Stable chip resistor

Abstract

The utility model provides a stable chip resistor. The stable chip resistor comprises a substrate, a pair of back electrodes, a pair of front electrodes, a resistive layer, a protective layer and side electrodes, the protective layer comprises a first protective layer and a second protective layer; the first protection layer is arranged between the two front electrodes in a spanning manner so as to completely cover the resistance layer, the second protection layer covers the first protection layer, and the second protection layer forms at least two protection layer structures of which the sizes are gradually increased through two times of printing; the first protection layer is arranged in a crossing mode to completely cover the resistance layer, the influence of the external environment on the resistance layer is effectively isolated, resistance fluctuation caused by temperature and humidity changes is reduced, and particularly, the second protection layer is of an incremental structure formed through two times of printing, so that the thickness of the protection layer is increased, and the reliability of the protection layer is improved. And the overall impact resistance and wear resistance of the resistor are improved, the performance stability of the resistor is enhanced, and the service life of the resistor is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of resistor, specifically, relates to a stable patch resistor. BACKGROUND

[0002] The patch resistor is mainly applied to the automobile industry. In the domestic market, the existing resistor products are difficult to meet the performance test standard, and quality improvement is needed. In particular, the resistance instability of the existing patch resistor can cause current and voltage abnormalities, generate excessive heat to affect other related electronic components, and seriously affect driving safety. In addition, frequent resistance value changes can shorten the service life of the entire electronic component and increase the cost of maintenance and replacement. Therefore, the stability requirement of the patch resistor is becoming more and more stringent. SUMMARY

[0003] Therefore, the utility model aims at providing a stable patch resistor to solve the above problems.

[0004] The utility model adopts the following scheme:

[0005] The utility model provides a stable patch resistor, which comprises a substrate, a pair of back electrodes, a pair of front electrodes, a resistance layer, a protective layer and side electrodes. The resistance layer covers between the front electrodes, the protective layer covers on the resistance layer, the side electrodes are respectively arranged on opposite sides of the substrate, and are used for connecting the front electrodes and the corresponding back electrodes on the side. The protective layer comprises a first protective layer and a second protective layer. The first protective layer is arranged between the two front electrodes to completely cover the resistance layer, the second protective layer covers on the first protective layer, and the second protective layer forms at least two protective layer structures with increasing sizes through twice printing.

[0006] As a further improvement, the thickness of each protective layer is relatively uniform to reduce the slope between the protective layer and the front electrode.

[0007] As a further improvement, the first protective layer is composed of glass material, and the second protective layer is composed of at least two layers of epoxy resin material.

[0008] As a further improvement, the protective layer film thickness of the glass material is 15um, the protective layer film thickness of the first layer of epoxy resin material is less than 15um, and the protective layer film thickness of the second layer of epoxy resin material is greater than 15um.

[0009] As a further improvement, a third protective layer is formed on the uncovered front electrode, and the third protective layer is composed of resin silver material.

[0010] As a further improvement, the uncovered area is less than the covered area to increase the overlap area of the resistance layer and the front electrode.

[0011] As a further improvement, the third protective layer is arranged to intersect the side electrode.

[0012] As a further improvement, the resistance layer is cut by violet laser to form a laser cutting groove which is inwardly retracted relative to the folding line, so as to perform laser resistance adjustment.

[0013] As a further improvement, one protective layer structure is printed by a 250 mesh screen printing, and another protective layer structure is printed by a 325 mesh screen printing.

[0014] As a further improvement, the size of the first protective layer is increased to 0.65mm*1.17mm.

[0015] The application further provides a preparation method of a stable chip resistor, comprising the following steps:

[0016] S1: providing a substrate, forming back electrodes separated from each other on the lower surface of the substrate, and forming front electrodes separated from each other on the upper surface of the substrate;

[0017] S2: forming a resistance layer connected to the front electrodes;

[0018] S3: forming a first protective layer on the resistance layer, which is arranged between the front electrodes to completely cover the resistance layer;

[0019] S4: forming a second protective layer of at least two protective layer structures with increasing sizes on the first protective layer by twice printing;

[0020] S5: forming a third protective layer on the uncovered front electrodes correspondingly;

[0021] S6: performing sputtering along the side surface to form a side electrode connected to the front electrode and the corresponding side back electrode.

[0022] As a further improvement, in step S2, further comprising:

[0023] The resistance layer is cut by violet laser to form a laser cutting groove which is inwardly retracted relative to the folding line, so as to perform laser resistance adjustment.

[0024] As a further improvement, the parameters of the violet laser are as follows: wavelength 400nm, resistance 1MΩ, power 4W, speed 80mm / s, and pulse 220p / mm, so as to cut out a crack-free L-shaped laser cutting groove.

[0025] As a further improvement, in step S4, further comprising:

[0026] A protective layer structure is printed by a 250 mesh screen, and another protective layer structure is printed by a 325 mesh screen.

[0027] As a further improvement, the thickness of each protective layer is relatively uniform to reduce the slope between the protective layer and the front electrode.

[0028] As a further improvement, in step S5, further comprising:

[0029] A resin silver material is used as the third protective layer, and the third protective layer is subjected to hydrophobic treatment.

[0030] As a further improvement, the semi-finished product of the printed resin silver material is transported into the drying oven along a preset distance, the transmission speed is 250 mm / min, the leveling time is 4.4 min, and the sintering temperature is 220 DEG C.

[0031] By adopting the above technical scheme, the utility model can obtain the following technical effects:

[0032] 1. The stable chip resistor of the application, by the arrangement of the first protective layer to completely cover the resistance layer, effectively isolates the influence of the external environment on the resistance layer, reduces the resistance fluctuation caused by temperature and humidity changes, and especially, the increasing structure formed by twice printing of the second protective layer not only increases the thickness of the protective layer, but also improves the overall impact resistance and wear resistance of the resistor, and enhances the performance stability of the resistor, prolongs the service life.

[0033] 2. By the preparation method of the stable chip resistor, a plurality of protective layer structures are adopted to ensure the stability and reliability of the resistor, and the structure and performance of the resistor are optimized, from the treatment of the substrate to the formation of the resistance layer, to the printing of the multi-layer protective layer and the sputtering of the side electrode, the overall process flow helps to improve the durability and adaptability of the product, especially in harsh application environments such as automotive electronics, and the increasing structure formed by twice printing makes the manufacturing process more controllable, which helps to improve the consistency and quality of the product and reduce the defect rate in production. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 is a structural schematic view of the stable chip resistor of the embodiment of the utility model;

[0035] Figure 2 is Figure 1 a structural schematic view of the protective layer in

[0036] Figure 3 is a tangent line schematic view of the stable chip resistor of the embodiment of the utility model under the parameter of purple light laser;

[0037] Figure 4is a grinding schematic view of the third protective layer of the stable chip resistor after hydrophobic treatment in the embodiment of the utility model;

[0038] Figure 5 is a hydrophobic schematic view of the resistance layer after the third protective layer of the stable chip resistor is treated in the embodiment of the utility model;

[0039] Figure 6 is a structure block diagram of the preparation method of the stable chip resistor in the embodiment of the utility model;

[0040] Figure 7 is a flow chart of the preparation method of the stable chip resistor in the embodiment of the utility model.

[0041] Icon: 1 - substrate, 2 - back electrode, 3 - front electrode, 4 - resistance layer, 5 - first protective layer, 6 - second protective layer, 7 - third protective layer. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely in conjunction with the drawings in the embodiments of the utility model below, obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model.

[0043] EMBODIMENT

[0044] In conjunction with Figures 1 to 5 , the present embodiment provides a kind of stable chip resistor, including substrate 1, a pair of back electrode 2, a pair of front electrode 3, resistance layer 4, protective layer and side electrode (not shown in figure).

[0045] The resistance layer 4 is covered between the front electrode 3, the protective layer is covered on the resistance layer 4, and the side electrode is respectively configured on the opposite sides of the substrate 1, for electrode connection the front electrode 3 and corresponding side back electrode 2.

[0046] The protective layer includes first protective layer 5 and second protective layer 6, the first protective layer 5 is straddled between two front electrodes 3 to completely cover the resistance layer 4, the second protective layer 6 is covered on first protective layer 5, and the second protective layer 6 is formed by twice printing at least two protective layer structures with increasing size.

[0047] The stable chip resistor in the above description, by the placement of the first protective layer 5 to completely cover the resistance layer 4, effectively isolates the influence of the external environment on the resistance layer 4, reduces the resistance fluctuation caused by temperature and humidity changes, especially, the second protective layer 6 forms an increasing structure by twice printing, not only increases the thickness of the protective layer, but also improves the overall impact and wear resistance of the resistor, and enhances the performance stability of the resistor, prolongs its service life.

[0048] In this embodiment, the thickness of each protective layer is relatively uniform, so as to reduce the slope between the protective layer and the front electrode 3, so that the contact point step slope between the protective layer and the front electrode is reduced after printing, thereby reducing the current aggregation effect in this area and reducing the loss of electrical performance. And reducing the slope helps the protective layer to be more evenly distributed during printing, avoiding printing defects caused by uneven thickness, thereby improving the overall quality.

[0049] Preferably, the first protective layer 5 is composed of glass material, and the second protective layer 6 is composed of at least two layers of epoxy resin material. Therefore, by the first protective layer 5 of glass material and the second protective layer 6 of epoxy resin material, a multi-layer protection structure is formed to effectively prevent water vapor penetration and improve the stability and reliability of the resistor in a humid environment. The first protective layer 5 of glass material not only prevents moisture, but also provides excellent mechanical protection, which can resist external impact and pressure, so that the resistor remains intact and stable under harsh conditions. The second protective layer 6 of epoxy resin material has good electrical insulation, avoiding the risk of resistor failure due to leakage or short circuit, ensuring the stability of electrical performance. The double protection structure makes the resistor able to resist environmental factors for a long time, reduces the performance degradation caused by changes in external environment, thereby greatly prolonging the service life of the product.

[0050] Further, the protective layer film thickness of the glass material is 15um. The film thickness of the first layer of epoxy resin material protective layer is less than 15um, and the film thickness of the second layer of epoxy resin material protective layer is greater than 15um. Among them, the increasing film layer size of the second protective layer 6 can further effectively solve the problem of incomplete pattern during printing.

[0051] In the embodiment, the third protective layer 7 is formed on the uncovered front electrode 3, and the third protective layer 7 is composed of resin silver material. The uncovered area is smaller than the covered area, so as to increase the overlapping area of the resistance layer 4 and the front electrode 3. The third protective layer 7 intersects with the side electrode, which ensures the smooth transition of the electrode surface and the external electrical connection, reduces the problem of poor contact caused by height difference, and improves the electrical connection reliability of the resistor. The resin silver material has good conductivity and protection performance, which is applied to the third protective layer 7. The resin silver material not only provides additional physical protection for the electrode and further resists the moisture erosion of the electrode from the external environment, but also maintains the conductivity of the electrode, effectively preventing resistance change or failure caused by corrosion.

[0052] In the embodiment, the resistance layer 4 is cut by violet laser, so as to form a laser cutting groove which is relatively recessed from the grain line, thereby laser resistance is adjusted. On the one hand, the wavelength of violet light is shorter than that of red light. The shorter the wavelength, the higher the photon energy, and the stronger the focusing ability and the higher the energy density. Therefore, the violet light can more accurately act on the material during cutting, reduces the scattering and diffusion of energy, thereby reducing the thermal influence on the surrounding material, and further reducing the cracks generated by the cutting edge. On the other hand, the high energy density and precise focusing characteristics of violet light result in a smaller heat affected zone during cutting. The smaller heat affected zone means that the degree of thermal expansion and cooling shrinkage of the material is relatively small, which reduces the cracks caused by thermal stress. In addition, the high frequency characteristics of violet light enable it to complete the cutting process more quickly when interacting with the material, thereby reducing the sustained heating time of the material during cutting and reducing the generation of cracks.

[0053] In the embodiment, a protective layer structure is printed by a 250 mesh screen, and another protective layer structure is printed by a 325 mesh screen. Thus, two protective layer structures with different sizes and thicknesses are printed by screens with different meshes. At the same time, the knot effect between the two is reduced.

[0054] In the embodiment, the size of the first protective layer 5 is increased to 0.65mm*1.17mm. In the prior art, the size of the first protective layer 5 is 0.55mm*0.55mm. Thus, increasing the size of the first protective layer 5 enables the resistance layer 4 to be completely covered and extended to cover the front electrode 3, and enables the resistance layer 4 and the protective layer to cover more electrodes.

[0055] In a second aspect, in combination with Figure 6 and Figure 7 The embodiment further provides a preparation method of a stable patch resistor, comprising the following steps:

[0056] S1: providing a substrate 1, forming back electrodes 2 separated from each other on the lower surface of the substrate 1, and forming front electrodes 3 separated from each other on the upper surface of the substrate 1;

[0057] S2: forming a resistance layer 4 connected to the front electrodes 3;

[0058] S3: forming a first protective layer 5 on the resistance layer 4, which is placed between the front electrodes 3 to completely cover the resistance layer 4;

[0059] S4: forming a second protective layer 6 of at least two protective layer structures with increasing size on the first protective layer 5 by twice printing;

[0060] S5: forming a third protective layer 7 on the uncovered front electrodes 3;

[0061] S6: sputtering along the side to form a side electrode connecting the front electrodes 3 and the corresponding side back electrodes 2.

[0062] The use of multiple protective layer structures ensures the stability and reliability of the resistor, aiming to optimize the structure and performance of the resistor. From the processing of the substrate 1 to the formation of the resistance layer 4, to the printing of the multi-layer protective layer and the sputtering of the side electrode, the overall process helps to improve the durability and adaptability of the product, especially in harsh application environments such as automotive electronics, while the increasing structure formed by twice printing makes the manufacturing process more controllable, helping to improve the consistency and quality of the product, and reducing the defect rate in production.

[0063] In step S2, it also includes:

[0064] The resistance layer 4 is cut by purple laser to form a laser cutting groove with inwardly recessed opposite folding lines, so as to perform laser resistance adjustment.

[0065] Further, the parameters of the purple laser are wavelength 400 nm, resistance 1 MΩ, power 4 W, speed 80 mm / s, and pulse 220 p / mm, so as to cut out a crack-free L-shaped laser cutting groove. As shown in Figure 3 The cutting is performed by changing the color and wavelength of the laser light, and the final inspection shows that the cutting edge has no cracks.

[0066] In step S4, it also includes:

[0067] One protective layer structure is printed by a 250-mesh screen, and another protective layer structure is printed by a 325-mesh screen.

[0068] Preferably, the thickness of each protective layer is relatively uniform to reduce the slope between the protective layer and the front electrode 3.

[0069] In step S5, it also includes:

[0070] The third protective layer 7 is made of resin silver material and is subjected to hydrophobic treatment. The hydrophobic treatment can prevent water vapor from entering the resin layer, reduce resistance value change and performance degradation caused by water vapor, and improve the stability and reliability of the resistance in a humid environment. In a complex and changeable environment, the patch resistor subjected to hydrophobic treatment can better resist the influence of external adverse factors, reduce the probability of failure, and ensure normal operation and service life.

[0071] Further, the half-finished product of the printed resin silver material is transported into the drying furnace at a preset distance, the transmission speed is 250 mm / min, the leveling time is 4.4 min, and the sintering temperature is 220°C. After this process, as shown in FIG. 6, the third protective layer has no obvious bubbles in the grinding appearance. As shown in FIG. 7, the hydrophobicity of the resistor is particularly good. Figure 4 Figure 5

[0072] The above is only a preferred embodiment of the present application, and the protection scope of the present application is not limited to the above-mentioned embodiments. Any technical solution falling within the scope of the present application belongs to the protection scope of the present application.​​

Claims

1. A stable chip resistor comprising a substrate, a pair of back electrodes, a pair of front electrodes, a resistance layer, a protective layer, and side electrodes; characterized in that, The resistance layer covers between the front electrodes, the protective layer covers on the resistance layer, and the side electrodes are respectively arranged on the opposite sides of the substrate for connecting the front electrodes and the corresponding side back electrodes; The protective layer includes a first protective layer and a second protective layer; the first protective layer is arranged between the two front electrodes to completely cover the resistance layer, and the second protective layer covers on the first protective layer, and the second protective layer is formed by twice printing to form at least two protective layer structures with increasing sizes.

2. The stable chip resistor according to claim 1, characterized in that, The thickness of each protective layer is relatively uniform to reduce the slope between the protective layer and the front electrode.

3. The stable chip resistor according to claim 2, wherein The first protective layer is composed of glass material, and the second protective layer is composed of at least two layers of epoxy resin material.

4. The stable chip resistor of claim 3, wherein The film thickness of the protective layer of glass material is 15um; the film thickness of the first layer of protective layer of epoxy resin material is less than 15um, and the film thickness of the second layer of protective layer of epoxy resin material is greater than 15um.

5. The stable chip resistor of claim 1, wherein A third protective layer is formed on the uncovered front electrode, and the third protective layer is composed of resin silver material.

6. The stable chip resistor of claim 5, wherein The uncovered area is less than the covered area to increase the overlapping area of the resistance layer and the front electrode.

7. The stable chip resistor of claim 5, wherein The third protective layer intersects with the side electrode.

8. The stable chip resistor of claim 1, wherein The resistance layer is cut by purple laser to form a laser cutting groove with relatively inwardly recessed folding lines, so as to perform laser resistance adjustment.

9. The stable chip resistor of claim 1, wherein A protective layer structure is printed by a 250-mesh screen printing, and another protective layer structure is printed by a 325-mesh screen printing.

10. The stable chip resistor of claim 1, wherein The size of the first protective layer is increased to 0.65mm*1.17mm.

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