Foam gum with insulation structure

Abstract

The utility model relates to the technical field of foam gum, in particular to foam gum with an insulation structure, which comprises a foam base layer, a buffer mechanism for relieving pressure is arranged on the foam base layer, and an insulation mechanism for isolating current is arranged on the buffer mechanism. According to the utility model, through the arrangement of the insulation mechanism and the design of a multi-layer insulation structure, the insulation performance of the foam gum is greatly improved, the current is effectively prevented from passing through, the risks of short circuit and fault of equipment are reduced, the use safety is ensured, and the foam gum can be firmly adhered to the surface of an adhered object in different environments; by arranging the buffer mechanism, the whole back adhesive has certain buffer performance, and by adopting polyurethane foam, the whole back adhesive has good flexibility and buffer performance, and the reasonable design of the multi-layer insulation structure and the bonding layer, the foam back adhesive can adapt to various complex use scenes while the insulation performance and the bonding performance are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of foam back adhesive, especially to a foam back adhesive with insulation structure. BACKGROUND

[0002] The foam back adhesive is widely used in many fields such as electronics, automobiles and buildings due to its good pasting performance, buffering performance and certain flexibility.

[0003] In some specific use scenarios, such as pasting of components inside electronic devices and fixing of electrical equipment, high requirements are put forward for the insulation performance of the foam back adhesive. The traditional foam back adhesive usually only has basic pasting function and limited insulation performance, and cannot effectively prevent current from passing through when encountering strong current or voltage environment, which can easily lead to device short circuit, failure and even safety accidents. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of the prior art, the utility model provides a foam back adhesive with insulation structure, which solves the technical problem of insufficient insulation performance of the existing foam back adhesive and poor performance caused by problems in strong current or voltage environment, and achieves the purpose of improving the insulation performance of the foam back adhesive, reducing the risk of device short circuit and failure, and improving the use safety.

[0005] To solve the above technical problems, the utility model provides the following technical scheme: a foam back adhesive with insulation structure, comprising a foam base layer, a pressure relieving buffer mechanism is arranged on the foam base layer, and an electric current isolating insulation mechanism is arranged on the buffer mechanism.

[0006] The insulation mechanism comprises a first insulation layer, an insulation film layer is mounted on the first insulation layer, a second insulation layer is mounted on the insulation film layer, a pasting layer is mounted on the other side of the foam base layer, and a protective layer is movably mounted on the pasting layer.

[0007] Preferably, the buffer mechanism comprises a buffer layer one mounted on one side of the foam base layer, a plurality of groups of cotton sticks are mounted on the buffer layer one, a buffer layer two is mounted on the buffer layer one, a partition layer connected with the first insulation layer is mounted at the top end of the buffer layer two, and stick grooves matched with the cotton sticks are formed in the buffer layer two.

[0008] Preferably, the foam base layer is made of high-elasticity and low-density polyurethane foam, and the thickness of the foam base layer is 0.5-5mm.

[0009] Preferably, the first insulation layer and the second insulation layer are both made of high-performance insulating silica gel, and the insulation film layer is made of polyimide material.

[0010] Preferably, the insulating film layer has a thickness of 10-50 μm and is distributed between the first insulating layer and the second insulating layer.

[0011] Preferably, the adhesive layer is made of acrylic pressure-sensitive adhesive and has a thickness of 20-80 μm, and the protective layer is made of a release film.

[0012] By means of the above technical scheme, the utility model provides a foam back adhesive with an insulating structure, which has at least the following beneficial effects:

[0013] 1. The utility model discloses an insulating mechanism, a multilayer insulating structure, which greatly improves the insulating performance of the foam back adhesive, effectively prevents current from passing through, reduces the risk of equipment short circuit and failure, ensures use safety, and the selected acrylic pressure-sensitive adhesive adhesive layer has high adhesive strength and good weather resistance, so that the foam back adhesive can be firmly adhered to the surface of the adherend in different environments.

[0014] 2. The utility model discloses a buffer mechanism, so that the back adhesive has certain buffering performance, and the whole is made of polyurethane foam, which has good flexibility and buffering performance, and the reasonable design of the multilayer insulating structure and the adhesive layer makes the foam back adhesive have good insulating performance and adhesive performance and be suitable for various complex use scenarios. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings, which are included to provide a further understanding of the application and constitute a part of this application, illustrate certain illustrative embodiments of the application and together with the description serve to explain the application.

[0016] In the drawings:

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the split overhead structure of the utility model;

[0019] Figure 3 It is a schematic diagram of the split overhead structure of the utility model;

[0020] Figure 4 It is a schematic diagram of the insulating mechanism part of the utility model.

[0021] In the drawings: 1, foam base layer;

[0022] 2, buffer mechanism; 21, buffer layer one; 22, cotton stick; 23, buffer layer two; 24, spacer; 25, stick groove;

[0023] 3, insulation mechanism; 31, first insulation layer; 32, insulation film layer; 33, second insulation layer; 34, adhesive layer; 35, protective layer. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0025] Embodiment one

[0026] The existing foam back adhesive has insufficient insulation performance, and problems are prone to occur under a strong current or voltage environment, resulting in poor performance. The embodiment provides a foam back adhesive with an insulation structure, which can improve the insulation performance of the foam back adhesive, reduce the risk of device short circuit and failure, and improve use safety. Figures 1-4 The foam back adhesive with an insulation structure comprises a foam base layer 1. The foam base layer 1 is made of high-elasticity and low-density polyurethane foam, has good flexibility and cushioning performance, can adapt to the adhesive requirements of different shapes and surfaces, and has a thickness of 0.5-5 mm. In a cushioning application scenario with high thickness requirements, a thicker foam base layer 1 can be selected, while in some internal adhesive scenarios of sensitive electronic devices, a thinner foam base layer 1 is selected. A pressure-reducing cushioning mechanism 2 is arranged on the foam base layer 1, and an insulation mechanism 3 for isolating current is arranged on the cushioning mechanism 2. The cushioning mechanism 2 can have certain cushioning performance and improve the overall service life, and the insulation mechanism 3 can improve the insulation performance of the back adhesive, effectively prevent current from passing through, and ensure use safety.

[0027] In the use of the back adhesive, in order to isolate the current, increase the safety performance of the use of the back adhesive, the insulation mechanism 3 includes a first insulation layer 31, the first insulation layer 31 and the second insulation layer 33 are made of high-performance insulating silica gel, which has good insulation performance and bonding performance, prevents current from passing through, the first insulation layer 31 is provided with an insulating film layer 32, the insulating film layer 32 is made of polyimide material, which has excellent electrical insulation performance, high temperature resistance and mechanical properties, the thickness of the insulating film layer 32 is 10-50μm, which can ensure good insulation effect and will not affect the overall flexibility of the foam back adhesive. This multilayer insulation structure design, through the synergistic effect between different materials, greatly improves the insulation performance of the foam back adhesive, compared with the traditional single-layer insulation structure, it can better cope with complex electrical environment, and it is distributed between the first insulation layer 31 and the second insulation layer 33, which improves the insulation effect of the back adhesive, the second insulation layer 33 is installed on the insulating film layer 32, the other side of the foam base layer 1 is provided with a sticking layer 34, the sticking layer 34 is made of acrylic pressure-sensitive adhesive, which has good sticking performance and weather resistance, and the thickness of the sticking layer 34 is between 20-80μm, which can ensure that the foam back adhesive and the object to be pasted have enough sticking strength, and the overall performance of the foam back adhesive will not be affected by the thickness of the sticking layer 34, the protective layer 35 is movably installed on the sticking layer 34, the protective layer 35 is made of release film, which can protect the sticking layer 34 from pollution and damage when the foam back adhesive is not in use, and ensure its sticking performance, when in use, just tear off the protective layer 35, and the sticking operation can be carried out. Through the first insulation layer 31, the insulating film layer 32 and the second insulation layer 33, the back adhesive has certain insulation, the sticking layer 34 can fix the back adhesive, and the protective layer 35 protects the sticking layer 34 from pollution and reduces the sticking effect.

[0028] Example two

[0029] Based on example one, as shown in Figures 1-4 The existing foam back adhesive has insufficient insulation performance, and problems may occur under strong current or voltage environment, resulting in poor performance. However, the existing foam back adhesive has low buffering performance, which reduces the service life of the back adhesive, so the device also has a structure for improving the buffering performance of the back adhesive.

[0030] In the use of the back adhesive, in order to improve the use effect of the back adhesive, prolong the service life, the buffer mechanism 2 includes the buffer layer one 21 installed on one side of the foam base layer 1, a plurality of groups of cotton sticks 22 are installed on the buffer layer one 21, the buffer layer two 23 is installed on the buffer layer one 21, the buffer layer two 23 is installed on the buffer layer two 23, and the buffer layer two 23 is installed on the buffer layer two 23. The first insulating layer 31 is connected with the buffer layer 24, and the rod groove 25 matched with the cotton stick 22 is formed in the buffer layer two 23. The buffer layer one 21 and the buffer layer two 23 play a preliminary buffering role, and under the cooperation of the cotton stick 22 and the rod groove 25, the buffering performance can be further improved.

[0031] It should be noted that in this document, the terms "comprise", "comprising", or any other variant thereof are intended to cover non-exclusive inclusions, so that processes, methods, articles or devices that include a series of elements not only include those elements, but also include other elements not explicitly listed, or inherent to such processes, methods, articles or devices.

[0032] Although the embodiments of the present application have been shown and described, it should be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A foam-backed adhesive having an insulating structure, comprising a foam base layer (1), characterized in that: The foam base layer (1) is provided with a pressure relief buffer mechanism (2), and the buffer mechanism (2) is provided with an insulation mechanism (3) for insulating current. The insulation mechanism (3) comprises a first insulation layer (31), an insulation film layer (32) mounted on the first insulation layer (31), and a second insulation layer (33) mounted on the insulation film layer (32); the other side of the foam base layer (1) is provided with a sticking layer (34), and the sticking layer (34) is movably provided with a protective layer (35).

2. The foam-backed adhesive with insulation structure according to claim 1, wherein: The buffer mechanism (2) comprises a buffer layer one (21) mounted on one side of the foam base layer (1), a plurality of groups of cotton sticks (22) mounted on the buffer layer one (21), a buffer layer two (23) mounted on the buffer layer one (21), a partition layer (24) mounted on the top end of the buffer layer two (23) and connected with the first insulation layer (31), and a stick groove (25) formed in the buffer layer two (23) and matched with the cotton stick (22).

3. The foam-backed adhesive with insulation structure according to claim 1, wherein: The foam base layer (1) is made of high-elasticity and low-density polyurethane foam, and the thickness of the foam base layer (1) is 0.5-5mm.

4. The foam-backed adhesive with insulation structure according to claim 1, wherein: The first insulation layer (31) and the second insulation layer (33) are both made of high-performance insulating silica gel, and the insulation film layer (32) is made of polyimide material.

5. The foam-backed adhesive with insulation structure according to claim 1, wherein: The thickness of the insulation film layer (32) is 10-50μm, and it is distributed between the first insulation layer (31) and the second insulation layer (33).

6. The foam-backed adhesive with insulation structure according to claim 1, wherein: The sticking layer (34) is made of acrylic pressure-sensitive adhesive, and the thickness of the sticking layer (34) is 20-80μm; the protective layer (35) is made of release film.

Images