Press fitting mechanism for power load cycle test of power semiconductor module

Abstract

The utility model relates to a press-fitting mechanism for a power load cycle test of a power semiconductor module. The press-fitting mechanism is mainly applied to press-fitting of a modular power semiconductor device in a power load cycle test. The device mainly comprises a horizontal fixed pressing clamp pressing structure, a 360-degree rotatable sliding crimping structure and a placement heat dissipation structure. A user can place a power semiconductor module at the central position of a bottom plate of a water-cooling radiator on the press-fitting mechanism, and can rotate the horizontal pressing clamp by 360 degrees to adjust the coordinate positions of the X-axis, the Y-axis and the Z-axis of the pressing clamp as required according to the modules with different sizes, heights and shapes so as to reliably press and fasten the modules; and carrying out a power load cycle test in which power-on heating and water-cooling heat dissipation are circulated and reciprocated. The press-fitting mechanism has the advantages of being small and light in structure, high in universality, flexible and convenient to operate, high in safety and reliability and the like.

Description

TECHNICAL FIELD

[0001] The patent belongs to the field of testing of power semiconductors, and particularly relates to a pressing mechanism for power load cycle test of power semiconductor modules. BACKGROUND

[0002] Module power semiconductors play a key role in the field of power electronics. With their wide application, the types of module forms become various, including large, medium and small power modules, plastic package modules, metal package modules, ceramic package modules and the like. The advantages of the modules are miniaturization, integration, high performance, environmental protection and customization. With the increasing market demand, in order to ensure the high-quality production of module semiconductors, the manufacturers need to test the power load cycle of the modules before delivery, so as to test the electrical performance indicators of the modules in the thermal cycle process under the harsh conditions of repeated heating and cooling in the later use environment. Therefore, a reliable pressing mechanism is needed to complete the power load cycle test. The power load cycle test needs to fix a large number of power semiconductor modules under a certain pressure on the pressing mechanism for test, and then update the modules for a new test process. Although the current pressing mechanism can play the role of electrical connection and physical fixation, the bulky and heavy pressing structure is time-consuming and laborious to replace the test modules. Therefore, we developed the fast pressing mechanism based on the large workload, time-consuming and complicated operation in the test process. CONTENT OF THE UTILITY MODEL

[0003] The utility model provides a kind of pressing mechanism for power semiconductor module power load cycle test, to solve the problem of large workload, time-consuming and complicated in the process of test operation.

[0004] The utility model solves the above-mentioned technical problem by adopting the technical scheme of a kind of pressing mechanism for power semiconductor module power load cycle test, including horizontal pressing forceps pressure structure, 360 degree rotatable sliding adjustment structure and place heat dissipation structure, three are located on bottom plate, wherein horizontal pressing forceps pressure structure is located 360 degree rotatable sliding adjustment structure top, place heat dissipation structure is located at the center of bottom plate, it is characterized in that: the horizontal pressing forceps pressure structure includes horizontal pressing forceps, and horizontal pressing forceps is connected with pressing forceps fastening screw and locking nut, the height of pressing forceps is adjusted by adjusting the height of pressing forceps fastening screw and locking nut, realizes the movement in Z axis direction;

[0005] The 360 degree rotatable sliding adjustment structure includes sliding fixed bottom plate, and the sliding fixed bottom plate has two, and two sliding blocks are arranged above each sliding fixed bottom plate, and a hexagonal fixed nut is arranged below the sliding fixed bottom plate (3), the sliding block is connected with the sliding fixed bottom plate (3) by sliding screw, and the sliding fixed bottom plate is connected with the upper surface of bottom plate.

[0006] The sliding fixed bottom plate is respectively provided with two long grooves, and a hexagonal fixed nut is arranged in the long groove; a through hole is arranged in the sliding block, and the lower end of the sliding screw is fixedly connected with the hexagonal fixed nut through the through hole in the sliding block and the long groove in the sliding fixed bottom plate.

[0007] Further, the horizontal pressing tongs are four in total, and two horizontal pressing tongs are arranged on each sliding fixed bottom plate; the bottom of the horizontal pressing tongs is connected with the upper surface of the sliding block; the horizontal pressing tongs are arranged in a four-corner symmetrical manner, so that the pressure is uniformly distributed.

[0008] Further, the long groove on the sliding fixed plate is a stepped groove with a small upper end and a large lower end; the width of the lower end of the long groove is the same as the width of the hexagonal fixed nut; the lower end of the stepped long groove clamps the parallel wall of the hexagonal fixed nut, so that the hexagonal fixed nut cannot rotate; since the upper end of the stepped long groove is smaller than the width of the hexagonal fixed nut, the hexagonal fixed nut and the sliding screw are locked and cannot be separated, and the hexagonal fixed nut can move along the length direction of the long groove.

[0009] Further, the sliding block can drive the horizontal pressing tongs to slide along the length direction of the long groove on the sliding fixed bottom plate, so as to realize the distance adjustment in the X-axis direction.

[0010] Further, the sliding block and the sliding screw are connected through a concentric structure, so that the sliding block can rotate on the sliding fixed bottom plate, so that the sliding block drives the horizontal pressing tongs to rotate by 360 degrees, and the position adjustment in the Y-axis direction is realized.

[0011] Further, the heat dissipation structure comprises a water-cooled radiator, and the water-cooled radiator is arranged above the bottom plate and between the two sliding fixed bottom plates; the front surface and the side surface of the water-cooled radiator are provided with central scale lines.

[0012] Further, annular water pipes are arranged in the water-cooled radiator, and a water inlet and a water outlet are connected to the water-cooled radiator.

[0013] Compared with the prior art, the utility model has the advantages of simple structure and convenient use; based on the nature of the power semiconductor module power load cycle test, the horizontal pressing tongs are first applied to the pressing structure of the pressing mechanism; the key point of the design is that the fixing device is light, small, easy to operate, and can be fixed and pressed at any time; the 360-degree slidable rotary pressing tongs are designed by the sliding block, the sliding fixed bottom plate and the hexagonal fixed nut, so that different demands for length, width and height of different modules and different fixed positions are met, and the universality and high adaptability of the pressing mechanism to the power semiconductor module are improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a front view structural schematic diagram of the utility model.

[0015] Figure 2 is the top view structure schematic diagram of the utility model;

[0016] Figure 3 is the sliding block, sliding fixed bottom plate, hexagonal fixed nut connection partial schematic diagram of the utility model;

[0017] Figure 4 is the horizontal pressure clamp pressure structure partial schematic diagram of the utility model;

[0018] Figure 5 is the long slot partial structure schematic diagram of the utility model;

[0019] In the drawing, 1 is bottom plate, 2 is hexagonal fixed nut, 3 is sliding fixed bottom plate, 4 is sliding screw, 5 is sliding block, 6 is horizontal pressure clamp, 7 is pressure clamp fastening screw, 8 is fastening nut, 9 is module, 10 is water cooling radiator, 11 is water inlet, 12 is water outlet, 13 is locking nut, 14 is fixed screw, 15 is screw, 16 is countersunk screw, 17 is connecting nut, 18 is long slot. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. It should be understood that the preferred embodiments described herein are only used for explaining and explaining the utility model, and are not used for limiting the utility model. Obviously, the described embodiments are only some embodiments of the utility model, and are not all embodiments. The components of the embodiments of the utility model described and shown in the drawings herein can be arranged and designed in various different configurations. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the utility model. In the embodiments, the components of the embodiments of the application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the application.

[0021] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "back", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected; it can be electrically connected; it can be a hydraulic oil circuit connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0023] Reference Figures 1 to 4 A power semiconductor module power load cycle test press-fitting mechanism, which is composed of horizontal pressure clamp pressure structure, 360 degree rotatable sliding adjustment structure and placing heat dissipation structure, three parts are located on the bottom plate 1.

[0024] The 360 degree rotatable sliding adjustment structure is according to Figure 1 and Figure 2 As shown, it mainly includes horizontal pressure clamp 6, hexagonal fixed nut 2, sliding fixed bottom plate 3, sliding screw 4, sliding block 5 and fixed screw 14. The sliding fixed bottom plate 3 has two, which are located on the two sides above the bottom plate 1, and the sliding block 5 is located above the sliding fixed bottom plate 3. Each sliding fixed bottom plate 3 is provided with two sliding blocks 5, and the sliding block 5 is provided with a vertical extending through threaded hole, and the threaded hole is provided with a sliding screw 4, and the sliding block 5 and the sliding fixed bottom plate 3 are connected through the sliding screw 4;

[0025] The sliding screw 4 is connected with the sliding fixed base plate 3 through the hexagonal fixed nut 2, the hexagonal fixed nut 2 is located below the sliding fixed base plate 3, the surface of the sliding fixed base plate 3 is provided with a through type upper small and lower large step long groove 18, two long grooves 18 are arranged on each sliding fixed base plate 3, the two long grooves 18 are parallel to each other, the width of the lower part of the long groove 18 is the same as the width of the hexagonal fixed nut 2, the hexagonal fixed nut 2 is located in the long groove 18, the parallel wall of the hexagonal fixed nut 2 is clamped by the lower end of the step long groove 18 so that the hexagonal fixed nut 2 cannot rotate, then the sliding screw 4 is rotated to make the lower end of the sliding screw 4 into the hexagonal fixed nut 2, because the upper part of the step long groove 18 is smaller than the width of the hexagonal fixed nut 2, the hexagonal fixed nut 2 and the sliding screw 4 are locked and cannot be separated but can move along the length direction of the long groove 18;

[0026] The upper surface of each sliding block 5 is provided with four threaded holes, the threaded holes are provided with fixed screws 14, the bottom of the horizontal pressure clamp 6 is fixedly connected with the sliding block 5 through the fixed screws 14, so that the horizontal pressure clamp 6 and the sliding block 5 can move left and right on the sliding fixed base plate 3 along the X-axis direction. Through the concentric structure between the sliding screw 4 and the sliding block 5, the sliding block 5 can rotate 360 degrees, and the horizontal pressure clamp 6 can move along the Y-axis direction at the same time.

[0027] The horizontal pressure clamp pressing structure comprises a horizontal pressure clamp 6, a pressure clamp fastening screw 7, a fastening nut 8 and a locking nut 13, as shown in Figure 1 and Figure 2 The horizontal pressure clamp 6 is provided with an opening at one end close to each other and a pressing rod at the other end, the pressure clamp fastening screw 7 passes through the opening, two locking nuts 13 are arranged on the pressure clamp fastening screw 7, the two locking nuts 13 are located on the upper and lower sides of the opening of the horizontal pressure clamp 6, and the lower end of the pressure clamp fastening screw 7 is connected with the fastening nut 8; the horizontal pressure clamp 6 is in a four-corner symmetrical distribution relationship to ensure that the pressing pressure is uniform, the height of the pressure clamp is adjusted by adjusting the height of the pressure clamp fastening screw 7 and the locking nut 13, so as to realize the movement in the Z-axis direction, after the adjustment is completed, the horizontal pressure clamp 6 is pressed down, and the pressure clamp fastening screw 7 and the fastening nut 8 of the horizontal pressure clamp 6 are pressed down, so that the pressure connection of the power semiconductor module 9 with different heights can be realized; wherein the horizontal pressure clamp 6 is a prior art.

[0028] According to the connection and cooperation of the horizontal pressure clamp pressing structure and the 360-degree rotatable sliding adjustment structure, a complete pressure clamp pressing system adjustable in the X-axis, Y-axis and Z-axis directions is realized, and according to Figure 2 and Figure 3 Two complete pressure clamp pressing systems can be simultaneously connected through two through type step long grooves 18 symmetrically arranged on one sliding fixed base plate 3.

[0029] The placing heat dissipation structure comprises a placing base plate 10, a plurality of placing grooves 11 and a plurality of placing blocks 12, as shown inFigure 1 and Figure 2 As shown in the drawings, it comprises a base plate 1, a water-cooled radiator 10, a water inlet 11, a water outlet 12, a screw 15, and a countersunk screw 16. The water-cooled radiator 10 is located between two sliding fixed base plates 3, and the water-cooled radiator 10 and the two sliding fixed base plates 3 are each provided with four threaded holes. The sliding fixed base plates 3 are symmetrically fixed on the base plate 1 through the screw 15. Since two horizontal pressure tongs 6 are symmetrically connected to each sliding fixed base plate 3, four horizontal pressure tongs are symmetrically connected to the base plate 1. The base plate 1 is provided with four threaded holes, and the lower surface of the water-cooled radiator 10 is provided with four threaded blind holes. The countersunk screw 16 passes through the threaded hole at the bottom of the base plate 1 and is connected to the threaded blind hole on the water-cooled radiator 10, so that the water-cooled radiator 10 is fixedly connected to the base plate 1. The front and side surfaces of the water-cooled radiator 10 are provided with center scale lines, which are used as references for placing the center position of the module. The water-cooled radiator 10 is internally provided with annular water pipes. When cooling, the cooling water enters the water-cooled radiator 10 through the water inlet 11, flows out of the water outlet 12 through the internal cooling pipeline, and completes a cooling cycle.

[0030] When the pressing mechanism works, the module 9 is placed in the middle position of the water-cooled radiator 10 through the scale lines on the front surface and the scale lines on the side surface of the water-cooled radiator 10. According to different fixed points of the module 9 on the market and different forms of the length, width and height dimensions, the number of corresponding fixed pressure tongs and the coordinate positions of the sliding rotary adjustment pressure tongs X, Y and Z are selected, so that the module 9 is reliably pressed and fastened. After the pressing is in place, the module 9 is connected to the nut 17 through the electrode lead-out, the rated current level is connected, the module 9 is heated, and after a certain time of power-on, the power is turned off and water is passed. The cooling water enters the water-cooled radiator 10 through the water inlet 11 and then flows out of the water outlet 12 for cooling. After a period of cooling, the water is turned off and the power is turned on to continue heating the module 9 with the rated current. In this way, the power load cycle test of the module is completed.

[0031] The above is only a specific implementation manner of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A press mechanism for power semiconductor module power load cycle test, comprising horizontal press jaw pressing structure, 360-degree rotatable sliding adjustment structure and placing heat dissipation structure, all of which are located on the base plate (1), wherein the horizontal press jaw pressing structure is located above the 360-degree rotatable sliding adjustment structure, and the placing heat dissipation structure is located at the center of the base plate (1), characterized in that: The horizontal pressure clamp pressure structure includes horizontal pressure clamp (6), and the horizontal pressure clamp (6) is connected with pressure clamp fastening screw (7) and locking nut (13). The height of the pressure clamp is adjusted by adjusting the height of the pressure clamp fastening screw (7) and the locking nut (13), and the movement in the Z-axis direction is realized. The 360-degree rotatable sliding adjustment structure includes sliding fixed bottom plate (3), and the sliding fixed bottom plate (3) is provided with two sliding blocks (5) above each sliding fixed bottom plate (3), and the sliding fixed bottom plate (3) is provided with hexagonal fixed nut (2) below. The sliding block (5) is connected with the sliding fixed bottom plate (3) through the sliding screw (4), and the sliding fixed bottom plate (3) is connected with the upper surface of the bottom plate (1). The sliding fixed bottom plate (3) is provided with two long grooves respectively, and the hexagonal fixed nut (2) is arranged in the long groove. The sliding block (5) is provided with a through hole penetrating the sliding block (5), and the lower end of the sliding screw (4) penetrates the through hole on the sliding block (5) and the long groove on the sliding fixed bottom plate (3) and is fixedly connected with the hexagonal fixed nut (2).

2. A press-pack mechanism for power semiconductor module power load cycle testing according to claim 1, characterized in that: The horizontal pressure clamp (6) is provided with two horizontal pressure clamps (6) on each sliding fixed bottom plate (3), and the horizontal pressure clamp (6) is connected with the upper surface of the sliding block (5). The horizontal pressure clamp (6) is arranged in a four-corner symmetrical manner.

3. A press-pack mechanism for power semiconductor module power load cycle testing according to claim 1, characterized in that: The long groove on the sliding fixed bottom plate (3) is a stepped shape penetrating from small to large, and the width below the long groove is the same as the width of the hexagonal fixed nut (2). The lower end of the stepped long groove clamps the parallel wall of the hexagonal fixed nut (2) so that it cannot rotate. Because the upper part of the stepped long groove is smaller than the width of the hexagonal fixed nut (2), the hexagonal fixed nut (2) and the sliding screw (4) are locked and cannot be separated, and the hexagonal fixed nut (2) can move along the length direction of the long groove.

4. A press-pack mechanism for power semiconductor module power load cycle testing according to claim 1, characterized in that: The sliding block (5) can drive the horizontal pressure clamp (6) to slide along the length direction of the long groove on the sliding fixed bottom plate (3), which is equivalent to the distance adjustment in the X-axis direction.

5. A press-pack mechanism for power semiconductor module power load cycle testing according to claim 4, characterized in that: The center hole of the sliding block (5) and the sliding screw (4) are connected through the concentric structure, so that the sliding block (5) can rotate on the sliding fixed bottom plate (3), so that the sliding block (5) drives the horizontal pressure clamp (6) to rotate by 360 degrees, which is equivalent to the position adjustment in the Y-axis direction.

6. A press-pack mechanism for power semiconductor module power load cycle testing according to claim 1, characterized in that: The placement and heat dissipation structure includes a water-cooled radiator (10), which is located above the bottom plate and between the two sliding fixed bottom plates (3). The front and side surfaces of the water-cooled radiator (10) are provided with center scale lines.

7. A press-pack mechanism for power semiconductor module power load cycle testing according to claim 6, characterized in that: The water-cooled radiator (10) is internally provided with an annular water pipe, and externally connected with a water inlet (11) and a water outlet (12).

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