Laser processing equipment

Abstract

The utility model provides laser processing equipment which is suitable for carrying out structure recombination on the surface of an object and comprises a carrying table, a control device and a laser device. The carrying platform is used for carrying an object. The laser device is electrically connected with the control device, the laser device comprises a laser light source module and a galvanometer module, and the laser device scans at least one part of the surface of the object through femtosecond laser, so that the at least one part of the surface is subjected to structure recombination.

Description

TECHNICAL FIELD

[0001] The present application relates to a surface treatment technology, in particular to a processing device for reorganizing the structure of a processing object by femtosecond laser. BACKGROUND

[0002] A conventional method for changing the microstructure of a material and further changing the properties thereof is heat treatment in a furnace tube. However, the aforementioned heat treatment is often limited to the size of the furnace tube, and as the processing object is gradually thinned, it is prone to deformation or breakage when heat treated in the furnace tube.

[0003] Therefore, how to design a process to reorganize the structure of a processing object to expand the application field of the processing object has become one of the important issues to be solved in this industry. CONTENT OF THE INVENTION

[0004] The technical problem to be solved by the present application is to provide a surface structure reorganization processing method to overcome the deficiencies of the prior art, which comprises: providing a processing object; performing a structure reorganization step to scan at least a portion of the surface of the processing object with a femtosecond laser to reorganize the structure of at least a portion of the surface.

[0005] According to a feasible embodiment, before performing the structure reorganization, a preheating step is performed to scan at least a portion of the surface of the processing object in a non-femtosecond laser manner.

[0006] According to a feasible embodiment, the preheating step is to scan at least a portion of the surface of the processing object in a laser spot surface scanning manner. The structure reorganization step is to scan at least a portion of the surface of the processing object in a laser spot line scanning manner.

[0007] According to a feasible embodiment, the preheating step is to scan at least a portion of the surface of the processing object in a laser spot line scanning manner. The structure reorganization step is to scan at least a portion of the surface of the processing object in a laser spot surface scanning manner.

[0008] According to a feasible embodiment, the wavelength of the femtosecond laser is 300-2000 nm, the pulse width of the femtosecond laser is 50-500 fs, and the pulse energy of the femtosecond laser is 10 nJ-1000 μJ.

[0009] The application also provides a laser processing device suitable for surface structure reorganization of a processing object. The laser processing device comprises a carrier, a control device, and a laser device. The carrier is used to carry the processing object. The laser device is electrically connected to the control device. The laser device comprises a laser light source module and a galvanometer module. The laser device scans at least a part of the surface of the processing object with a femtosecond laser to reorganize the structure of the at least part of the surface. The wavelength of the femtosecond laser is 300-2000 nm. The pulse width of the femtosecond laser is 50-500 fs. The pulse energy of the femtosecond laser is 10 nJ-1000 μJ.

[0010] According to an embodiment, the laser device performs a preheating step before performing the structure reorganization step. The preheating step scans at least a part of the surface of the processing object with a non-femtosecond laser.

[0011] According to an embodiment, the preheating step scans at least a part of the surface of the processing object with a laser spot surface scanning method. The structure reorganization step scans at least a part of the surface of the processing object with a laser spot line scanning method.

[0012] According to an embodiment, the preheating step scans at least a part of the surface of the processing object with a laser spot line scanning method. The structure reorganization step scans at least a part of the surface of the processing object with a laser spot surface scanning method.

[0013] According to an embodiment, the processing object is a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate.

[0014] According to an embodiment, the laser processing device further comprises a spectral imaging device comprising a photosensitive component. The spectral imaging device is electrically connected to the control device. The spectral imaging device receives reflected light reflected by the processed object and transmits a photosensitive signal to the control device. The control device generates a spectral image corresponding to the photosensitive signal.

[0015] One advantage of the application is that the surface structure reorganization method can reorganize the structure of the surface of the processing object in a short time. In some technical fields, the processing object is a silicon carbide substrate. The resistance of the silicon carbide substrate can be changed without damaging the shape of the silicon carbide substrate by scanning with a femtosecond laser, thereby improving the electrical properties.

[0016] Further, in an embodiment, a preheating step is performed before the structure reorganization step. The preheating step scans at least a part of the surface of the processing object with a non-femtosecond laser. The surface structure reorganization effect of the processing object is better after the preheating step.

[0017] Further, according to an embodiment, the laser processing device further comprises a spectral imaging device, including a photosensitive component, the spectral imaging device is electrically connected to the control device, receives the reflected light reflected by the processed object, and correspondingly transmits a photosensitive signal to the control device, and the control device correspondingly generates a spectral image. In this way, the surface structure reorganization of the processed object can be monitored in real time, and whether the expected effect (such as the profile of the surface microstructure of the processed object) is achieved can be determined, and the conditions of the femtosecond laser can be adjusted accordingly.

[0018] The details of other effects and embodiments of the present application are described below in conjunction with the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0020] Figure 1 Process flow diagram of the surface structure reorganization processing method according to an embodiment of the present application;

[0021] Figure 2 Process flow diagram of the surface structure reorganization processing method according to an embodiment of the present application;

[0022] Figure 3 Architectural diagram of the laser processing device according to an embodiment of the present application. DETAILED DESCRIPTION

[0023] The following is to illustrate the embodiments of the present application disclosed in the present application related to "surface structure reorganization processing method and laser processing device" through specific embodiments. Those skilled in the art can understand the advantages and effects of the present application from the content disclosed in the present specification. The present application can be implemented or applied through other different specific embodiments, and each detail in the present specification can be modified and changed based on different viewpoints and applications without departing from the concept of the present application. In addition, the drawings of the present application are only simple schematic illustrations, not the depiction according to the actual size, and the prior declaration is made. The following embodiments will further illustrate the related technical content of the present application in detail, but the disclosed content is not used to limit the protection scope of the present application.

[0024] Please refer to Figure 1This is a schematic diagram illustrating the process steps of a surface structure remodeling method according to an embodiment of this application. The surface structure remodeling method 100 includes steps S1 to S2. Step S1 involves providing a workpiece. According to some embodiments, the workpiece may be a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate. Step S2 involves performing a structure remodeling step by scanning at least a portion of the surface of the workpiece with a femtosecond laser, thereby remodeling the structure of at least a portion of the surface. In other words, the surface structure remodeling method of this application can partially or completely remodel the surface of the workpiece, generating multiple microstructures.

[0025] Please see Figure 2 This is a schematic diagram of the process steps of a surface structure reconstruction method 200 according to an embodiment of this application. According to this embodiment, before performing step S2, a preheating step S11 is also performed, in which at least a portion of the surface of the workpiece is scanned using a non-femtosecond laser. Through this second scanning and preheating, the surface structure reconstruction effect of the workpiece is improved.

[0026] According to some embodiments, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scanning method. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot line scanning method.

[0027] According to some embodiments, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot line scan. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scan.

[0028] The aforementioned "at least a portion" refers to the area processed by laser. This can be partial processing or processing of the entire surface.

[0029] According to some embodiments, the structural reconstruction step is performed under the following femtosecond laser conditions: the wavelength of the femtosecond laser is 300 to 2000 nm (inclusive of any positive integer from 300 to 2000 nm), the pulse width of the femtosecond laser is 50 to 500 fs (inclusive of any positive integer from 50 to 500 fs), and the pulse energy of the femtosecond laser is 10 nJ to 1000 μJ (inclusive of any positive integer from 10 nJ to 1000 μJ).

[0030] Please see Figure 3Fig. 1 is a schematic diagram of an embodiment of a laser processing apparatus Z. The laser processing apparatus Z is suitable for performing structural reorganization on a surface of a workpiece. The laser processing apparatus Z comprises a carrier 1, a control device 2, and a laser device 3. The carrier 1 is configured to carry the workpiece. The laser device 3 is electrically connected to the control device 2. The laser device 3 comprises a laser light source module 31, a galvanometer module 32, and a field lens module 33. The laser device 3 is configured to perform structural reorganization on at least a portion of the surface of the workpiece by scanning the at least a portion of the surface of the workpiece with femtosecond laser light. In some embodiments, the structural reorganization is performed on the surface of the workpiece by scanning the at least a portion of the surface of the workpiece with femtosecond laser light having a wavelength of 300-2000 nm (including any positive integer within the range of 300-2000 nm), a pulse width of 50-500 fs (including any positive integer within the range of 50-500 fs), and a pulse energy of 10 nJ-1000 μJ (including any positive integer within the range of 10 nJ-1000 μJ).

[0031] The control device 2 is, for example, a computer. In some embodiments, the workpiece processed by the laser processing apparatus Z can be a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate.

[0032] In some embodiments, the laser device 3 is further configured to perform a preheating step before performing the structural reorganization step. The preheating step is performed by scanning the at least a portion of the surface of the workpiece with non-femtosecond laser light. The structural reorganization step is performed by scanning the at least a portion of the surface of the workpiece with femtosecond laser light. In some embodiments, the preheating step is performed by scanning the at least a portion of the surface of the workpiece with a laser spot. The structural reorganization step is performed by scanning the at least a portion of the surface of the workpiece with a laser line. In some embodiments, the preheating step is performed by scanning the at least a portion of the surface of the workpiece with a laser line. The structural reorganization step is performed by scanning the at least a portion of the surface of the workpiece with a laser spot.

[0033] In some embodiments, the preheating step is performed by scanning the at least a portion of the surface of the workpiece with a laser spot. The structural reorganization step is performed by scanning the at least a portion of the surface of the workpiece with a laser line. In some embodiments, the preheating step is performed by scanning the at least a portion of the surface of the workpiece with a laser line. The structural reorganization step is performed by scanning the at least a portion of the surface of the workpiece with a laser spot.

[0034] Please refer to Fig. 1 again. Figure 3According to the embodiment, the laser processing device Z further comprises a spectral imager 4, including a light sensing component, and the spectral imager 4 is electrically connected to the control device 2, receives the reflected light reflected by the processed object, and correspondingly transmits a light sensing signal to the control device 2, and the control device 2 correspondingly generates a spectral image. The light sensing component is, for example, a charge-coupled device (CCD). According to some embodiments, the light source of the reflected light reflected by the processed object is the laser beam, and according to some other embodiments, the spectral imager 4 comprises another light source module, such as a light-emitting diode, which irradiates the processed object with white light, and the light sensing component receives the reflected light reflected by the processed object. In other words, according to some embodiments, the optical axis of the laser device 3 can be coaxial with the optical axis of the spectral imager 4. According to some other embodiments, the optical axis of the laser device 3 can be different from the optical axis of the spectral imager 4, and the present application does not have any limitation.

[0035] According to some embodiments, the spectral imager 4 is a hyper-spectral imaging (HSI) device. By observing the hyper-spectral image, the condition of the surface structure reorganization of the processed object can be monitored in real time. For example, the surface structure reorganization is to form microstructures on the surface, and by the hyper-spectral image, it can be known whether the shape of the microstructure is the preset shape, and the processing conditions of the femtosecond laser can be further adjusted.

[0036] “Advantages of the embodiments”

[0037] One of the advantages of the present application is that the surface structure reorganization processing method provided by the present application can make the surface of the processed object reorganize in a short time by the technical solution of “scanning at least a part of the surface of the processed object by the femtosecond laser to make at least a part of the surface reorganize”. In some technical fields, the processed object is a silicon carbide substrate, and by scanning with the femtosecond laser, the resistance of the silicon carbide substrate can be changed without damaging the shape of the silicon carbide substrate, and the electrical properties can be improved.

[0038] Further, in an embodiment, before the structure reorganization is performed, a preheating step is also performed, in which at least a part of the surface of the processed object is scanned in a manner other than the femtosecond laser. By scanning twice, the effect of the surface structure reorganization of the processed object after preheating is better.

[0039] Further, according to an embodiment, the laser processing device Z further comprises an optical sensor, which is electrically connected to the control device 2, receives the reflected light reflected by the processed object, and correspondingly transmits a light sensing signal to the control device 2, and the control device 2 correspondingly generates a spectral image. In this way, the condition of the surface structure reorganization of the processed object can be monitored in real time, and the conditions of the femtosecond laser can be correspondingly adjusted.

[0040] The above-described embodiments and / or implementations are merely used to illustrate the preferred embodiments and / or implementations of the present application, and are not intended to limit the embodiments of the present application in any form, and any person skilled in the art can make some changes or modifications to other equivalent embodiments without departing from the technical means disclosed in the present application, but should be considered as the same technology or embodiments as the present application.

Claims

1. A laser processing device suitable for structural remodeling of the surface of a workpiece, characterized in that, The laser processing equipment includes: A platform for supporting the workpiece being processed; A control device; and A laser device electrically connected to the control device, the laser device including a laser source module, a galvanometer module and a field mirror module, the laser device scanning at least a portion of the surface of the workpiece with a femtosecond laser, causing the at least a portion of the surface to undergo structural reorganization; The femtosecond laser has a wavelength of 300 to 2000 nm, a pulse width of 50 to 500 fs, and a pulse energy of 10 nJ to 1000 μJ.

2. The laser processing equipment according to claim 1, characterized in that, The processed object is a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate.

3. The laser processing equipment according to claim 1, characterized in that, The laser processing equipment also includes a spectral imager, which includes a photosensitive component. The spectral imager is electrically connected to the control device, receives reflected light reflected by the workpiece, and transmits a photosensitive signal to the control device accordingly. The control device then generates a spectral image.

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