Slide glass device of diffusion oxidation furnace
By designing a wafer carrier device with a frame and a U-shaped mesh substrate, and using return springs and ball bearings to hold the silicon wafers, combined with clamping adjustment and rotation drive components, the problem of uneven storage and diffusion of silicon wafers of different sizes was solved, and uniform oxidation diffusion of silicon wafers was achieved.
Patent Information
- Application Number
- CN202423302614.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2034-12-31
AI Technical Summary
The wafer carrier device of the existing diffusion oxidation furnace cannot accommodate the storage of silicon wafers of different sizes, and the silicon wafers are prone to sticking together, resulting in uneven diffusion oxidation.
A wafer carrier device including a frame and a U-shaped mesh carrier plate is designed. The carrier plate is provided with a lower positioning groove and a side positioning groove. The silicon wafer is clamped by a return spring and a ball bearing. The position of the silicon wafer is adjusted by a clamping adjustment component and a rotation drive component to ensure that the gap between the silicon wafers is evenly distributed.
It achieves applicability to silicon wafers of different sizes, avoids silicon wafer bonding, ensures uniform diffusion oxidation, and improves the uniformity of silicon wafer oxidation diffusion and production efficiency.
Smart Images
Figure CN223814946U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to diffusion oxidation technical field especially is concerned with a diffusion oxidation furnace's carrier device. BACKGROUND
[0002] Diffusion oxidation process is an important process in silicon wafer processing, and diffusion oxidation process refers to that the silicon wafer is placed into the reaction furnace of diffusion oxidation equipment with carrier device as carrier, nitrogen and diffusion source are introduced into the reaction furnace of diffusion oxidation equipment at a certain temperature, so as to diffuse and deposit PN junction on the surface of silicon wafer;
[0003] Referring to the diffusion oxidation furnace carrier device disclosed in Chinese patent authorized announcement No.CN215295835U, it comprises two end plates, two upper support rods and two lower support rods, the two upper support rods and the two lower support rods are connected between the two end plates to form a square frame structure, a plurality of upper support rods are arranged between the two upper support rods along the length direction of the upper support rods, a plurality of lower support rods are arranged between the two lower support rods along the length direction of the lower support rods, the lower part of the adjacent two upper support rods corresponds to the two lower support rods, and the four rods form a carrier storage area, and the distance between the two upper support rods in the carrier storage area is greater than the distance between the two lower support rods. The utility model solves the problem that the production capacity is limited in the same process time, and improves the process effect and process quality;
[0004] Through the above comparison file, it can be known that the prior art still has the following disadvantages: during the storage of the silicon wafer, the device can only store silicon wafers of a specific size, and it is difficult to adjust the storage size of the carrier device according to the size of the silicon wafer, which causes poor applicability of the existing carrier device, and when the silicon wafer is placed into the oxidation furnace through the carrier device for diffusion oxidation reaction, the adjacent silicon wafers may be in contact with each other, which may cause the contact surface of the adjacent silicon wafers to be difficult to diffuse and oxidize, and may cause uneven diffusion oxidation. UTILITY MODEL CONTENT
[0005] The utility model provides a diffusion oxidation furnace's carrier device, be useful to store various size's silicon wafer through carrier device, and be useful to guarantee the uniformity of silicon wafer diffusion oxidation.
[0006] In order to solve the problems in the prior art, the utility model discloses a diffusion oxidation furnace carrier device, which comprises a frame and a back-shaped mesh carrier plate, and the back-shaped mesh carrier plate is rotationally connected in the frame.
[0007] The back type mesh loading plate is internally fixed with a slide plate, a plurality of lower positioning grooves are formed in the slide plate, clamping plates are arranged at front and back of the slide plate, a plurality of positioning blocks arranged from left to right are fixed to inner sides of the clamping plates, side positioning grooves are formed in inner sides of the positioning blocks, contraction grooves are formed in left and right sides of inner walls of the side positioning grooves, return springs are connected to the contraction grooves, arc-shaped sliding blocks connected to the contraction grooves are connected to end portions of the return springs, and rolling balls located in the side positioning grooves are rotatably connected to inner sides of the arc-shaped sliding blocks.
[0008] The right wall in the frame is fixed with a heat shield, and a rotary driving assembly is arranged in the heat shield.
[0009] Further, the side positioning grooves are connected with buffer pads.
[0010] Further, the clamping adjusting assemblies each comprise a fixed plate, a threaded adjusting rod and two guide rods, the fixed plate is fixed to the upper end of the back type mesh loading plate, the threaded adjusting rod is rotatably connected to the outer side of the adjacent clamping plate, and the threaded adjusting rod is threadedly penetrated through the adjacent fixed plate.
[0011] Further, the two guide rods are fixed to the outer sides of the adjacent clamping plates and are slidably penetrated through the adjacent fixed plates.
[0012] Further, the rotary driving assembly comprises a motor, a main gear, a rotating shaft and a secondary gear, the motor is fixed to the right wall in the frame, and the main gear is connected to the power end of the motor.
[0013] Further, the rotating shaft is rotatably connected to the right wall in the frame, the secondary gear is fixedly sleeved to the periphery of the rotating shaft, the rotating shaft is rotatably penetrated out of the left surface of the heat shield, and the left end of the rotating shaft is fixed to the right end of the back type mesh loading plate.
[0014] Compared with the prior art, the present application has the following advantages:
[0015] 1. By inserting the silicon wafer into the corresponding lower positioning groove and side positioning groove, the silicon wafer is clamped and limited by the elastic force of the return spring and the rolling ball, the silicon wafer is placed neatly on the device, the clamping and positioning of all silicon wafers are quickly achieved by the work of the clamping adjusting assembly, the accidental falling of the silicon wafer is avoided, the clamping distance between the front and rear positioning blocks can be adjusted, the loading of other batches of silicon wafers of different sizes is facilitated, and the applicability of the slide plate device is effectively ensured.
[0016] 2. By setting a side positioning groove on the inner side of each positioning block, so that there is a gap between adjacent side positioning grooves, and after the silicon wafer is clamped by the positioning block, there is also a gap between adjacent silicon wafers, thereby avoiding the situation that adjacent silicon wafers are attached to each other, in combination with the working of the rotary driving assembly to drive the back-shaped mesh carrier plate and the silicon wafer to rotate, the uniformity of the contact reaction between nitrogen in the oxidation furnace and the silicon wafer is ensured, compared with the prior art, thereby facilitating more uniform oxidation diffusion of the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall top view structure of the utility model;
[0018] Figure 2 It is a schematic diagram of the A local enlarged structure of the utility model;
[0019] Figure 3 It is a schematic diagram of the B local enlarged structure of the utility model;
[0020] Figure 4 It is a schematic diagram of the back-shaped mesh carrier plate side view structure of the utility model;
[0021] Figure 5 It is a schematic diagram of the overall top view external structure of the utility model.
[0022] Figures 1-5 Middle: frame 1, back-shaped mesh carrier plate 2, carrier plate 3, clamping plate 4, threaded adjusting rod 5, guide rod 6, positioning block 7, side positioning groove 8, buffer pad 9, contraction groove 10, back spring 11, arc-shaped sliding block 12, ball 13, lower positioning groove 14, heat shield 15, motor 16, main gear 17, rotating shaft 18, blocking gear 19, fixed plate 20. DETAILED DESCRIPTION
[0023] A carrier device of a diffusion oxidation furnace:
[0024] As shown in Figures 1-5 The embodiment includes a frame 1 and a back-shaped mesh carrier plate 2, the back-shaped mesh carrier plate 2 is rotationally connected in the frame 1, the carrier plate 3 is fixed in the middle of the back-shaped mesh carrier plate 2, a plurality of lower positioning grooves 14 are formed in the carrier plate 3, clamping plates 4 are arranged on the front and rear of the carrier plate 3, a plurality of positioning blocks 7 are arranged in the clamping plates 4 from left to right, side positioning grooves 8 are formed in the positioning blocks 7, contraction grooves 10 are formed on the left and right sides of the inner wall of the side positioning grooves 8, back springs 11 are connected to the contraction grooves 10, arc-shaped sliding blocks 12 are slidingly connected to the ends of the back springs 11, and balls 13 are rotationally connected to the arc-shaped sliding blocks 12 in the side positioning grooves 8.
[0025] When the silicon wafer is loaded by the wafer device, the silicon wafer is inserted into the corresponding lower positioning groove 14 and the side positioning groove 8, and the silicon wafer is inserted into the side positioning groove 8 along the ball 13. By the rolling of the ball 13, the smoothness of the silicon wafer inserted into the side positioning groove 8 is ensured, and the silicon wafer pushes the ball 13 and the arc-shaped slider 12 into the contraction groove 10. The arc-shaped slider 12 compresses the return spring 11 until the silicon wafer is inserted into the corresponding lower positioning groove 14. At the same time, the elastic force of the return spring 11 drives the arc-shaped slider 12 and the ball 13 to reset, which is beneficial to clamping and limiting the silicon wafer by the elastic force of the return spring 11, so as to place the silicon wafer neatly on the device.
[0026] As shown in Figure 1 , 2 , in the embodiment, the front and rear parts of the upper end of the back-shaped mesh carrier plate 2 are provided with clamping adjusting assemblies. The clamping adjusting assemblies each include a fixed plate 20, a threaded adjusting rod 5, and two guide rods 6. The fixed plate 20 is fixed to the upper end of the back-shaped mesh carrier plate 2. The threaded adjusting rod 5 is rotationally connected to the outer side of the adjacent clamping plate 4 and is threaded through the adjacent fixed plate 20. The two guide rods 6 are fixed to the outer side of the adjacent clamping plate 4 and are slidably threaded through the adjacent fixed plate 20. The side positioning groove 8 is provided with a buffer pad 9.
[0027] When the silicon wafers are placed neatly, in order to prevent the silicon wafers from falling accidentally, the threaded adjusting rod 5 is twisted to drive the clamping plate 4 and the positioning block 7 to approach the front and rear ends of the silicon wafers. At the same time, the clamping plate 4 drives the guide rod 6 to slide along the fixed plate 20, which ensures the stability of the movement of the clamping plate 4 and the positioning block 7. Thus, the positioning block 7 can quickly clamp and position all the silicon wafers, avoiding the accidental falling of the silicon wafers. Since the buffer pad 9 is arranged in the side positioning groove 8, the buffer pad 9 is in contact with the silicon wafers when the positioning block 7 clamps the silicon wafers. The buffer pad 9 buffers the clamping of the silicon wafers, which prevents the damage of the silicon wafers.
[0028] As shown in Figure 1 , 2 , in the embodiment, the clamping adjusting assembly includes a fixed plate 20, a threaded adjusting rod 5, and two guide rods 6. The fixed plate 20 is fixed to the upper end of the back-shaped mesh carrier plate 2. The threaded adjusting rod 5 is rotationally connected to the outer side of the adjacent clamping plate 4 and is threaded through the adjacent fixed plate 20. The two guide rods 6 are fixed to the outer side of the adjacent clamping plate 4 and are slidably threaded through the adjacent fixed plate 20.
[0029] And when loading other batch size of silicon wafer, in order to make the wafer device can clamp other batch size of silicon wafer, screw the threaded adjusting rod 5 and drive the clamping plate 4 and the positioning block 7 to move forward and backward, so that the clamping spacing between the front and rear positioning blocks 7 can be adjusted conveniently, thus facilitating the loading of other batch size of silicon wafer by the wafer device, and effectively ensuring the applicability of the wafer device.
[0030] As shown in Figure 1 , 3 In this embodiment, the right wall in the frame 1 is fixed with a heat shield 15, the heat shield 15 is provided with a rotary drive assembly, the rotary drive assembly includes a motor 16, a main gear 17, a rotating shaft 18 and a secondary gear 19, the motor 16 is fixed to the right wall in the frame 1, the main gear 17 is connected to the power end of the motor 16, the rotating shaft 18 is rotatably connected to the right wall in the frame 1, the secondary gear 19 is fixedly sleeved on the periphery of the rotating shaft 18, the rotating shaft 18 rotatably penetrates out of the left side of the heat shield 15, and the left end of the rotating shaft 18 is fixed with the right end of the return type meshed carrier plate 2.
[0031] By setting a side positioning groove 8 on the inner side of each positioning block 7, there is a gap between adjacent side positioning grooves 8, and after the silicon wafer is clamped by the positioning block 7, there is also a gap between adjacent silicon wafers, so as to avoid the situation that adjacent silicon wafers are adhered to each other, which is beneficial to ensure the uniformity of silicon wafer diffusion oxidation, and the rotation of the main gear 17, the secondary gear, the rotating shaft 18, the return type meshed carrier plate 2, the clamping plate 4, the positioning block 7 and the silicon wafer driven by the motor 16, so that the silicon wafer can be fully contacted with nitrogen in rotation, which ensures the uniformity of the contact reaction between nitrogen and silicon wafer in the oxidation furnace, and compared with the prior art, the oxidation diffusion of the silicon wafer is more uniform.
Claims
1. A diffusion oxidation furnace's slide device, comprising a frame (1) and a back type mesh carrier plate (2), the back type mesh carrier plate (2) is rotationally connected in the frame (1), characterized in that: a slide plate (3) is fixed in the middle of the back type mesh carrier plate (2), a plurality of lower positioning grooves (14) are formed on the slide plate (3), and clamping plates (4) are arranged on the front and back of the slide plate (3), a plurality of positioning blocks (7) are fixed on the inner side of the clamping plates (4) from left to right, side positioning grooves (8) are formed on the inner side of the positioning blocks (7), contraction grooves (10) are formed on the left and right sides of the inner wall of the side positioning grooves (8), return springs (11) are connected to the contraction grooves (10), arc-shaped sliding blocks (12) are slidingly connected to the ends of the return springs (11), and rolling balls (13) are rotationally connected to the inner side of the arc-shaped sliding blocks (12) in the side positioning grooves (8); and clamping and adjusting assemblies are arranged on the front and back of the upper end of the back type mesh carrier plate (2). A heat shield (15) is fixed to the right wall in the frame (1), and a rotary driving assembly is arranged in the heat shield (15).
2. A carrier device for a diffusion oxidation furnace as defined in claim 1, characterized in that: The side positioning grooves (8) are connected with buffer pads (9).
3. A carrier device for a diffusion oxidation furnace as defined in claim 1, wherein: Each clamping and adjusting assembly comprises a fixed plate (20), a threaded adjusting rod (5), and two guide rods (6), the fixed plate (20) is fixed to the upper end of the back type mesh carrier plate (2), the threaded adjusting rod (5) is rotationally connected to the outer side of the adjacent clamping plate (4), and the threaded adjusting rod (5) is threaded through the adjacent fixed plate (20).
4. A carrier device for a diffusion oxidation furnace as defined in claim 3, wherein: The two guide rods (6) are fixed to the outer sides of the adjacent clamping plates (4) and are distributed left and right, and the guide rods (6) are slidingly threaded through the adjacent fixed plates (20).
5. A carrier device for a diffusion oxidation furnace as defined in claim 1, wherein: The rotary driving assembly comprises a motor (16), a main gear (17), a rotating shaft (18), and a secondary gear (19), the motor (16) is fixed to the right wall in the frame (1), and the main gear (17) is connected to the power end of the motor (16).
6. A carrier device for a diffusion oxidation furnace as defined in claim 5, wherein: The rotating shaft (18) is rotationally connected to the right wall in the frame (1), the secondary gear (19) is fixedly sleeved on the periphery of the rotating shaft (18), the rotating shaft (18) is rotationally threaded out of the left side of the heat shield (15), and the left end of the rotating shaft (18) is fixed to the right end of the back type mesh carrier plate (2).