Radiator for electric load device and electronic equipment

Abstract

A heat radiator for an electric load device and an electronic device wherein the heat radiator comprises: a heat radiation main body having a hot end and a cold end opposite to each other, the hot end being used for thermally coupling with an electric load device, the heat radiation main body having an accommodating cavity extending from the hot end to the cold end; the containing cavity is filled with the phase change working medium, and the phase change working medium is at least converted between a gas state and a liquid state within a phase change temperature range; wherein the first end wall, provided with the hot end, of the heat dissipation body is recessed towards the containing cavity to form at least one assembly blind hole, and the assembly blind hole is used for fixing the electric load device. According to the technical scheme, the radiator capable of being used for the electric load device is easier to assemble, the production cost is lower, and the radiating effect is better.

Description

TECHNICAL FIELD

[0001] The utility model relates to electric load device technical field especially, it relates to a radiator for electric load device and electronic equipment. BACKGROUND

[0002] In electric load device, with the device made of LED (Light Emitting Diode, light emitting diode), IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor), MOS (Metal-Oxide-Semiconductor, metal oxide semiconductor field effect transistor) etc. as an example, high heat is a problem that can not be ignored. These devices will produce a large amount of heat in the working process, if not in time heat dissipation, will seriously affect the service life of electric load device, even lead to device damage. Therefore, the heat dissipation problem becomes one of the key factors restricting the performance improvement and wide application of electric load device.

[0003] At present, for electric load device, phase change radiator can consider heat dissipation effect and production cost to some extent. The advantage of phase change radiator lies in its high efficient heat dissipation performance and stable heat dissipation effect. Because phase change material can absorb a large amount of heat in the phase change process, therefore can significantly reduce the working temperature of electric load device, prolong its service life. At the same time, phase change radiator also has the advantages of small volume, light weight, easy to install, etc., suitable for various compact electronic equipment.

[0004] However, in phase change radiator, the thickness of the shell not only affects the cost and weight of the radiator, but also has a direct impact on its heat transfer efficiency. Although the thicker shell can provide better structural strength and sealing, it will also increase the cost and weight of the radiator, and reduce the heat transfer efficiency. Therefore, in order to realize more efficient heat dissipation and lower cost, the shell of the radiator is usually designed to be relatively thin.

[0005] However, the shell thinning also brings a series of problems. Because the shell is thin, it cannot be directly fixed and sealed by using screws and other penetrating connection methods. The cavity of phase change working medium must be sealed to prevent the leakage of phase change material, so the penetrating connection method such as screw is obviously not applicable. Other assembly methods in between are slightly weak, for example, although the adhesive method can realize sealing, it is easy to fail in high temperature environment, and the gluing process increases the process procedure, which is not conducive to mass production. In addition, other connection methods such as buckle and thread are also troublesome in the assembly process, which requires additional assembly time and tools, increasing the manufacturing cost and difficulty.

[0006] Therefore, how to realize efficient heat dissipation and stable sealing of the phase change heat sink while ensuring thin shell, low cost and light weight becomes a problem to be solved. Utility model content

[0007] The utility model solves the technical problem of providing a heat sink for electric load device and electronic equipment which is easier to assemble, has lower production cost and better heat dissipation effect.

[0008] To solve the above technical problem, the utility model embodiment provides a heat sink for electric load device, comprising: a heat dissipation main body having opposite hot end and cold end, the hot end is used for thermal coupling with an electric load device, the heat dissipation main body has the accommodation cavity extending from the hot end to the cold end;Phase change working medium is filled in the accommodation cavity, the phase change working medium is at least between gaseous state and liquid state in phase change temperature range;Wherein, the first end wall of the heat dissipation main body is recessed to form at least one assembly blind hole to the accommodation cavity, and the assembly blind hole is used to fix the electric load device.

[0009] Optionally, the assembly blind hole is formed by stamping process.

[0010] Optionally, the heat sink further comprises: a mounting medium piece arranged in the interior of the assembly blind hole, the mounting medium piece is fixed to the inner wall of the assembly blind hole, and the mounting medium piece is used to adapt to the fixing element for fixing the electric load device.

[0011] Optionally, the inner wall of the assembly blind hole and / or the outer wall of the mounting medium piece is provided with a limiting structure to fix the mounting medium piece to the inner wall of the assembly blind hole.

[0012] Optionally, a part of the inner wall of the assembly blind hole is recessed to form the limiting structure towards the mounting medium piece to limit the mounting medium piece.

[0013] Optionally, the inner wall of the assembly blind hole has a threaded structure, and the threaded structure is used for threaded connection with the fixing element for fixing the electric load device.

[0014] Optionally, the threaded structure on the inner wall of the assembly blind hole is formed synchronously or step by step by stamping process.

[0015] Optionally, the heat dissipation main body comprises: a heat dissipation shell, the cold end is located in the heat dissipation shell, and the heat dissipation shell has an opening on the side away from the cold end;Cover part, seal the opening, the first end wall is located in the cover part.

[0016] Optionally, the thickness of the wall of the heat dissipation main body is uniform.

[0017] Optionally, the wall of the heat dissipation main body has a thickness of 0.05-1mm.

[0018] Optionally, the material of the heat dissipation main body is selected from one of iron, copper, aluminum, iron alloy, copper alloy and aluminum alloy.

[0019] Optionally, the electrical load device is an LED lamp or a power semiconductor device.

[0020] To solve the above technical problem, the utility model embodiment further provides a kind of manufacturing method of heat sink for electrical load device, comprising: form heat dissipation main body, the heat dissipation main body has opposite hot end and cold end, the hot end is used to be thermally coupled with an electrical load device, the heat dissipation main body has from the hot end to the cold end containing cavity;Phase change working medium is filled in the containing cavity;At least one assembly blind hole is formed in the first end wall of the heat dissipation main body and is formed with the hot end, and the assembly blind hole is used to fix the electrical load device.

[0021] Optionally, the at least one assembly blind hole formed in the first end wall of the heat dissipation main body and is formed with the hot end includes: providing a profile as the first end wall;The profile is stamped to form the assembly blind hole.

[0022] Optionally, after forming the at least one assembly blind hole, the method further comprises: placing a mounting medium in the assembly blind hole;The mounting medium is fixed to the inner wall of the assembly blind hole, and the mounting medium is used to adapt to the fixing element for fixing the electrical load device.

[0023] Optionally, the mounting medium is fixed to the inner wall of the assembly blind hole includes: extruding the part wall of the first end wall and is formed with the assembly blind hole, so that the part wall of the first end wall and is formed with the assembly blind hole is recessed to form a limiting structure towards the mounting medium, and the limiting structure limits the mounting medium.

[0024] Optionally, at the same time or after forming the at least one assembly blind hole, the method further comprises: stamping a threaded structure on the inner wall of the assembly blind hole, and the threaded structure is used to be screwed with the fixing element for fixing the electrical load device.

[0025] To solve the above technical problem, the utility model embodiment further provides an electronic device, comprising electrical load device;The heat sink described above.

[0026] Compared with the prior art, the technical scheme of the utility model embodiment has the following beneficial effects:

[0027] To solve the above technical problems, the utility model discloses a heat sink for electric load device, comprising: the heat sink main part has opposite hot end and cold end, the hot end is used for with an electric load device thermal coupling, the heat sink main part has the containing cavity that extends from the hot end to the cold end;Phase change working medium, fill in the containing cavity, the phase change working medium is at least in the phase change temperature range between gaseous state and liquid state conversion;Wherein, the heat sink main part forms the first end wall of the hot end recesses and forms at least one assembly blind hole to the containing cavity, and the assembly blind hole is used for fixing the electric load device.

[0028] Adopt the technical scheme of the application, through the combination of the heat sink main part, the phase change working medium and the assembly blind hole, realize high -efficient heat dissipation. The hot end of the heat sink main part is thermally coupled with the electric load device, effectively conducts heat to the phase change working medium, absorbs heat through the phase change process of the phase change working medium, and releases heat through the cold end of the heat sink main part. Thus, high -efficient heat dissipation effect can be realized. Further, the assembly blind hole is formed in the first end wall, so that the electric load device can be stably connected to the heat sink. Further, the fixing element of the electric load device and the assembly blind hole are connected outside the containing cavity, which does not affect the air tightness of the containing cavity.

[0029] Further, the assembly blind hole is formed by stamping process. Thus, the processing flow of the heat sink can be simplified, the production cost is reduced, and the economic benefit of the heat sink is improved.

[0030] Further, the fixing element of the electric load device and the mounting medium are connected, and are indirectly connected to the inner wall of the assembly blind hole through the mounting medium. Thus, the mounting medium can strengthen the stability of the connection between the fixing element and the inner wall of the assembly blind hole. At the same time, by using the mounting medium, the complexity of the assembly blind hole structure can be further simplified.

[0031] Further, the thickness of the wall of the heat sink main part is uniform, and the thickness of the wall of the heat sink main part is 0.05-1mm. Thus, on the one hand, the heat dissipation effect of the heat sink main part with thin wall is better, which is conducive to enhancing the heat dissipation effect. On the other hand, the sheet-shaped profile is easier to stamp, which can reduce the production cost. In addition, the smaller thickness can further reduce the overall weight of the heat sink, so as to further improve the lightweight degree. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 is a schematic view of a heat sink for electric load device of the utility model embodiment;

[0033] Figure 2 is Figure 1 the structure shown in the direction of A-A is the sectional view;

[0034] Figure 3 is Figure 1A schematic view of an inner wall of the blind hole assembly forming a limiting structure;

[0035] Figure 4 is a flow chart of a manufacturing method of the heat sink for the electrical load device according to an embodiment of the present application. DETAILED DESCRIPTION

[0036] As mentioned in the background, the existing heat sink for the electrical load device has a large thickness of the shell for assembly with the electrical load device, high production cost and insufficient heat dissipation efficiency.

[0037] To solve the above technical problems, the present application provides a heat sink for an electrical load device, comprising: a heat dissipation main body having opposite hot and cold ends, the hot end being used for thermal coupling with an electrical load device, the heat dissipation main body having a containing cavity extending from the hot end to the cold end; a phase change working medium filled in the containing cavity, the phase change working medium being converted between gaseous and liquid states at least in a phase change temperature range; wherein a first end wall of the heat dissipation main body forming the hot end is recessed towards the containing cavity to form at least one assembly blind hole, the assembly blind hole being used for fixing the electrical load device.

[0038] The technical scheme of the present application realizes efficient heat dissipation through the combination of the heat dissipation main body, the phase change working medium and the assembly blind hole. The hot end of the heat dissipation main body is thermally coupled with the electrical load device, effectively conducting heat to the phase change working medium, absorbing heat through the phase change process of the phase change working medium, and releasing heat through the cold end of the heat dissipation main body. Thus, efficient heat dissipation effect can be achieved. Further, the assembly blind hole is formed in the first end wall, so that the electrical load device can be stably connected to the heat sink. Further, the fixing element of the electrical load device and the assembly blind hole are connected outside the containing cavity, which does not affect the air tightness of the containing cavity.

[0039] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0040] Figure 1 is a schematic view of a heat sink 100 for an electrical load device 200 according to an embodiment of the present application, Figure 2 is Figure 1 is a sectional view along the direction A-A of the structure shown.

[0041] in combination with Figure 1 and Figure 2The heat sink 100 for the electric load device 200 can include: a heat sink body 10 having opposite hot end 101 and cold end 102, the hot end 101 is used to be thermally coupled with an electric load device 200, the heat sink body 10 has a containing cavity 1 extending from the hot end 101 to the cold end 102; phase change working medium filled in the containing cavity 1, the phase change working medium at least in the phase transition temperature range between the gaseous state and the liquid state; wherein the first end wall 2 of the heat sink body 10 forming the hot end 101 is recessed to form at least one assembly blind hole 3 towards the containing cavity 1, the assembly blind hole 3 is used to fix the electric load device 200.

[0042] Wherein, the electric load device refers to an element or device for consuming or absorbing electric energy in the circuit. These devices can have different characteristics and functions according to different application requirements.

[0043] In an optional embodiment, the electric load device is an LED lamp or a power semiconductor device. Further, the power semiconductor device can include an insulated gate bipolar transistor (IGBT) or a power metal oxide semiconductor field effect transistor (power MOS tube) and the like.

[0044] In some embodiments, the first end wall 2 and at least a part of the surface of the electric load device 200 are in close contact, which can ensure the close contact between the hot end of the shell and the electric load device, and improve the heat conduction efficiency.

[0045] In some embodiments, the heat sink body 10 can include: a heat sink shell 5, the cold end 102 is located in the heat sink shell 5, and the side of the heat sink shell 5 away from the cold end 102 has an opening; a cover part 6 sealing the opening, and the first end wall 2 is located in the cover part 6.

[0046] In some embodiments, the heat sink shell 5 has a main body part 51 and at least one heat dissipation part 52 protruding outward from a first side 511 of the main body part 51. Further, the containing cavity 1 includes an evaporation cavity 11 defined by the main body part 51, and a condensation cavity 12 defined by each heat dissipation part 52. Each condensation cavity 12 is in communication with the evaporation cavity 11, and the evaporation cavity 11 has an opening on a second side 512 of the main body part 51 opposite to the first side 511; a cover part 6 sealing the opening.

[0047] Further, the cover part 6 can be thermally coupled with an electric load device 200.

[0048] Further, the condensation cavity 12 and / or the evaporation cavity 11 are filled with phase change working medium.

[0049] In some embodiments, the main body 51 has a first side 511 and a second side 512 opposite to each other, wherein the second side 512 is closer to the heat source than the first side 511, the heat source being the electrical load device 200 to be cooled. In other words, in a specific application scenario, the heat generated by the electrical load device 200 is transferred to the second side 512 of the main body 51 by thermal conduction.

[0050] Furthermore, the cover portion 6 is disposed on the second side 512 of the main body portion 51 and is thermally coupled to the electrical load device 200. Furthermore, a hot end 101 is formed in the cover portion 6, and at least a portion of the cover portion 6 forms a first end wall 2.

[0051] Furthermore, the heat dissipation housing 5 is indirectly thermally coupled to the electrical load device 200 through the cover portion 6.

[0052] Furthermore, the main body 51 defines an evaporation chamber 11, and at least one heat dissipation portion 52 disposed on the first side 511 of the main body 51 defines a condensation chamber 12. In other words, the evaporation chamber 11 is closer to the hot end 101 than the condensation chamber 12.

[0053] Furthermore, the phase change working fluid is capable of changing between gaseous and liquid states within at least the phase change temperature range, and flows back and forth between the evaporation chamber 11 and the condensation chamber 12.

[0054] In a specific application scenario, the initial state of the phase change working fluid can be, for example, liquid. The liquid phase change fluid is placed in the evaporation chamber 11 and is closer to the second side 512 than the first side 511. The electrical load device 200, acting as a heat source, transfers heat to the phase change working fluid via heat transfer, causing the phase change working fluid temperature to rise and gradually vaporize (or evaporate), absorbing heat in the process. The gaseous phase change working fluid diffuses from the evaporation chamber 11 in the opposite direction to the first direction D1 to at least one condensation chamber 12 (e.g., Figure 2 (As shown by the dashed arrow). The first direction D1 is in the same direction as the direction from the cold end 101 to the hot end 102.

[0055] Furthermore, because it is far from the heat source, the temperature inside the condensing chamber 12 is lower than the temperature inside the evaporating chamber 11. The heat carried by the gaseous phase change working fluid is dissipated in the condensing chamber 12, and the temperature gradually decreases until it re-condenses (or liquefies) into a liquid phase change working fluid. Further, the liquid phase change working fluid flows back into the evaporating chamber 11 (e.g., Figure 2 (As indicated by the solid arrow), to continue absorbing heat and vaporizing (or evaporating). Thus, during the cyclical phase change process, the phase change working fluid continuously carries the heat from the heat source to the condensation chamber, and then transfers it to the external environment through the heat dissipation section 52.

[0056] In some embodiments, the phase change working medium can be selected from alcohol such as ethanol, methanol and related mixtures, or the type of the phase change working medium can be determined according to specific application scenarios.

[0057] Further, the boiling point of the phase change working medium should be less than the maximum temperature threshold at which the electrical load device 200 can stably work, so as to ensure that the temperature of the electrical load device 200 is always kept below the maximum temperature threshold.

[0058] In some embodiments, the evaporation cavity 11 and the condensation cavity 12 can be vacuum cavities before being filled with the phase change working medium. In this way, the normal work of the phase change working medium can be ensured without being affected by mixed air or other substances.

[0059] In some embodiments, the heat dissipation shell 5 and the cover 6 can be made of materials with high thermal conductivity such as aluminum alloy, stainless steel, copper and copper alloy, so as to ensure the heat dissipation efficiency of the heat sink 100.

[0060] With reference to Figure 1 and Figure 2 In some embodiments, the main body 51 and the heat dissipation part 52 are integrally formed. That is, the entire heat dissipation shell 5 is integrally formed. In this way, the integrally formed main body 51 and the heat dissipation part 52 can make the heat dissipation shell 5 have higher structural strength. Moreover, the integrally formed main body 51 and the heat dissipation part 52 are easier to manufacture, and the production of the entire heat dissipation shell 5 can be completed through fewer manufacturing steps. In this way, the manufacturing cost can be reduced, and the production efficiency can be improved.

[0061] In some embodiments, the main body 51 and the heat dissipation part 52 are formed synchronously or step by step through a stamping process. The stamping process is a commonly used metal processing method, which uses a die to apply external force to a metal plate on a press machine to make it plastically deform, so as to obtain a part with the required shape and size.

[0062] In a typical application scenario, a die with a specific shape can be selected according to actual production needs, and the die is used to stamp the main body 51 and the heat dissipation part 52 synchronously. In this way, the process steps can be simplified, and the production efficiency of the heat dissipation shell 5 can be improved.

[0063] In another typical application scenario, the main body 51 can be formed by stamping with one die, and the heat dissipation part 52 can be formed by stamping with another die. In this way, the step-by-step stamping of the heat dissipation shell 5 can improve the yield and reduce the risk of profile breakage in the stamping process.

[0064] In other embodiments, the heat dissipation shell 5 can also be integrally formed by processes such as vacuum forming, hot pressing or injection molding.

[0065] With reference toFigure 2 The cover part 6 comprises a plate part 61 and a flange 62 extending from the outer edge of the plate part 61 in the first direction D1. The heat dissipation shell 5 comprises an extension wall 53 extending from the plane of the plate part 61 in the first direction D1. At least a portion of the flange 62 and at least a portion of the extension wall 53 are seamlessly fitted. In this way, the flange 62 and the extension wall 53 in face-to-face contact can strengthen the connection between the heat dissipation shell 5 and the cover part 6, and enhance the connection stability of the heat dissipator 100. Further, the face-to-face contact between the flange 62 and the extension wall 53 has a better sealing effect than other contact modes (such as line contact). The face-to-face contact can provide a larger contact area, thereby increasing the reliability and stability of the sealing, avoiding accidental leakage of the phase change working medium, and effectively reducing the performance decline or failure risk caused by poor sealing.

[0066] In some embodiments, the seamless connection between the flange 62 and the extension wall 53 can be achieved by welding or multiple crimping processes, etc.

[0067] Further, the plate part 61 can be used to form the first end wall 2. In other words, the at least one assembly blind hole 3 can be formed in the plate part 1.

[0068] In some embodiments, in combination with Figure 2 and Figure 3 , the first end wall 2 is recessed towards the accommodating cavity 1 to form at least one assembly blind hole 3, and the assembly blind hole 3 is used to fix the electrical load device 200.

[0069] Specifically, the electrical load device 200 can have a fixing element 201, at least a portion of which can be inserted into the assembly blind hole 3 and directly or indirectly fixedly connected with the inner wall of the assembly blind hole 3.

[0070] In some embodiments, the assembly blind hole 3 is formed by a stamping process. In this way, the production process can be simplified. Compared with the process of forming an assembly blind hole by drilling in the prior art, the scheme of forming the assembly blind hole 3 by the stamping process allows the thickness of the first end wall 2 (and the wall of the entire heat dissipation main body 10) to be further reduced. For example, in the prior art, the shell thickness of the heat dissipation radiator formed by drilling to form an assembly blind hole needs to be greater than the depth of the processed assembly blind hole (for example, at least 1-2 centimeters), which not only causes an increase in production cost, but also causes an increase in the overall weight of the heat dissipation radiator and a decrease in the heat dissipation effect. However, in the scheme of forming the assembly blind hole 3 by the stamping process in the present application, the wall of the heat dissipation main body 10 can be thinned to 0.05-1 millimeters, thereby reducing the production cost, reducing the overall weight of the heat dissipation radiator 100, and optimizing the heat dissipation effect of the heat dissipation radiator 100. As a preferred embodiment, the heat dissipation radiator can be made of a thin and ductile material (for example, tinplate, white iron sheet, low-carbon cold-rolled sheet, etc.). Specifically, the heat dissipation shell 5 and the cover portion 6 can be formed by the stamping process based on the thin material, and the sealing between the heat dissipation shell 5 and the cover portion 6 can be achieved by a multiple edge rolling process. Such materials have a low cost, and the above processes are mature processes, which are conducive to greatly reducing the cost.

[0071] In some embodiments, the assembly blind hole 3 can also be formed by a process such as vacuum forming, hot pressing, or injection molding.

[0072] In some embodiments, the assembly blind hole 3 can be formed at the same time as the cover portion 6 is processed, or the cover portion 6 can be further processed to form the assembly blind hole 3 after the cover portion 6 is processed.

[0073] In some embodiments, the cover portion 6 is recessed towards the cold end 102 to form a recessed portion, and the recessed portion is adapted to receive at least a portion of the electrical load device 200.

[0074] Further, at least a portion of the side wall of the cover portion 6 forming the recessed portion and the side wall of the main portion 51 forming the evaporation cavity 11 form an annular cavity 13, and the annular cavity 13 is adapted to form a portion of the evaporation cavity 111. In this way, the annular cavity 13 surrounds the heat source (for example, the electrical load device 200), which can increase the area of heat exchange between the phase change working medium and the heat source, and further optimize the heat dissipation effect.

[0075] In some embodiments, the heat dissipation radiator 100 can further include a mounting medium 4 arranged inside the assembly blind hole 3, the mounting medium 4 being fixed to the inner wall 31 of the assembly blind hole 3, and the mounting medium 4 being adapted to fit with the fixing element 201 fixing the electrical load device 200.

[0076] Specifically, in combination with Figure 2 and Figure 3The outer circumferential surface of the mounting medium 4 can be tightly fitted with the inner wall 31 of the assembly blind hole 3. In this way, it can be ensured that the mounting medium 4 is firmly installed in the assembly blind hole 3, and further, it can be ensured that the electrical load device 200 can be firmly connected with the heat sink 100 through the mounting medium 4.

[0077] In some embodiments, the mounting medium 4 can also be formed with a mounting hole 41 extending along the first direction D1, and at least a portion of the fixing element 201 of the electrical load device 200 can be inserted into the mounting hole 41.

[0078] In an optional embodiment, the mounting hole 41 can be a threaded hole for example, and the fixing element 201 can be a bolt or screw for example, and the outer circumferential surface of the fixing element 201 can be threadedly fitted with the inner wall of the mounting hole 41.

[0079] In some embodiments, the mounting medium 4 can be made of elastic material, and the diameter of the mounting hole 41 can be slightly smaller than the diameter of the fixing element 201. In this way, when the fixing element 201 is inserted into the mounting hole 41, the mounting medium 4 can be elastically deformed towards the inner wall 31 of the assembly blind hole 3, so that the connection between the mounting medium 4 and the inner wall 31 of the assembly blind hole 3 is more tightly and firmly.

[0080] In some embodiments, the inner wall 31 of the assembly blind hole 3 and / or the outer wall of the mounting medium 4 can be provided with a limiting structure 7 to fix the mounting medium 4 to the inner wall 31 of the assembly blind hole 3. In this way, the limiting structure 7 can effectively prevent the mounting medium 4 from accidentally coming out of the assembly blind hole 3, which can cause the electrical load device 200 to accidentally fall off and cause loss.

[0081] Specifically, referring to Figure 3 , a portion of the inner wall 31 of the assembly blind hole 3 is recessed towards the mounting medium 4 to form the limiting structure 7 to limit the mounting medium 4.

[0082] In some embodiments, the limiting structure 7 can be formed synchronously when the assembly blind hole 3 is processed. Alternatively, the limiting structure 7 can be processed on the inner wall 31 of the assembly blind hole 3 in advance before the mounting medium 4 is placed.

[0083] In a preferred embodiment, the limiting structure 7 can be formed after the mounting medium 4 is placed in the assembly blind hole 3. For example, after the mounting medium 4 is placed in the assembly blind hole 3, the portion of the first end wall 2 forming the assembly blind hole 3 can be extruded on the side facing away from the first direction D1, so that the inner wall 31 of the assembly blind hole 3 is plastically deformed and recessed towards the mounting medium 4 to form the limiting structure 7. In this way, the process of forming the limiting structure 7 is simpler, which is beneficial to improve the production and processing efficiency.

[0084] In some embodiments, the inner wall 31 of the assembly blind hole 3 has a threaded structure for threaded connection with the fixing element 201 for fixing the electrical load device 200.

[0085] Further, the threaded structure on the inner wall 31 of the assembly blind hole 3 is formed synchronously or step by step by a stamping process.

[0086] In other embodiments, the threaded structure can also be used as the limiting structure 7, and the outer peripheral surface of the mounting medium 4 can be threaded connected with the inner wall 31 of the assembly blind hole 3.

[0087] In some embodiments, the thickness of the wall of the heat dissipation main body 10 is uniform. Thus, the heat generated by the electrical load device 200 can be uniformly transmitted to the phase change working medium, optimizing the heat dissipation effect.

[0088] In some embodiments, the thickness of the wall of the heat dissipation main body 10 is 0.05-1 mm. Thus, the material can be saved, the production cost can be reduced, and the overall weight of the heat sink 100 can be reduced.

[0089] It should be understood that the thickness of the wall of the heat dissipation main body 10 is related to the actual size of the heat sink 100, and the thickness of the wall of the heat sink 100 for a larger size electrical load device 200 can be greater than the thickness of the wall of the heat sink 100 for a smaller size electrical load device 200.

[0090] In some embodiments, the material of the heat dissipation main body 10 is selected from one of iron, copper, aluminum, iron alloy, copper alloy, and aluminum alloy. Thus, the heat dissipation performance of the heat sink 100 can be ensured, the production process can be simplified, and the production cost can be reduced.

[0091] In some embodiments, the inner wall of the heat dissipation shell 1 can also be provided with a capillary structure (not shown in the figure), and the liquid phase change working medium is returned to the evaporation cavity 11 from the condensation cavity 12 under the action of the capillary structure. Thus, the circulation of the phase change working medium between the evaporation cavity 11 and the condensation cavity 12 can be accelerated, and the heat dissipation effect of the heat sink 100 can be optimized.

[0092] It should be understood that in the typical actual application of the heat sink 100 in the embodiments of the present application, the evaporation cavity 11 is located below the condensation cavity 12 in the direction of gravity. In some actual application scenarios, the heat sink 100 can also need to be inclined or inverted, at this time, the capillary structure provided on the inner wall of the heat dissipation shell 1 can play a guiding role to make at least part of the liquid phase change working medium return to the evaporation cavity 11 against gravity.

[0093] The technical scheme of the application realizes high-efficiency heat dissipation through the combination of the heat dissipation main body 10, the phase change working medium and the assembly blind hole 3. The hot end of the heat dissipation main body 10 is in thermal coupling with the electrical load device 200, effectively conducts heat to the phase change working medium, absorbs heat through the phase change process of the phase change working medium, and releases heat through the cold end of the heat dissipation main body 10. Thus, high-efficiency heat dissipation effect can be achieved. Further, the assembly blind hole 3 is formed in the first end wall 2, so that the electrical load device 200 can be stably connected to the heat sink 100. Further, the fixing element 201 of the electrical load device 200 and the assembly blind hole 3 are connected outside the accommodating cavity 1, and do not affect the air tightness of the accommodating cavity 1.

[0094] Further, the assembly blind hole 3 is formed by a stamping process. Thus, the processing flow of the heat sink 100 can be simplified, the production cost is reduced, and the economic benefit of the heat sink 100 is improved.

[0095] Further, the fixing element 201 of the electrical load device 200 and the mounting medium 4 are connected, and are connected to the inner wall 31 of the assembly blind hole 3 through the mounting medium 4. Thus, the mounting medium 4 can strengthen the stability of the connection between the fixing element 201 and the inner wall 31 of the assembly blind hole 3. At the same time, the use of the mounting medium 4 can further simplify the complexity of the structure of the assembly blind hole 3.

[0096] Further, the thickness of the wall of the heat dissipation main body 10 is uniform, and the thickness of the wall of the heat dissipation main body 10 is 0.05-1 mm. Thus, on the one hand, the heat dissipation effect of the heat dissipation main body 10 with a thinner wall is better, which is conducive to enhancing the heat dissipation effect. On the other hand, the sheet-shaped profile is easier to stamp, which can reduce the production cost. In addition, the overall weight of the heat sink 100 can be further reduced.

[0097] Reference Figure 4 The utility model embodiment further provides a kind of manufacturing method of heat sink for electrical load device, the method can be used to manufacture Figures 1 to 3 The above heat sink 100 shown in the figure.

[0098] Specifically, the method can include:

[0099] Step S1, form a heat dissipation main body, the heat dissipation main body has opposite hot end and cold end, the hot end is used to be in thermal coupling with an electrical load device, the heat dissipation main body has accommodating cavity from the hot end to the cold end;

[0100] Step S2, fill phase change working medium in the accommodating cavity;

[0101] Step S3, at least one assembly blind hole is formed in the first end wall of the heat dissipation main body and forms the hot end, and the assembly blind hole is used to fix the electrical load device.

[0102] The specific structure and working principle of the heat sink for the electric load device can be referred to the related description of the above embodiments, which will not be repeated here. Figures 1 to 3

[0103] In some embodiments, step S2 can be performed in a vacuum environment. In this way, the phase change working medium can be prevented from being contaminated by air, water vapor and other impurities, which can affect the phase change process and further affect the heat dissipation effect.

[0104] In some embodiments, step S3 can further include: stamping the first end wall to form the assembly blind hole. In this way, the assembly blind hole can be formed by stamping process, which can simplify the production and processing flow and reduce the production cost.

[0105] In some embodiments, after step S3 is performed, the method can further include:

[0106] placing a mounting medium in the assembly blind hole;

[0107] fixing the mounting medium to the inner wall of the assembly blind hole, the mounting medium being adapted to the fixing element for fixing the electric load device.

[0108] From the above, the mounting medium can be used to stably connect the electric load device and the assembly blind hole.

[0109] Further, fixing the mounting medium to the inner wall of the assembly blind hole includes: extruding the part of the first end wall forming the assembly blind hole, so that the part of the first end wall forming the assembly blind hole is recessed towards the mounting medium to form a limiting structure, and the limiting structure limits the mounting medium. In this way, the limiting structure can be formed by extrusion, so that the mounting medium is more firmly and stably accommodated in the assembly blind hole.

[0110] In some embodiments, the method can further include: stamping a threaded structure on the inner wall of the assembly blind hole at the same time or after forming the at least one assembly blind hole, the threaded structure being used for threaded connection with the fixing element for fixing the electric load device, and the electric load device 200 being connected to the assembly blind hole formed in the first end wall of the heat sink through the fixing element.

[0111] Embodiments of the present application also provide an electronic device. In combination with Figure 1 and Figure 2 , the electronic device includes an electric load device 200 and a heat sink 100 as described in the above embodiments. Figures 1 to 3

[0112] ​​It should be understood that the term "and / or" in this document is merely used to describe an associated relationship between associated objects, which means that there can be three relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone.

[0113] The relational terms herein, such as first, second, and the like, are used solely to distinguish one entity or action from another, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the words "comprises", "has", and "includes" and other similar forms are intended to be equivalent in meaning and open-ended, and one or more items listed after any of these words does not mean that the list is exhaustive of one or more items, or that only the listed one or more items can be used. In the drawings and specification, exemplary embodiments have been disclosed. However, many variations and modifications can be made to these embodiments. Accordingly, although specific terms are employed, they are used in a generic and descriptive sense only and not for purposes of limitation.

[0114] Although the utility model discloses as above, the utility model is not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be the range limited by claim.

Claims

1. A heat sink for an electrically loaded device, characterized in that The heat sink comprises: a heat sink body having opposite hot end and cold end, the hot end being configured to thermally couple with an electrical load device, the heat sink body having a receiving cavity extending from the hot end to the cold end; a phase change working medium filled in the receiving cavity, the phase change working medium being configured to change between gaseous state and liquid state at least in a phase change temperature range; wherein a first end wall of the heat sink body, in which the hot end is formed, is recessed towards the receiving cavity to form at least one assembly blind hole configured to fix the electrical load device.

2. The heat spreader of claim 1, wherein, The assembly blind hole is formed by a stamping process.

3. The heat spreader of claim 1, wherein, Further comprising: a mounting medium arranged inside the assembly blind hole, the mounting medium being fixed to an inner wall of the assembly blind hole, the mounting medium being configured to be adapted with a fixing element configured to fix the electrical load device.

4. The heat sink of claim 3, wherein, The inner wall of the assembly blind hole and / or the outer wall of the mounting medium is provided with a limiting structure to fix the mounting medium to the inner wall of the assembly blind hole.

5. The heat sink of claim 4, wherein, A portion of the inner wall of the assembly blind hole is recessed towards the mounting medium to form the limiting structure to limit the mounting medium.

6. The heat spreader of claim 1, wherein, The inner wall of the assembly blind hole is provided with a threaded structure configured to be screwed with the fixing element configured to fix the electrical load device.

7. The heat sink of claim 6, wherein, The threaded structure on the inner wall of the assembly blind hole is formed by a stamping process synchronously or step by step.

8. The heat spreader of claim 1, wherein, The heat sink comprises: a heat sink housing, the cold end being located in the heat sink housing, the heat sink housing having an opening on a side facing away from the cold end; a cover sealing the opening, the first end wall being located in the cover.

9. The heat spreader of claim 1, wherein, The thickness of the wall of the heat sink body is uniform; and / or the thickness of the wall of the heat sink body is 0.05-1 millimeter.

10. The heat sink of claim 9, wherein, The material of the heat sink body is selected from one of iron, copper, aluminum, iron alloy, copper alloy and aluminum alloy.

11. The heat spreader of claim 1, wherein, The electrical load device is an LED lamp or a power semiconductor device.

12. An electronic device, comprising: The heat sink comprises: an electrical load device; a heat sink as claimed in any one of claims 1 to 11.

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