Jig bottom film structure with adsorption function
By employing vacuum adsorption and automatic cleaning mechanisms, the problems of damage during circuit board fixing and low debris cleaning efficiency have been solved, achieving a high-quality and efficient production process.
Patent Information
- Application Number
- CN202520008244.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-01-03
AI Technical Summary
Existing fixtures are prone to damaging circuit boards when fixing them for mounting, and cannot automatically clean up debris left over from the process, resulting in low production efficiency.
The circuit board patch is fixed by vacuum adsorption. The negative pressure generated by the electric vacuum pump is used to fasten it to the support column. The deformation of the rubber pad realizes automatic cleaning of debris. The suction of the vacuum pump is used to collect the dust and debris into the storage box.
This avoids damage to circuit boards caused by mechanical clamping, achieves automatic cleaning, and improves the quality and efficiency of production and processing.
Smart Images
Figure CN223809980U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to jig bottom film field, especially in a kind of jig bottom film structure with adsorption function. BACKGROUND
[0002] With the continuous development of manufacturing industry, the precision and quality requirements of product are higher and higher. In order to ensure the accuracy and consistency of workpiece in processing, assembling, detecting and other links, special jig is needed to provide stable support and positioning, and jig bottom film structure emerges as the times require as an important part.
[0003] In prior art, jig bottom film structure needs to fix workpiece or product placed on jig, to ensure that displacement or deformation does not occur in processing process, for example, jig for circuit board patch, in mechanical processing, the jig is fixed by clamping parts, so as to realize the fixation of circuit board patch, but the fixation of circuit board patch by clamping parts is easy to damage circuit board patch, thereby affecting product quality, in addition, the existing jig cannot automatically clean the debris left in processing process in time, and manual cleaning is needed, which reduces production and processing efficiency.
[0004] Therefore, it is necessary to provide a jig bottom film structure with adsorption function to solve the above problems. CONTENT OF UTILITY MODEL
[0005] The utility model aims at providing a jig bottom film structure with adsorption function to solve the problems that fixation of circuit board patch by clamping parts is easy to damage circuit board patch, thereby affecting product quality, in addition, the existing jig cannot automatically clean the debris left in processing process in time, and manual cleaning is needed, which reduces production and processing efficiency.
[0006] To achieve the above object, the utility model provides the following technical scheme: a jig bottom film structure with adsorption function, including base plate, the top of base plate is fixedly installed with support element, the top of support element is fixedly installed with support column, the support column is hollow structure, and the top of support column is communicated with outside, the number of support column is multiple, multiple support columns are arrayed on support element, the top of support element is provided with sliding slot, multiple sliding slots are arrayed on support element, one end of sliding slot is downwardly arranged, and the inner wall of sliding slot is provided with discharge hole at one end arranged downwardly.
[0007] The substrate is a hollow structure, and an inner cavity of the substrate and the material discharge hole are in communication with each other, the substrate is internally provided with vacuum chambers, a plurality of vacuum chambers are arranged in an array in the substrate, one end of the support column is in communication with the vacuum chamber, a first pipeline is fixedly installed on one side of the vacuum chamber, the first pipeline is in communication with the plurality of vacuum chambers, the first pipeline is located in the substrate, an electric vacuum pump is fixedly installed in the substrate, an output end of the electric vacuum pump is in communication with the first pipeline, and a second pipeline is fixedly installed in the substrate, and two adjacent vacuum chambers are in communication with each other through the second pipeline.
[0008] Preferably, a through groove is arranged on the support column and close to the top of the support column, and a rubber pad is arranged in the through groove, a plurality of rubber pads are arranged in an array on the support column, and the support column penetrates through the upper surface of the support element.
[0009] Preferably, a positioning block is fixedly installed on the support element, the positioning block is fixedly installed on four corners of the support element, and a buffer pad is fixedly installed on the positioning block.
[0010] Preferably, a receiving box is slidably installed in the substrate, a top surface of the receiving box is provided as an opening, the receiving box is oppositely arranged relative to the material discharge hole, one side of the substrate is provided with an opening, and the receiving box corresponds to the opening.
[0011] Preferably, a ventilation groove is arranged on the side surface of the substrate, connecting pieces are fixedly installed on both sides of the substrate, and threads are arranged in the connecting pieces.
[0012] The technical effects and advantages of the utility model are as follows:
[0013] The electric vacuum pump is used for pumping out air in the vacuum chamber, when all the air in the vacuum chamber is pumped out, the circuit board patch on the support element is tightly adsorbed and fixed on the support column due to the fact that the atmospheric pressure outside is higher than the air pressure in the vacuum chamber, thereby achieving the fixation of the circuit board patch, the circuit board patch is fixed by the vacuum adsorption in the utility model, damage to the circuit board patch caused by mechanical clamping fixation is avoided, and the processing quality is improved; after the processing of the circuit board patch is completed, the output power of the electric vacuum pump is increased, the suction force of the electric vacuum pump on the vacuum chamber is increased, the rubber pad on the support column is deformed, air enters the vacuum chamber, and the circuit board patch is conveniently taken out from the support element; in addition, the dust around the rubber pad and the debris of the circuit board patch are concentrated and fall into the chute due to the fact that the rubber pad is deformed, the dust and the debris enter the receiving box through the material discharge hole, and the purpose of automatic cleaning is achieved, manual cleaning is not needed, and the production and processing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS
[0014] Fig. 1 It is a jig bottom film structure schematic diagram with adsorption function of the utility model.
[0015] Fig. 2 It is a base plate structure schematic diagram of the utility model.
[0016] Fig. 3 It is a support column structure schematic diagram of the utility model.
[0017] In the figure: 1, base plate; 2, support element; 3, support column; 4, sliding groove; 5, discharge hole; 6, positioning block; 7, buffer pad; 8, rubber pad; 9, electric vacuum pump; 10, first pipeline; 11, vacuum chamber; 12, second pipeline; 13, storage box; 14, opening; 15, connecting piece; 16, ventilation slot. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0019] The utility model provides a kind of jig bottom film structure with adsorption function as shown in Figs. 1-3 Including base plate 1, the top of base plate 1 is fixedly installed with support element 2, and the workpiece to be processed is placed on the surface of support element 2 for circuit board patch processing.
[0020] In order to solve the problem that the circuit board patch is easily damaged by clamping the parts to fix the circuit board patch, thereby affecting the product quality, in addition, the existing jig cannot automatically clean the debris left during processing in time, manual cleaning is required, which reduces the production and processing efficiency, in the utility model, the top of support element 2 is fixedly installed with support column 3, support column 3 is a hollow structure, support column 3 has negative pressure, which can adsorb and fix the circuit board patch above support column 3, realize the purpose of adsorption and fixation, thereby replacing the mechanical clamping fixation mode in the prior art, which is not easy to damage the surface of circuit board patch.
[0021] It should be noted that, in the utility model, the inside of the base plate 1 is provided with a vacuum chamber 11, a plurality of vacuum chambers 11 are arranged in the inside of the base plate 1, the vacuum chamber 11 is communicated with one end of the supporting column 3, a first pipeline 10 is fixedly installed on one side of the vacuum chamber 11, the first pipeline 10 is communicated with the plurality of vacuum chambers 11, the first pipeline 10 is located in the base plate 1, an electric vacuum pump 9 is fixedly installed in the inside of the base plate 1, the output end of the electric vacuum pump 9 is communicated with the first pipeline 10, a second pipeline 12 is fixedly installed in the inside of the base plate 1, two adjacent vacuum chambers 11 are communicated with each other through the second pipeline 12, after the circuit board patch is placed on the supporting element 2, it needs to be adsorbed and fixed, the air suction function of the electric vacuum pump 9 extracts the air in the inside of the vacuum chamber 11 through the first pipeline 10, the plurality of vacuum chambers 11 are communicated with each other through the second pipeline 12, at this time, the external air pressure is higher than the air pressure in the inside of the vacuum chamber 11, so that the negative pressure is generated in the supporting column 3.
[0022] Further, the number of the supporting column 3 is multiple, and the supporting column 3 is arranged in an array on the supporting element 2, so that the adsorption and fixing effect of the circuit board patch is improved, and the stability is good.
[0023] In the utility model, the supporting column 3 is provided with a through slot at a position close to the top of the supporting column 3, a rubber pad 8 is arranged in the through slot, a plurality of rubber pads 8 are arranged in an array on the supporting column 3, and the supporting column 3 penetrates the upper surface of the supporting element 2, after the circuit board patch is processed, the output power of the electric vacuum pump 9 is improved, under the action of atmospheric pressure, the rubber pad 8 on the supporting column 3 is bent, so that a gap is generated between the rubber pad 8 and the circuit board patch, the external air enters the vacuum chamber 11 from the gap, so that the air pressure in the inside of the vacuum chamber 11 is consistent with the external air pressure, thereby facilitating the circuit board patch to be taken out from the supporting element 2.
[0024] The top of the supporting element 2 is provided with a sliding groove 4, a plurality of sliding grooves 4 are arranged in an array on the supporting element 2, one end of the sliding groove 4 is arranged downward, a discharge hole 5 is arranged on the inner wall of the sliding groove 4 at the downward end, the base plate 1 is a hollow structure, and the inner cavity of the base plate 1 is communicated with the discharge hole 5, in the process that the external air enters the vacuum chamber 11 from the gap, an air suction force is generated around the rubber pad 8, the dust around the rubber pad 8 can be sucked away, the dust sucked away falls into the sliding groove 4 under the action of gravity, because the sliding groove 4 is provided with an inclined downward slope, the dust is discharged from the discharge hole 5 through the inclined downward slope.
[0025] The inside of the substrate 1 is slidably mounted with a storage box 13, the top surface of the storage box 13 is provided as an opening, the storage box 13 is arranged opposite to the discharge hole 5, one side of the substrate 1 is provided with an opening 14, the storage box 13 corresponds to the opening 14, the dust discharged from the discharge hole 5 falls into the inside of the storage box 13 arranged opposite to the discharge hole 5, and the storage box 13 is taken out from the opening 14, so that the dust is conveniently collected and treated.
[0026] The supporting element 2 is fixedly mounted with a positioning block 6, the positioning block 6 is fixedly mounted on the four corners of the supporting element 2, and the positioning block 6 is fixedly mounted with a buffer pad 7. When the circuit board patch is processed, the positioning block 6 can accurately limit the position of the workpiece, so that the workpiece can be in the accurate position every time, thereby improving the precision and consistency of processing or detection. The buffer pad 7 is arranged to provide a buffering effect during processing, thereby further improving the processing quality of the circuit board patch.
[0027] The side surface of the substrate 1 is provided with a ventilation groove 16, and the two sides of the substrate 1 are fixedly mounted with connecting pieces 15, and the inside of the connecting piece 15 is provided with threads.
[0028] During the vacuum adsorption process, the ventilation groove 16 is arranged to make the inner cavity of the substrate 1 communicate with the outside, and to help the electric vacuum pump 9 dissipate heat, thereby prolonging the service life of the electric vacuum pump 9. The connecting piece 15 is arranged to facilitate the connection of the jig bottom film with external equipment, thereby improving the practicability of the jig bottom film.
Claims
1. A jig bottom film structure with adsorption function, comprising a substrate (1), characterized in that: The top of the substrate (1) is fixedly installed with a supporting element (2), the top of the supporting element (2) is fixedly installed with a supporting column (3), the supporting column (3) is a hollow structure, and the top of the supporting column (3) is connected with the outside, the number of the supporting column (3) is multiple, multiple supporting columns (3) are arranged on the supporting element (2), the top of the supporting element (2) is provided with a chute (4), multiple chutes (4) are arranged on the supporting element (2), one end of the chute (4) is arranged downward, and the inner wall of the chute (4) is provided with a discharging hole (5) at the downward end. The substrate (1) is a hollow structure, and the inner cavity of the substrate (1) is connected with the discharging hole (5), the inside of the substrate (1) is provided with a vacuum chamber (11), multiple vacuum chambers (11) are arranged in the substrate (1), the vacuum chamber (11) is connected with one end of the supporting column (3), the vacuum chamber (11) is fixedly installed with a first pipeline (10) on one side, the first pipeline (10) is connected with multiple vacuum chambers (11), the first pipeline (10) is located in the substrate (1), the inside of the substrate (1) is fixedly installed with an electric vacuum pump (9), the output end of the electric vacuum pump (9) is connected with the first pipeline (10), and the inside of the substrate (1) is fixedly installed with a second pipeline (12), and adjacent two vacuum chambers (11) are connected with each other through the second pipeline (12).
2. The jig bottom film structure with adsorption function according to claim 1, characterized in that: The supporting column (3) is provided with a through groove near the top of the supporting column (3), and the through groove is provided with a rubber pad (8), multiple rubber pads (8) are arranged on the supporting column (3), and the supporting column (3) penetrates the upper surface of the supporting element (2).
3. The jig bottom film structure with adsorption function according to claim 1, characterized in that: The supporting element (2) is fixedly installed with a positioning block (6), the positioning block (6) is fixedly installed on the four corners of the supporting element (2), and the positioning block (6) is fixedly installed with a buffer pad (7).
4. The jig bottom film structure with an adsorption function according to claim 1, characterized in that: The inside of the substrate (1) is slidably installed with a storage box (13), the top surface of the storage box (13) is provided as an opening, the storage box (13) is arranged opposite to the discharging hole (5), one side of the substrate (1) is provided with an opening (14), and the storage box (13) corresponds to the opening (14).
5. The jig bottom film structure with an adsorption function according to claim 1, characterized in that: The side surface of the substrate (1) is provided with a ventilation groove (16), and the two sides of the substrate (1) are fixedly installed with a connecting piece (15), and the inside of the connecting piece (15) is provided with a thread.