Packaging structure of quantum chip

Abstract

The utility model discloses a quantum chip packaging structure, relates to the quantum chip packaging structure field, and comprises a bearing assembly and a packaging cover plate, the inner surface of the bearing assembly is fixedly provided with a silicon intermediary plate, and the bottom of the silicon intermediary plate is equidistantly provided with metal projections in an array mode; and a lower heat transfer assembly is fixedly mounted on the inner surface of the bearing assembly. According to the packaging structure of the quantum chip, a limiting groove is formed, so that a ceramic clamping block can be automatically inserted into an upper ceramic cooling fin when a worker installs a packaging cover plate to the top of a bearing assembly; and then the connecting block drives the arc-shaped clamping block to be automatically clamped into the arc-shaped clamping groove through the elastic force of the elastic buffering cushion, so that automatic locking work is completed, and due to the fact that the arc-shaped clamping block is arranged in an arc shape, the separation work between the lower heat transfer assembly and the upper heat transfer assembly can be rapidly completed when a worker forcibly pulls up the packaging cover plate; therefore, a worker can assemble and disassemble the packaging structure more conveniently.

Description

TECHNICAL FIELD

[0001] The utility model relates to quantum chip packaging structure field, concretely is a kind of quantum chip's packaging structure. BACKGROUND

[0002] Quantum chip is the core component of quantum computer, responsible for implementing the basic operation of quantum computing, unlike traditional computer chips, quantum chip uses the principle of quantum mechanics to process information, with potential computing power, and quantum chip is installed and used with packaging structure in actual use.

[0003] However, the current quantum chip packaging structure still has some deficiencies, such as the existing quantum chip packaging structure disassembly step is more cumbersome, which causes the staff to spend a long time when overhauling and replacing the quantum chip, thereby interfering with the assembly or repair efficiency of the staff, and thus there is a certain use defect.

[0004] Therefore, it is urgent to improve this defect, and the utility model provides a quantum chip packaging structure. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of quantum chip's packaging structure to solve the problems raised in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of quantum chip's packaging structure, including bearing assembly and packaging cover plate, the inner surface of the bearing assembly is fixedly installed with silicate interposer, and the bottom of silicate interposer is installed with metal protrusion in array type equidistance, and the inner surface of bearing assembly is fixedly installed with lower heat transfer component, and the inner surface of bearing assembly is clamped and installed with quantum chip body, the packaging cover plate is attached and installed at the top of bearing assembly, and the bottom of packaging cover plate is provided with positioning slot, and the inside of packaging cover plate is embedded and installed with upper heat transfer component.

[0007] Further, the bearing assembly contains packaging base, guide carrier plate and metal ball, and the bottom of the packaging base is fixedly installed with guide carrier plate, and the bottom of the guide carrier plate is installed with metal ball in array type equidistance, and the top of the guide carrier plate is connected with the bottom of the metal protrusion.

[0008] Further, the lower heat transfer component contains lower ceramic heat sink, ceramic clamping block, elastic buffer pad, connecting block and arc clamping block, and the top of the lower ceramic heat sink is fixedly installed with ceramic clamping block in symmetry, and the both sides of the ceramic clamping block are symmetrically installed with elastic buffer pad, and the outside of the elastic buffer pad is fixedly connected with connecting block, and the outside of the connecting block is symmetrically installed with arc clamping block.

[0009] Further, the outer side of the elastic buffer pad is fixedly connected with the inner side of the connecting block, the inner side of the elastic buffer pad is fixedly connected with the side of the ceramic clamping block, and the connecting block forms a fixed structure with the ceramic clamping block through the elastic buffer pad.

[0010] Further, the outer end of the quantum chip body is completely matched with the inner size of the positioning groove, and the quantum chip body forms a clamping structure with the packaging cover plate through the positioning groove.

[0011] Further, the upper ceramic heat dissipation fin comprises a limiting groove and an arc-shaped clamping groove, the bottom of the upper ceramic heat dissipation fin is provided with the limiting groove, and the inner surface of the limiting groove is symmetrically provided with the arc-shaped clamping groove.

[0012] Further, the number of the limiting grooves is two, and the two limiting grooves are symmetrically arranged at the bottom of the upper ceramic heat dissipation fin, and the arrangement positions of the limiting grooves correspond to the fixed positions of the ceramic clamping blocks.

[0013] Further, the inner size of the arc-shaped clamping groove is completely matched with the outer size of the arc-shaped clamping block, and the arc-shaped clamping block forms a clamping structure with the upper ceramic heat dissipation fin through the arc-shaped clamping groove.

[0014] The utility model provides a kind of packaging structure of quantum chip, with following beneficial effects:

[0015] 1, the utility model discloses limiting groove is set, so that staff can automatically insert ceramic clamping block into the inside of upper ceramic heat dissipation fin when installing packaging cover plate to the top of bearing assembly, then the elastic force of elastic buffer pad makes connecting block drive arc-shaped clamping block automatically enter the inside of arc-shaped clamping groove, to complete automatic locking work, since arc-shaped clamping block is arranged in arc, staff can also quickly complete the separation work between lower heat dissipation component and upper heat dissipation component when pulling packaging cover plate, so that staff is more convenient when disassembling packaging structure, to avoid staff to need to spend long time when quantum chip is overhauled and replaced, the assembly or maintenance efficiency of staff is disturbed.

[0016] 2, the utility model discloses lower heat dissipation component and upper heat dissipation component are set, so that the packaging structure can timely export the heat inside cavity after being assembled, to ensure the stability of quantum chip body when continuously operating. ACCURACY

[0017] Figure 1 It is a bottom split solid structure schematic diagram of the utility model packaging structure of quantum chip;

[0018] Figure 2The utility model relates to a packaging structure of quantum chip's front view three-dimensional structure schematic diagram.

[0019] Figure 3 The utility model relates to a packaging structure of quantum chip's Figure 1 The structure amplification schematic diagram of A in the middle.

[0020] In the drawing: 1, bearing assembly, 101, packaging base, 102, guide carrier plate, 103, metal ball, 2, silicon interposer, 3, metal protrusion, 4, lower heat transfer assembly, 401, lower ceramic heat sink, 402, ceramic clamping block, 403, elastic buffer pad, 404, connecting block, 405, arc clamping block, 5, quantum chip body, 6, packaging cover plate, 7, positioning groove, 8, upper heat transfer assembly, 801, upper ceramic heat sink, 802, limiting groove, 803, arc clamping groove. Specific embodiments

[0021] The embodiments of the utility model are further described in detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but cannot be used to limit the scope of the utility model.

[0022] As Figures 1-3As shown, a packaging structure of a quantum chip includes a bearing assembly 1 and a packaging cover plate 6, the inner surface of the bearing assembly 1 is fixedly installed with a silicon interposer 2, and the bottom of the silicon interposer 2 is arrayed and installed with metal bumps 3 at equal distances, and the inner surface of the bearing assembly 1 is fixedly installed with a lower heat transfer assembly 4, the lower heat transfer assembly 4 includes a lower ceramic heat sink 401, a ceramic clamping block 402, an elastic buffer pad 403, a connecting block 404 and an arc-shaped clamping block 405, the top of the lower ceramic heat sink 401 is fixedly installed with the ceramic clamping block 402 in a symmetrical manner, the two sides of the ceramic clamping block 402 are symmetrically installed with the elastic buffer pad 403, the outer side of the elastic buffer pad 403 is fixedly connected with the connecting block 404, the outer side of the elastic buffer pad 403 is fixedly connected with the inner side of the connecting block 404, the inner side of the elastic buffer pad 403 is fixedly connected with the side of the ceramic clamping block 402, and the connecting block 404 and the ceramic clamping block 402 constitute a fixed structure through the elastic buffer pad 403, the connecting block 404 in the fixed structure does not loosen when driving the arc-shaped clamping block 405 to be clamped and locked, the outer side of the connecting block 404 is symmetrically installed with the arc-shaped clamping block 405, the inner surface of the bearing assembly 1 is clamped and installed with a quantum chip body 5, the packaging cover plate 6 is attached and installed on the top of the bearing assembly 1, the bottom of the packaging cover plate 6 is provided with a positioning groove 7, and the inside of the packaging cover plate 6 is embeddedly installed with an upper heat transfer assembly 8, the upper heat transfer assembly 8 includes an upper ceramic heat sink 801, a limiting groove 802 and an arc-shaped clamping groove 803, the bottom of the upper ceramic heat sink 801 is provided with the limiting groove 802, the number of the limiting grooves 802 is two, the two limiting grooves 802 are symmetrically provided at the bottom of the upper ceramic heat sink 801, the provided position of the limiting grooves 802 corresponds to the fixed position of the ceramic clamping block 402, the inner surface of the limiting grooves 802 is symmetrically provided with the arc-shaped clamping groove 803, the inner dimension of the arc-shaped clamping groove 803 completely matches the outer dimension of the arc-shaped clamping block 405, and the arc-shaped clamping block 405 and the upper ceramic heat sink 801 constitute a clamping structure through the arc-shaped clamping groove 803, the arc-shaped clamping block 405 is clamped into the inside of the upper ceramic heat sink 801 to complete the locking work.

[0023] As Figure 1 and Figure 2As shown, the inner surface of the bearing assembly 1 is fixedly installed with a silicon intermediate plate 2, the bearing assembly 1 comprises a packaging base 101, a guide carrier plate 102 and metal balls 103, the bottom of the packaging base 101 is fixedly installed with the guide carrier plate 102, the bottom of the guide carrier plate 102 is installed with the metal balls 103 in an array and at equal distances, the top of the guide carrier plate 102 is connected with the bottom of the metal protrusions 3, the bottom of the silicon intermediate plate 2 is installed with the metal protrusions 3 in an array and at equal distances, the inner surface of the bearing assembly 1 is fixedly installed with a lower heat transfer assembly 4, the inner surface of the bearing assembly 1 is clampedly installed with a quantum chip body 5, a packaging cover plate 6 is connected with the top of the bearing assembly 1, the bottom of the packaging cover plate 6 is provided with a positioning groove 7, the upper end of the quantum chip body 5 is completely matched with the inside of the positioning groove 7, the quantum chip body 5 and the packaging cover plate 6 form a clamped structure through the positioning groove 7, the packaging cover plate 6 is sealed on the top of the bearing assembly 1 to complete the closing operation, and the inside of the packaging cover plate 6 is embeddedly installed with an upper heat transfer assembly 8.

[0024] In summary, the packaging structure of the quantum chip is first according to Figures 1-3 As shown in the structure, the staff clamps the quantum chip body 5 to the inside of the packaging base 101, then holds the packaging cover plate 6 and installs it to the top of the packaging base 101, at this time, the packaging cover plate 6 is clamped on the upper end of the quantum chip body 5 through the cooperation of the positioning groove 7, at this time, the ceramic clamping block 402 moves to the inside of the limiting groove 802 under the pressing of the packaging cover plate 6, when the ceramic clamping block 402 is completely moved into the inside of the limiting groove 802, the connecting block 404 drives the arc-shaped clamping block 405 to automatically clamp into the inside of the arc-shaped clamping groove 803, so as to complete the clamping and locking work, thereby automatically completing the clamping and packaging work, at this time, the upper end of the lower heat transfer assembly 4 is completely connected with the lower end of the upper heat transfer assembly 8, so that the lower heat transfer assembly 4 and the upper heat transfer assembly 8 can quickly conduct the heat inside the packaging structure under the cooperation of each other, so as to ensure the stability of the quantum chip body 5 during continuous operation.

[0025] The embodiments of the present application are given for the purpose of example and description, and are not exhaustive or limit the present application to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present application, and to enable those of ordinary skill in the art to understand the present application so as to design various embodiments with various modifications suitable for specific purposes.

Claims

1. A packaging structure of a quantum chip comprising a carrier assembly (1) and a packaging cover plate (6), characterized in that The inner surface of the bearing assembly (1) is fixedly installed with a silicon intermediate plate (2), the bottom of the silicon intermediate plate (2) is installed with metal protrusions (3) in an array and at equal distances, the inner surface of the bearing assembly (1) is fixedly installed with a lower heat transfer assembly (4), and the inner surface of the bearing assembly (1) is clampedly installed with a quantum chip body (5), the packaging cover plate (6) is attached to the top of the bearing assembly (1), the bottom of the packaging cover plate (6) is provided with a positioning groove (7), and the inside of the packaging cover plate (6) is embeddedly installed with an upper heat transfer assembly (8).

2. The packaging structure of a quantum chip according to claim 1, wherein, The bearing assembly (1) comprises a packaging base (101), a guide carrier plate (102) and metal balls (103), the bottom of the packaging base (101) is fixedly installed with the guide carrier plate (102), the bottom of the guide carrier plate (102) is installed with the metal balls (103) in an array and at equal distances, and the top of the guide carrier plate (102) is attached to the bottom of the metal protrusions (3).

3. The packaging structure of a quantum chip according to claim 1, wherein, The lower heat transfer assembly (4) comprises a lower ceramic heat dissipation fin (401), a ceramic clamping block (402), an elastic buffer pad (403), a connecting block (404) and an arc-shaped clamping block (405), the top of the lower ceramic heat dissipation fin (401) is fixedly installed with the ceramic clamping block (402) in a symmetrical manner, the two sides of the ceramic clamping block (402) are symmetrically installed with the elastic buffer pad (403), the outer side of the elastic buffer pad (403) is fixedly connected with the connecting block (404), and the outer side of the connecting block (404) is symmetrically installed with the arc-shaped clamping block (405).

4. The packaging structure of a quantum chip according to claim 3, wherein, The outer side of the elastic buffer pad (403) is fixedly connected with the inner side of the connecting block (404), the inner side of the elastic buffer pad (403) is fixedly connected with the side of the ceramic clamping block (402), and the connecting block (404) and the ceramic clamping block (402) form a fixed structure through the elastic buffer pad (403).

5. The packaging structure of a quantum chip according to claim 1, wherein, The upper end of the quantum chip body (5) is completely matched with the inside of the positioning groove (7), and the quantum chip body (5) and the packaging cover plate (6) form a clamping structure through the positioning groove (7).

6. The packaging structure of a quantum chip according to claim 3, wherein, The upper heat transfer assembly (8) comprises an upper ceramic heat dissipation fin (801), a limiting groove (802) and an arc-shaped clamping groove (803), the bottom of the upper ceramic heat dissipation fin (801) is provided with the limiting groove (802), and the inner surface of the limiting groove (802) is symmetrically provided with the arc-shaped clamping groove (803).

7. The packaging structure of a quantum chip according to claim 6, wherein, The number of the limiting grooves (802) is two, and the two limiting grooves (802) are symmetrically provided at the bottom of the upper ceramic heat dissipation fin (801), and the positions where the limiting grooves (802) are provided correspond to the fixed positions of the ceramic clamping blocks (402).

8. The packaging structure of a quantum chip according to claim 6, wherein, The inside of the arc-shaped clamping groove (803) is completely matched with the outside of the arc-shaped clamping block (405), and the arc-shaped clamping block (405) and the upper ceramic heat dissipation fin (801) form a clamping structure through the arc-shaped clamping groove (803).

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