Lead structure of golden finger position of circuit board
By introducing a copper sheet isolation structure and a graphene heat dissipation layer at the gold finger position of the circuit board, the problem of lead etching damaging the gold finger is solved, the electrical connection effect and heat dissipation performance are improved, and the normal operation of the circuit board is ensured.
Patent Information
- Application Number
- CN202520120168.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-01-17
AI Technical Summary
The existing gold fingers of circuit boards are easily damaged during etching and peeling, which affects the electrical connection between them and the circuit board. Furthermore, prolonged operation of the circuit board can lead to excessively high temperatures, causing damage to electronic components.
Copper sheets are used to isolate the gold fingers from the auxiliary leads. The main leads and auxiliary leads are separated by etching, and soldering is performed between the gold fingers and the copper sheets to avoid direct contact between the gold fingers and acid corrosion. At the same time, a graphene heat dissipation layer is set on the circuit board body to improve the heat dissipation effect.
It effectively protects the gold fingers from etching damage, improves electrical connection, and ensures normal use and heat dissipation performance of the circuit board through the conductivity of the copper sheet and the high heat dissipation of graphene.
Smart Images
Figure CN223816268U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to gold finger position lead structure technical field especially relates to the lead structure of circuit board gold finger position. BACKGROUND
[0002] Gold finger is common on computer memory, display card, it is a connector, in the circuit board design, gold finger needs to have good conductivity, wear resistance, oxidation resistance and corrosion resistance, the main role is connection, according to its performance characteristics, can be divided into conventional gold finger, long and short gold finger and segmented gold finger.
[0003] The lead structure of gold finger position mainly includes PCB board body, gold finger position and lead, the lead includes first lead and second lead, the first lead is connected with the gold finger position, the second lead is connected with the first lead, and the line width of the first lead is narrower than that of the second lead, which makes the amount of residual lead less when etching to remove the lead after electroplating gold, thereby improving the processing precision of the gold finger and meeting the stability, timeliness and other requirements of signal transmission between the PCB and other components.
[0004] However, the existing gold finger lead structure of the circuit board needs to be etched for acidic corrosion during subsequent stripping, and the stripping needs to be performed after the corrosion is completed. However, the existing lead is directly welded with the gold finger, and the acidity during etching may cause damage to the gold finger, thereby affecting the subsequent electrical connection effect between the gold finger and the circuit board, and affecting the subsequent use. In addition, the circuit board is an electronic component, and long-term operation may cause the surface temperature to be too high, thereby affecting normal use.
[0005] Therefore, in order to overcome the problem that the existing lead is easily damaged during etching and stripping, thereby affecting the subsequent electrical connection effect between the gold finger and the circuit board and affecting the subsequent use, and the temperature of the circuit board is too high during long-term operation, thereby causing damage to the electronic component and affecting the overall use, a lead structure of a gold finger position of a circuit board can be designed. The copper sheet has strong conductivity, and the gold finger is not directly damaged during stripping of the lead. The subsequent welding of the gold finger and the copper sheet can improve the electrical connection between the gold finger and the circuit board, and will not affect the subsequent use of the circuit board. In addition, the circuit board has a self-reinforced heat dissipation structure layer, thereby improving the heat dissipation effect. SUMMARY
[0006] In order to overcome the problem that the existing lead is easily damaged during etching and stripping, thereby affecting the subsequent electrical connection effect between the gold finger and the circuit board and affecting the subsequent use, and the temperature of the circuit board is too high during long-term operation, thereby causing damage to the electronic component and affecting the overall use.
[0007] The utility model discloses a technical scheme for a lead structure of a gold finger position of a circuit board, comprising a circuit board body, a plurality of gold finger bodies arranged uniformly on the upper end surface of the circuit board body, a copper sheet arranged at one end of the gold finger body above the circuit board body, a main lead part arranged at the rear end of the copper sheet, a plurality of auxiliary leads arranged uniformly and connected to the gold finger body arranged at one end of the main lead part close to the copper sheet, an anti-oxidation layer arranged inside the circuit board body, and a graphene heat dissipation layer arranged on the front end surface of the circuit board body.
[0008] Preferably, the main lead part and the auxiliary lead are separated by etching, and the auxiliary lead and the gold finger body are isolated by the copper sheet. In the case of acid corrosion, the gold finger body is not directly contacted, preventing corrosion of the gold finger body. The subsequent electrical connection effect of the gold finger body is greatly improved. The copper sheet has good conductivity, and the gold finger body and the copper sheet are welded by the welding part at one end.
[0009] Preferably, the upper end surface of the circuit board body is provided with a plurality of uniformly arranged electronic elements, and the electronic elements are electrically connected to the circuit body inside the circuit board body.
[0010] Preferably, one end of the gold finger body is provided with a circuit part, and the other end of the circuit part away from the gold finger body is provided with a welding part.
[0011] Preferably, the welding part and the copper sheet are in a welded integrated structure, and the copper sheet has good conductivity.
[0012] Preferably, the width of the auxiliary lead is equal to the width of the welding part.
[0013] Preferably, the inside of the circuit board body is provided with a circuit body, and the outer surface of the circuit board body is coated with a waterproof material.
[0014] Preferably, the rear end surface of the circuit board body is provided with an insulating layer, and the rear end surface of the insulating layer is provided with a waterproof layer.
[0015] The utility model discloses the beneficial effect:
[0016] 1. The lead structure of the gold finger position of the circuit board, the main lead part and the auxiliary lead are separated by etching, the auxiliary lead and the gold finger body are isolated by the copper sheet, in the case of acid corrosion, the gold finger body is not directly contacted, preventing corrosion of the gold finger body. The subsequent electrical connection effect of the gold finger body is greatly improved. The copper sheet has good conductivity, and the gold finger body and the copper sheet are welded by the welding part at one end. The copper sheet 6 has strong conductivity, and the gold finger is not directly damaged during the stripping of the lead. The subsequent welding of the gold finger and the copper sheet improves the electrical connection of the circuit board.
[0017] 2、The lead structure of the circuit board gold finger position protects the internal circuit body through the oxidation-proof layer of the front end face of the circuit board body, the graphene heat dissipation layer on the surface of the circuit board body has high heat dissipation, the heat dissipation effect of the circuit board body is improved, and the circuit board improves the heat dissipation effect through the self-strengthening heat dissipation structure layer. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 A three-dimensional structure schematic view of the lead structure of the circuit board gold finger position is shown.
[0019] Figure 2 A top view of the three-dimensional structure of the lead structure of the circuit board gold finger position is shown.
[0020] Figure 3 A three-dimensional structure schematic view of the circuit board material layer of the utility model is shown. Figure 2 A three-dimensional structure schematic view of the circuit board material layer of the utility model is shown.
[0021] Figure 4 A three-dimensional structure schematic view of the circuit board material layer of the utility model is shown. Figure 2 A three-dimensional structure schematic view of the circuit board material layer of the utility model is shown.
[0022] Figure 5 A three-dimensional structure schematic view of the circuit board material layer of the utility model is shown.
[0023] The specific embodiments of the utility model are further explained below in combination with the drawings and examples. DETAILED DESCRIPTION
[0024] A three-dimensional structure schematic view of the lead structure of the circuit board gold finger position is shown.
[0025] A three-dimensional structure schematic view of the lead structure of the circuit board gold finger position is shown. Figures 1-5 The utility model provides a kind of embodiment: the lead structure of the circuit board gold finger position, including circuit board body 1, the upper end surface of circuit board body 1 is provided with multiple gold finger body 4 of uniform arrangement, one end of gold finger body 4 is provided with copper sheet 6 located above circuit board body 1, the rear end of copper sheet 6 is provided with main lead part 2, main lead part 2 and the end close to copper sheet 6 is provided with multiple auxiliary lead 3 of uniform arrangement and is connected with gold finger body 4, the inside of circuit board body 1 is provided with oxidation-proof layer 12, the front end face of circuit board body 1 is provided with graphene heat dissipation layer 11.
[0026] A three-dimensional structure schematic view of the lead structure of the circuit board gold finger position is shown. Figures 1-2In the embodiment, the upper end surface of the circuit board body 1 is provided with a plurality of uniformly arranged electronic elements 5, the electronic elements 5 are electrically connected with the circuit body 13 inside the circuit board body 1, one end of the gold finger body 4 is provided with a circuit part 7, the other end of the circuit part 7 away from the gold finger body 4 is provided with a welding part 8, the welding part 8 and the copper sheet 6 are in a welding integrated structure, the copper sheet 6 has good conductivity, the main lead part 2 and the auxiliary lead 3 are separated by etching, the auxiliary lead 3 and the gold finger body 4 are isolated by the copper sheet 6, the gold finger body 4 and the auxiliary lead 3 are separated in the case of acid corrosion, and the corrosion does not directly contact the gold finger body 4, thereby preventing corrosion of the gold finger body 4.
[0027] Please refer to Figures 3-5 In the embodiment, the width of the auxiliary lead 3 is equal to the width of the welding part 8, the inside of the circuit board body 1 is provided with a circuit body 13, the outer surface of the circuit board body 1 is coated with a waterproof material, the rear end surface of the circuit board body 1 is attached with an insulating layer 10, the rear end surface of the insulating layer 10 is attached with a waterproof layer 9, thereby greatly improving the subsequent electrical connection effect of the gold finger body 4, the copper sheet 6 has good conductivity, and the gold finger body 4 and the copper sheet 6 are welded through the welding part 8 at one end; the internal circuit body 13 is protected by the anti-oxidation layer 12 on the front end surface of the circuit board body 1, and the graphene heat dissipation layer 11 on the surface of the circuit board body 1 has high heat dissipation, thereby improving the heat dissipation effect of the circuit board body 1.
[0028] In the embodiment, the width of the auxiliary lead 3 is equal to the width of the welding part 8, the inside of the circuit board body 1 is provided with a circuit body 13, the outer surface of the circuit board body 1 is coated with a waterproof material, the rear end surface of the circuit board body 1 is attached with an insulating layer 10, the rear end surface of the insulating layer 10 is attached with a waterproof layer 9, thereby greatly improving the subsequent electrical connection effect of the gold finger body 4, the copper sheet 6 has good conductivity, and the gold finger body 4 and the copper sheet 6 are welded through the welding part 8 at one end; the internal circuit body 13 is protected by the anti-oxidation layer 12 on the front end surface of the circuit board body 1, and the graphene heat dissipation layer 11 on the surface of the circuit board body 1 has high heat dissipation, thereby improving the heat dissipation effect of the circuit board body 1.
[0029] Through the above steps, the main lead part 2 is separated from the auxiliary lead 3 by etching, and the auxiliary lead 3 is isolated from the gold finger body 4 by being provided with the copper sheet 6. In the case of acid corrosion, it will not directly contact the gold finger body 4 to solve the problem that the existing lead is easy to damage the gold finger when etching and stripping, which affects the electrical connection effect between the gold finger and the circuit board afterwards, and affects the subsequent use. At the same time, the long-term operation of the circuit board will cause the temperature to be too high, causing the electronic components 5 to be damaged, affecting the overall use.
Claims
1. A lead structure for a gold finger site of a circuit board, comprising a circuit board body (1), characterized in that: The upper end surface of the circuit board body (1) is provided with a plurality of uniformly arranged gold finger bodies (4), one end of the gold finger body (4) is provided with a copper sheet (6) above the circuit board body (1), the rear end of the copper sheet (6) is provided with a main lead part (2), the main lead part (2) and the copper sheet (6) are provided with a plurality of uniformly arranged auxiliary lead lines (3) connected with the gold finger body (4) at one end, the inside of the circuit board body (1) is provided with an oxidation prevention layer (12), and the front end surface of the circuit board body (1) is provided with a graphene heat dissipation layer (11).
2. The lead structure of a contact finger of a circuit board according to claim 1, wherein: The upper end surface of the circuit board body (1) is provided with a plurality of uniformly arranged electronic elements (5), and the electronic elements (5) are electrically connected with the circuit body (13) inside the circuit board body (1).
3. The lead structure of a contact finger of a circuit board according to claim 1, wherein: One end of the gold finger body (4) is provided with a circuit part (7), and the other end of the circuit part (7) away from the gold finger body (4) is provided with a welding part (8).
4. The lead structure of a contact finger of a circuit board according to claim 3, wherein: The welding part (8) and the copper sheet (6) are in a welding integrated structure, and the copper sheet (6) has good conductivity.
5. The lead structure of a contact finger of a circuit board according to claim 1, wherein: The width of the auxiliary lead line (3) is equal to the width of the welding part (8).
6. The lead structure of a pin of a gold finger of a circuit board according to claim 1, wherein: The inside of the circuit board body (1) is provided with a circuit body (13), and the outer surface of the circuit board body (1) is coated with a waterproof material.
7. The lead structure of a pin of a gold finger of a circuit board according to claim 1, wherein: The rear end surface of the circuit board body (1) is provided with an insulating layer (10), and the rear end surface of the insulating layer (10) is provided with a waterproof layer (9).