Recognition device for flip chip on die bonder

Abstract

The utility model discloses an identification device for a flip chip on a die bonder, which belongs to the technical field of LED (light-emitting diode) production and comprises a chip table for placing an object to be tested and a lighting system positioned above the chip table, the illumination system comprises a CCD camera and an annular light source, the annular light source is located between the CCD camera and the wafer table, the annular light source comprises an auxiliary support of a circular ring structure, and a plurality of blue light sources are evenly distributed on the inner ring of the auxiliary support. Annular blue light illumination is adopted to replace traditional coaxial red light illumination, efficient and accurate identification of the wafer is achieved, forward and reverse identification of the wafer is included, the contrast ratio of MARK points of the flip wafer is improved, then the problem that in the prior art, wafer identification is not accurate is solved, and the overall performance and reliability of the LED flip-chip technology are improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to LED production technical field relates to a kind of recognition device of flip chip on die bonder. BACKGROUND

[0002] In LED packaging process, wafer identification is the key step to ensure the quality and performance of the measured object. For vertical wafer, due to the obvious difference between the surface pad and non-pad area, the wafer stage light using coaxial red light source can effectively identify (its identification method is shown in Figure 1 ), and achieve good identification effect. However, for flip chip, it is difficult to accurately identify the surface MARK point under red light due to the particularity of packaging method and structure.

[0003] Wafer identification is a key link in flip chip technology, which involves accurate positioning and direction identification of LED wafer. Correct wafer identification can ensure accurate alignment of the chip in the packaging process, which is crucial to maintain the consistency and performance of the measured object. If the wafer identification is not accurate, it may cause wafer loss, die bonding reversal, or even cause the measured object to fail.

[0004] Currently, flip LED packaging technology is to place the electrode contact of LED chip downward, directly mount it on silicon carrier or PCB substrate, interconnect through solder / conductive adhesive in the middle, then stick it to heat sink, and use prism plastic package outside. The light beam generated by the chip is emitted through the transparent sapphire substrate. The flip LED chip used in this packaging structure is a high-reflectivity metal layer formed on the epitaxial semiconductor, such as Ag and Al, which not only serves as the electrical contact layer of the semiconductor, but also serves as the light reflection layer, making it impossible to accurately identify the flip chip surface MARK point under red light. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a kind of recognition device of flip chip on die bonder, to solve the technical problems raised in the prior art.

[0006] The utility model aims to achieve the following technical solutions:

[0007] A kind of recognition device of flip chip on die bonder, including wafer stage of placing measured object and the illumination system located above wafer stage;The illumination system includes CCD camera and annular light source, the annular light source is located between CCD camera and wafer stage, the annular light source includes the auxiliary support of circular ring structure, several blue light sources are evenly distributed on the inner ring of the auxiliary support.

[0008] As further improvement of one embodiment of the utility model, wherein, the wafer stage one side is provided with base, be provided with the adjusting seat on the base, be provided with the measuring support frame of up and down adjustable position on the adjusting seat, the CCD camera is set up on the measuring support frame through the lens shell, the annular light source is set up on the measuring support frame through the adjusting rod.

[0009] As further improvement of one embodiment of the utility model, wherein, the measuring support frame has upper support plate and lower support plate, the upper support plate is used for fixed mounting lens shell, the lower support plate has through hole for lens shell to pass through inside;Locking assembly is set up on the lower support plate and fixes adjusting rod.

[0010] As further improvement of one embodiment of the utility model, wherein, the upper support plate is in the form of a hoop.

[0011] As further improvement of one embodiment of the utility model, wherein, the locking assembly includes locking piece with circular arc cavity, and both ends of the locking piece are fixed on the lower support plate by screws.

[0012] As further improvement of one embodiment of the utility model, wherein, a first driving mechanism is arranged between the adjusting seat and the base to enable the adjusting seat to move horizontally relative to the base, and a second driving mechanism is arranged between the measuring support frame and the adjusting seat to enable the measuring support frame to move vertically relative to the adjusting seat.

[0013] The above technical solution has the following beneficial effects: the annular blue light illumination is used to replace the traditional coaxial red light illumination, efficient and accurate identification of the wafer is realized, including forward and reverse identification of the wafer, the contrast of the flip chip MARK point is improved, and the problem of inaccurate wafer identification in the prior art is overcome, and the overall performance and reliability of the LED flip process are improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only exemplary, and those skilled in the art can obtain other implementation drawings according to the provided drawings without creative labor.

[0015] The structure, proportion, size and the like shown in the specification are only used to cooperate with the content disclosed in the specification, to be understood and read by those skilled in the art, and do not define the limiting conditions that can be implemented by the utility model, so they do not have technical substantive significance. Any modification of structure, change of proportion relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model.

[0016] Figure 1 It is a schematic diagram of an existing coaxial light source.

[0017] Figure 2 It is a structural schematic diagram provided by the utility model.

[0018] Figure 3 It is a schematic diagram of a ring light source of the utility model.

[0019] Figure 4 It is a schematic diagram of on-site MARK point recognition provided by the utility model.

[0020] In the figure:

[0021] 1, base;

[0022] 2, adjusting seat;

[0023] 3, measuring support frame; 31, upper support plate; 32, lower support plate;

[0024] 4, CCD camera;

[0025] 5, ring light source; 51, auxiliary support; 52, blue light source;

[0026] 6, adjusting rod;

[0027] 7, wafer table;

[0028] 8, lens shell;

[0029] 9, measured object. DETAILED DESCRIPTION

[0030] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The utility model will be described in detail below with reference to the drawings and in combination with embodiments.

[0031] It should be noted that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0032] In the utility model, in not making opposite explanation case, the orientation words such as " upper, lower, top, bottom " used are usually for the direction shown in the drawing or for the component itself in vertical, perpendicular or gravity direction;Similarly, for the convenience of understanding and description, " inner, outer " refers to the inner, outer of the contour of each component itself, but the above orientation words are not used to limit the utility model.

[0033] Embodiment

[0034] Referring to Figures 2-4 As shown in the figure, a flip chip recognition device of die bonder, its structure mainly includes wafer table 7 and illumination system. Wafer table 7 is used to place measured object 9, i.e. the flip chip to be identified. Illumination system is located above wafer table 7, including CCD camera 4 and annular light source 5. Wherein, annular light source 5 is arranged between CCD camera 4 and wafer table 7, and its design includes an auxiliary bracket 51 with a circular structure, and a plurality of blue light sources 52 are uniformly distributed on the inner ring of the bracket. Such layout can ensure that light is uniformly irradiated on measured object 9, improve the recognition accuracy.

[0035] CCD camera 4 is fixed at the upper end of lens shell 8, and lens is built in lens shell 8, so that the camera can clearly capture the light reflected by measured object 9. Through the irradiation of blue light source 52, the MARK point on the surface of flip chip can be more easily identified under blue light, solving the problem of difficult identification under red light. The device is reasonably designed, and can effectively improve the recognition efficiency and accuracy of flip chip.

[0036] Specifically, one side of wafer table 7 is provided with base 1, and further provided with adjusting seat 2 on base 1 to finely adjust the position. Measuring support frame 3 that can adjust the position up and down is arranged on adjusting seat 2, and this design makes the whole recognition device can adapt to different size wafers. CCD camera 4 is arranged on measuring support frame 3 through lens shell 8, to ensure the accuracy of shooting angle and focal length. Similarly, annular light source 5 is arranged on measuring support frame 3 through adjusting rod 6, and adjusting rod 6 allows the light source position to be adjusted to optimize the light projection angle, to ensure that measured object 9 obtains uniform and sufficient illumination.

[0037] In the embodiment, a first driving mechanism is arranged between the adjusting base 2 and the base 1, which is realized by a hand wheel driving or motor driving screw rod assembly, so that the adjusting base 2 can be smoothly horizontally moved (X-axis direction movement) relative to the base 1. Similarly, a second driving mechanism is arranged between the measuring support frame 3 and the adjusting base 2, which can also be selected as a hand wheel driving or motor driving screw rod assembly, so as to realize the accurate vertical movement (Z-axis direction movement) of the measuring support frame 3 relative to the adjusting base 2. Both of the two driving mechanisms adopt the conventional technology in the field, and the structure and working principle thereof belong to the known category of the person skilled in the art, and thus will not be described here again, so as to keep the description simple.

[0038] In the embodiment, the measuring support frame 3 is provided with an upper support plate 31 and a lower support plate 32, and the whole forms a stable support structure. The upper support plate 31 is designed as a clamp structure, which is convenient for closely and stably fixing and installing the lens shell 8. The lower support plate 32 is provided with a through hole, so that the lens shell 8 can smoothly pass through and limit the lens shell 8 from shaking left and right. Meanwhile, the lower support plate 32 is also provided with a locking assembly to fix the adjusting rod 6. The locking assembly comprises a locking piece with a circular arc cavity, and both ends of the locking piece are fixed on the lower support plate 32 by screws, so as to ensure the stable and reliable position of the adjusting rod 6.

[0039] The utility model discloses in wafer identification aspect has carried out the innovative design, through introducing annular blue light illumination system, replaced traditional coaxial red light illumination mode.This improvement not only has improved the identification efficiency and accuracy of wafer significantly, also realized the accurate judgment to wafer positive and negative direction.Annular blue light illumination can highlight the feature on wafer more effectively, especially for the MARK point of flip chip, its contrast has improved significantly.This change effectively overcomes the problem of inaccurate wafer identification in the prior art, reduces the misidentification rate, thereby ensuring that the overall performance and reliability of LED flip technology are greatly improved.

[0040] Obviously, the above-described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor should belong to the scope of protection of the utility model.

[0041] It is to be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise, and it should also be understood that when the terms "comprise" and / or "include" are used in the specification, there is a feature, step, work, device, component and / or combination thereof.

[0042] It should be noted that the terms "first", "second", and the like used in the description and the claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0043] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A flip-chip identification device for a die bonder, comprising a wafer stage for placing the wafer under test and an illumination system located above the wafer stage; characterized in that: The lighting system includes a CCD camera and a ring light source. The ring light source is located between the CCD camera and the wafer stage. The ring light source includes an auxiliary support with a circular structure. Several blue light sources are evenly distributed on the inner ring of the auxiliary support.

2. The identification device according to claim 1, characterized in that: A base is provided on one side of the wafer stage, an adjustment seat is provided on the base, and a measurement support frame that can be adjusted up and down is provided on the adjustment seat. The CCD camera is mounted on the measurement support frame through a lens housing, and the ring light source is mounted on the measurement support frame through an adjustment rod.

3. The identification device according to claim 2, characterized in that: The measuring support frame has an upper support plate and a lower support plate. The upper support plate is used to fix and install the lens housing, and the lower support plate has a through hole for the lens housing to pass through. The lower support plate is provided with a locking assembly to fix the adjusting rod.

4. The identification device according to claim 3, characterized in that: The upper support plate has a clamp structure.

5. The identification device according to claim 3, characterized in that: The locking assembly includes a locking plate with an arc-shaped cavity, and both ends of the locking plate are fixed to the lower support plate by screws.

6. The identification device according to claim 2, characterized in that: A first driving mechanism is provided between the adjusting seat and the base, so that the adjusting seat moves horizontally relative to the base; a second driving mechanism is provided between the measuring support frame and the adjusting seat, so that the measuring support frame moves vertically relative to the adjusting seat.

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