Heat dissipation structure of sound box

Abstract

The utility model provides a heat dissipation structure of a sound box. The heat dissipation structure comprises a top cover assembly, a heat dissipation support, a sound cavity and a screen frame. A plurality of heat dissipation holes are formed in the screen frame, a heat dissipation part is further arranged between the heat dissipation support and the top cover assembly, the heat dissipation support comprises a heat conduction face and a first installation face, and the first installation face is perpendicular to the heat conduction face. According to the heat dissipation structure of the sound box provided by the utility model, the heat generated in the top cover assembly can be effectively conducted to the heat dissipation support through the heat dissipation part arranged between the heat dissipation support and the top cover assembly, and heat dissipation is carried out through the heat dissipation holes in the heat dissipation support and the screen frame; therefore, the heat dissipation effect of the heat dissipation structure of the sound box is effectively ensured; besides, the sound cavity and the mainboard assembly are directly assembled on the first mounting surface of the heat dissipation support, so that heat generated by the sound cavity and the mainboard assembly can be effectively and directly conducted to the heat dissipation support, heat convection with the outside is carried out through the heat dissipation holes in the screen frame, the temperature is reduced, and heat dissipation is carried out.

Description

TECHNICAL FIELD

[0001] The utility model relates to inverter technical field especially relates to a heat dissipation structure of sound box. BACKGROUND

[0002] The heat dissipation structure of the sound box on the market is complex, which leads to complex assembly operation, affects assembly efficiency and causes artificial cost increase, and the heat conduction of the heat dissipation structure is uneven, which causes uneven heat dissipation, affects the experience and safety of users in the use process. UTILITY MODEL CONTENTS

[0003] The utility model discloses a heat dissipation structure of sound box, which solves the problems of complex heat dissipation structure of existing sound box, complex assembly operation, affected assembly efficiency, increased artificial cost, uneven heat conduction of heat dissipation structure, uneven heat dissipation, and poor user experience and safety during use.

[0004] The utility model discloses a heat dissipation structure of sound box, which solves the problems of complex heat dissipation structure of existing sound box, complex assembly operation, affected assembly efficiency, increased artificial cost, uneven heat conduction of heat dissipation structure, uneven heat dissipation, and poor user experience and safety during use.

[0005] A plurality of heat dissipation holes for connecting the heat dissipation bracket with the external environment are arranged on the mesh frame, and a heat dissipation component is further arranged between the heat dissipation bracket and the top cover assembly.

[0006] Further, a plurality of first mounting holes are arranged on the heat conduction surface of the heat dissipation bracket, and the top cover assembly has a plurality of first mounting columns corresponding to the first mounting holes.

[0007] Further, a plurality of first locking members pass through the first mounting holes and are locked in the first mounting columns, so that the heat dissipation bracket is assembled on the top cover assembly.

[0008] Further, a plurality of second mounting holes for fixedly connecting the sound cavity are arranged on the first mounting surface of the heat dissipation bracket, and a plurality of second mounting columns corresponding to the second mounting holes are arranged on the sound cavity.

[0009] Further, a plurality of second locking members pass through the second mounting holes and are locked in the second mounting columns, so that the sound cavity is fixedly assembled on the mounting surface of the heat dissipation bracket.

[0010] Further, the mounting surface is further provided with a positioning hole for the component of the sound cavity to pass through, and the positioning hole is a strip-shaped hole.

[0011] Further, the first mounting surface of the heat dissipation support is provided with a plurality of third mounting columns, the mainboard assembly comprises a mainboard and a mainboard heat sink, and the mainboard and the mainboard heat sink are both provided with third mounting holes corresponding to the third mounting columns.

[0012] Further, a plurality of third locking members pass through the third mounting holes and are locked in the third mounting columns, so that the mainboard assembly is fixedly assembled on the mounting surface of the heat dissipation support and located above the sound cavity.

[0013] Further, the heat dissipation structure further comprises a rear cover plate fixed in the mesh frame, and the rear cover plate and the mesh frame form a closed structure for closing the heat dissipation support.

[0014] Further, the heat dissipation support further comprises a second mounting surface for fixedly connecting with the mesh frame and the rear cover plate.

[0015] The heat dissipation structure of the sound box has the advantages that: by using the heat dissipation component arranged between the heat dissipation support and the top cover assembly, the heat generated in the top cover assembly can be effectively introduced into the heat dissipation support, and then dissipated through the heat dissipation holes on the heat dissipation support and the mesh frame, so that the uniformity of heat conduction of the heat dissipation support is effectively improved, and the uniformity of heat dissipation of the heat dissipation support is improved, and the heat dissipation effect of the heat dissipation structure of the sound box is ensured; in addition, by directly assembling the sound cavity and the mainboard assembly on the first mounting surface of the heat dissipation support, the rationality of the layout of the sound cavity and the mainboard assembly in the mesh frame can be effectively improved, and the heat generated by the sound cavity and the mainboard assembly can be directly introduced into the heat dissipation support, and then conducted to the outside through the heat dissipation holes on the mesh frame, so that the temperature is reduced, and the heat is dissipated, thereby further improving the uniformity of heat conduction of the heat dissipation support, ensuring the uniformity of heat dissipation of the heat dissipation support, and improving the heat dissipation effect of the heat dissipation structure of the sound box. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The assembly schematic view of the heat dissipation structure of the sound box is provided in the utility model;

[0017] Figure 2 The structure schematic view of the top cover assembly in the heat dissipation structure of the sound box is provided in the utility model;

[0018] Figure 3 The structure schematic view of the heat dissipation support in the heat dissipation structure of the sound box and the assembly of the heat dissipation support on the top cover assembly is provided in the utility model;

[0019] Figure 4The structure diagram of the sound cavity in the heat dissipation structure of the sound box and the structure of assembling the sound cavity on the heat dissipation support is provided in the utility model.

[0020] Figure 5 The structure diagram of the main board assembly in the heat dissipation structure of the sound box and the structure of assembling the main board assembly on the heat dissipation support is provided in the utility model.

[0021] Figure 6 The structure diagram of the rear cover plate in the heat dissipation structure of the sound box and the structure of assembling the net frame on the heat dissipation support is provided in the utility model.

[0022] In the drawing,

[0023] 100 - the heat dissipation structure of the sound box,

[0024] 10 - the top cover assembly, 11 - the top cover, 12 - the display lamp plate, 13 - the light guide piece, 14 - the annular lamp plate,

[0025] 15 - the first mounting column, 16 - the first locking piece, 20 - the heat dissipation support, 21 - the heat conduction surface,

[0026] 211 - the first mounting hole, 22 - the first mounting surface, 221 - the second mounting hole, 222 - the third mounting column,

[0027] 23 - the second mounting surface, 30 - the sound cavity, 31 - the second mounting column, 32 - the second locking piece, 40 - the main board assembly, 41 - the main board, 42 - the main board heat dissipation plate, 43 - the third mounting hole, 44 - the third locking piece, 50 - the frame net,

[0028] 51 - the heat dissipation hole, 52 - the rear cover plate. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the utility model more clearly and clearly, the following is combined with the drawing and example, and the utility model is further explained in detail.

[0030] Referring to Figures 1-6The sound box heat dissipation structure 100 comprises a top cover assembly 10, a heat dissipation support 20 fixed to the top cover assembly 10, an acoustic cavity 30 and a mainboard 41 assembly 40 fixed to the heat dissipation support 20 and a mesh frame 50 covering the heat dissipation support 20, a plurality of heat dissipation holes 51 for connecting the heat dissipation support 20 with the external environment are arranged on the mesh frame 50, and a heat dissipation component is further arranged between the heat dissipation support 20 and the top cover assembly 10, the heat dissipation support 20 comprises a heat conduction surface 21 attached to the heat dissipation component and a first mounting surface 22 for fixedly connecting the acoustic cavity 30 and the mainboard 41 assembly 40, and the first mounting surface 22 and the heat conduction surface 21 are arranged perpendicularly to each other.

[0031] As shown in Figure 1 and Figure 3 In the embodiment provided by the utility model, a plurality of first mounting holes 211 are arranged on the heat conduction surface 21 of the heat dissipation support 20, and the top cover assembly 10 is provided with a plurality of first mounting columns 15 corresponding to the first mounting holes 211. By penetrating the first mounting holes 211 with a plurality of first locking members 16 such as bolts, studs and pins and locking the first locking members 16 in the first mounting columns 15, the heat dissipation support 20 can be assembled on the top cover assembly 10, and the stability of the heat dissipation support 20 assembled on the top cover assembly 10 can be effectively ensured. The top cover assembly 10 provided by the utility model comprises a top cover 11, a light guide member 13, an annular lamp plate 14 and a display lamp plate 12, the first mounting columns 15 are arranged on the annular lamp plate 14, and the heat dissipation adhesive is attached to the gap between the annular lamp plate 14 and the heat conduction surface 21 of the heat dissipation support 20.

[0032] As shown in Figure 3 and Figure 4 , the mounting surface of the heat dissipation support 20 is provided with a plurality of second mounting holes 221 for fixed connection with the sound cavity 30, and the sound cavity 30 is provided with a plurality of second mounting columns 31 corresponding to the second mounting holes 221. By passing a plurality of second locking members 32 such as bolts, studs and pins through the second mounting columns 31 and locking them in the second mounting holes 221, the sound cavity 30 can be fixedly assembled on the mounting surface of the heat dissipation support 20, and the stability of the sound cavity 30 mounted on the mounting surface of the heat dissipation support 20 can be effectively ensured, the rationality of the layout of the sound cavity 30 in the mesh frame 50 can be effectively improved, the heat generated by the sound cavity 30 can be directly conducted to the heat dissipation support 20, and the heat convection with the air in the external environment through the heat dissipation holes 51 on the mesh frame 50 can be performed to reduce the temperature and dissipate heat, thereby further improving the uniformity of heat conduction of the heat dissipation support 20, ensuring the uniformity of heat dissipation of the heat dissipation support 20, and improving the heat dissipation effect of the heat dissipation structure 100 of the sound box. In addition, the mounting surface is also provided with positioning holes for the components of the sound cavity 30 to pass through, and the positioning holes are strip-shaped holes. By passing the components of the sound cavity 30 into the positioning holes of the mounting surface of the heat dissipation support 20, the positioning accuracy between the sound box and the heat dissipation support 20 can be effectively improved, and by setting the positioning holes as strip-shaped holes, the adaptability between the shape of the positioning holes and the shape of the components of the sound cavity 30 can be effectively ensured, thereby effectively improving the fit of the components of the sound cavity 30 passing into the positioning holes.

[0033] As shown in Figure 3 and Figure 5 , the first mounting surface 22 of the heat dissipation support 20 is provided with a plurality of third mounting columns 222, and the main board 41 assembly 40 is provided with a plurality of third mounting holes 43 corresponding to the third mounting columns 222. The main board 41 assembly 40 includes the main board 41 and the main board heat dissipation plate 42. By passing a plurality of third locking members 44 such as bolts, studs and pins through the third mounting holes 43 and locking them in the third mounting columns 222, the main board 41 assembly 40 can be fixedly assembled on the mounting surface of the heat dissipation support 20, and the stability of the main board 41 assembly 40 mounted on the mounting surface of the heat dissipation support 20 can be effectively ensured, the rationality of the layout of the main board 41 assembly 40 in the mesh frame 50 can be effectively improved, the heat generated by the main board 41 assembly 40 can be directly conducted to the heat dissipation support 20, and the heat convection with the air in the external environment through the heat dissipation holes 51 on the mesh frame 50 can be performed to reduce the temperature and dissipate heat, thereby further improving the uniformity of heat conduction of the heat dissipation support 20, ensuring the uniformity of heat dissipation of the heat dissipation support 20, and improving the heat dissipation effect of the heat dissipation structure 100 of the sound box.

[0034] As shown in Figure 1 and Figure 6As shown, in the embodiment provided by the utility model, the heat dissipation structure 100 of the sound box further comprises a rear cover plate 52 fixed in the mesh frame 50, and the rear cover plate 52 and the mesh frame 50 form a closed structure for closing the heat dissipation support 20. By forming the closed structure for closing the heat dissipation support 20 by the rear cover plate 52 and the mesh frame 50, the overall sealing property of the sound box using the heat dissipation structure 100 of the sound box can be effectively ensured, so that dust and moisture in the external environment cannot enter the sound cavity 30 or the control assembly, and the safety of the sound box using the heat dissipation structure 100 of the sound box can be effectively ensured. In addition, the heat dissipation support 20 provided by the utility model further comprises a second mounting surface 23 for fixedly connecting with the mesh frame 50 and the rear cover plate 52, by assembling the rear part of the mesh frame 50 on the second mounting surface 23, the positioning precision between the mesh frame 50 and the heat dissipation support 20 can be effectively improved, and the rear cover is buckled on the rear part of the mesh frame 50, the closed structure for closing the heat dissipation support 20 formed by the rear cover plate 52 and the mesh frame 50 can be effectively realized, so that the overall sealing property of the sound box using the heat dissipation structure 100 of the sound box can be ensured.

[0035] The above is only the preferred embodiment of the utility model, and is not used to limit the utility model, and any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A heat dissipation structure of a sound box, characterized in that, The heat dissipation support is fixed on the top cover assembly, the sound cavity and the mainboard assembly are fixed on the heat dissipation support, and the mesh frame is arranged on the heat dissipation support. The heat dissipation support and the top cover assembly are provided with a heat dissipation component, the heat dissipation support comprises a heat conduction surface matched with the heat dissipation component and a first mounting surface for fixed connection with the sound cavity and the mainboard assembly, and the first mounting surface and the heat conduction surface are arranged perpendicularly.

2. The heat dissipation structure of a sound box according to claim 1, wherein, The heat dissipation support is provided with a plurality of first mounting holes on the heat conduction surface, and the top cover assembly is provided with a plurality of first mounting columns corresponding to the first mounting holes.

3. The heat dissipation structure of a sound box according to claim 2, wherein, A plurality of first locking members pass through the first mounting holes and are locked in the first mounting columns, so that the heat dissipation support is assembled on the top cover assembly.

4. The heat dissipation structure of a sound box according to claim 1, wherein, The heat dissipation support is provided with a plurality of second mounting holes for fixed connection with the sound cavity on the first mounting surface, and the sound cavity is provided with a plurality of second mounting columns corresponding to the second mounting holes.

5. The heat dissipation structure of a sound box according to claim 4, wherein, A plurality of second locking members pass through the second mounting columns and are locked in the second mounting holes, so that the sound cavity is fixedly assembled on the first mounting surface of the heat dissipation support.

6. The heat dissipation structure of a sound box according to claim 4, wherein, The first mounting surface is further provided with a positioning hole for components of the sound cavity to pass through, and the positioning hole is a strip-shaped hole.

7. The heat dissipation structure of a sound box according to claim 1, wherein, The heat dissipation support is provided with a plurality of third mounting columns on the first mounting surface, the mainboard assembly comprises a mainboard and a mainboard heat dissipation fin, and the mainboard and the mainboard heat dissipation fin are provided with third mounting holes corresponding to the third mounting columns.

8. The heat dissipation structure of a sound box according to claim 7, wherein, A plurality of third locking members pass through the third mounting holes and are locked in the third mounting columns, so that the mainboard assembly is fixedly assembled on the first mounting surface of the heat dissipation support and located above the sound cavity.

9. The heat dissipation structure of a sound box according to claim 1, wherein, The heat dissipation support further comprises a second mounting surface for fixed connection with the mesh frame and the rear cover plate.

10. The heat dissipation structure of a sound box according to claim 9, wherein, The heat dissipation support further comprises a second mounting surface for fixed connection with the mesh frame and the rear cover plate.

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