Modularized assembly structure of automobile brake liquid level sensor

The modular assembly structure solves the problem of the difficulty in automating the production of existing liquid level sensors, enabling efficient and stable mass production and signal transmission.

CN223815153UActive Publication Date: 2026-01-20OUTDO ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202420161560.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-23
Publication Date
2026-01-20
Estimated Expiration
2034-01-23

AI Technical Summary

Technical Problem

The existing installation method of automotive brake fluid level sensors is complex, difficult to adapt to automated production, and requires a high degree of manual intervention.

Method used

The modular assembly structure includes a housing, an inner mold support, a circuit board, a reed switch, and pins. The inner mold assembly is assembled by snap-fitting and hot riveting. A contour groove and a silicone layer are set on the circuit board to facilitate mass production by automated equipment.

Benefits of technology

It has achieved efficient and stable automated production, improved production efficiency and yield, and ensured the stability and accuracy of signal transmission.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223815153U_ABST
    Figure CN223815153U_ABST
Patent Text Reader

Abstract

The utility model discloses a modular assembly structure of an automobile brake liquid level sensor, which comprises a shell, an installation cavity is arranged in the shell, one side of the installation cavity is provided with a butt-joint slot, and the butt-joint slot is communicated with the installation cavity; the inner mold bracket is clamped and fixed with the mounting cavity; the circuit board is clamped and fixed with the inner mold bracket; pins at two ends of the reed switch are welded and fixed with the circuit board; the contact pin is fixed with the inner mold bracket, the first end of the contact pin is electrically connected with the circuit board, and the second end of the contact pin is suspended in the opposite slot; modularized assembly is achieved, so that batch production and welding are facilitated through automatic equipment, production efficiency is high, and consistency is good.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of automobile parts, specifically relates to a modular assembly structure of automobile brake brake liquid level sensor. BACKGROUND

[0002] The liquid level sensor of automobile brake brake is mainly used for detecting the liquid level of brake fluid, and the change of liquid level is converted into an electric signal, which is then provided to the relevant electronic control system or brake fluid level display system. When the liquid level of brake fluid is lower than the set value, the relevant system will issue an alarm to remind the driver to add brake fluid in time.

[0003] The function of brake fluid level sensor is to ensure the normal operation of brake system. If the brake fluid is insufficient, it may cause poor brake effect and affect driving safety. Therefore, the driver should check the liquid level of brake fluid regularly to ensure that it is within the normal range.

[0004] This kind of liquid level sensor is usually composed of sensor body, float and metal shell. When the liquid level changes, the float will move up and down accordingly, so as to change the closing or opening of reed tube contact in the sensor body, and output the corresponding electric signal.

[0005] The principle of reed tube measuring liquid level is based on the interaction of magnetic field and electric current and the physical properties of liquid. In liquid level measurement, reed tube is usually used with float. When the liquid level changes, the float will move up and down accordingly, so as to change the magnetic field around the reed tube. This change will cause the contact in the reed tube to close or open, and then output the corresponding electric signal. Specifically, when the liquid level rises, the float rises accordingly, causing the magnetic field around the reed tube to change. This change causes the contact in the reed tube to close, outputting the corresponding electric signal. When the liquid level drops, the float drops accordingly, the magnetic field changes, the contact opens, and the electric signal is output. The method of reed tube measuring liquid level has the advantages of simple structure, stable performance, high precision, etc.

[0006] In the existing installation method of liquid level sensor, each element is usually assembled into the shell in a predetermined order, which has the problems of complex assembly process, small operation space and high degree of manual intervention, and is difficult to adapt to automatic production. SUMMARY

[0007] The utility model aims at the problems existing in the prior art, provides a modular assembly structure of automobile brake brake liquid level sensor, realizes modular assembly, so as to facilitate batch production welding by using automatic equipment, high production efficiency, good consistency.

[0008] To achieve the above object, the utility model adopts the technical scheme of:

[0009] A kind of modular assembly structure of automobile brake brake fluid level sensor, comprising: shell, the inside of the shell is equipped with installation cavity, the side of the shell is equipped with pair of insertion slot, the pair of insertion slot is communicated with the installation cavity;Inner mold support, the inner mold support is fixed with the installation cavity;Circuit board, the circuit board is fixed with the inner mold support;Reed, both ends pin of the reed is welded with the circuit board;Pin, the pin is fixed with the inner mold support, the first end of the pin is electrically connected with the circuit board, the second end of the pin is suspended in the pair of insertion slot.

[0010] The stem of the pin is equipped with several first insertion holes, the inner mold support is equipped with several vertical columns corresponding to the first insertion hole, the first insertion hole is inserted with the vertical column, and the first insertion hole is fixed by hot riveting with the vertical column.

[0011] The first end of the pin is connected with insertion rod, the circuit board is equipped with second insertion hole, the insertion rod is inserted with the second insertion hole, and electrical connection is realized.

[0012] The circuit board is equipped with profiled groove, the reed is embedded in the profiled groove, both ends pin of the reed is welded with the pad of the circuit board.

[0013] First silica gel layer is arranged between the profiled groove and the reed, and the reed is coated with second silica gel layer.

[0014] The inner mold support, the circuit board, the reed and the pin form an inner mold assembly, which is loaded into the installation cavity from the pair of insertion slot and is fixed with the installation cavity.

[0015] Epoxy resin layer is arranged between the inner mold assembly and the installation cavity.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] 1, both ends pin of reed is welded with circuit board first, pin is fixed with inner mold support, then circuit board is fixed with inner mold support, form inner mold assembly, inner mold assembly is loaded into shell installation cavity fixed with card, realize modular assembly, so as to facilitate the use of automatic equipment batch production welding, with the advantages of high production efficiency, good consistency, process production process controllable, high alarm precision, simple process, high yield;

[0018] 2, the profiled groove of circuit board is coated with silica gel, and then the reed is placed, after the glue is dry, the reed is fixed, so that the pin of the reed can be automatically welded by automatic equipment;

[0019] 3, the second silica gel layer cooperates with the first silica gel layer, completely covers the dry reed tube, and protects the dry reed tube from the influence of sensor vibration and thermal shrinkage of the epoxy resin at high and low temperatures. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is an exploded view of the liquid level sensor in an embodiment of the present application;

[0021] Figure 2 It is a perspective view of the inner mold assembly in an embodiment of the present application; wherein the dry reed tube is in a state of not being coated with silica gel;

[0022] Figure 3 It is a perspective view of the inner mold assembly in an embodiment of the present application; wherein the dry reed tube is in a state of being coated with silica gel;

[0023] Figure 4 It is an assembly view of the inner mold assembly and the shell in an embodiment of the present application;

[0024] Figure 5 It is a whole perspective view of the liquid level sensor in an embodiment of the present application; wherein the shell is in a state of being half-sectioned;

[0025] In the figure: 1, shell; 2, inner mold support; 3, circuit board; 4, dry reed tube; 5, pin; 501, plug rod; 6, profiling groove; 7, first silica gel layer; 8, second silica gel layer; 9, epoxy resin layer. DETAILED DESCRIPTION

[0026] The technical scheme of the present application will be described clearly and completely below in combination with the drawings in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the present application.

[0027] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0028] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. As "horizontal" merely means that it is more horizontal than "vertical", it does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0029] In the description of the utility model, it is necessary to point out that, unless there is definite stipulation and limitation, the terms "arrange", "install", "connect" and "connect" should be understood broadly, for example, it can be fixed connection, also can be detachable connection, or integrally connected, can be direct connection, also can be indirect connection through intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0030] As Figures 1 to 5 As shown in a kind of modular assembly structure of automobile brake brake fluid level sensor, comprising: shell 1, the inside of shell is equipped with installation cavity, one side of shell 1 is equipped with counter slot, counter slot is communicated with installation cavity;Inner mould support 2, inner mould support 2 is fixed with installation cavity;Circuit board 3, circuit board 3 is fixed with inner mould support 2;Reed 4, the both ends pin of reed 4 is welded with circuit board 3;Pin 5, pin 5 is fixed with inner mould support 2, the first end of pin 5 is electrically connected with circuit board 3, the second end of pin 5 is suspended in counter slot.

[0031] The both ends pin of reed 4 is welded with circuit board 3 first, pin 5 is fixed with inner mould support 2, then circuit board 3 is fixed with inner mould support 2, form inner mould assembly, the whole inner mould assembly is fixed with installation cavity of shell 1 again, realizes modular assembly, so as to facilitate the welding of automatic equipment batch production, production efficiency is high, consistency is good.

[0032] Among them, the clamping mode of inner mould assembly and shell 1, preferably, the clamping hook is arranged on inner mould support 2, the clamping groove is arranged on the inner wall of installation cavity, when the clamping hook is clamped into the clamping groove, it indicates that it is installed in place, and the operation logic is simple, which is convenient for being implemented by automatic equipment.

[0033] The clamping mode of circuit board 3 and inner mould support 2, preferably, a plurality of clamping holes are arranged in multiple directions on circuit board 3, a plurality of insertion rods are arranged on inner mould support 2, when the insertion rods are inserted into the clamping holes respectively, it indicates that it is installed in place, and the operation logic is simple, which is convenient for being implemented by automatic equipment.

[0034] In some embodiments, the rod of the pin 5 is provided with a plurality of first insertion holes, the inner mold support 2 is provided with a plurality of vertical columns corresponding to the first insertion holes one by one, the first insertion holes are inserted and matched with the vertical columns, and the first insertion holes and the vertical columns are fixed by hot riveting. By inserting and matching the pin 5 with the inner mold support 2 and then fixing by hot riveting, the stability of the installation of the pin 5 is ensured, the pin 5 will not shake and wear when the sensor vibrates, the stability of signal transmission is ensured, and meanwhile, the bearing capacity of the pin 5 is increased when the pin 5 is plugged into the external socket.

[0035] Hot riveting is a process method for permanently connecting two or more metal parts together by heating. In the hot riveting process, the connection parts of the two metal parts are denatured and even melted together by increasing the temperature, so as to realize the connection. Hot riveting is usually used to connect metal parts, especially those parts which need to bear high load or need to maintain connection for a long time.

[0036] In some embodiments, the first end of the pin 5 is connected with a plug rod 501, the circuit board 3 is provided with a second insertion hole, the plug rod 501 is inserted and matched with the second insertion hole, and electrical connection is realized. The pin 5 is inserted and matched with the second insertion hole of the circuit board 3 through the plug rod 501, only up-down displacement operation is needed to realize the connection, the operation is simple and convenient, and automatic assembly by automatic equipment is facilitated.

[0037] In some embodiments, the circuit board 3 is provided with a profiling groove 6, the reed switch 4 is embedded in the profiling groove 6, and the two end pins of the reed switch 4 are parallelly welded and fixed with the pads of the circuit board 3.

[0038] When the reed switch 4 is embedded in the profiling groove 6 provided on the circuit board 3, the profiling groove 6 plays a supporting and positioning role on the reed switch 4, that is, the position of the reed switch 4 relative to the circuit board 3 is fixed, so that the accuracy of the reed switch 4 in measuring the liquid level is ensured; since the shape of the reed switch 4 is a cylinder, the profiling groove 6 can be provided as a rectangular hole, and the width of the profiling groove 6 is less than the diameter of the reed switch 4, so that the depth of the lower half of the reed switch 4 embedded in the profiling groove 6 is adjusted, that is, the two end pins of the reed switch 4 are parallelly contacted with the upper end surface of the circuit board. By adjusting the shape and size of the profiling groove 6, the two end pins of the reed switch 4 are parallelly contacted with the circuit board 3, so that automatic welding of the pins and the contacts is facilitated, the contact accuracy and stability of the pins and the contacts are ensured, and the stability of signal transmission is ensured.

[0039] In some embodiments, a first silica gel layer 7 is arranged between the profiling groove 6 and the dry reed tube 4, and a second silica gel layer 8 is arranged outside the dry reed tube 4. The first silica gel layer 7 is coated in the profiling groove 6, then the dry reed tube 4 is placed, and after the glue is dry, the dry reed tube 4 is fixed in the profiling groove 6, so that the pins of the dry reed tube can be automatically welded by automatic equipment; the second silica gel layer 8 cooperates with the first silica gel layer 7 to completely cover the dry reed tube 4, thereby protecting the dry reed tube 4 from the influence of sensor vibration and thermal shrinkage of epoxy resin at high and low temperatures.

[0040] In some embodiments, the inner mold support 2, the circuit board 3, the dry reed tube 4, and the pin 5 form an inner mold assembly, the inner mold assembly is loaded into the mounting cavity from the opposite plug groove, and is clamped and fixed with the mounting cavity. The inner mold assembly is integrally loaded into the shell 1 in a nested manner, and after the inner mold assembly is assembled, it only needs to be clamped and pushed in one direction, which is simple to operate, has high standardization and process degree, and is convenient for batch operation of automatic equipment.

[0041] In some embodiments, an epoxy resin layer 9 is arranged between the inner mold assembly and the mounting cavity. The epoxy resin layer 9 plays a sealing and protection role to avoid water and dust from the outside entering the mounting cavity.

[0042] The installation method of the present application is that silica gel is coated in the profiling groove 6 of the circuit board 3, then the dry reed tube 4 is placed in the profiling groove 6, after the silica gel is solidified, the dry reed tube 4 is fixed in the profiling groove 6, then silica gel is coated outside the dry reed tube 4 to cover the dry reed tube 4; the pin 5 is inserted into the column of the inner mold support 2 and is fixed by hot riveting, the circuit board 3 is clamped on the inner mold support 2, and at the same time, the insertion rod 501 of the pin 5 penetrates through the second insertion hole of the circuit board 3 and is fixed by hot riveting to realize electrical connection; after the inner mold support 2, the circuit board 3, the dry reed tube 4, and the pin 5 form an inner mold assembly, the inner mold assembly is integrally nested into the shell 1, is clamped and fixed with the mounting cavity, and modular assembly is realized.

[0043] The working principle of the present application is that the sensor is installed in the brake fluid kettle, is connected with the opposite plug groove and the socket, when the liquid level of the brake fluid kettle rises and falls, the float ball in it also rises and falls, so that the float ball approaches or moves away from the dry reed tube 4 of the sensor, the dry reed tube 4 outputs corresponding electrical signals to the circuit board 3 based on the change, and the circuit board 3 transmits the electrical signals to the socket through the pin 5.

[0044] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements, and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A modular assembly structure of an automobile brake fluid level sensor, characterized by, Include: The shell (1), the inside of the shell (1) is provided with mounting cavity, one side of the shell (1) is provided with a pair of insertion slot, the pair of insertion slot is communicated with the mounting cavity; The inner mold support (2) is clamped and fixed with the mounting cavity; The circuit board (3) is clamped and fixed with the inner mold support (2); The dry reed (4) is welded and fixed with the circuit board (3) at both ends of the pin; The insertion pin (5) is fixed with the inner mold support (2), the first end of the insertion pin (5) is electrically connected with the circuit board (3), and the second end of the insertion pin (5) is suspended in the pair of insertion slot.

2. A modular assembly structure for an automobile brake fluid level sensor according to claim 1, characterized in that, The rod body of the insertion pin (5) is provided with a plurality of first insertion holes, the inner mold support (2) is provided with a plurality of vertical columns corresponding to the first insertion holes, the first insertion holes and the vertical columns are inserted and matched, and the first insertion holes and the vertical columns are fixed by hot riveting.

3. The modular assembly structure of a brake fluid level sensor for an automobile according to claim 1, wherein The first end of the insertion pin (5) is connected with the insertion rod (501), the circuit board (3) is provided with a second insertion hole, the insertion rod (501) is inserted and matched with the second insertion hole, and electrical connection is realized.

4. The modular assembly structure of a brake fluid level sensor for an automobile according to claim 1, wherein The circuit board (3) is provided with a profiling groove (6), the dry reed (4) is embedded in the profiling groove (6), and both ends of the pin of the dry reed (4) are parallelly welded and fixed with the solder pad of the circuit board (3).

5. A modular assembly structure for an automobile brake fluid level sensor according to claim 4, wherein A first silica gel layer (7) is arranged between the profiling groove (6) and the dry reed (4), and a second silica gel layer (8) is arranged on the outer side of the dry reed (4).

6. The modular assembly structure of an automobile brake fluid level sensor according to claim 1, wherein The inner mold support (2), the circuit board (3), the dry reed (4) and the insertion pin (5) constitute an inner mold assembly, the inner mold assembly is loaded into the mounting cavity from the pair of insertion slot, and is clamped and fixed with the mounting cavity.

7. A modular assembly structure for an automotive brake fluid level sensor according to claim 6, wherein An epoxy resin layer (9) is arranged between the inner mold assembly and the mounting cavity.