Integrated power supply module
By integrating power ICs and peripheral components onto a small PCB through integrated power modules, the problem of insufficient integration of power modules is solved, achieving both convenience and space saving.
Patent Information
- Application Number
- CN202520287917.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-22
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-02-22
AI Technical Summary
The integration of power modules on existing PCBs is insufficient, making rapid design iteration impossible and space utilization inefficient.
Design an integrated power module that integrates the power IC and peripheral components such as resistors, capacitors, inductors, and MOSFETs onto a small PCB. Current conduction and module mounting are achieved through conductive copper sheets and pad pins, and signals are extracted.
It improves the convenience and space utilization efficiency of the power module, and simplifies PCB design and iteration process.
Smart Images
Figure CN223809966U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of PCB power supply, especially relates to an integrated power module. BACKGROUND
[0002] The conventional power module on the PCB is usually to weld the power IC and peripheral devices (resistor, capacitor, inductor, MOS, etc.) on the board, and the integration degree is insufficient; and after a power supply scheme is designed for a product, due to the different sizes of the devices and the PCB mainboard, the power module cannot be quickly introduced into another product for application, and the iteration design convenience is insufficient. SUMMARY
[0003] The utility model discloses a kind of integrated power modules, to be able to regard entire power module as a material and directly apply to circuit design, greatly increase the convenience, while save a lot of space for PCB design.
[0004] To achieve the above object, the utility model provides an integrated power module, comprising:
[0005] Bottom layer circuit board, the bottom layer circuit board has front and back, the front is connected with multiple electronic components;
[0006] Top layer inductor, the top layer inductor is electrically connected to the bottom layer circuit board front, and multiple the electronic components are between the top layer inductor and the bottom layer circuit board.
[0007] In an embodiment of the utility model, the bottom layer circuit board front is provided with conductive copper sheet, and the conductive copper sheet is electrically connected to the top layer inductor.
[0008] In an embodiment of the utility model, multiple the electronic components at least include power IC, resistor, capacitor, inductor, MOS tube.
[0009] In an embodiment of the utility model, the bottom layer circuit board back is provided with solder pad pin corresponding to multiple the electronic components.
[0010] The utility model technical scheme is by the power IC and peripheral devices (resistor, capacitor, inductor, MOS, etc.) design to a small PCB, the input, output and control signal related to power supply are led out to the PCB bottom solder pad pin, actual use only needs to regard entire module as a material and directly apply to circuit design, greatly increase the convenience, while save a lot of space for PCB design. BRIEF DESCRIPTION OF DRAWINGS
[0011] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.
[0012] Fig. 1 The structure schematic view of the utility model is shown in the figure.
[0013] Fig. 2 The structure schematic view of the utility model is shown in the figure.
[0014] Explanation of reference numerals:
[0015] 1, bottom layer circuit board; 11, electronic components; 2, top layer inductor; 3, conductive copper sheet; 4, solder pad pin.
[0016] The realization, functional characteristics and advantages of the utility model will be further described with reference to the drawings in combination with embodiments. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.
[0018] With reference to Figs. 1-2 The utility model provides a kind of integrated power module, including bottom layer circuit board 1 and top layer inductor 2, bottom layer circuit board 1 has front and back, and front is connected with multiple electronic components 11;Top layer inductor 2 is electrically connected to the front of bottom layer circuit board 1, and multiple electronic components 11 are between top layer inductor 2 and bottom layer circuit board 1.
[0019] It can be understood that the entire power module is an integrated unit, contains multiple components, is integrated together by suitable wiring and connecting mode, realizes the function of power supply. This integrated module can reduce space occupation, improve the efficiency of power supply system, and reduce the complexity of assembly.
[0020] The bottom PCB 1 refers to a small PCB which carries various electronic components 11 in the power module. The bottom PCB 1 has a front side and a back side, which are used to arrange different electrical components. Inductor is a kind of electronic component, which is usually used for energy storage, filtering or adjusting current fluctuation. In this case, the top inductor 2 is located on the top of the bottom PCB 1 and is electrically connected thereto. The front side of the bottom PCB 1 is provided with a plurality of electronic components 11, such as resistors, capacitors, ICs, etc. These components are connected by circuits to realize the working of the power module; the back side is used to arrange pins which can be connected to other modules.
[0021] In the structure of the power module, between the front side of the bottom PCB 1 and the top inductor 2, a part of the electronic components 11 are arranged therebetween. These electronic components 11 are peripheral components of the IC, which are collectively integrated on the same small PCB to form an integral whole. In actual use, the entire module can be directly applied to the circuit design as a material, which greatly increases the convenience and saves a lot of space for the PCB design.
[0022] Referring to Figs. 1-2 In an embodiment of the present application, the front side of the bottom PCB 1 is provided with a conductive copper sheet 3 which is electrically connected to the top inductor 2.
[0023] It can be understood that the conductive copper sheet 3 is a copper layer for current conduction, which can exist as a wire or a connection point. Copper is a very good conductive material, and is therefore often used in the manufacture of circuit boards. On the front side of the bottom PCB 1, there is a specially designed copper sheet or copper layer, which is soldered together with the top inductor 2 through soldering to conduct current to the inductor.
[0024] Referring to Figs. 1-2 In an embodiment of the present application, the plurality of electronic components 11 at least include a power IC, a resistor, a capacitor, an inductor, and a MOS tube.
[0025] It can be understood that the power IC (Integrated Circuit) is an integrated circuit specially designed to handle power management, which can regulate, convert, and stabilize the power supply. The power IC usually has multiple functions, such as voltage reduction, voltage increase, and voltage stabilization. Resistance is an electronic component that limits the flow of current. It is used to adjust the current size or voltage division in the circuit, and plays a role in protecting the circuit, adjusting the current, or providing appropriate operating voltage for other components in the power module. Capacitors are energy storage components that store electric charge and are commonly used to smooth current, filter noise, or regulate voltage. In the power module, capacitors are often used for voltage stabilization, filtering, or buffering to maintain voltage stability or reduce power fluctuations. Inductance is a component used to store energy and regulate current fluctuations. The top inductor 2 mentioned earlier also plays a key role in this module. Inductors are commonly used for filtering and stabilizing current, especially in power modules, where inductors work together with capacitors to help the power supply output smoother current. MOS tubes are commonly used semiconductor devices used as switches or amplifiers. In the power module, MOS tubes are used to control the flow of current, especially as switching elements in power conversion circuits.
[0026] Referring to Figs. 1-2 In an embodiment of the present application, the bottom layer circuit board 1 has solder pad pins 4 on the back surface corresponding to the plurality of electronic components 11.
[0027] It can be understood that the solder pad pins 4 are used to quickly solder and install the entire power module on the PCB, which is very convenient.
[0028] The technical scheme of the utility model discloses that the power IC and peripheral devices (resistance, capacitance, inductance, MOS, etc.) are designed into a small PCB, and the input, output and control signals related to the power supply are led out to the solder pad pins 4 on the bottom of the PCB. In actual use, the entire module can be directly applied to the circuit design as a material, greatly increasing the convenience, and saving a lot of space for PCB design.
[0029] The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it should be understood that the orientations or positional relationships indicated by terms such as "upper", "lower", "left", "right" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationship in the drawings are only used for exemplary illustration, and cannot be understood as a limitation of the present patent. For those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances.
[0030] The above merely provides preferred embodiments of the present application, and is not used to limit the present application. Any modification, equivalent replacement, and improvement made in the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. An integrated power module, characterized by Comprising: A bottom layer circuit board (1) having a front side and a back side, the front side being connected with a plurality of electronic components (11); A top layer inductor (2) being electrically connected to the front side of the bottom layer circuit board (1), and a plurality of the electronic components (11) being between the top layer inductor (2) and the bottom layer circuit board (1).
2. The integrated power module of claim 1, wherein, The front side of the bottom layer circuit board (1) is provided with a conductive copper sheet (3) which is electrically connected to the top layer inductor (2).
3. The integrated power module of claim 2, wherein, The plurality of electronic components (11) at least includes a power IC, a resistor, a capacitor, an inductor, and a MOS tube.
4. The integrated power module of claim 3, wherein, The back side of the bottom layer circuit board (1) is provided with a solder pad pin (4) corresponding to the plurality of electronic components (11).