Laser processing system

Abstract

The utility model provides a laser processing system which comprises a laser device, a first reflector path assembly located on an emergent light path of the laser device and used for improving laser energy density, and a second reflector path assembly located on an emergent light path of the first reflector path assembly and used for light spot shaping. And the mounting box is provided with a first mounting cavity for mounting the laser, a second mounting cavity for mounting the first reflector path assembly and a third mounting cavity for mounting the second reflector path assembly. According to the utility model, the consistency of light spots emitted by the laser processing system can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser adds light technical field, especially in kind, a laser processing system. BACKGROUND

[0002] For the higher precision requirement special processing scene, the laser spot shape of the laser from the laser processing system needs to be consistent and the laser energy needs to be concentrated. The existing laser processing system mainly includes a laser and an external light path component for adjusting the laser energy density and the laser spot shape. The laser and the external light path component are placed in two different cavities, so that the installation and adjustment of the external processing light path can not affect the normal work of the laser. However, the devices in the external light path component for adjusting the laser spot shape and the devices in the external light path component for adjusting the laser energy density are placed in the same cavity, and a large amount of heat generated by the devices in the external light path component for adjusting the laser energy density will affect the normal work of the devices in the external light path component for adjusting the laser spot shape, resulting in poor consistency of the laser spot shape of the laser from the external light path component. Therefore, it is necessary to improve the existing laser processing system to improve the consistency of the laser spot emitted by the laser processing system. SUMMARY

[0003] The utility model discloses a laser processing system, which can improve the consistency of the laser spot emitted by the laser processing system.

[0004] To solve the above technical problems, the utility model provides a kind of laser processing system, including laser, still including the first external light path component for improving laser energy density in the exit light path of the laser, the second external light path component for spot shaping in the exit light path of the first external light path component, and the installation box with the first installation cavity of installing the laser, the second installation cavity of installing the first external light path component and the third installation cavity of installing the second external light path component.

[0005] Optionally, the first installation cavity, the second installation cavity and the third installation cavity are installed on the same substrate, and the substrate is located in the installation box.

[0006] Optionally, the installation box further includes a water cooling cavity and a water cooler, the water cooler is installed in the water cooling cavity, the water cooling cavity is located on the first side of the substrate, and the first installation cavity, the second installation cavity and the third installation cavity are located on the second side of the substrate opposite to the first side.

[0007] Optionally, the first installation cavity is a solid cube, the second installation cavity is located on the first side of the first installation cavity, the third installation cavity is located on the second side of the first installation cavity, and the first side and the second side are adjacent.

[0008] Optionally, the first external optical path assembly comprises a first mirror group, a frequency doubling assembly and a first beam expander assembly, the first mirror group is located on the outgoing light path of the laser, the frequency doubling assembly is located on the outgoing light path of the first mirror, and the first beam expander assembly is located on the outgoing light path of the frequency doubling assembly.

[0009] Optionally, the second external optical path assembly comprises a second mirror group, a second beam expander assembly and a spot shaping assembly, the second mirror group is located on the outgoing light path of the first beam expander assembly, the second beam expander assembly is located on the reflected light path of the second mirror, and the spot shaping assembly is located on the outgoing light path of the second beam expander assembly.

[0010] Optionally, the laser processing system further comprises a power detection assembly, the power detection assembly is located in the second mounting cavity and on the outgoing light path of the second mirror group, and the second beam expander assembly is located on the outgoing light path of the power detection assembly.

[0011] Optionally, the laser processing system further comprises a power adjustment assembly and a controller for adjusting the light power of the outgoing laser of the power adjustment assembly according to the light power detected by the power detection assembly, the power adjustment assembly is located in the second mounting cavity and on the outgoing light path of the second mirror group, and the power detection assembly is located on the outgoing light path of the power adjustment assembly.

[0012] Optionally, the power adjustment assembly comprises a beam splitter and a quarter-wave plate with adjustable incident angle, the laser processing system further comprises an optical absorption cylinder and a motor for driving the quarter-wave plate to adjust the incident angle, the controller is connected with the motor, the quarter-wave plate is located on the outgoing light path of the second mirror group, the beam splitter is located on the outgoing light path of the quarter-wave plate, the power detection assembly is located on the refracted light path of the beam splitter, and the optical absorption cylinder is located on the reflected light path of the beam splitter.

[0013] Optionally, the laser processing system further comprises a third external optical path assembly, the third external optical path assembly is mounted outside the mounting box, and the third external optical path assembly is located on the outgoing light path of the second external optical path assembly.

[0014] The laser processing system has the following beneficial effects:

[0015] Since the laser is installed in the first installation cavity, the first external light path assembly is installed in the second installation cavity, and the second external light path assembly is installed in the third installation cavity, and the first external light path assembly is used to improve the laser energy density, and the second external light path assembly is used for spot shaping, the first external light path assembly for improving the laser energy density and the second external light path assembly for spot shaping can be placed in the second installation cavity and the third installation cavity respectively, so that the heat generated by the first external light path assembly when adjusting the energy density of the laser will not easily affect the consistency of the spot shaping of the second external light path assembly, thereby improving the consistency of the spot emitted by the laser processing system; in addition, since the laser, the first external light path assembly and the second external light path assembly are installed in different cavities respectively, the installation and debugging of the first external light path assembly and the second external light path assembly can avoid affecting the performance of the laser, and the installation and debugging of the second external light path assembly can avoid affecting the performance of the first external light path assembly. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic diagram of a laser processing system in the embodiment of the present application;

[0017] Figure 2 is a structural schematic diagram of a laser processing system in the embodiment of the present application.

[0018] BRIEF DESCRIPTION OF DRAWINGS:

[0019] 100- laser;

[0020] 210- first mirror group; 220- frequency doubling assembly; 230- first beam expander assembly;

[0021] 310- second mirror group; 320- second beam expander assembly; 330- spot shaping assembly;

[0022] 400- installation box; 410- first installation cavity; 420- second installation cavity; 430- third installation cavity;

[0023] 500- power detection assembly;

[0024] 600- power adjustment assembly;

[0025] 700- light absorption cylinder;

[0026] 810- galvanometer; 820- field lens. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0029] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0030] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships in which the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third", etc. are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0031] In addition, the terms "horizontal", "vertical", etc. do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0032] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the connection between two elements inside. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] ReferenceFigure 1 and Figure 2 , Figure 1 is a structure schematic diagram of a laser processing system in the embodiment of the utility model, Figure 2 is a structure schematic diagram of a laser processing system in the embodiment of the utility model, the embodiment provides a kind of laser processing system, including laser 100, the first outer light path component for improving laser energy density in the exit light path of the laser 100, the second outer light path component for facula shaping in the exit light path of the first outer light path component, and with the first installation cavity 410 of installing the laser 100, the second installation cavity 420 of installing the first outer light path component and the third installation cavity 430 of installing the second outer light path component of installation box 400.

[0034] Since the laser 100 is installed in the first installation cavity 410, the first outer light path component is installed in the second installation cavity 420 and the second outer light path component is installed in the third installation cavity 430, and the first outer light path component is used to improve the laser energy density, and the second outer light path component is used for facula shaping, so the first outer light path component for improving the laser energy density and the second outer light path component for facula shaping can be placed in the second installation cavity 420 and the third installation cavity 430 respectively, so that the heat generated by the first outer light path component when adjusting the energy density of the laser will not easily affect the consistency of the facula shaping of the second outer light path component, thereby improving the consistency of the facula emitted by the laser processing system. In addition, since the laser 100, the first outer light path component and the second outer light path component are installed in different chambers respectively, the installation and debugging of the first outer light path component and the second outer light path component can avoid affecting the performance of the laser 100, and the installation and debugging of the second outer light path component can avoid affecting the performance of the first outer light path component. For example, the laser 100 needs to be produced and debugged under vacuum conditions, and has high sealing performance requirements, the first outer light path component needs to be produced and debugged in a dust-free workshop, and the second outer light path component can be produced and debugged in a general clean room and a dust-free environment.

[0035] In the embodiment, the first installation cavity 410, the second installation cavity 420 and the third installation cavity 430 are installed on the same substrate, and the substrate is located in the installation box 400. In this way, the water cooling system can cool the first outer light path, the second outer light path and the laser.

[0036] Further, the mounting box 400 further comprises a water cooling cavity and a water cooler, the water cooler is installed in the water cooling cavity, the water cooling cavity is located at the first side of the base plate, and the first mounting cavity 410, the second mounting cavity 420 and the third mounting cavity 430 are located at the second side of the base plate opposite to the first side. In this way, the environmental consistency of the laser 100, the first external light path assembly and the second external light path assembly can be improved, and the stability of the laser processing system can be improved.

[0037] The first mounting cavity 410 is a three-dimensional cube, the second mounting cavity 420 is located at the first side of the first mounting cavity 410, the third mounting cavity 430 is located at the second side of the first mounting cavity 410, and the first side and the second side are adjacent. In this way, the second mounting cavity 420 and the third mounting cavity 430 are located at two sides of the first mounting cavity 410 respectively, and the two sides can connect the laser light path. In this way, the working of the second external light path assembly in the third mounting cavity 430 can be further avoided from being affected by the first external light path assembly in the second mounting cavity 420.

[0038] The first external light path assembly comprises a first mirror group 210, a frequency doubling assembly 220 and a first beam expander assembly 230, the first mirror group 210 is located on the outgoing light path of the laser 100, the frequency doubling assembly 220 is located on the outgoing light path of the first mirror, and the first beam expander assembly 230 is located on the outgoing light path of the frequency doubling assembly 220.

[0039] The second external light path assembly comprises a second mirror group 310, a second beam expander assembly 320 and a spot shaping assembly 330, the second mirror group 310 is located on the outgoing light path of the first beam expander assembly 230, the second beam expander assembly 320 is located on the reflected light path of the second mirror, and the spot shaping assembly 330 is located on the outgoing light path of the second beam expander assembly 320.

[0040] The laser sub-processing system further comprises a power detection assembly 500, the power detection assembly is located in the second mounting cavity 420 and on the outgoing light path of the second mirror group 310, and the second beam expander assembly 320 is located on the outgoing light path of the power detection assembly 500. In this way, the accuracy of the optical power detection assembly can also be avoided from being affected by the heat generated by the first external light path assembly.

[0041] Specifically, the power detection assembly 500 comprises a Buerger window and a photosensitive probe, the Buerger window is located on the outgoing light path of the second mirror group 310, the second beam expander assembly 320 is located on the transmission light path of the Buerger window, and the photosensitive probe is located on the reflected light path of the Buerger window.

[0042] Further, the laser sub-processing system further comprises a light barrier installed around the photosensitive probe. The light barrier installed around the photosensitive probe can block stray light from entering the photosensitive probe and affecting the accuracy of the photosensitive probe.

[0043] The laser sub-processing system further comprises a power adjustment assembly 600 and a controller for adjusting the light power of the laser emitted by the power adjustment assembly 600 according to the light power detected by the power detection assembly 500. The power adjustment assembly 600 is located in the second mounting cavity 420 and on the light path of the second mirror group 310. The power detection assembly 500 is located on the light path of the power adjustment assembly 600. In this way, the heat generated by the first external light path assembly can also avoid affecting the accuracy of the light power adjustment assembly.

[0044] Specifically, the power adjustment assembly 600 comprises a beam splitter and a quarter-wave plate with adjustable incident angle. The laser sub-processing system further comprises an optical absorption cylinder 700 and a motor for driving the quarter-wave plate to adjust the incident angle. The controller is connected to the motor. The quarter-wave plate is located on the light path of the second mirror group 310. The beam splitter is located on the light path of the quarter-wave plate. The power detection assembly 500 is located on the refracted light path of the beam splitter. The optical absorption cylinder 700 is located on the reflected light path of the beam splitter.

[0045] The laser sub-processing system further comprises a third external light path assembly. The third external light path assembly is installed outside the mounting box 400, and the third external light path assembly is located on the light path of the second external light path assembly.

[0046] Specifically, the third external light path assembly comprises a galvanometer 810 and a field lens 820. The galvanometer 810 is located on the light path of the second external light path assembly. The field lens 820 is located on the light path of the galvanometer 810.

[0047] In this embodiment, the light path principle of the laser sub-processing system is as follows:

[0048] The laser is emitted from the laser 100, enters the frequency doubling assembly 220 through the first mirror group 210, is adjusted in size for the first time through the first-level beam expander assembly 230, and then is emitted from the second mounting cavity 420, enters the power adjustment assembly 600 through the second mirror group 310, enters the power detection system, is adjusted in size for the second time through the second-level beam expander assembly 320, is folded back to enter the beam shaping assembly 330, and then enters the galvanometer 810 and the field lens 820.

[0049] The above description is only the description of the preferred embodiment of the utility model, and does not limit the utility model in any way, and any change and modification of the utility model according to the above disclosure by the ordinary skilled in the art of the utility model belongs to the protection scope of the claims.

Claims

1. A laser processing system comprising a laser, characterized in that, The laser processing system further comprises a first external optical path assembly for improving laser energy density located on the outgoing light path of the laser, a second external optical path assembly for spot shaping located on the outgoing light path of the first external optical path assembly, and a mounting box with a first mounting cavity for mounting the laser, a second mounting cavity for mounting the first external optical path assembly, and a third mounting cavity for mounting the second external optical path assembly.

2. The laser processing system of claim 1, wherein, The first mounting cavity, the second mounting cavity and the third mounting cavity are mounted on the same substrate, and the substrate is located in the mounting box.

3. The laser processing system of claim 2, wherein, The mounting box further comprises a water cooling cavity and a water cooler, the water cooler is mounted in the water cooling cavity, the water cooling cavity is located on the first side of the substrate, and the first mounting cavity, the second mounting cavity and the third mounting cavity are located on the second side of the substrate opposite to the first side.

4. The laser processing system of claim 1, wherein, The first mounting cavity is a three-dimensional cube, the second mounting cavity is located on the first side of the first mounting cavity, the third mounting cavity is located on the second side of the first mounting cavity, and the first side and the second side are adjacent.

5. The laser processing system of claim 1, wherein, The first external optical path assembly comprises a first mirror group, a frequency doubling assembly and a first beam expanding assembly, the first mirror group is located on the outgoing light path of the laser, the frequency doubling assembly is located on the outgoing light path of the first mirror, and the first beam expanding assembly is located on the outgoing light path of the frequency doubling assembly.

6. The laser processing system of claim 5, wherein, The second external optical path assembly comprises a second mirror group, a second beam expanding assembly and a spot shaping assembly, the second mirror group is located on the outgoing light path of the first beam expanding assembly, the second beam expanding assembly is located on the reflected light path of the second mirror, and the spot shaping assembly is located on the outgoing light path of the second beam expanding assembly.

7. The laser processing system of claim 6, wherein, The laser processing system further comprises a power detection assembly, the power detection assembly is located in the second mounting cavity and on the outgoing light path of the second mirror group, and the second beam expanding assembly is located on the outgoing light path of the power detection assembly.

8. The laser processing system of claim 7, wherein, The laser processing system further comprises a power adjustment assembly and a controller for adjusting the light power of the laser emitted by the power adjustment assembly according to the light power detected by the power detection assembly, the power adjustment assembly is located in the second mounting cavity and on the outgoing light path of the second mirror group, and the power detection assembly is located on the outgoing light path of the power adjustment assembly.

9. The laser processing system of claim 8, wherein, The power adjustment assembly comprises a beam splitter and a quarter-wave plate with adjustable incident angle, the laser processing system further comprises an optical absorption cylinder and a motor for driving the quarter-wave plate to adjust the incident angle, the controller is connected with the motor, the quarter-wave plate is located on the outgoing light path of the second mirror group, the beam splitter is located on the outgoing light path of the quarter-wave plate, the power detection assembly is located on the refracted light path of the beam splitter, and the optical absorption cylinder is located on the reflected light path of the beam splitter.

10. The laser processing system of claim 1, wherein, The laser processing system further comprises a third external optical path assembly, the third external optical path assembly is mounted outside the mounting box, and the third external optical path assembly is located on the outgoing light path of the second external optical path assembly.

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