Radiator and photographic equipment

Abstract

The utility model provides a radiator and photographic equipment. The radiator comprises a shell, a cover body covering the shell, a plurality of first radiating pieces arranged between the shell and the cover body, and a plurality of second radiating pieces connected with the first radiating pieces, a heat dissipation cavity used for containing cooling liquid is formed between the shell and the cover. The plurality of first heat dissipation pieces are arranged in the heat dissipation cavity and are connected with at least one of the shell or the cover body, and the first heat dissipation pieces are columnar components; the second heat dissipation pieces are arranged in the heat dissipation cavity and connected with the corresponding first heat dissipation pieces, the second heat dissipation pieces are sheet-shaped components, and a heat dissipation groove communicated with the heat dissipation cavity is formed between every two adjacent second heat dissipation pieces. The columnar first heat dissipation piece and the sheet-shaped second heat dissipation piece jointly achieve the heat dissipation function of the heat dissipation device, the heat dissipation area of the heat dissipation device is increased, and the heat dissipation efficiency of the heat dissipation device is improved; the arrangement difficulty of the sheet-shaped second heat dissipation piece is reduced, the process difficulty is reduced, and the manufacturing efficiency of the radiator is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of photographic equipment more particularly, it relates to a radiator and photographic equipment. BACKGROUND

[0002] In the production of the radiator, a basic factor of the heat dissipation efficiency is the heat dissipation area. The air-cooled and water-cooled radiator generally adopts the fin or the gill installed on the heat dissipation surface to increase the heat dissipation area. The thickness of the heat dissipation fin is as thin as possible, and the fin is generally 0.2mm, and the gill is generally 0.1mm. But the heat dissipation fin is a plane structure, and the fluid cannot form the turbulent flow on the surface thereof, and is easy to form the adhesion layer, and the thickness of the adhesion layer increases with the increase of the length of the heat dissipation fin, and the adhesion layer increases the thermal resistance on one hand and the flow resistance on the other hand. Therefore, the spacing between the heat dissipation fins cannot be too small, and the spacing of the heat dissipation fins of the server CPU radiator is generally 1mm. The increase of the heat dissipation area cannot be simply realized by increasing the heat dissipation fin, and the heat dissipation area needs to be increased under the condition of not increasing the flow resistance and the thermal resistance.

[0003] The pin type radiator uses the heat dissipation column to replace the heat dissipation fin, and the fluid can form the turbulent flow on the surface of the heat dissipation column and is not easy to form the adhesion layer. The heat dissipation column can be increased to increase the heat dissipation area under the condition of not increasing the flow resistance and the thermal resistance, but the pin type radiator is generally integrally formed by using the cold forging process, and the diameter of the heat dissipation column and the gap between the heat dissipation columns cannot be too small due to the limitation of the forming and the drawing, and the heat dissipation column is difficult to form and is easy to break during the drawing when the diameter and the gap are too small. It is more difficult to reach the diameter of about 0.1mm of the convex structure and the gap size required for the evaporation heat dissipation. And the welding of the small metal wire as the heat dissipation column has the problems of the deformation of the metal wire in the production and processing, the difficulty in controlling the gap between the dense metal wires, and the low production efficiency caused by the small size and large number of the metal wires. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a radiator and photographic equipment to solve the technical problem that the radiator is difficult to increase the heat dissipation area and improve the production efficiency in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model adopts the technical scheme that:

[0006] In the first aspect, a radiator is provided, comprising:

[0007] The shell, a cover body provided on the shell, a plurality of first heat dissipation members provided between the shell and the cover body, and a plurality of second heat dissipation members connected with the first heat dissipation members; a heat dissipation cavity for accommodating a cooling liquid is provided between the shell and the cover body; a plurality of the first heat dissipation members are arranged in the heat dissipation cavity and connected with at least one of the shell or the cover body, and the first heat dissipation member is a columnar member; a plurality of the second heat dissipation members are arranged in the heat dissipation cavity and connected with the corresponding first heat dissipation members, and the second heat dissipation member is a sheet-shaped member, and a heat dissipation groove in communication with the heat dissipation cavity is formed between adjacent two second heat dissipation members.

[0008] By adopting the above technical scheme, the columnar first heat dissipation member and the sheet-shaped second heat dissipation member jointly realize the heat dissipation function of the heat dissipation device, increase the heat dissipation area of the heat dissipation device, and improve the heat dissipation efficiency of the heat dissipation device; the columnar first heat dissipation member can support the sheet-shaped second heat dissipation member, thereby reducing the difficulty of setting the sheet-shaped second heat dissipation member, reducing the process difficulty caused by the small gap between adjacent two second heat dissipation members, and improving the manufacturing efficiency of the heat dissipation device.

[0009] In one embodiment, each second heat dissipation member is provided with a plurality of mounting holes corresponding to the first heat dissipation members one by one, and the first heat dissipation member is inserted into the mounting hole when the second heat dissipation member is connected with the first heat dissipation member.

[0010] By adopting the above technical scheme, the assembly difficulty of the first heat dissipation member and the second heat dissipation member is reduced.

[0011] In one embodiment, the first heat dissipation member and the second heat dissipation member are reflow soldering members.

[0012] By adopting the above technical scheme, the assembly difficulty of the first heat dissipation member and the second heat dissipation member is reduced.

[0013] In one embodiment, adjacent two second heat dissipation members are arranged in parallel at equal intervals, and the size of the heat dissipation groove formed between each group of adjacent two second heat dissipation members is equal.

[0014] By adopting the above technical scheme, the reflow soldering method has the following advantages: high precision and high efficiency, the reflow soldering can quickly and efficiently fix electronic components, and at the same time, provide high-precision soldering; suitable for large-scale production, and conducive to improving manufacturing efficiency.

[0015] In one embodiment, the shell is provided with an inlet channel and an outlet channel in communication with the heat dissipation cavity, the inlet channel is provided with an inlet opening in communication with the heat dissipation cavity, and the outlet channel is provided with an outlet opening in communication with the heat dissipation cavity.

[0016] By adopting the technical scheme, the heat dissipation uniformity of different parts of the heat sink is improved.

[0017] In one embodiment, the housing and the second heat dissipation member form a liquid inlet cavity and a liquid outlet cavity in communication with the heat dissipation groove, the liquid inlet cavity is located on one side of the second heat dissipation member, the liquid outlet cavity is located on the other side of the second heat dissipation member, the liquid inlet opening is in communication with the liquid inlet cavity, and the liquid outlet opening is in communication with the liquid outlet cavity.

[0018] By adopting the technical scheme, the cooling liquid is beneficial to enter the heat dissipation cavity.

[0019] In one embodiment, the heat sink includes two groups of the second heat dissipation members, each group of the second heat dissipation members includes a plurality of the second heat dissipation members arranged in parallel and at intervals, and the two groups of the second heat dissipation members are respectively located on the two sides of the liquid inlet opening.

[0020] By adopting the technical scheme, the cooling liquid is beneficial to enter the heat dissipation cavity.

[0021] In one embodiment, the liquid inlet channel defines a liquid inlet direction, the second heat dissipation member extends along the liquid inlet direction, and the size of the liquid inlet opening in the liquid inlet direction matches the size of the second heat dissipation member.

[0022] By adopting the technical scheme, the heat dissipation efficiency is further improved.

[0023] In one embodiment, a plurality of the first heat dissipation members are arranged in an array in the heat dissipation cavity.

[0024] By adopting the technical scheme, the first heat dissipation members are arranged in an orderly manner, and the heat dissipation uniformity of the heat sink is improved.

[0025] In a second aspect, a photographic equipment is provided, including a photographic equipment and the heat sink described above, and the heat sink is arranged on the photographic equipment.

[0026] By adopting the technical scheme, on the basis of the advantages of the heat sink with the above-mentioned embodiments, the photographic equipment of the present embodiment also has the advantage of being easy to manufacture. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0028] Figure 1It is the perspective view of the heat radiator provided by the embodiment of the utility model.

[0029] Figure 2 It is the explosion view of one perspective of the heat radiator provided by the embodiment of the utility model.

[0030] Figure 3 It is the explosion view of another perspective of the heat radiator provided by the embodiment of the utility model.

[0031] Figure 4 It is Figure 3 The enlarged view of "A" in the heat radiator.

[0032] Figure 5 It is the sectional view of the heat radiator provided by the embodiment of the utility model. Figure 1 .

[0033] Figure 6 It is the sectional view of the heat radiator provided by the embodiment of the utility model. Figure 2 .

[0034] The reference signs in the drawings are:

[0035] 1, shell; 2, cover; 3, first heat dissipation piece; 4, second heat dissipation piece; 5, heat dissipation cavity; 6, heat dissipation groove;

[0036] 41, mounting hole; 11, liquid inlet channel; 12, liquid outlet channel; 13, liquid inlet opening; 14, liquid outlet opening; 15, liquid inlet cavity; 16, liquid outlet cavity; X, liquid inlet direction. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical schemes and beneficial effects to be solved by the utility model more clearly understood, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and not to limit the utility model.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.

[0039] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the utility model, and do not indicate that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0040] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating relative importance or indicating the number of technical features. In the description of the utility model, the meaning of "multiple" is two or more than two, unless otherwise explicitly specified. The specific implementation of the utility model is described in more detail below in combination with specific embodiments:

[0041] As shown in Figure 1 And Figure 2 The utility model discloses a radiator for the heat dissipation of photographic equipment, including but not limited to fill light, the radiator provided by the embodiment integrates the advantages of columnar heat dissipation piece and sheet heat dissipation piece, improves the heat dissipation area of radiator and improves the manufacturing efficiency of radiator, which is described below through specific implementation:

[0042] Please see Figures 3 to 5 The radiator of the embodiment comprises:

[0043] The shell 1, the cover body 2 on the shell 1, the plurality of first heat dissipation pieces 3 between the shell 1 and the cover body 2 and the plurality of second heat dissipation pieces 4 connected with the first heat dissipation pieces 3, the heat dissipation cavity 5 for accommodating cooling liquid between the shell 1 and the cover body 2, the plurality of first heat dissipation pieces 3 arranged in the heat dissipation cavity 5 and connected with at least one of the shell 1 or the cover body 2, the first heat dissipation piece 3 is a columnar member, the plurality of second heat dissipation pieces 4 arranged in the heat dissipation cavity 5 and connected with the corresponding first heat dissipation piece 3, the second heat dissipation piece 4 is a sheet member, and the adjacent two second heat dissipation pieces 4 form the heat dissipation groove 6 communicated with the heat dissipation cavity 5.

[0044] Here, it can be understood that the shell 1 refers to the member for accommodating the first heat dissipation piece 3 and the second heat dissipation piece 4;

[0045] The cover body 2 refers to the member for covering on the shell 1, the heat dissipation cavity 5 is arranged between the shell 1 and the cover body 2, the heat dissipation cavity 5 is used for accommodating cooling liquid, the cooling liquid is used for taking away the heat of the first heat dissipation piece 3 and the second heat dissipation piece 4 in the heat dissipation cavity 5, thereby realizing the heat dissipation function;

[0046] The first heat dissipation piece 3 refers to the heat dissipation piece with the first shape, the plurality of first heat dissipation pieces 3 are arranged in the heat dissipation cavity 5, and the plurality of first heat dissipation pieces 3 are connected with at least one of the shell 1 or the cover body 2, that is, the heat of the shell 1 or the cover body 2 can be transmitted to the heat dissipation cavity 5 through the first heat dissipation piece 3, and the first heat dissipation piece 3 is a columnar member, that is, the shape of the first heat dissipation piece 3 is columnar;

[0047] The second heat sink 4 refers to a heat sink with a second shape; multiple second heat sinks 4 are arranged in the heat dissipation cavity 5, and the first heat sinks 3 corresponding to the multiple second heat sinks 4 are connected, that is, the heat of the first heat sink 3 can be transferred to the heat dissipation cavity 5 through the second heat sinks 4; the second heat sink 4 is a sheet-like component, that is, the shape of the second heat sink 4 is sheet-like; two adjacent second heat sinks 4 are spaced apart by a preset distance and form a heat dissipation groove 6, the heat dissipation groove 6 is connected to the heat dissipation cavity 5, that is, the coolant can enter the heat dissipation groove 6 to remove the heat of the second heat sink 4.

[0048] The working principle of the radiator provided in this embodiment is as follows:

[0049] The coolant enters the heat dissipation cavity 5 and flows into the heat dissipation tank 6. Since the first heat dissipation component 3 is immersed in the coolant in the heat dissipation cavity 5, and the second heat dissipation component 4 is immersed in the coolant in the heat dissipation tank 6, the inner walls of the shell 1 and the cover 2 are also in contact with the coolant. In this way, the heat dissipation area between the radiator and the coolant is increased, and the heat dissipation efficiency of the radiator is improved.

[0050] By adopting the above technical solution, the columnar first heat sink 3 and the plate-shaped second heat sink 4 together realize the heat dissipation function of the heat sink, increase the heat dissipation area of ​​the heat sink, and improve the heat dissipation efficiency of the heat sink; the columnar first heat sink 3 can support the plate-shaped second heat sink 4, reduce the difficulty of setting the plate-shaped second heat sink 4, reduce the process difficulty caused by the small gap between two adjacent second heat sinks 4, and improve the manufacturing efficiency of the heat sink.

[0051] In one embodiment, each second heat sink 4 is provided with a plurality of mounting holes 41 corresponding one-to-one with the first heat sink 3, and the first heat sink 3 is inserted into the mounting holes 41 when the second heat sink 4 is connected to the first heat sink 3.

[0052] Here, it can be understood that the second heat sink 4 is provided with multiple mounting holes 41, and the position of each mounting hole 41 corresponds one-to-one with the first heat sink 3. The shape and size of the mounting hole 41 match the shape and size of the first heat sink 3, so that the first heat sink 3 can be inserted into the mounting hole 41. The first heat sink 3 is inserted into the mounting hole 41, so that the second heat sink 4 is connected to the first heat sink 3.

[0053] It needs to be further explained that the first heat sink 3 can be either clearance-fitted or interference-fitted with the mounting hole 41. When the two are clearance-fitted, the first heat sink 3 and the mounting hole 41 need to be fixed by welding or bonding to achieve a fixed connection between them; while when the two are clearance-fitted, the first heat sink 3 and the mounting hole 41 are fixedly connected to each other by the force of the interference fit.

[0054] By adopting the above technical solution, it is beneficial to reduce the assembly difficulty of the first heat sink 3 and the second heat sink 4.

[0055] In one embodiment, the first heat dissipation member 3 and the second heat dissipation member 4 are reflow soldering members.

[0056] Here, it can be understood that the first heat dissipation member 3 and the second heat dissipation member 4 are fixedly connected to each other by reflow soldering, which refers to a process of melting solder by controlling heating after connecting one or more electronic components to a contact pad using a mixture of solder and flux to achieve permanent bonding. Different heating methods such as reflow ovens, infrared heating lamps, or hot air guns can be used for soldering.

[0057] By adopting the above technical solution, the reflow soldering method has the following advantages: high precision and high efficiency. Reflow soldering can quickly and efficiently fix electronic components while providing high-precision soldering. It is suitable for mass production and helps improve manufacturing efficiency.

[0058] In one embodiment, two adjacent second heat dissipation members 4 are arranged in parallel at equal intervals, and the size of the heat dissipation groove 6 formed between each group of two adjacent second heat dissipation members 4 is equal.

[0059] Here, it can be understood that the equal size of the heat dissipation groove 6 allows the volume of the cooling liquid entering the heat dissipation groove 6 to be equal, making the heat dissipation efficiency of each second heat dissipation member 4 consistent and improving the uniformity of the heat dissipation of the heat sink.

[0060] By adopting the above technical solution, the uniformity of heat dissipation of different parts of the heat sink is improved.

[0061] In one embodiment, the housing 1 is provided with a liquid inlet channel 11 and a liquid outlet channel 12 communicating with the heat dissipation cavity 5. The liquid inlet channel 11 is provided with a liquid inlet opening 13 communicating with the heat dissipation cavity 5, and the liquid outlet channel 12 is provided with a liquid outlet opening 14 communicating with the heat dissipation cavity 5.

[0062] By adopting the above technical solution, it is beneficial for the cooling liquid to enter the heat dissipation cavity 5.

[0063] In one embodiment, the housing 1 and the second heat dissipation member 4 form a liquid inlet cavity 15 and a liquid outlet cavity 16 communicating with the heat dissipation groove 6. The liquid inlet cavity 15 is located on one side of the second heat dissipation member 4, and the liquid outlet cavity 16 is located on the other side of the second heat dissipation member 4. The liquid inlet opening 13 communicates with the liquid inlet cavity 15, and the liquid outlet opening 14 communicates with the liquid outlet cavity 16.

[0064] Here, it can be understood that the cooling liquid enters the liquid inlet cavity 15 from the liquid inlet channel 11. The cooling liquid in the liquid inlet cavity 15 first cools one side of the second heat dissipation member 4, then flows towards the other side of the second heat dissipation member 4 and enters the liquid outlet cavity 16, and finally is discharged from the liquid outlet opening 14.

[0065] Through the above technical scheme, the cooling liquid flows directionally, which is beneficial to improve the overall heat dissipation efficiency of the heat sink.

[0066] In one embodiment, the heat sink comprises two groups of second heat dissipation pieces 4, each group of second heat dissipation pieces 4 comprises a plurality of second heat dissipation pieces 4 arranged in parallel and at intervals, and the two groups of second heat dissipation pieces 4 are respectively located on two sides of the liquid inlet opening 13.

[0067] Here, it can be understood that the liquid outlet cavities 16 formed by the two groups of second heat dissipation pieces 4 are respectively located on two sides of the liquid inlet opening 13, that is, the cooling liquid flowing out of the liquid inlet opening 13 first enters the liquid inlet cavities 15 of the two groups of second heat dissipation pieces 4, and then flows to the liquid outlet cavities 16 on two sides of the liquid inlet opening 13, respectively, so that the flow path of the cooling liquid is shortened, and the heat dissipation efficiency is improved.

[0068] Through the above technical scheme, the heat dissipation efficiency is further improved.

[0069] In one embodiment, the liquid inlet passage 11 is defined with a liquid inlet direction X, the second heat dissipation pieces 4 extend along the liquid inlet direction X, and the size of the liquid inlet opening 13 in the liquid inlet direction X matches the size of the second heat dissipation pieces 4.

[0070] Here, it can be understood that the cooling liquid flows from the liquid inlet opening 13 to the heat dissipation cavities 5, and the size of the second heat dissipation pieces 4 matches the size of the liquid inlet opening 13, so that the cooling liquid can smoothly enter the heat dissipation grooves 6 formed by the second heat dissipation pieces 4.

[0071] Through the above technical scheme, the heat dissipation efficiency is improved.

[0072] In one embodiment, a plurality of first heat dissipation pieces 3 are arranged in an array in the heat dissipation cavities 5.

[0073] Through the above technical scheme, the first heat dissipation pieces 3 are arranged in an orderly manner, which is beneficial to improve the uniformity of heat dissipation of the heat sink.

[0074] In a second aspect, a photographic equipment is provided, comprising the photographic equipment and the heat sink described above, and the heat sink is arranged on the photographic equipment.

[0075] Through the above technical scheme, on the basis of the advantages of the heat sink with the above embodiments, the photographic equipment of the present embodiment also has the advantage of being easy to manufacture.

[0076] The above description is only a preferred embodiment of the present application, and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat sink, characterized by, The heat sink comprises a shell (1), a cover (2) arranged on the shell (1), a plurality of first heat dissipation members (3) arranged between the shell (1) and the cover (2), and a plurality of second heat dissipation members (4) connected with the first heat dissipation members (3); a heat dissipation cavity (5) for containing cooling liquid is arranged between the shell (1) and the cover (2); a plurality of the first heat dissipation members (3) are arranged in the heat dissipation cavity (5) and connected with at least one of the shell (1) or the cover (2), and the first heat dissipation member (3) is a columnar member; a plurality of the second heat dissipation members (4) are arranged in the heat dissipation cavity (5) and connected with corresponding first heat dissipation members (3), and the second heat dissipation member (4) is a sheet-shaped member, and two adjacent second heat dissipation members (4) form a heat dissipation groove (6) in communication with the heat dissipation cavity (5). Each second heat dissipation member (4) is provided with a plurality of mounting holes (41) corresponding to the first heat dissipation members (3), and the first heat dissipation member (3) is inserted into the mounting hole (41) when the second heat dissipation member (4) is connected with the first heat dissipation member (3).

2. The heat spreader of claim 1, wherein, The first heat dissipation member (3) and the second heat dissipation member (4) are reflow soldering members.

3. The heat spreader of claim 2, wherein, Two adjacent second heat dissipation members (4) are arranged in parallel and at equal intervals, and the heat dissipation groove (6) formed between each group of two adjacent second heat dissipation members (4) has equal dimensions.

4. The heat spreader of claim 1, wherein, The shell (1) is provided with a liquid inlet channel (11) and a liquid outlet channel (12) in communication with the heat dissipation cavity (5), the liquid inlet channel (11) is provided with a liquid inlet opening (13) in communication with the heat dissipation cavity (5), and the liquid outlet channel (12) is provided with a liquid outlet opening (14) in communication with the heat dissipation cavity (5).

5. The heat spreader of claim 1, wherein, The shell (1) and the second heat dissipation member (4) form a liquid inlet cavity (15) and a liquid outlet cavity (16) in communication with the heat dissipation groove (6), the liquid inlet cavity (15) is located on one side of the second heat dissipation member (4), the liquid outlet cavity (16) is located on the other side of the second heat dissipation member (4), the liquid inlet opening (13) is in communication with the liquid inlet cavity (15), and the liquid outlet opening (14) is in communication with the liquid outlet cavity (16).

6. The heat spreader of claim 5, wherein, The heat sink comprises two groups of second heat dissipation members (4), each group of second heat dissipation members (4) comprises a plurality of second heat dissipation members (4) arranged in parallel and at equal intervals, and the two groups of second heat dissipation members (4) are located on the two sides of the liquid inlet opening (13) respectively.

7. The heat spreader of claim 6, wherein, The liquid inlet channel (11) defines a liquid inlet direction X, the second heat dissipation member (4) extends along the liquid inlet direction X, and the size of the liquid inlet opening (13) in the liquid inlet direction X matches the size of the second heat dissipation member (4).

8. The heat spreader of claim 6, wherein, A plurality of the first heat dissipation members (3) are arranged in an array in the heat dissipation cavity (5).

9. The heat sink of any one of claims 1 to 8, wherein, The heat sink is arranged on the photographic equipment.

10. A photographic apparatus characterized by comprising: ​

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