[0018] The first pipe is provided with a first switch for selecting the first transmission path, and the second pipe is provided with a second switch for selecting the second transmission path;

[0019] The first switch and the second switch are in the same switching state.

[0020] Optionally, the container is provided with a drain outlet at the bottom;

[0021] The vacuum device also includes:

[0022] A third pipe is connected to the drain outlet to provide a third transmission path, and a third switch for selecting the third transmission path is provided on the third pipe;

[0023] The switching state of the third switch is different from that of the first switch or the second switch.

[0024] Optionally, the vacuum device further includes a first processor that is electrically connected to the first switch, the second switch, and the third switch respectively, and switches the switching states of the first switch, the second switch, and the third switch.

[0025] Optionally, the vacuum device satisfies one or more of the following:

[0026] The container is transparent, and the vacuum device further includes a detection component, which is used to output a first detection signal, the first detection signal being used to characterize the liquid level height in the container;

[0027] The vacuum device further includes: a liquid level sensor disposed on the inner wall of the container, the liquid level sensor being disposed at a preset position, the liquid level sensor being used to output a second detection signal, the second detection signal being used to characterize that the liquid level in the container is at the preset position;

[0028] The vacuum device further includes a second processor that is electrically connected to the detection component or the liquid level sensor, and electrically connected to the first switch, the second switch and the third switch, and switches the switching states of the first switch, the second switch and the third switch according to the first detection signal or the second detection signal.

[0029] Optionally, the vacuum device satisfies one or more of the following:

[0030] The first switch includes one or more of a solenoid valve and a pneumatic valve;

[0031] The second switch includes one or more of a solenoid valve and a pneumatic valve;

[0032] The third switch includes one or more of a solenoid valve and a pneumatic valve.

[0033] Optionally, the separation component has a first interface and a second interface, the first interface being used to communicate with a second end of a first pipe, and the second interface being used to communicate with a first end of a second pipe;

[0034] Wherein, the first interface is not higher than the second interface.

[0035] In contrast, this utility model also provides a conveying device, comprising:

[0036] Transport components for wafers;

[0037] An adsorption component is disposed at the contact point between the conveying component and the wafer, and the adsorption component adsorbs the wafer during the movement of the conveying component;

[0038] The vacuum device described in any of the foregoing embodiments is connected to the adsorption component and is used to draw gas between the wafer and the adsorption component.

[0039] In the vacuum device provided by this utility model, a separation component is provided between the first pipe and the second pipe. Since the first transmission path of the first pipe and the second transmission path of the second pipe are connected, and the first pipe and the separation component are in a connected state, as are the second pipe and the separation component, the vacuum generator can draw gas along the first transmission path, the separation component, and the second transmission path. When the gas passes through the separation component, the separation component can separate and contain a specific medium within the gas, ensuring that most of what enters the vacuum generator is gas, thereby generating a large adsorption force at the adsorption component. Thus, when the vacuum device is applied to the wafer transport process, the wafer can be firmly adsorbed onto the transport device, thereby improving the stability of the wafer transport process. Attached Figure Description

[0040] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 A schematic diagram of a wafer transport scenario is shown;

[0042] Figure 2 A schematic diagram of the structure of a vacuum device according to the first embodiment of the present invention is shown;

[0043] Figure 3 A schematic diagram of a vacuum device according to the second embodiment of the present invention is shown. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] As described in the background section, in some manufacturing processes, solutions remain on the wafer surface. The presence of these solutions reduces the adhesion and poses a risk of wafer detachment.

[0046] See Figure 1 The diagram shows a wafer transport scenario. In an electroplating scenario, the wafer ( Figure 1 (Not shown) Before and after electroplating, the wafer is transferred by a robotic arm 10. During the transfer process, the wafer needs to be rotated 180 degrees.

[0047] To prevent the wafer from falling during the flipping process, a suction cup 20 and a suction pipe 30 connected to the suction cup 20 are provided at the contact point between the wafer and the robotic arm 10. A vacuum pump (not shown) is connected to the suction pipe 30 to draw in gas, which can then be directed to the appropriate position. Figure 1 Move in the direction indicated by the middle arrow.

[0048] Because electroplating equipment contains electroplating solution, after the wafer is electroplated, the surface of the wafer will have electroplating liquid on it, causing some of the liquid to be drawn into the vacuum pump. Over time, the vacuum pump will accumulate a large amount of liquid, which reduces the suction force provided by the vacuum pump and poses a risk of the wafer falling off.

[0049] To address the aforementioned problems, this invention provides a vacuum device that can separate specific media (such as liquids) from gases, reducing the probability of these media entering the vacuum generator and thus generating greater adsorption force.

[0050] In some embodiments, the present invention provides a vacuum device, wherein a separation component is provided between a first pipe and a second pipe. Since the first transmission path of the first pipe and the second transmission path of the second pipe are connected, and the first pipe and the separation component are in a connected state, and the second pipe and the separation component are also in a connected state, the vacuum generator can draw gas along the first transmission path, the separation component, and the second transmission path. When the gas passes through the separation component, the separation component can separate and contain a specific medium within the gas, so that most of what enters the vacuum generator is gas, thereby generating a large adsorption force at the adsorption component. Thus, when the vacuum device is applied to the wafer transport process, the wafer can be firmly adsorbed onto the transport device, thereby improving the stability of the wafer transport process.

[0051] In addition, the vacuum equipment provided by the utility model has a simple structure, is easy to implement, and can be easily adjusted according to actual application scenarios, making it highly versatile.

[0052] To enable those skilled in the art to more clearly understand and implement the concepts, implementation schemes, and advantages of this specification, the following description, with reference to the accompanying drawings, provides examples of the above content.

[0053] See Figure 2 The diagram shown is a structural schematic of a vacuum device according to the first embodiment of this utility model. Figure 2 As shown, the vacuum device can be connected to the adsorption component S.

[0054] like Figure 2 As shown, the vacuum equipment may include:

[0055] A first conduit P1 provides a first transmission path, the first conduit P1 having a first end and a second end, the first end of the first conduit P1 being connected to the adsorption component S.

[0056] In some embodiments, during the provision of a vacuum environment, the first pipe P1 can draw gas near the adsorption component S through its first end connected to the adsorption component S. The drawn gas can flow through the first transmission path provided by the first pipe P1, thereby reaching the vacuum generator ( Figure 2 (Not shown).

[0057] A second pipe P2 provides a second transmission path, the second pipe P2 having a first end and a second end, and the first transmission path and the second transmission path are connected.

[0058] In some embodiments, the first transmission path and the second transmission path are connected, so the gas flowing through the first pipe P1 can be drawn into the second pipe P2 and further reach the vacuum generator.

[0059] In some embodiments, both the first pipe P1 and the second pipe P2 can be made of polyethylene (PE) material. In the presence of liquid, polyethylene has strong corrosion resistance, and the first pipe P1 and the second pipe P2 have a longer service life.

[0060] It is understood that the materials of the first and second pipes in the above example are only for illustrative purposes. This utility model does not impose any restrictions on the materials of the first and second pipes, as long as they can be adapted to the application scenario.

[0061] It is connected to the second end of the first pipe P1 and the first end of the second pipe P2 respectively, providing a chamber with a sealed environment. Figure 2 (Not shown), and a separation component that separates and contains a specific medium within the gas ( Figure 2 (Not shown).

[0062] In some embodiments, the first pipe P1 and the second pipe P2 are closed environments, and the chamber is a closed environment, so that gas will not escape during the process of providing a vacuum environment, thereby improving the stability of the adsorption force.

[0063] In some embodiments, the first pipe P1 and the separation component are in communication, and the second pipe P2 and the separation component are in communication, so that the drawn-out gas can flow through the chamber. Within this chamber, the gas and other media accompanying the gas can be processed, allowing specific media in the gas to be separated from the gas, thereby improving the cleanliness of the gas.

[0064] A vacuum generator that connects to the second end of the second pipe P2 and draws the gas along the first transmission path and the second transmission path.

[0065] In some embodiments, by setting a separation component in the gas transport path, the cleanliness of the gas is improved, thus greatly reducing the amount of non-gaseous media entering the vacuum generator. The vacuum generator can continuously and stably pump gas, thereby providing a stable and large adsorption force, reducing the risk of wafer detachment, and making the wafer transport process more stable.

[0066] In some embodiments, the vacuum generator may be a vacuum pump.

[0067] In some embodiments, the separation assembly may include: a container D having the chamber and communicating with the first pipe P1 and the second pipe P2 respectively; a cooling pipe P3 wound around the outer wall of the container D for the flow of a cooling medium, the cooling pipe P3 having a cooling medium inlet IN1 and a cooling medium outlet OT1, and the cooling liquid being used to separate the liquid in the gas.

[0068] In some embodiments, container D provides a cavity for gas flow and for containing the solution, and the cavity has a large space. When the gas enters the cavity, the liquid in the gas can drip off automatically under the action of the cooling medium and gravity, thereby achieving separation between the gas and the liquid.

[0069] In some implementations, the cooling pipe P3 is wound around the outer wall of the container D. The cooling medium can enter from the cooling medium inlet IN1 and exit from the cooling medium outlet OT1, so that the formed cooling medium loop has a larger contact area with the outer wall of the container D.

[0070] It should be noted that when the cooling pipe P3 is wound around the outer wall of container D, the distribution of the cooling pipe P3 should avoid the connection between the first pipe P1 and container D, as well as the connection between the second pipe P2 and container D, so that the supply process of the cooling medium and the process of gas extraction are independent of each other and do not interfere with each other.

[0071] In some embodiments, when the temperature of the cooling medium is lower than the temperature of the wafer fabrication process, the gas can be cooled so that some non-gaseous media (e.g., liquids) in the gas condense into liquid, achieving gas-liquid separation. Then, the other gases enter the vacuum generator through the second pipe P2, establishing a vacuum environment.

[0072] Furthermore, the reduced amount of liquid entering the vacuum generator also extends the service life of the vacuum generator.

[0073] It should be noted that, in this invention, the temperature of the cooling medium should satisfy the following condition: when the liquid in the gas condenses into droplets, the gas will not solidify.

[0074] For example, in electroplating applications, the process temperature is generally 20 degrees Celsius. By reducing the temperature of the cooling medium to 10 degrees Celsius, the electroplating solution in the gas can be precipitated out.

[0075] In some embodiments, along the winding direction of the cooling pipe P3, the cooling medium outlet OT1 may be located above the cooling medium inlet IN1.

[0076] In other words, the circulation path of the cooling medium is from bottom to top, which prolongs the action time of the cooling medium, improves the exchange efficiency and heat transfer efficiency, and allows the liquid in the gas to condense into liquid agglomerates.

[0077] In some other embodiments, along the winding direction of the cooling pipe P3, the cooling medium inlet IN1 may be located above the cooling medium outlet OT1.

[0078] In some embodiments, see Figure 2 The cooling medium inlet IN1 and the cooling medium outlet OT1 are located on the same side of the container D. In some other embodiments, the cooling medium inlet IN1 and the cooling medium outlet OT1 can be located on opposite sides of the container D, which increases the distance the cooling medium flows, allowing the cooling medium to fully contact the outer surface of the container D and fully exchange heat.

[0079] In some embodiments, in addition to increasing the distance the cooling medium flows, as in the examples above, the cooling effect can also be improved by increasing the gas flow time. For example, the width of container D is greater along the gas flow direction.

[0080] In some embodiments, the cooling medium can be provided using various methods. For example, the cooling medium can be provided to the cooling medium inlet via a main pipeline of a cooling system located at the machine end (e.g., the electroplating equipment end). Another example is providing the cooling medium to the cooling medium inlet via a water pipe.

[0081] In some embodiments, the cooling medium may include at least one of cooling water and coolant.

[0082] In some embodiments, see next. Figure 2 A first switch K1 for selecting the first transmission path is provided on the first pipe P1.

[0083] In other words, when a vacuum environment needs to be established, by turning on the first switch K1, the gas near the adsorption component S can be drawn into the vacuum generator through the first pipe P1.

[0084] When there is no need to establish a vacuum environment, or when it is necessary to cut off the vacuum environment in the first pipe P1, the transmission path between the gas and the vacuum generator is disconnected by putting the first switch K1 in the open state.

[0085] In some embodiments, the second pipe P2 is provided with a second switch K2 for selecting the second transmission path.

[0086] In other words, when a vacuum environment needs to be established, by turning on the second switch K2, the gas transmitted to the container D through the first pipe P1 can be drawn into the vacuum generator through the second pipe P1.

[0087] When there is no need to establish a vacuum environment, or when it is necessary to cut off the vacuum environment in the second pipe P2, the transmission path between the gas and the vacuum generator is disconnected by setting the second switch K2 to the open state.

[0088] In some embodiments, a first switch K1 for selecting the first transmission path is provided on the first pipe P1, and a second switch K2 for selecting the second transmission path is provided on the second pipe P2.

[0089] In other words, by changing the switching states of the first switch K1 and the second switch K2, the transmission path between the gas and the vacuum generator can be selected or disconnected.

[0090] In some embodiments, such as Figure 2 As shown, when both the first switch K1 and the second switch K2 are present, the switching states of the first switch K1 and the second switch K2 are the same.

[0091] That is, the first switch K1 and the second switch K2 are both in the on state, or the first switch K1 and the second switch K2 are both in the off state.

[0092] It should be noted that, firstly, Figure 2 The position of the first switch K1 shown in the diagram on the first pipe P1 is for illustrative purposes only. The position of the first switch K1 only needs to be sufficient to control the on / off state of the first transmission path. Second, Figure 2 The position of the second switch K2 shown in the diagram on the second pipe P2 is for illustrative purposes only. The position of the second switch K2 should be sufficient to control the on / off state of the second transmission path.

[0093] In some embodiments, the first switch K1 and the second switch K2 are of the same type.

[0094] For example, the first switch K1 includes one or more of a solenoid valve and a pneumatic valve, and the second switch K2 includes one or more of a solenoid valve and a pneumatic valve.

[0095] In one specific embodiment, both the first switch K1 and the second switch K2 are solenoid valves.

[0096] It should be noted that the types of switches listed in the above schemes are for illustrative purposes only, and are used to represent components with on and off functions. In some other embodiments, other circuits or arrangements with switching capabilities may also be used as the first switch and / or the second switch.

[0097] In some embodiments, the separation component has a first interface (not shown) and a second interface (not shown), the first interface being used to communicate with a second end of a first pipe P1, and the second interface being used to communicate with a first end of a second pipe P2; wherein the first interface is not higher than the second interface.

[0098] In other words, the position where the second end of the first pipe P1 connects with the separation component (e.g., container D) is not higher than the position where the first end of the second pipe P2 connects with the separation component (e.g., container D).

[0099] In this design, the position where the second end of the first pipe P1 connects to the separation component is lower than the position where the second end of the second pipe P2 connects to the separation component, creating a height difference between these two connection points. Under the influence of this height difference and suction force, gas flows from the second end of the first pipe P1 to the first end of the second pipe P2, while other media drip from the second end of the first pipe P1 to the bottom of container D, thus achieving better gas-liquid separation.

[0100] In some embodiments, as the process is carried out over a long period or multiple times, the liquid volume in container D gradually increases, occupying a larger space and leaving less space for gas, thus increasing the difficulty of establishing a vacuum environment. When the liquid level is too high, there is a possibility that the stored liquid may be drawn into the vacuum generator.

[0101] Based on this, see Figure 3 The diagram shown is a structural schematic of a vacuum device according to the second embodiment of this utility model. The similarities between this embodiment and the previous embodiments will not be described again; the differences are as follows:

[0102] See Figure 3 The bottom of container D is provided with a drain port (not shown in the figure).

[0103] Accordingly, the vacuum equipment includes: a third pipe P4 connected to the drain port, providing a third transmission path, and a third switch K3 for selecting the third transmission path is provided on the third pipe P4.

[0104] In some embodiments, by controlling the on / off state of the third switch K3, the liquid flow path can be opened or closed, thereby releasing the liquid stored in container D when the flow path is selected.

[0105] In some embodiments, the third switch K3 may include one or more of a solenoid valve and a pneumatic valve.

[0106] In some embodiments, when the third switch K3 is activated, it indicates that there is a large amount of liquid in container D, making it difficult to establish a vacuum environment, and therefore the gas pumping can be stopped.

[0107] In other words, the switching state of the third switch K3 is different from the switching state of the first switch K1 or the second switch K2, so as to execute the vacuum environment establishment process and the liquid drainage process in a time-sharing manner.

[0108] For example, the third switch K3 is in the ON state, and the first switch K1 or the second switch K2 is in the OFF state; or, for another example, the third switch K3 is in the OFF state, and the first switch K1 or the second switch K2 is in the ON state.

[0109] In some embodiments, the vacuum device may further include a first processor (not shown), which is electrically connected to the first switch, the second switch, and the third switch, respectively. Through the coordinated processing of the first processor, the switching states of the first switch K1, the second switch K2, and the third switch K3 can be switched, achieving orderly switching between different processes during transmission.

[0110] In some embodiments, the first processor may include, but is not limited to:

[0111] Hardware circuits implemented using application-specific integrated circuits (ASICs), programmable logic devices (PLDs), microcontroller units (MCUs), microprocessor units (MPUs), digital signal processors (DSPs), or central processing units (CPUs), etc. For example, hardware circuits implemented using PLDs may include field-programmable gate arrays (FPGAs).

[0112] When multiple processors are included, the types of processors can be the same or different. For example, processors can include MCUs and FPGAs. Processors can include MCUs, FPGAs, and CPUs. Processors can include MCUs, DSPs, and FPGAs. Or, processors can include CPUs and FPGAs, and so on. When a processor includes multiple processors, these processors can be configured separately, partially integrated, or fully integrated. For example, processors can be implemented as a system-on-chip (SOC) or an ASIC.

[0113] It should be noted that the first processor can use general-purpose computer equipment to communicate and perform data operations with the first, second, and third switches. This embodiment of the invention does not involve any improvement to the specific operating method of the computing device. The process of acquiring and comparing data using the computing device can be implemented using existing or conventional techniques in the field.

[0114] In short, the stability of the wafer transfer process can be further improved by using the first processor, the first switch, the second switch, and the third switch.

[0115] In some embodiments, the control mechanism used to determine the switching state of the third switch varies depending on the application scenario.

[0116] Example 1: The container is transparent.

[0117] In other words, the liquid level in the container can be acquired in real time. In this case, the vacuum device further includes a detection component, which is used to output a first detection signal, which is used to characterize the liquid level in the container.

[0118] In some embodiments, the detection component can output a detection beam to the outer wall of the container. After reflection or transmission, the echo beam can be received by the detection component, thereby determining a first detection signal corresponding to an incident position.

[0119] By changing the position of the probe beam incident on the outer wall of the container, the first detection signal at different incident positions can be obtained, and the liquid level in the container can be determined by the first detection signal at different incident positions.

[0120] In some embodiments, the penetrating power of the probe beam differs between the container and the solution, resulting in variations in the parameters of the acquired first detection signal at different locations. These variations could include the time interval at which the first detection signal is detected, the intensity of the first detection signal, or the waveform of the first detection signal. This allows for the determination of a target incident position that corresponds to the liquid level among multiple incident positions based on the differences in at least one of these parameters.

[0121] In some embodiments, the detection component may include a laser and a detector, wherein a detection beam emitted by the laser can illuminate any point on the outer surface of the container. After reflection or transmission, an echo beam corresponding to the detection beam can be formed. When the detector receives the echo beam, it can generate a detection signal.

[0122] In some embodiments, the laser may include one or more types of lasers. For example, the laser may include a semiconductor laser, a fiber laser, or other types of lasers. For example, a semiconductor laser may include a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), a distributed feedback laser (DFB), or similar devices. The above are merely examples, and the present invention does not limit the type of laser.

[0123] In some embodiments, the detector may include one or more detectors. For example, the detector may include: a photodetector circuit, a PIN photodiode (PINPD), an avalanche photodiode (APD), a single photon avalanche diode (SPAD), a silicon photomultiplier (SiPM), or similar devices. The above are merely examples, and the present invention does not limit the type of detector.

[0124] Thus, when the vacuum device also includes a second processor electrically connected to the detection component, the first switch, the second switch, and the third switch, the second processor can switch the switching states of the first switch, the second switch, and the third switch according to the first detection signal.

[0125] Specifically, based on the detection component, first detection signals corresponding to different positions on the outer wall of the container can be acquired. By processing multiple first detection signals, for example, processing multiple first detection signals can obtain their respective corresponding light intensity values. Based on the difference in light intensity values, the relative relationship between the liquid level height in the container and a preset height can be determined. Thus, when it is determined that the liquid level height is greater than the preset height value, the third switch switches from the off state to the selected state, while the first and second switches switch from the selected state to the off state. Conversely, the current switching states of the first, second, and third switches are maintained.

[0126] The reason why the liquid level height can be determined based on the light intensity values ​​corresponding to each first detection signal is that:

[0127] When the probe beam is incident at different locations, if the path along the direction of the probe beam's incident position includes both a container and a solution, and other parameters are consistent (e.g., the type and parameters of the probe beam, the material of the container, etc.), in one case, the first light intensity value corresponding to that location is smaller, and the first light intensity values ​​corresponding to locations that satisfy this condition tend to be the same, or the light intensity difference can be considered to be 0.

[0128] If the path along the direction of the incident position of the probe beam only includes the container, in one case, the second light intensity value corresponding to that position is larger (e.g., larger than the first light intensity value), and the second light intensity values ​​corresponding to the positions that satisfy this condition tend to be the same, or the light intensity difference can be considered to be 0.

[0129] This way, when the light intensity value at the first location point changes significantly from the light intensity values ​​at the two adjacent locations, it indicates that the height at the first location point is the liquid level.

[0130] It should be noted that when the liquid level is determined to be greater than the preset height value, the second processor can also output a motion stop signal to the transmission device, so that the transmission device is in a stopped state.

[0131] Example 2: The vacuum equipment further includes: a liquid level sensor disposed on the inner wall of the container, the liquid level sensor being disposed at a preset position, the liquid level sensor being used to output a second detection signal, the second detection signal being used to characterize that the liquid level in the container is at the preset position.

[0132] In other words, the liquid level sensor is positioned at the highest point of the liquid contained in the container, and the liquid level sensor is used to output a second detection signal, which is used to characterize that the liquid level in the container is at the highest point.

[0133] In some embodiments, the liquid level sensor is positioned at a certain distance from the bottom of the container, and this distance represents the highest liquid level that the container can hold. When the liquid level does not reach the set position, the liquid level sensor does not generate the second detection signal; the liquid level sensor generates the second detection signal only when the liquid level reaches or exceeds the set position.

[0134] Thus, when the vacuum equipment also includes a second processor electrically connected to the liquid level sensor, the first switch, the second switch, and the third switch, the second processor can switch the switching states of the first switch, the second switch, and the third switch according to the second detection signal.

[0135] Specifically, based on the liquid level sensor, a second detection signal is generated only when the liquid level reaches or exceeds the sensor's set position. Upon receiving this second detection signal, the second processor can switch the third switch from an open state to a selected state, while switching the first and second switches from a selected state to an open state. Conversely, it maintains the current on / off states of the first, second, and third switches.

[0136] It should be noted that, firstly, when the liquid level is determined to be greater than the preset height value, the second processor can also output a motion stop signal to the transmission device, so that the transmission device is in a stopped state; secondly, the first processor and the second processor can be implemented by a single circuit, or the first processor and the second processor can be integrated on the same system-on-a-chip (SoC).

[0137] In some embodiments, the vacuum device may further include a collection device disposed on the side where the liquid outlet of the third pipe is located. This enables liquid recovery and recycling.

[0138] In some embodiments, the material of the collection device may be corrosion-resistant to prevent liquid leakage caused by corrosion of the collection device.

[0139] Therefore, by using the vacuum equipment in the above scheme, on the one hand, the dryness of the gas drawn into the vacuum generator is improved to provide a stable and larger adsorption force, so that the wafer has higher stability during the transfer process; on the other hand, by setting the first switch, the second switch and the third switch, different processes can be coordinated, and the liquid level in the container can meet the transfer requirements.

[0140] It should be noted that, firstly, Figure 2 and Figure 3 The shapes and dimensions of the illustrated vacuum equipment are merely illustrative examples used to demonstrate the ability to provide a vacuum environment and should not be construed as limitations on the vacuum equipment itself; secondly... Figure 2 and Figure 3 The shape of the container shown is for illustrative purposes only. In other embodiments, the cross-sectional shape of the container may also be circular or triangular.

[0141] The above examples describe multiple embodiments of the present invention. The optional methods described in each embodiment can be combined and cross-referenced without conflict, thereby extending to a variety of possible embodiments. These can all be considered as embodiments disclosed or made public by the present invention.

[0142] This utility model also provides a conveying device corresponding to the vacuum equipment described in any of the above embodiments, which will be described below. It should be noted that the content of the conveying device described below can be referred to in conjunction with the content of the vacuum equipment described above.

[0143] In some embodiments, see next. Figure 2 and Figure 3 The conveying device may include:

[0144] The transport component T for transporting wafers.

[0145] In some embodiments, the conveying component T may be a robotic arm. The structure and movement of the robotic arm can be found in existing descriptions.

[0146] An adsorption component S is disposed at the contact point between the conveying component T and the wafer (not shown). The adsorption component S adsorbs the wafer during the movement of the conveying component T.

[0147] The vacuum device as described in any of the foregoing embodiments is connected to the adsorption component S and is used to draw gas between the wafer and the adsorption component S.

[0148] In some embodiments, the adsorption component S is disposed on the conveying component T, and the wafer is placed on the adsorption component S.

[0149] When it is necessary to move the wafer, the vacuum equipment is turned on, so that the gas between the wafer and the adsorption component S can be drawn out, which reduces the gas pressure on the contact surface between the wafer and the adsorption component S to a level far below atmospheric pressure. Under the action of pressure difference, the wafer is tightly adsorbed onto the adsorption component S.

[0150] In some embodiments, the adsorption component S can be a suction cup.

[0151] In some embodiments, the vacuum equipment has a separation component that enables gas-liquid separation when solution remains on the wafer, and the vacuum equipment provides stable and satisfactory adsorption force. This results in greater stability when the wafer is in the transport state.

[0152] In some embodiments, the vacuum device (e.g., the first end of the first pipe P1) can be connected to the bottom of the adsorption component S after passing through the conveying component T. This reduces the gas travel path and shortens the time required to establish a vacuum environment.

[0153] In some embodiments, a vacuum device (e.g., the first end of the first pipe P1) can be connected to the sidewall of the adsorption component S, thus eliminating the need to modify the transfer component T and simplifying the implementation.

[0154] For example, a connecting pipe is provided at the first end of the first pipe P1 and the side wall of the adsorption component S.

[0155] For details regarding the structure, connection relationships, functions, and working principles of the vacuum equipment in some embodiments, please refer to the descriptions and figures above, which will not be repeated here.

[0156] It is understood that terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with terms such as "first" and "second" may explicitly or implicitly include one or more of that feature. Furthermore, terms such as "first" and "second" are used to distinguish similar objects and are not necessarily used to describe a specific order or indicate importance. It is understood that such terms can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein.

[0157] While the embodiments disclosed in this specification are as described above, the utility model is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this utility model; therefore, the scope of protection of this utility model should be determined by the scope defined in the claims.

Claims

1. A vacuum device, characterized in that, The vacuum device, connected to the adsorption assembly, includes: A first conduit providing a first transmission path, the first conduit having a first end and a second end, the first end of the first conduit being connected to the adsorption component; A second pipe provides a second transmission path, the second pipe having a first end and a second end, and the first transmission path and the second transmission path are connected; The separation component is connected to the second end of the first pipe and the first end of the second pipe respectively, providing a chamber with a sealed environment, and separating and containing a specific medium in the gas. A vacuum generator that connects to the second end of the second pipe and draws the gas along the first and second transmission paths.

2. The vacuum device according to claim 1, characterized in that, The separation component includes: A container having the chamber and communicating with the first pipe and the second pipe respectively; A cooling pipe is wound around the outer wall of the container to allow the flow of a cooling medium. The cooling pipe has a cooling medium inlet and a cooling medium outlet, and the coolant is used to separate the liquid in the gas.

3. The vacuum device according to claim 2, characterized in that, Along the winding direction of the cooling pipe, the cooling medium outlet is located above the cooling medium inlet.

4. The vacuum device according to claim 2, characterized in that, Meet one or more of the following: The first pipe is equipped with a first switch for selecting the first transmission path; The second pipe is equipped with a second switch for selecting the second transmission path; The first pipe is provided with a first switch for selecting the first transmission path, and the second pipe is provided with a second switch for selecting the second transmission path; The first switch and the second switch are in the same switching state.

5. The vacuum device according to claim 4, characterized in that, The container is provided with a drain outlet at the bottom; The vacuum device also includes: A third pipe is connected to the drain outlet to provide a third transmission path, and a third switch for selecting the third transmission path is provided on the third pipe; The switching state of the third switch is different from that of the first switch or the second switch.

6. The vacuum device according to claim 5, characterized in that, Also includes: A first processor is electrically connected to the first switch, the second switch, and the third switch respectively, and switches the switch states of the first switch, the second switch, and the third switch.

7. The vacuum device according to claim 5, characterized in that, Meet one or more of the following: The container is transparent, and the vacuum device further includes a detection component, which is used to output a first detection signal, the first detection signal being used to characterize the liquid level height in the container; The vacuum device further includes: a liquid level sensor disposed on the inner wall of the container, the liquid level sensor being disposed at a preset position, the liquid level sensor being used to output a second detection signal, the second detection signal being used to characterize that the liquid level in the container is at the preset position; The vacuum device further includes a second processor that is electrically connected to the detection component or the liquid level sensor, and electrically connected to the first switch, the second switch and the third switch, and switches the switching states of the first switch, the second switch and the third switch according to the first detection signal or the second detection signal.

8. The vacuum device according to claim 5, characterized in that, Meet one or more of the following: The first switch includes one or more of a solenoid valve and a pneumatic valve; The second switch includes one or more of a solenoid valve and a pneumatic valve; The third switch includes one or more of a solenoid valve and a pneumatic valve.

9. The vacuum device according to claim 1, characterized in that, The separation component has a first interface and a second interface, the first interface being used to communicate with the second end of the first pipe, and the second interface being used to communicate with the first end of the second pipe; Wherein, the first interface is not higher than the second interface.

10. A conveying device, characterized in that, include: Transport components for wafers; An adsorption component is disposed at the contact point between the conveying component and the wafer, and the adsorption component adsorbs the wafer during the movement of the conveying component; The vacuum device according to any one of claims 1 to 9, wherein the vacuum device is connected to the adsorption component and is used to draw gas between the wafer and the adsorption component.

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