Liquid cooling heat dissipation inductance device

Abstract

The utility model relates to the technical field of inductors, and provides a liquid cooling heat dissipation inductance device which is characterized in that based on the heat dissipation requirement of a current large-current inductor, a liquid cooling bottom plate is integrated in an integrally-formed base, liquid cooling flow channels distributed in the radial direction are arranged, every two adjacent liquid cooling flow channels are connected end to end, and cooling liquid is poured into the liquid cooling flow channels; therefore, a large amount of heat generated when the inductor body works in a large current is taken away, high temperature caused by heat accumulation or continuous high-temperature work is avoided, liquid-cooled heat dissipation is achieved, and the heat dissipation efficiency is greatly improved. As the liquid cooling flow channel and the base are integrally formed, the volume of the product is reduced by 34% on year-on-year basis, and the product is miniaturized and is matched with the mounting plate for built-in mounting, so that the waterproof, dustproof and anticorrosive functions are realized; and moisture and dust caused by aging of the sealing ring when the photovoltaic inductor is externally arranged outside the photovoltaic equipment case are prevented from entering the photovoltaic equipment case to influence an electric appliance circuit, so that the service life of a product is further prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to inductor technical field especially relates to a liquid cooling heat dissipation inductor device. BACKGROUND

[0002] The photovoltaic inductor is composed of an inductor main body, a metal shell and a pouring sealant. The photovoltaic inductor not only needs to bear large current on the photovoltaic power generation system, but also needs to have the performance requirements of good heat dissipation, small volume, long service life, low cost, small power consumption, high working efficiency, waterproof, dustproof, anticorrosion and beauty. The metal shell of the photovoltaic inductor plays a crucial role in the performance requirements.

[0003] In the current industry, the metal shell of the photovoltaic inductor is a shell structure with cooling fins, i.e. a cooling fin metal shell. The cooling fin metal shell increases the contact area with air through the cooling fins to expand the heat dissipation area of the photovoltaic inductor, and finally performs heat dissipation through natural cooling or forced air cooling. However, there are problems:

[0004] 1. The cooling fin metal shell cannot adapt to the photovoltaic power generation system with large working current. The cooling fin metal shell cannot effectively reduce the high temperature generated by the photovoltaic inductor during operation through natural cooling or forced air cooling. Due to the inability to dissipate heat in time, the working temperature rises, which reduces the current carrying capacity of the photovoltaic inductor, and further increases the power consumption, reduces the working efficiency and shortens the service life.

[0005] 2. The cooling fin metal shell is provided with cooling fins radiating outward, which causes the volume of the photovoltaic inductor to increase in the full range, and the space occupation of the cooling fins is large, which further causes the overall size of the photovoltaic equipment installed with the photovoltaic inductor to increase.

[0006] 3. The photovoltaic inductor is generally externally hung and locked outside the photovoltaic equipment cabinet. The sealing ring on the mounting surface of the photovoltaic inductor is used to prevent moisture and dust in the environment from entering the photovoltaic equipment cabinet through the installation gap between the photovoltaic inductor and the photovoltaic equipment cabinet. However, as the sealing ring of the photovoltaic inductor ages, the waterproof and dustproof performance will deteriorate, which will cause moisture and dust to enter the photovoltaic equipment cabinet, affecting the electrical circuit of the photovoltaic equipment. In addition, the externally hung and locked photovoltaic inductor is easily corroded by the external environment. Although the metal shell of the photovoltaic inductor has a protective layer such as a coating or an oxidation layer, it will still be corroded after a long time. Increasing the corrosion resistance of the protective layer will increase the process difficulty and cost of the protective layer. INVENTION CONTENTS

[0007] The utility model provides a liquid cooling heat dissipation inductor device, solved the existing photovoltaic inductor heat dissipation efficiency is poor, the volume is big, therefore the technical problem that the external hanging type mounting structure that adopts leads to the poor installation sealing property, poor corrosion resistance.

[0008] To solve the above technical problems, the utility model provides a liquid cooling heat dissipation inductor device is equipped with base and solid seal with inductance main part in base, the base includes liquid cooling bottom plate, fixed wall of two sides top surface of liquid cooling bottom plate is divided and install bottom plate of two sides end of liquid cooling bottom plate is divided,

[0009] Liquid cooling bottom plate is equipped with radial distribution liquid cooling flow channel, and the liquid cooling flow channel is a transverse cavity; Two by two adjacent liquid cooling flow channels are connected at the head and tail to form a connecting cavity, and a support wall is arranged in the middle to separate the liquid cooling flow channels.

[0010] The liquid cooling bottom plate is integrally formed with the fixed wall and the mounting plate.

[0011] The basic scheme is based on the heat dissipation demand of the current large current inductor. The liquid cooling bottom plate is integrated in the integrally formed base, the radial distribution liquid cooling flow channel is arranged, two by two adjacent liquid cooling flow channels are connected at the head and tail and filled with cooling liquid, so as to take away a large amount of heat generated when the inductor main body works at large current, avoid high temperature caused by heat accumulation or continuous work at high temperature, realize liquid cooling heat dissipation, realize outstanding progress of 40 DEG C reduction of working temperature compared with traditional fin heat dissipation, greatly improve the heat dissipation efficiency, and the product current carrying capacity is increased by 26.6%, and the service life is increased by 3-3.5 times; Due to the integral forming of the liquid cooling flow channel and the base, the product volume is reduced by 34% compared with the same period, the mold investment cost is reduced by 82%, the product cost is low, the power consumption is small, and the working efficiency is high; Miniaturization is realized at the same time, and the mounting plate is used for built-in installation, so as to realize the functions of waterproof, dustproof and anticorrosion, avoid the influence of moisture and dust entering the photovoltaic equipment cabinet caused by aging of the sealing ring when the photovoltaic inductor is externally connected to the photovoltaic equipment cabinet, and further improve the service life of the product.

[0012] In further embodiments, the end of the liquid cooling bottom plate is provided with at least one mounting position, the mounting position is a groove formed based on the connecting cavity along the vertical surface, and the longitudinal section area of the groove is greater than that of the connecting cavity;

[0013] Further comprising at least one sealing baffle, the sealing baffle is a plate structure; The sealing baffle is welded and installed in the mounting position to seal the connecting cavity and thereby communicate the two by two adjacent liquid cooling flow channels.

[0014] The scheme is matched with the integral forming process of the liquid cooling flow channel, and a corresponding mounting position and sealing baffle are arranged, so that the sealing performance of the cooling liquid is met, the manufacturing process difficulty is reduced, and the manufacturing efficiency is improved.

[0015] In further embodiments, the mounting plate is symmetrically distributed at the two side ends of the liquid cooling bottom plate, and a mounting hole vertically penetrating the plate surface is arranged in the middle of the plate surface.

[0016] The upper part of the fixed wall extends vertically, and the end is an outwardly convex ┏-shaped structure. The two end faces of the ┏-shaped structure are respectively provided with a first mounting groove recessed inward. The lower part of the fixed wall is connected with the top of the liquid cooling bottom plate. The inner side wall of the lower part is a curved surface structure with gradually increasing cross section. The two end faces of the curved surface structure are respectively provided with a second mounting groove recessed inward.

[0017] The mounting plate is arranged at the both ends of the liquid cooling bottom plate. The mounting hole on the mounting plate cooperates with the bolt to realize the mounting and fixing of the inductor device as a whole. The inner side wall of the lower part of the fixed wall is arranged as a curved surface structure with gradually increasing cross section. On the one hand, the inner cavity of the base is closer to the inductor body, which is beneficial to the heat conduction of the inductor body, so as to improve the heat dissipation efficiency. On the other hand, by reducing the volume of the inner cavity, the amount of potting glue is reduced, and the input cost of the potting glue is reduced. The first mounting groove and the second mounting groove are respectively arranged at the two end faces of the outwardly convex ┏-shaped structure and the inwardly extending curved surface structure, so as to be ready for the mounting and fixing of the first side cover plate and the second side cover plate.

[0018] In further embodiments, the first side cover plate and the second side cover plate are further included. The lower part of the first side cover plate is provided with a through hole matched with the second mounting groove. The upper part of the first side cover plate is provided with an outwardly convex ear seat on both sides. The ear seat is provided with a through hole matched with the first mounting groove. The first side cover plate and the second side cover plate are the same in structure.

[0019] The first side cover plate and the second side cover plate are respectively arranged at the both ends of the base and are mounted and fixed by cooperating with the first mounting groove and the second mounting groove through screws, so as to form a potting cavity.

[0020] The first cover plate and the second cover plate are arranged correspondingly based on the integrally formed base, so as to form a potting cavity for accommodating the inductor body. Since the structure is simple, the installation difficulty is low, and the labor cost of installation is reduced.

[0021] In further embodiments, one end of the liquid cooling flow channel distributed on the outer edge of the both sides of the liquid cooling bottom plate is left empty, which is respectively used as a liquid cooling inlet and a liquid cooling outlet of the liquid cooling flow channel.

[0022] Two groups of liquid cooling connectors are further included. One group of the liquid cooling connectors is fixed at the liquid cooling inlet and is fixed by laser welding. The other group of the liquid cooling connectors is fixed at the liquid cooling outlet and is fixed by laser welding.

[0023] The liquid cooling connectors are arranged at the both ends of the liquid cooling flow channel. The cooling liquid enters the liquid cooling flow channel of the liquid cooling shell through the liquid cooling connectors. The heat generated by the inductor body during operation is taken out of the flow channel through the heat transfer by convection, so as to realize high-efficiency heat dissipation. The liquid cooling circuit can be realized in a circulating mode. The liquid cooling efficiency is high, and the heat dissipation efficiency is high.

[0024] In a further embodiment, the inductor body includes a magnetic core, a coil winding, and an insulating layer, the insulating layer being nested on the magnetic core, and the coil winding being nested on the magnetic core through the insulating layer;

[0025] The magnetic core includes a core center column, a core top cover, and a core bottom cover; the two ends of the core center column are respectively connected to the core top cover and the core bottom cover, and the insulating layer is surrounded on it, with the coil winding surrounding the outside of the insulating layer.

[0026] This solution uses a block-shaped magnetic powder core alloy core. The magnetic powder core alloy core has high saturation magnetic flux density and low power loss. While meeting the bias inductance requirements, the core volume can be made smaller, further realizing the miniaturization of the product.

[0027] In a further embodiment, the insulating layer includes insulating paper, a first insulating plate, and a second insulating plate; the insulating paper covers the magnetic core column, with its inner side closely attached to the outer side wall of the magnetic core column, and the coil winding is surrounded on its outer side;

[0028] The first insulating plate has a through hole in the middle that penetrates the plate surface. The through hole is larger than the cross-section of the magnetic core column and its inner diameter is smaller than the inner diameter of the coil winding.

[0029] The second insulating plate has the same structure as the first insulating plate;

[0030] One end of the central column of the magnetic core passes through the mounting through hole on the first insulating plate and is fixedly connected to the upper cover of the magnetic core, while the other end passes through the mounting through hole on the second insulating plate and is fixedly connected to the lower cover of the magnetic core.

[0031] In a further embodiment, the coil winding is a continuous flat copper coil made of flat copper wire.

[0032] This solution uses a continuous flat copper coil. The continuous flat copper coil is formed by winding a flat copper wire into a coil using an automatic winding machine. This method has high production efficiency, low cost, and the copper wire has low resistance, low power loss, good thermal conductivity, and strong current carrying capacity. Attached Figure Description

[0033] Figure 1 This is a liquid-cooled heat dissipation inductor device provided in this embodiment of the utility model;

[0034] Figure 2 This is provided by the embodiment of the present utility model. Figure 1 Exploded view of the liquid-cooled outer casing;

[0035] Figure 3 This is provided by the embodiment of the present utility model. Figure 1 Exploded view of the main body of the inductor;

[0036] Figure 4 is the embodiment of the utility model provides Figure 1 the cross section drawing of liquid cooling shell in

[0037] Figure 5 is the embodiment of the utility model provides Figure 2 the three-dimensional structure diagram of main shell in

[0038] Figure 6 is the embodiment of the utility model provides Figure 1 the assembly schematic view of

[0039] Figure 7 is the experimental comparison data chart of the embodiment of the utility model.

[0040] Figure 8 is the three-dimensional structure diagram of prior art A of the embodiment of the utility model.

[0041] Wherein: base A, inductance body B;

[0042] Liquid cooling bottom plate 1, liquid cooling runner 11, support wall 12, installation site 13;Fixed wall 2, ┏ Shape structure 21, first installation groove 22, curved surface structure 23, second installation groove 24;Installation bottom plate 3;Sealing baffle 4, mounting hole 41;First side cover plate 5, lug seat 51;Second side cover plate 6;Liquid cooling connector 7;

[0043] Magnetic core middle column B1, magnetic core upper cover B2, magnetic core lower cover B3, coil winding B4, insulating paper B5, first insulating plate B6, second insulating plate B7. Specific embodiments

[0044] The embodiment of the utility model is specifically illustrated below in conjunction with the drawings, and the embodiment is only for the purpose of illustration and can not be understood as limiting the utility model, including the drawings are only for reference and use, and do not constitute the limitation of the patent protection range of the utility model, because many changes can be made to the utility model without departing from the spirit and scope of the utility model.

[0045] The utility model embodiment provides a kind of liquid cooling heat dissipation inductor device, as shown in Figures 1-8 In the present embodiment, base A and inductance body sealed in the base A are provided, the base A includes liquid cooling bottom plate 1, fixed wall 2 arranged on the top surface of the two sides of the liquid cooling bottom plate 1 and installation bottom plate 3 arranged on the end of the two sides of the liquid cooling bottom plate 1;

[0046] The liquid cooling bottom plate 1 is provided with radially distributed liquid cooling flow channels 11, which are transversely penetrating cavities; two adjacent liquid cooling flow channels 11 are connected end to end to form a connecting cavity, and a support wall 12 is arranged in the middle to separate the liquid cooling flow channels 11;

[0047] The liquid cooling bottom plate 1 is integrally formed with the fixed wall 2 and the mounting plate.

[0048] Specifically, one end of the support wall 12 is arranged at the end of the liquid cooling bottom plate 1, and the other end is inwardly recessed to form a connecting cavity; two adjacent support walls 12 are staggered.

[0049] Wherein, after the inductance body B is put into the potting cavity, the potting glue is injected, and after the potting glue is cooled and solidified, an integrated inductance device is formed.

[0050] Specifically, an extrusion die is opened, an aluminum alloy 6063 is extruded to form the base A, and a cutting machine is used to cut the base A to a specified length, and then a CNC machine tool is used to mill the different liquid cooling flow channels 11 in the base A to connect them together. The base A is extruded from aluminum alloy 6063, which has good heat conduction performance, good corrosion resistance and good mechanical properties. In other embodiments, other metals or alloys can be selected for extrusion according to requirements. The "aluminum alloy 6063" in the present embodiment is only a preferred description and does not limit the scope.

[0051] In the present embodiment, the end of the liquid cooling bottom plate 1 is provided with at least one mounting position 13, which is a groove formed by expanding the connecting cavity along the vertical plane, and the longitudinal cross-sectional area of the mounting position 13 is greater than that of the connecting cavity;

[0052] Further comprising at least one sealing baffle 4, which is a plate structure; the sealing baffle 4 is welded and mounted on the mounting position 13 to seal the connecting cavity and thereby connect two adjacent liquid cooling flow channels 11.

[0053] In the present embodiment, the sealing baffle 4 is punched and formed on an aluminum alloy 6063 plate by a punch.

[0054] The present embodiment is an integrated process for liquid cooling flow channels 11, which sets up a one-to-one corresponding mounting position 13 and sealing baffle 4, thereby meeting the sealing of the cooling liquid while reducing the difficulty of the manufacturing process and improving the manufacturing efficiency.

[0055] In the present embodiment, the mounting plate is symmetrically distributed on both sides of the liquid cooling bottom plate 1, and a mounting hole 41 is arranged in the middle of the plate surface and vertically penetrates the plate surface;

[0056] The upper part of the fixed wall 2 extends vertically, and the end thereof is an outwardly protruding ┏-shaped structure 21, the end faces of both ends of the ┏-shaped structure 21 are respectively provided with a first mounting groove 22 which is inwardly recessed; the lower part of the fixed wall 2 is connected with the top of the liquid cooling bottom plate 1, and the inner side wall of the lower part is a curved surface structure 23 with gradually increasing cross section, and the end faces of both ends of the curved surface structure 23 are respectively provided with a second mounting groove 24 which is inwardly recessed.

[0057] In the embodiment, mounting plates are arranged at both ends of the liquid cooling bottom plate 1, and the mounting holes 41 on the mounting plates are matched with bolts to realize mounting and fixing of the whole inductance device. The inner side wall of the lower part of the fixed wall 2 is arranged as the curved surface structure 23 with gradually increasing cross section, which on the one hand makes the inner cavity of the base A closer to the inductance main body B, and is beneficial to heat conduction of the inductance main body B, so as to improve the heat dissipation efficiency; on the other hand, by reducing the volume of the inner cavity, the amount of potting glue is reduced, and the input cost of the potting glue is further reduced. The first mounting groove 22 and the second mounting groove 24 are respectively arranged at the end faces of both ends of the outwardly protruding ┏-shaped structure 21 and the inwardly extending curved surface structure 23, so as to be ready for mounting and fixing of the first side cover plate 5 and the second side cover plate 6.

[0058] In the embodiment, the first side cover plate 5 and the second side cover plate 6 are further included; the lower part of the first side cover plate 5 is provided with a through hole matched with the second mounting groove 24, and the upper part of the first side cover plate 5 is provided with outwardly protruding ear seats 51 on both sides thereof, and the ear seats 51 are provided with through holes matched with the first mounting groove 22; the first side cover plate 5 and the second side cover plate 6 are the same in structure;

[0059] The first side cover plate 5 and the second side cover plate 6 are respectively arranged at both ends of the base A and are mounted and fixed by screws matched with the first mounting groove 22 and the second mounting groove 24, so as to form a potting cavity.

[0060] Preferably, the first side cover plate 5 and the second side cover plate 6 are punch cut into shape from aluminum alloy 5052 plates. The aluminum alloy 6063 and the aluminum alloy 5052 plates in the embodiment are only a preferred description and are not limited.

[0061] In the embodiment, the base A is integrally formed, and the corresponding first cover plate and the second cover plate are arranged in cooperation to form a potting cavity for accommodating the inductance main body B. Since the structure is simple, the installation difficulty is low, and the labor installation cost is reduced.

[0062] In the embodiment, one end of the liquid cooling flow channel 11 distributed on the outer edges of both sides of the liquid cooling bottom plate 1 is left empty, and is respectively used as a liquid cooling inlet and a liquid cooling outlet of the liquid cooling flow channel 11.

[0063] Two groups of liquid cooling connectors 7 are further included, one group of the liquid cooling connectors 7 is fixed at the liquid cooling inlet and is fixed by laser welding, and the other group of the liquid cooling connectors 7 is fixed at the liquid cooling outlet and is fixed by laser welding.

[0064] The temperature of the cooling liquid entering the liquid cooling flow channel 11 and the flow rate of the cooling liquid can be controlled by the intelligent liquid cooling system according to actual needs, and the working temperature is kept at a stable and ideal temperature point.

[0065] In this embodiment, liquid cooling connectors 7 are arranged at both ends of the liquid cooling flow channel 11, and the cooling liquid enters the liquid cooling flow channel 11 of the liquid cooling shell through the liquid cooling connectors 7. The heat generated by the inductor body B during operation is taken away from the flow channel through convection heat exchange to achieve high-efficiency heat dissipation. A circulating liquid cooling loop can be realized, and the liquid cooling efficiency and the heat dissipation efficiency are high.

[0066] In this embodiment, the inductor body B includes a magnetic core, a coil winding B4, and an insulation layer, the insulation layer is nested on the magnetic core, and the coil winding B4 is nested on the magnetic core through the insulation layer.

[0067] The magnetic core includes a magnetic core middle column B1, a magnetic core upper cover B2, and a magnetic core lower cover B3. The two ends of the magnetic core middle column B1 are connected with the magnetic core upper cover B2 and the magnetic core lower cover B3, respectively, and the insulation layer is wrapped thereon. The coil winding B4 is wrapped outside the insulation layer.

[0068] In this embodiment, a block-shaped magnetic powder core alloy magnetic core is adopted. The magnetic powder core alloy magnetic core has high saturation magnetic flux density and low power loss. The magnetic core volume can be made smaller while meeting the bias inductance requirement, thereby further realizing product miniaturization.

[0069] In this embodiment, the insulation layer includes an insulation paper B5 and first and second insulation plates B6 and B7. The insulation paper B5 is wrapped around the magnetic core middle column B1, and the inner side surface thereof is tightly attached to the outer side wall of the magnetic core middle column B1, and the outer side surface thereof is wrapped with the coil winding B4.

[0070] The first insulation plate B6 is provided with a mounting through hole penetrating the plate surface in the middle portion. The mounting through hole is larger than the cross section of the magnetic core middle column B1, and the inner diameter thereof is smaller than the inner diameter of the coil winding B4.

[0071] The second insulation plate B7 has the same structure as the first insulation plate B6.

[0072] One end of the magnetic core middle column B1 is fixedly connected with the magnetic core upper cover B2 through the mounting through hole in the first insulation plate B6, and the other end is fixedly connected with the magnetic core lower cover B3 through the mounting through hole in the second insulation plate B7.

[0073] In this embodiment, the coil winding B4 is a flat copper wire coil formed by winding flat copper wires.

[0074] This embodiment uses a continuous-winding flat copper coil. The continuous-winding flat copper coil is formed by winding a flat copper wire into a coil using an automatic winding machine. This method has high production efficiency, low cost, and the copper wire has low resistance, low power loss, good thermal conductivity, and strong current carrying capacity.

[0075] The liquid-cooled inductor provided in this embodiment is applied in photovoltaic power generation systems. Photovoltaic power generation systems include residential, commercial / industrial, and ground-mounted systems. The liquid-cooled inductor can be used in photovoltaic inverters, energy storage inverters, and other photovoltaic equipment. When using it, the customer first installs the liquid-cooled inductor on the pre-installed screw posts inside the photovoltaic equipment chassis, then tightens it with nuts. Next, the input and output terminals of the liquid-cooled inductor are connected to the corresponding circuit positions. Finally, liquid cooling pipes are installed on the liquid-cooled connector 7 of the liquid-cooled inductor to complete the installation. The liquid-cooled inductor functions as an energy storage, filter, voltage boost, voltage buck, and voltage stabilizer in the circuit.

[0076] See Figure 6 , Figure 7 , Figure 8 Compare this embodiment with the prior art:

[0077] Among them, the existing technology A is a conventional heat sink heat dissipation solution, which sets a large number of dense heat sinks on the inductor casing, and then dissipates heat through natural cooling or forced air cooling.

[0078] The existing technology B is a conventional bottom-mounted water-cooled base plate cooling solution (such as Chinese patent CN216773002U "A Water-Cooled Inductor Module Structure"). In this solution, the inductor is mounted on an independent water-cooled base plate, and the water-cooled base plate absorbs the heat from the inductor through a thermally conductive silicone grease layer for heat dissipation.

[0079] Existing technology C is an improved cooling solution for existing technology B, in which two sets of symmetrical water-cooling plates are nested or installed on both sides of the inner cavity of the metal shell of the photovoltaic inductor, and the water-cooling plates are sealed in the potting adhesive layer after potting.

[0080] Comparative analysis shows that:

[0081] 1. Regarding heat dissipation and temperature, this embodiment can reduce the operating temperature of the inductor to around 100°C. In contrast, prior art A uses natural cooling and forced air cooling, so its operating temperature is around 140°C. Prior art B uses a water-cooled base plate for heat dissipation, but due to the presence of a partition (inductor housing, thermal grease, and water-cooled base plate housing), the heat dissipation efficiency cannot be further improved, and the operating temperature is around 130°C. Prior art C uses two sets of water-cooled plates to expand the contact area, resulting in an operating temperature of around 120°C. As can be seen from the comparison, the cooling efficiency of this embodiment is significant.

[0082] II. In terms of volume, under the premise of the same power and large current inductor, the overall volume of the inductor device can be made to 1523390mm 3 The volume of the products of the prior arts A, B and C is at least 1770465mm 3 and at most 2311760mm 3 In terms of volume, compared with the smallest embedded prior art C, the volume of the embodiment is 86% of that of the prior art C; compared with the largest prior art A, the volume of the embodiment is 65.9% of that of the prior art A, which is 14% to 34.1% lower than the prior arts, and further miniaturization is achieved.

[0083] III. In terms of service life, in a general working environment, the service life of an inductor used normally and continuously depends mainly on the working temperature of the inductor. When working normally, the higher the working temperature of the inductor, the faster the aging of the insulation material, wire, heat-conducting material, sealing ring and shell in the inductor, and the shorter the service life. The working temperature of the inductor of the prior art A is as high as about 140℃ when the current load is 300A, the inductor ages very fast, and thus the service life is very short, only 4-5 years. The working temperature of the inductor of the prior art B is about 130℃ when the current load is 300A, the inductor also ages fast, and thus the service life is 8-10 years. The working temperature of the inductor of the prior art C is about 120℃ when the current load is 300A, and thus the service life is 13-15 years. The inductor of the embodiment is miniaturized, and is installed in the photovoltaic device case and cooled by liquid, so that the heat dissipation efficiency is greatly improved, the working environment is stable and the temperature is appropriate, the working temperature of the inductor is only about 100℃ when the current load is 300A, and thus the service life is greatly increased, which is 18-20 years according to the test data.

[0084] IV. Analysis from the maximum current load capacity

[0085] The higher the working temperature of the inductor when working normally, the worse the maximum current load capacity of the inductor. The working temperature of the inductor of the embodiment is only about 100℃ when the current load is 300A, and thus the maximum current load capacity of the inductor can reach about 380A, which is significantly improved compared with the maximum current load capacities of the prior arts A, B and C, which are about 300A, about 320A and about 340A respectively.

[0086] V. Analysis from the investment cost

[0087] On the one hand, since the embodiment adopts extrusion molding, the mold cost is nearly 10% different from prior arts B and C, and the mold cost of prior art A is particularly high due to the need for die casting manufacturing of the shell with fins;

[0088] On the other hand, the overall cost of the liquid cooling shell 1 of the embodiment is only 57.3 yuan combined with the glue pouring cost, which is similar to prior art A, but the mold cost of prior art A is as high as 50,000 yuan, and the overall cost is obviously high; compared with prior arts B and C, which need to additionally manufacture the water cooling plate, the costs are 128.82 yuan and 153.5 yuan respectively, and the cost of a single product is too high, which is 2.25 times and 2.678 times of the embodiment, much higher than the embodiment.

[0089] In summary, compared with prior arts A, B and C, the embodiment has made significant progress in heat dissipation efficiency, volume, service life, maximum current carrying capacity and cost.

[0090] The embodiment of the utility model based on the current large current inductor heat dissipation demand, in the base A of integral molding is integrated liquid cooling bottom plate 1, set up radial distribution liquid cooling flow channel 11, two two adjacent liquid cooling flow channel 11 head and tail connection and pour into cooling liquid, thereby take away the large amount of heat generated when inductance main body works in large current, avoid the heat accumulation and produce high temperature or continuously work in high temperature, realize liquid cooling type heat dissipation, compared with the traditional fin heat dissipation, realize the outstanding progress of 40 DEG C of working temperature reduction, the heat dissipation efficiency improves greatly, and the product current carrying capacity increases by 26.6%, and the service life increases by 3-3.5 times;And because the liquid cooling flow channel 11 and the base A are integrally formed, the product volume is reduced by 34% compared with the base A, the mold investment cost is reduced by 82%, the product cost is low, the power consumption is small, and the working efficiency is high;Miniaturization is installed with the mounting plate in built-in type to realize the functions of waterproof, dustproof and anticorrosion, avoid the moisture and dust entering the photovoltaic equipment cabinet inside when the photovoltaic inductor is externally mounted on the photovoltaic equipment cabinet, which affects the electrical circuit, and further improves the service life of the product.

[0091] The above embodiment is a preferred embodiment of the utility model, but the embodiment of the utility model is not limited by the above embodiment, and any change, modification, replacement, combination and simplification without departing from the spirit and principle of the utility model should be equivalent replacement, which is included in the protection scope of the utility model.

Claims

1. A liquid-cooled heat dissipation inductor device, characterized in that: The device includes a base and an inductor body encapsulated within the base. The base includes a liquid-cooled base plate, fixed walls disposed on the top surfaces of both sides of the liquid-cooled base plate, and mounting base plates disposed at the ends of both sides of the liquid-cooled base plate. The liquid-cooled base plate is provided with radially distributed liquid-cooled channels, which are transversely penetrating cavities; two adjacent liquid-cooled channels are connected end to end to form a connecting cavity, and a supporting wall is arranged in the middle to separate the liquid-cooled channels. The liquid-cooled base plate is integrally formed with the fixed wall and the mounting plate.

2. The liquid-cooled heat dissipation inductor device as described in claim 1, characterized in that: The liquid-cooled base plate has at least one mounting position at its end. The mounting position is a groove formed by expanding the connecting cavity along the vertical plane, and its longitudinal cross-sectional area is larger than that of the connecting cavity. It also includes at least one sealing baffle, which is a plate structure; the sealing baffle is welded and installed at the mounting position to seal the connecting cavity and thereby connect the two adjacent liquid cooling channels.

3. The liquid-cooled heat dissipation inductor device as described in claim 2, characterized in that: The mounting plates are symmetrically distributed on both sides of the liquid-cooled base plate, and a vertical mounting hole penetrating the plate surface is provided in the middle of the plate surface; The upper part of the fixed wall extends vertically, and its end is a U-shaped structure that protrudes outward. The two end faces of the U-shaped structure are respectively provided with a first mounting groove that is recessed inward. The lower part of the fixed wall is connected to the top of the liquid-cooled base plate. The lower inner wall is a curved surface structure with a gradually increasing cross-section. The two end faces of the curved surface structure are respectively provided with a second mounting groove that is recessed inward.

4. The liquid-cooled heat dissipation inductor device as described in claim 3, characterized in that: It also includes a first side cover plate and a second side cover plate; the lower part of the first side cover plate is provided with a through hole that mates with the second mounting groove, and the upper two sides are provided with outwardly protruding ear seats, the ear seats being provided with through holes that mate with the first mounting groove; the first side cover plate and the second side cover plate have the same structure. The first side cover plate and the second side cover plate are respectively covered at both ends of the base and installed and fixed by screws in the first mounting groove and the second mounting groove to form a potting cavity.

5. The liquid-cooled heat dissipation inductor device as described in claim 1, characterized in that: One end of the liquid cooling channels distributed on both outer edges of the liquid cooling base plate is left empty, serving as the liquid cooling inlet and liquid cooling outlet of the liquid cooling channels, respectively. It also includes two sets of liquid cooling connectors. One set of liquid cooling connectors is fixed to the liquid cooling inlet and is fixed by laser welding; the other set of liquid cooling connectors is fixed to the liquid cooling outlet and is fixed by laser welding.

6. The liquid-cooled heat dissipation inductor device as described in claim 1, characterized in that: The inductor body includes a magnetic core, a coil winding, and an insulating layer. The insulating layer is nested on the magnetic core, and the coil winding is nested on the magnetic core through the insulating layer. The magnetic core includes a core center column, a core top cover, and a core bottom cover; the two ends of the core center column are respectively connected to the core top cover and the core bottom cover, and the insulating layer is surrounded on it, with the coil winding surrounding the outside of the insulating layer.

7. The liquid-cooled heat dissipation inductor device as described in claim 6, characterized in that: The insulating layer includes insulating paper, a first insulating plate, and a second insulating plate; the insulating paper covers the central column of the magnetic core, with its inner side closely attached to the outer wall of the central column of the magnetic core, and the coil winding is surrounded on its outer side. The first insulating plate has a through hole in the middle that penetrates the plate surface. The through hole is larger than the cross-section of the magnetic core column and its inner diameter is smaller than the inner diameter of the coil winding. The second insulating plate has the same structure as the first insulating plate; One end of the central column of the magnetic core passes through the mounting through hole on the first insulating plate and is fixedly connected to the upper cover of the magnetic core, while the other end passes through the mounting through hole on the second insulating plate and is fixedly connected to the lower cover of the magnetic core.

8. The liquid-cooled heat dissipation inductor device as described in claim 6, characterized in that: The coil winding is a continuous flat copper coil made of flat copper wire.

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