Semiconductor packaging mold

Abstract

The utility model discloses a semiconductor packaging mould, which comprises a rack, a lower mould and an upper mould, the lower mould is fixedly arranged on the upper end face of the rack, the upper mould is arranged right above the lower mould, the top end of the rack is fixedly connected with a support, the inner side of the support is provided with a moving mechanism, and the moving mechanism is arranged on the upper mould. The moving mechanism comprises two symmetrical first fixing plates fixedly connected with the inner wall of one side of the rack, and a first lead screw is axially and rotationally connected between the two first fixing plates. The positions of the high-pressure blowing mechanism in the front-back transverse direction, the longitudinal direction and the left-right transverse direction are accurately adjusted by means of the moving mechanism, and two groups of blowing nozzles which are arranged in the radial direction and are provided with air outlets in the upper and lower parts are matched, so that all positions of a mold cavity can be accurately and comprehensively cleaned, impurity residues are avoided, the packaging quality is ensured, and the defective rate of chips is reduced; and rapid and efficient cleaning operation can be realized through cooperation of the two parts, the automation degree is improved, the cleaning time is shortened, the efficiency of a semiconductor packaging production line is improved, and the market competitiveness of enterprises is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging mold. Background Technology

[0002] In the field of semiconductor packaging, the cleanliness of the mold plays a crucial role in the packaging quality. With the continuous development of semiconductor technology, the requirements for the precision and reliability of chip packaging are becoming increasingly stringent. If there are impurities such as dust and debris inside the cavities of the lower and upper molds during the packaging process, they may be mixed into the packaging material, leading to performance defects in the packaged chip, such as short circuits and open circuits, which seriously affect the quality and lifespan of the chip.

[0003] Traditional mold cleaning methods often have many limitations. For example, some simple manual cleaning methods are difficult to ensure that different height positions inside the mold cavity are thoroughly cleaned, and some corners and gaps are easily missed. Moreover, manual cleaning is inefficient and cannot meet the needs of large-scale production. In addition, some fixed-position air blowing devices cannot flexibly adjust the air blowing position according to different mold structures and cleaning needs, resulting in unsatisfactory cleaning results.

[0004] Therefore, we propose a semiconductor packaging mold. Utility Model Content

[0005] The main purpose of this utility model is to provide a semiconductor packaging mold. In order to prevent dust, debris and other impurities from being mixed into the packaging material due to insufficient mold cleanliness, which would lead to short circuits, open circuits and other performance defects in the packaged chip, as well as affect the chip quality and service life, it is necessary to improve the mold cleaning method, thereby improving the quality and efficiency of semiconductor packaging, so as to meet the increasingly higher requirements for chip packaging accuracy and reliability under the development of semiconductor technology, and effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A semiconductor packaging mold includes a frame, a lower mold, and an upper mold. The lower mold is fixedly installed on the upper end face of the frame, and the upper mold is located directly above the lower mold. A bracket is fixedly connected to the top of the frame, and a moving mechanism is provided on the inner side of the bracket. The moving mechanism includes two symmetrical first fixing plates fixedly connected to one inner wall of the frame. A first lead screw is axially rotatably connected between the two first fixing plates. A first motor is fixedly connected to one outer wall of one of the first fixing plates. The output end of the first motor passes through the first fixing plate and is fixedly connected to one end of the first lead screw. A second sleeve block is threadedly connected to the outer side of the first lead screw.

[0008] The inner side of the frame is provided with two symmetrical support rods. One of the support rods passes radially through the second sleeve block, and the support rod and the second sleeve block slide vertically together. The top of each of the two support rods is fixedly connected to a fixing block. A second lead screw is axially rotatably connected between the two fixing blocks. A second motor is fixedly installed on the outer wall of one end of one of the fixing blocks. The output end of the second motor passes through the fixing block and is fixedly connected to one end of the second lead screw. The outer side of the second lead screw is threaded to a first sleeve block. A high-pressure blowing mechanism is provided on one side of the first sleeve block. The high-pressure blowing mechanism is located between the lower mold and the upper mold. The high-pressure blowing mechanism includes a moving plate. Multiple blowing nozzles are provided on the side of the moving plate away from the first sleeve block. The multiple blowing nozzles are arranged in two radial groups, and air outlets are opened at the top and bottom of both groups of blowing nozzles.

[0009] By adopting the above technical solution, the first motor is started, and the output end of the first motor drives the first lead screw to rotate axially. Since the second sleeve block is threadedly connected to the first lead screw, when the first lead screw rotates, the second sleeve block will move laterally back and forth along the axis of the first lead screw, and the support rod will slide up and down along the second sleeve block. The movement of the second sleeve block will drive the fixed block, the second lead screw and the high-pressure blowing mechanism connected to the first sleeve block to move in the horizontal and vertical directions, thereby adjusting the position of the high-pressure blowing mechanism in the horizontal and vertical directions so that it can be aligned with the corresponding areas of the lower mold and the upper mold that need to be blown.

[0010] After adjustment, start the second motor. The second motor drives the second lead screw to rotate axially. The first sleeve block and the second lead screw are threadedly connected. When the second lead screw rotates, the first sleeve block will move in a straight line along the left and right lateral direction of the second lead screw, thereby driving the high-pressure air blowing mechanism connected to one side of it to move in the left and right lateral direction, ensuring that the air blowing nozzle can be in the optimal working position and effectively act on the relevant parts of the lower mold and the upper mold.

[0011] Once the high-pressure blowing mechanism is adjusted to the appropriate position via the moving mechanism, it is activated. The moving plate is equipped with multiple air nozzles arranged radially in two groups, each with an outlet at both the top and bottom. Gas is ejected at high speed from these outlets. This arrangement of the two groups of air nozzles cleans both the lower and upper molds. The high-pressure gas from the nozzles effectively removes dust, debris, and other impurities that may be present at different heights within the cavities of the lower and upper molds, ensuring the cleanliness of the lower mold cavity. This creates a favorable environment for subsequent semiconductor chip placement and packaging operations, preventing impurities from contaminating the packaging material or affecting chip placement, thus ensuring the quality of semiconductor packaging.

[0012] Furthermore, the air nozzles are fixedly mounted on the movable plate by fasteners, and air supply pipes are fixedly connected to the opposite ends of the two sets of air nozzles. Air supply main pipes are fixedly connected to the ends of the multiple air supply pipes away from the air nozzles.

[0013] By adopting the above technical solution, the gas first enters the gas supply system of the high-pressure blowing mechanism through the gas transmission main pipe. The gas transmission main pipe, as the main gas transmission channel, guides the gas from the gas source, such as the gas pump, to each branch. The gas in the gas transmission main pipe is divided into multiple gas transmission branches. The function of these gas transmission branches is to further distribute the gas to each blowing nozzle, ensuring that each blowing nozzle can obtain a sufficient gas supply.

[0014] The air nozzle is securely fixed to the moving plate by a fastener. This fixing method ensures that the air nozzle is stable in position during operation and will not shift due to the impact of high-pressure gas or the movement of the moving mechanism.

[0015] When the gas reaches the nozzle through the gas supply pipe, the gas is ejected at high speed from the outlet of the nozzle.

[0016] Furthermore, the bracket is fixedly connected to two symmetrical second fixing plates on the inner wall of the side away from the second set of blocks. A sliding rod is fixedly connected between the two second fixing plates. A slider is slidably connected to the outside of the sliding rod. Another support rod is radially passed through the slider, and the support rod and the slider slide up and down in cooperation.

[0017] By adopting the above technical solution, two symmetrical second fixing plates are fixedly connected to the inner wall of the bracket, providing a stable installation base for the slide rod. The main function of the slide rod is to serve as a guide component for the slider. When the slider is subjected to external force, it will slide along the slide rod. This sliding connection method ensures that the movement trajectory of the slider is along the axial direction of the slide rod, thus playing a precise guiding role.

[0018] Another support rod radially penetrates the slider and has an up-and-down sliding engagement with it. This means that as the slider slides along the rod, the support rod can slide up and down within the slider. This design provides auxiliary support and balance during the operation of the entire device, when the moving mechanism drives the related components to move. If the device experiences slight imbalance or uneven force during lateral or longitudinal movement, this engagement between the slider and the support rod can help disperse and balance these forces, ensuring the overall stability of the device and the accuracy of the movement of related components. Especially when working in conjunction with other components such as the first set of blocks and the second set of blocks, it can better maintain the structural integrity and working accuracy of the entire mold device.

[0019] Furthermore, the second set of blocks is provided with threaded holes at the ends opposite to the slider, and bolts are threaded into the two threaded holes, and the bolts abut against the two corresponding support rods. Limiting plates are fixedly connected to the bottom ends of the two support rods.

[0020] By adopting the above technical solution, when the bolt is tightened, the end of the bolt will abut against the support rod. This abutting action can fix the position of the second block and the slider on the support rod.

[0021] The main function of the limiting plate is to prevent the slider and the second set of blocks from sliding excessively downward on the support rod. When unexpected situations occur during the operation of the device, such as vibration or collision, which cause the slider and the second set of blocks to tend to slide downward, the limiting plate will act as a stop to prevent the slider and the second set of blocks from detaching from the support rod, thereby protecting the structural integrity of the entire device, preventing component damage and device failure, and ensuring that the device can operate stably and safely.

[0022] Furthermore, a limiting rod is fixedly connected between the two fixed blocks, and the first sleeve block is slidably connected to the limiting rod.

[0023] By adopting the above technical solution, the limiting rod fixedly connected between the two fixed blocks provides a precise guide path for the first sleeve block. When the second lead screw rotates and drives the first sleeve block to make longitudinal linear motion, the first sleeve block will slide along the limiting rod. This sliding connection method ensures that the movement direction of the first sleeve block is strictly along the axial direction of the limiting rod, preventing the first sleeve block from shifting or rotating during longitudinal movement. This ensures that the high-pressure blowing mechanism connected to one side of the first sleeve block can accurately reach the predetermined position and effectively operate the lower mold.

[0024] Furthermore, a cylinder is fixedly installed at the top of the bracket, and the output end of the cylinder passes through the bracket and is fixedly connected to the top of the upper mold.

[0025] By adopting the above technical solution, the cylinder is used to control the up and down movement of the upper mold.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] (1) The present invention provides a semiconductor packaging mold. The moving mechanism can accurately adjust the position of the high-pressure blowing mechanism in the front-back horizontal and vertical directions and the left-right horizontal direction. The first motor drives the first lead screw to rotate, so that the second set of blocks drives the relevant components to move in the front-back horizontal and vertical directions. Then the second motor drives the second lead screw to rotate, so that the first set of blocks drives the high-pressure blowing mechanism to move in the left-right horizontal direction. This ensures that the blowing nozzle can be accurately aligned with the corresponding areas of the lower mold and the upper mold that need to be blown. Whether it is the edge, corner or different height position of the mold cavity, it can be effectively cleaned, which greatly improves the accuracy and comprehensiveness of cleaning and effectively avoids the problem of impurity residue caused by inadequate cleaning.

[0028] (2) The present invention provides a semiconductor packaging mold. Since the upper and lower sets of air nozzles are arranged radially and have air outlets at the top and bottom, they can thoroughly clean dust, debris and other impurities at different heights inside the lower and upper mold cavities, ensuring the cleanliness of the lower mold cavity. This effectively prevents impurities from mixing into the packaging material or affecting the placement of the chip when the semiconductor chip is placed into the lower mold for packaging, thereby ensuring the quality of semiconductor packaging and reducing the chip defect rate caused by impurities. The moving mechanism and the high-pressure blowing mechanism work together to quickly adjust the blowing position and perform efficient cleaning operations. Compared with traditional cleaning methods and mold structures, it has a higher degree of automation and can complete the cleaning of the mold in a shorter time, saving a lot of time for subsequent packaging processes, improving the production efficiency of the entire semiconductor packaging production line, and helping enterprises to gain an advantageous position in fierce market competition. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a semiconductor packaging mold according to the present invention.

[0030] Figure 2 This is a schematic diagram of the moving mechanism of a semiconductor packaging mold according to the present invention.

[0031] Figure 3 This is a schematic diagram of the high-pressure air blowing mechanism of a semiconductor packaging mold according to the present invention.

[0032] In the diagram: 1. Frame; 2. Support; 3. Moving mechanism; 4. First fixed plate; 5. First lead screw; 6. First motor; 7. Second motor; 8. First sleeve block; 9. High-pressure air blowing mechanism; 10. Moving plate; 11. Air nozzle; 12. Fixing component; 13. Air supply branch pipe; 14. Air supply main pipe; 15. Bolt; 16. Limiting plate; 17. Second fixed plate; 18. Sliding rod; 19. Sliding block; 20. Support rod; 21. Fixed block; 22. Lower mold; 23. Upper mold; 24. Cylinder; 25. Second sleeve block; 26. Second lead screw; 27. Limiting rod. Detailed Implementation

[0033] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0034] To prevent dust, debris, and other impurities from contaminating the packaging material due to insufficient mold cleaning, which could lead to performance defects such as short circuits and open circuits in the packaged chip, and affect chip quality and lifespan, it is necessary to improve mold cleaning methods. This will enhance the quality and efficiency of semiconductor packaging, meeting the ever-increasing demands for precision and reliability in semiconductor technology. Figure 1 , Figure 2 , Figure 3 As shown, a semiconductor packaging mold includes a frame 1, a lower mold 22, and an upper mold 23. The lower mold 22 is fixedly installed on the upper end face of the frame 1, and the upper mold 23 is located directly above the lower mold 22. A bracket 2 is fixedly connected to the top of the frame 1. A moving mechanism 3 is provided on the inner side of the bracket 2. The moving mechanism 3 includes two symmetrical first fixing plates 4 fixedly connected to the inner wall of one side of the frame 1. A first lead screw 5 is axially rotatably connected between the two first fixing plates 4. A first motor 6 is fixedly connected to the outer wall of one side of one of the first fixing plates 4. The output end of the first motor 6 passes through the first fixing plate 4 and is fixedly connected to one end of the first lead screw 5. A second sleeve block 25 is threadedly connected to the outer side of the first lead screw 5.

[0035] The inner side of the frame 1 is provided with two symmetrical support rods 20. One of the support rods 20 passes radially through the second sleeve block 25, and the support rod 20 and the second sleeve block 25 slide vertically together. The top ends of the two support rods 20 are fixedly connected to the fixing blocks 21. The two fixing blocks 21 are axially rotatably connected to the second lead screw 26. A second motor 7 is fixedly installed on the outer wall of one end of the fixing block 21. The output end of the second motor 7 passes through the fixing block 21 and is fixedly connected to one end of the second lead screw 26. The outer side of the second lead screw 26 is threadedly connected to the first sleeve block 8. A high-pressure blowing mechanism 9 is provided on one side of the first sleeve block 8. The high-pressure blowing mechanism 9 is located between the lower mold 22 and the upper mold 23. The high-pressure blowing mechanism 9 includes a moving plate 10. The side of the moving plate 10 away from the first sleeve block 8 is provided with multiple blowing nozzles 11. The multiple blowing nozzles 11 are arranged in two radial groups, and the top and bottom ends of the two groups of blowing nozzles 11 are provided with air outlets.

[0036] When in use, the first motor 6 is started, and the output end of the first motor 6 drives the first lead screw 5 to rotate axially. Since the second sleeve block 25 is threadedly connected to the first lead screw 5, when the first lead screw 5 rotates, the second sleeve block 25 will move laterally back and forth along the axis of the first lead screw 5. The support rod 20 slides up and down along the second sleeve block 25. The movement of the second sleeve block 25 will drive the fixed block 21, the second lead screw 26 and the high-pressure blowing mechanism 9 connected to the first sleeve block 8 to move in the horizontal and vertical directions, thereby adjusting the position of the high-pressure blowing mechanism 9 in the horizontal and vertical directions so that it can be aligned with the corresponding areas of the lower mold 22 and the upper mold 23 that need to be blown.

[0037] After adjustment, the second motor 7 is started. The second motor 7 drives the second lead screw 26 to rotate axially. The first sleeve block 8 is threadedly connected to the second lead screw 26. When the second lead screw 26 rotates, the first sleeve block 8 will move linearly along the left and right lateral direction of the second lead screw 26, thereby driving the high-pressure air blowing mechanism 9 connected to one side to move in the left and right lateral direction, ensuring that the air blowing nozzle 11 can be in the optimal working position and effectively act on the relevant parts of the lower mold 22 and the upper mold 23.

[0038] After the high-pressure blowing mechanism 9 is adjusted to the appropriate position by the moving mechanism 3, the high-pressure blowing mechanism 9 is started. Since the moving plate 10 is provided with multiple blowing nozzles 11 arranged in two radial groups, and each group of blowing nozzles 11 has an air outlet at the top and bottom, the gas will be ejected at high speed from these air outlets. The arrangement of the upper and lower groups of blowing nozzles 11 can blow air to clean the lower mold 22 and the upper mold 23. For dust, debris and other impurities that may exist at different heights inside the cavity of the lower mold 22 and the upper mold 23, the high-pressure gas blown out by the upper and lower groups of blowing nozzles 11 can completely blow the impurities away from the mold surface, ensuring the cleanliness of the cavity of the lower mold 22. This creates good environmental conditions for subsequent operations such as placing semiconductor chips into the lower mold 22 for packaging, avoiding impurities from mixing into the packaging material or affecting the placement of the chip, thereby ensuring the quality of semiconductor packaging.

[0039] For example, such as Figure 2 , Figure 3 As shown, the present invention also includes the following: the air nozzle 11 is fixedly installed on the movable plate 10 by the fixing member 12; the two sets of air nozzles 11 are fixedly connected to the opposite ends of the air supply pipes 13; and the multiple air supply pipes 13 are fixedly connected to the ends of the air supply pipes 13 away from the air nozzles 11 by the main air supply pipe 14.

[0040] In use, the gas first enters the gas supply system of the high-pressure blowing mechanism 9 through the gas supply main pipe 14. The gas supply main pipe 14 serves as the main gas delivery channel, guiding the gas from gas sources such as air pumps to various branches. The gas in the gas supply main pipe 14 is diverted to multiple gas supply branches 13. The function of these gas supply branches 13 is to further distribute the gas to each blowing nozzle 11, ensuring that each blowing nozzle 11 can obtain sufficient gas supply.

[0041] The air nozzle 11 is firmly fixed to the moving plate 10 by the fixing member 12. This fixing method ensures that the air nozzle 11 is stable in position during operation and will not be displaced due to the impact of high pressure gas or the movement of the moving mechanism 3.

[0042] When the gas reaches the air nozzle 11 through the gas delivery pipe 13, the gas is ejected at high speed from the outlet of the air nozzle 11.

[0043] For example, such as Figure 1 , Figure 2 As shown, this utility model also includes two symmetrical second fixing plates 17 fixedly connected to the inner wall of the bracket 2 on the side away from the second sleeve block 25. A sliding rod 18 is fixedly connected between the two second fixing plates 17. A slider 19 is slidably connected to the outside of the sliding rod 18. Another support rod 20 is radially passed through the slider 19, and the support rod 20 and the slider 19 slide up and down in cooperation.

[0044] In use, two symmetrical second fixing plates 17 are fixedly connected to the inner wall of the bracket 2, providing a stable installation base for the slide bar 18. The main function of the slide bar 18 is to serve as a guide component for the slider 19. When the slider 19 is subjected to external force, it will slide along the slide bar 18. This sliding connection method ensures that the movement trajectory of the slider 19 is along the axial direction of the slide bar 18, thus playing a precise guiding role.

[0045] Another support rod 20 radially penetrates the slider 19 and is in a sliding engagement with the slider 19. This means that as the slider 19 slides along the slide bar 18, the support rod 20 can slide up and down within the slider 19. This design can play an auxiliary support and balancing role when the moving mechanism 3 drives the related components to move during the operation of the entire device. If the device experiences slight imbalance or uneven force during lateral or longitudinal movement, this engagement between the slider 19 and the support rod 20 can help disperse and balance these forces, ensuring the overall stability of the device and the accuracy of the movement of related components. Especially when working in conjunction with other components such as the first set of blocks 8 and the second set of blocks 25, it can better maintain the structural integrity and working accuracy of the entire mold device.

[0046] For example, such as Figure 2As shown, the present invention also includes threaded holes at the ends of the second sleeve block 25 and the slider 19, and bolts 15 are threadedly connected to the two threaded holes, and the bolts 15 abut against the two corresponding support rods 20. The bottom ends of the two support rods 20 are fixedly connected to limit plates 16.

[0047] When in use, when the bolt 15 is tightened, the end of the bolt 15 will abut against the support rod 20. This abutting action can fix the position of the second sleeve block 25 and the slider 19 on the support rod 20.

[0048] The main function of the limiting plate 16 is to prevent the slider 19 and the second sleeve block 25 from sliding excessively downward on the support rod 20. When unexpected situations such as vibration or collision occur during the operation of the device, causing the slider 19 and the second sleeve block 25 to tend to slide downward, the limiting plate 16 will act as a stop to prevent the slider 19 and the second sleeve block 25 from detaching from the support rod 20, thereby protecting the structural integrity of the entire device, preventing component damage and device failure, and ensuring that the device can operate stably and safely.

[0049] For example, such as Figure 2 As shown, the present invention also includes a limiting rod 27 fixedly connected between the two fixed blocks 21, and the first sleeve block 8 is slidably connected to the limiting rod 27.

[0050] In use, the limiting rod 27, which is fixedly connected between the two fixed blocks 21, provides a precise guide path for the first sleeve block 8. When the second lead screw 26 rotates and drives the first sleeve block 8 to make longitudinal linear motion, the first sleeve block 8 will slide along the limiting rod 27. This sliding connection ensures that the movement direction of the first sleeve block 8 is strictly along the axial direction of the limiting rod 27, preventing the first sleeve block 8 from shifting or rotating during longitudinal movement. This ensures that the high-pressure blowing mechanism 9 connected to one side of the first sleeve block 8 can accurately reach the predetermined position and effectively operate the lower mold 22.

[0051] For example, such as Figure 1 As shown, the present invention also includes a cylinder 24 fixedly installed at the top of the bracket 2, and the output end of the cylinder 24 passes through the bracket 2 and is fixedly connected to the top of the upper mold 23.

[0052] In use, cylinder 24 is used to control the up and down movement of the upper mold 23.

[0053] It should be noted that this utility model is a semiconductor packaging mold. When the first motor 6 is started, the output end of the first motor 6 drives the first lead screw 5 to rotate axially. Since the second sleeve block 25 is threadedly connected to the first lead screw 5, and the support rod 20 slides up and down along the second sleeve block 25, the second sleeve block 25 will move laterally back and forth along the axial direction of the first lead screw 5. This will drive the fixed block 21, the second lead screw 26 and the high-pressure blowing mechanism 9 connected to the first sleeve block 8 to move in the horizontal and vertical directions. This will adjust the position of the high-pressure blowing mechanism 9 in the horizontal direction so that it can be aligned with the corresponding areas of the lower mold 22 and the upper mold 23 that need to be blown.

[0054] After completing the above-mentioned lateral front and rear position adjustment, start the second motor 7. The second motor 7 drives the second lead screw 26 to rotate axially. The first sleeve block 8 and the second lead screw 26 are threadedly connected. When the second lead screw 26 rotates, the first sleeve block 8 will move linearly along the left and right lateral direction of the second lead screw 26, thereby driving the high-pressure air blowing mechanism 9 connected to one side to move in the left and right lateral direction, ensuring that the air blowing nozzle 11 can be in the optimal working position and effectively act on the relevant parts of the lower mold 22 and the upper mold 23.

[0055] After the high-pressure blowing mechanism 9 is adjusted to the appropriate position by the moving mechanism 3, the high-pressure blowing mechanism 9 is started. The gas first enters the gas supply system of the high-pressure blowing mechanism 9 through the gas supply main pipe 14. Then, the gas in the gas supply main pipe 14 is divided into multiple gas supply branches 13. The gas is then further distributed to each blowing nozzle 11 by the gas supply branches 13. Finally, the gas is ejected at high speed from the outlet of the blowing nozzle 11. The upper and lower sets of blowing nozzles 11 are used to blow and clean the lower mold 22 and the upper mold 23, thoroughly blowing away impurities from the mold surface, ensuring the cleanliness of the cavity of the lower mold 22, and creating good environmental conditions for subsequent operations such as placing semiconductor chips into the lower mold 22 for packaging.

[0056] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging mold, comprising a frame (1), a lower mold (22) and an upper mold (23), characterized in that, The lower mold (22) is fixedly installed on the upper end face of the frame (1). The upper mold (23) is located directly above the lower mold (22). A bracket (2) is fixedly connected to the top of the frame (1). A moving mechanism (3) is provided on the inner side of the bracket (2). The moving mechanism (3) includes two symmetrical first fixing plates (4) fixedly connected to the inner wall of one side of the frame (1). A first lead screw (5) is axially rotatably connected between the two first fixing plates (4). A first motor (6) is fixedly connected to the outer wall of one side of one of the first fixing plates (4). The output end of the first motor (6) passes through the first fixing plate (4) and is fixedly connected to one end of the first lead screw (5). A second sleeve block (25) is threadedly connected to the outer side of the first lead screw (5). The inner side of the frame (1) is provided with two symmetrical support rods (20). One of the support rods (20) passes radially through the second sleeve block (25), and the support rod (20) and the second sleeve block (25) slide vertically together. The top ends of the two support rods (20) are fixedly connected to a fixing block (21). The two fixing blocks (21) are axially rotatably connected to a second lead screw (26). A second motor (7) is fixedly installed on the outer wall of one end of one of the fixing blocks (21). The output end of the second motor (7) passes through the fixing block (21) and is connected to the second lead screw (26). One end of the second screw (26) is fixedly connected, and the outer side of the second screw (26) is threadedly connected to the first sleeve block (8). A high-pressure blowing mechanism (9) is provided on one side of the first sleeve block (8). The high-pressure blowing mechanism (9) is located between the lower mold (22) and the upper mold (23). The high-pressure blowing mechanism (9) includes a moving plate (10). A plurality of blowing nozzles (11) are provided on the side of the moving plate (10) away from the first sleeve block (8). The plurality of blowing nozzles (11) are arranged in two radial groups, and the top and bottom of the two groups of blowing nozzles (11) are provided with air outlets.

2. A semiconductor packaging mold according to claim 1, characterized in that: The air nozzle (11) is fixedly installed on the movable plate (10) by a fastener (12). The two sets of air nozzles (11) are fixedly connected to the opposite ends of the air supply pipes (13), and the ends of the multiple air supply pipes (13) away from the air nozzles (11) are fixedly connected to the main air supply pipes (14).

3. A semiconductor packaging mold according to claim 1, characterized in that: The bracket (2) is fixedly connected to two symmetrical second fixing plates (17) on the inner wall of the side away from the second set of blocks (25). A sliding rod (18) is fixedly connected between the two second fixing plates (17). A slider (19) is slidably connected to the outside of the sliding rod (18). Another support rod (20) is radially passed through the slider (19), and the support rod (20) and the slider (19) slide up and down in cooperation.

4. A semiconductor packaging mold according to claim 3, characterized in that: The second set of blocks (25) and the slider (19) are provided with threaded holes at the opposite ends. Bolts (15) are threaded into the two threaded holes, and the bolts (15) abut against the corresponding two support rods (20). The bottom ends of the two support rods (20) are fixedly connected to limit plates (16).

5. A semiconductor packaging mold according to claim 1, characterized in that: A limiting rod (27) is fixedly connected between the two fixed blocks (21), and the first sleeve block (8) is slidably connected to the limiting rod (27).

6. A semiconductor packaging mold according to claim 1, characterized in that: A cylinder (24) is fixedly installed at the top of the bracket (2), and the output end of the cylinder (24) passes through the bracket (2) and is fixedly connected to the top of the upper mold (23).

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