LED packaging structure
By setting marking sections on the fluorescent film, the problem of poor thickness consistency of the white wall adhesive was solved, enabling efficient production and high-quality products of LED packaging structures.
Patent Information
- Application Number
- CN202520046529.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-01-08
AI Technical Summary
In the production of single-sided LEDs, the existing LED packaging structure suffers from poor consistency in the thickness of the white adhesive, resulting in low production efficiency and high costs. Commonly used adhesive spraying equipment cannot accurately control the thickness, and reliance on visual observation leads to large errors.
Marking sections are set on the fluorescent film, and white wall adhesive is used to cover the top surface of the marking sections to ensure consistent coating thickness. The marking sections also increase the bonding area between the white wall adhesive and the fluorescent film, thus optimizing production control.
It improved the consistency of white wall adhesive thickness, enhanced product quality and production stability, increased production efficiency, and reduced production costs.
Smart Images
Figure CN223816374U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of LED, especially relates to a LED packaging structure. BACKGROUND
[0002] As a solid semiconductor device, LED has the advantages of small volume, light weight, high luminous efficiency, energy saving and environmental protection, and has been widely used in various industries, and the market demand for LED is also increasing. Single-sided light-emitting LED is widely used in lighting, backlight and automobile fields due to its small size, light thickness, high power, small size and strong flexibility.
[0003] At present, most of the LED packaging structures that realize single-sided light emission on the market are structures that surround the LED wafer with white glue. When producing single-sided light-emitting LED, the LED wafer 2 is first welded on the substrate 1, then the fluorescent film piece 4 with the same size as the surface of the LED wafer 2 is bonded on the LED wafer 2 using an adhesive, and finally white glue 3 is sprayed around the fluorescent film piece 4 until the height of the white glue 3 is flush with the top surface of the fluorescent film piece 4 (as shown in FIG. Figure 1
[0004] The theoretical thickness of the white glue is equal to the sum of the thickness of the LED wafer and the thickness of the fluorescent film piece. The pressure film process can directly set the value, but the pressure film process has low production efficiency and high production cost. Therefore, the industry generally uses a glue spraying process to form the white glue, but the glue spraying equipment used in the common glue spraying process cannot specifically set the thickness value of the sprayed white glue, and the thickness of the sprayed white glue cannot be measured in real time during production. Therefore, the thickness of the white glue can only be judged by observation, but most of the commonly used fluorescent film pieces are regular rectangles with smooth surfaces and no special identification points, which leads to the fact that the thickness of the white glue produced in actual production can only be observed by the naked eye and judged by experience, or judged by experience through multiple trial productions, and the error is prone to be large. This can easily cause poor thickness consistency of the white glue and low production efficiency. SUMMARY
[0005] The utility model solves the technical problem of providing a LED packaging structure with high production consistency.
[0006] In order to solve the above technical problems, the utility model adopts the technical scheme: a LED packaging structure, including the substrate, be equipped with LED wafer and white wall glue on the substrate, the top surface of LED wafer is equipped with fluorescent film piece, the fluorescent film piece includes the main part that covers the top surface of LED wafer all area and is marked by the rim of the main part Extension mark department, the top surface of mark department is lower than the top surface of main part setting, the white wall glue is arranged around LED wafer, mark department is embedded in white wall glue, and the partial area of white wall glue covers the top surface of mark department.
[0007] In an embodiment, the number of the mark department is one or more.
[0008] In an embodiment, the main part and the mark department are an integral structure integrally processed and formed.
[0009] In an embodiment, the mark department is a polygon, a semicircle or a semi-elliptical shape.
[0010] In an embodiment, the bottom surface of the mark department is flush with the bottom surface of the main part.
[0011] In an embodiment, the height difference between the top surface of the mark department and the top surface of the main part is one fifth to two thirds of the thickness of the main part.
[0012] In an embodiment, the height difference between the top surface of the mark department and the top surface of the main part is half of the thickness of the main part.
[0013] In an embodiment, the top surface of the fluorescent film piece is flush with the top surface of the white wall glue.
[0014] In an embodiment, the substrate has a positive pad and a negative pad, and the LED wafer is electrically connected to the positive pad and the negative pad, respectively.
[0015] The LED packaging structure has the advantages of novel structure, the thickness of the white wall glue is clearly indicated to completely cover the top surface of the mark department during glue spraying production, the bonding area of the white wall glue and the fluorescent film piece is effectively increased to ensure the tightness of the bonding between the white wall glue and the fluorescent film piece, the experience-based determination of the thickness of the white wall glue during production is solved, the control standard of product quality is greatly optimized, the production efficiency is improved, the consistency of the thickness of the white wall glue is ensured, and the overall quality of the product and the stability of production are improved. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings described in the following only constitute some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained according to the structures shown in the drawings without creative labor.
[0017] Figure 1 FIG. 1 is a sectional view of a prior art LED packaging structure;
[0018] Figure 2 FIG. 2 is a sectional view of an LED packaging structure according to an embodiment of the present application.
[0019] Explanation of reference numerals:
[0020] 1, substrate;
[0021] 2, LED wafer;
[0022] 3, white wall glue;
[0023] 4, fluorescent film; 41, main part; 42, mark part. DETAILED DESCRIPTION
[0024] The purposes, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings.
[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only constitute some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0026] It should be noted that if the embodiments of the present application involve directional indications such as up, down, left, right, front, back, etc., the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain specific posture such as shown in the drawings. If the specific posture changes, the directional indications also change accordingly.
[0027] In addition, if the embodiments of the present application involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one of the features.
[0028] In addition, the meaning of "and / or" appearing throughout the text is that three parallel solutions are included, for example, "and / or" includes solutions, or solutions, or solutions that satisfy both. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor in the protection scope required by the utility model.
[0029] In the present application, unless otherwise expressly specified and limited, the terms "mounting", "connection", "connection", "fixing" and other terms should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0030] Embodiment one
[0031] Please refer to Figure 2 The embodiment one of the utility model relates to: a LED packaging structure, including substrate 1, be equipped with LED wafer 2 and white wall glue 3 on substrate 1, substrate 1 has anode pad and cathode pad, LED wafer 2 is electrically connected with anode pad and cathode pad respectively, the top surface of LED wafer 2 is equipped with fluorescent film piece 4, fluorescent film piece 4 is bonded with the fixedness with LED wafer 2, fluorescent film piece 4 includes the main part 41 of covering the top surface of LED wafer 2 all area and the mark part 42 of extending outward by the rim of main part 41, in the embodiment, main part 41 and mark part 42 are integrally formed one-piece structure, the top surface of mark part 42 is lower than the top surface of main part 41 setting, namely the connecting place of main part 41 and mark part 42 forms the step structure, white wall glue 3 is arranged around LED wafer 2, mark part 42 is embedded in white wall glue 3, and the partial area of white wall glue 3 covers the top surface of mark part 42.
[0032] The number of mark part 42 is one or more, and the specific number of mark part 42 can be set as required.
[0033] The mark part 42 is polygonal, semicircular or semi-elliptical, and in the embodiment, the mark part 42 is rectangular.
[0034] To facilitate the processing and forming of the fluorescent film piece 4, the bottom surface of the mark part 42 is preferably flush with the bottom surface of the main part 41. In other embodiments, the bottom surface of the mark part 42 can be slightly higher than the bottom surface of the main part 41.
[0035] The height difference between the top surface of the mark portion 42 and the top surface of the main portion 41 is one fifth to two thirds of the thickness of the main portion 41. In this embodiment, the height difference between the top surface of the mark portion 42 and the top surface of the main portion 41 is half of the thickness of the main portion 41.
[0036] The top surface of the fluorescent film sheet 4 is flush with the top surface of the white wall adhesive 3.
[0037] The above is only an optional embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structural transformation made under the inventive concept of the present application, or direct / indirect application in other related technical fields is included in the patent protection range of the present application.
Claims
1. An LED package structure, characterized by: The substrate is provided with an LED wafer and white wall glue, the top surface of the LED wafer is provided with a fluorescent film piece, the fluorescent film piece comprises a main part covering the whole area of the top surface of the LED wafer and a mark part extending outward from the edge of the main part, the top surface of the mark part is lower than that of the main part, the white wall glue is arranged around the LED wafer, the mark part is embedded in the white wall glue, and part of the white wall glue covers the top surface of the mark part.
2. The LED package structure of claim 1, wherein: The number of the mark part is one or more.
3. The LED package structure of claim 1, wherein: The main part and the mark part are an integral structure formed by integral processing.
4. The LED package structure of claim 1, wherein: The mark part is in polygonal, semicircular or semi-elliptical shape.
5. The LED package structure of claim 1, wherein: The bottom surface of the mark part is flush with the bottom surface of the main part.
6. The LED package structure of claim 1, wherein: The height difference between the top surface of the mark part and the top surface of the main part is one fifth to two thirds of the thickness of the main part.
7. The LED package structure of claim 6, wherein: The height difference between the top surface of the mark part and the top surface of the main part is half of the thickness of the main part.
8. The LED package structure of claim 1, wherein: The top surface of the fluorescent film piece is flush with the top surface of the white wall glue.
9. The LED package structure of claim 1, wherein: The substrate is provided with a positive electrode pad and a negative electrode pad, and the LED wafer is electrically connected with the positive electrode pad and the negative electrode pad respectively.