Quick heat dissipation PCB (printed circuit board)

Abstract

The utility model discloses a rapid heat dissipation PCB circuit board, which comprises a substrate, a heat dissipation assembly is installed at the bottom of the substrate, the heat dissipation assembly comprises an adhesive layer arranged on the outer wall of the bottom of the substrate, a heat conduction plate is arranged on the outer wall of the bottom of the adhesive layer, the outer wall of the outside of the heat conduction plate is fixedly connected with more than one heat dissipation sheet, and the heat dissipation sheet is fixedly connected with the substrate. The radiator comprises more than one radiating fin, the more than one radiating fin is distributed at equal intervals, the outer wall of one side of the more than one radiating fin is fixedly connected with the same air outlet pipe, more than one air outlet hole is formed in the air outlet pipe, the more than one air outlet hole is located in gaps of the more than one radiating fin, and the more than one radiating fin is arranged in a wave shape. According to the heat dissipation device, the heat dissipation assembly is arranged, heat generated by working of the circuit board can be actively conducted and dissipated to the outside, it is not needed to wait for the heat to be passively dissipated to the outside, and therefore the heat dissipation effect of the device is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a fast heat dissipation PCB circuit board. Background Technology

[0002] A PCB, or printed circuit board, is the support structure for electronic components and the carrier for their electrical connections. With the rapid development of electronic technology, PCBs are increasingly widely used in electronic devices, and their performance and quality directly affect the overall performance of these devices.

[0003] A search revealed a utility model with Chinese patent publication number CN219678773U, which discloses a fast heat dissipation PCB circuit board. This utility model has an aluminum sheet fixedly mounted on the rear side of the substrate, a ceramic heat dissipation layer fixedly mounted on one side of the aluminum sheet, and heat dissipation fins located inside the ceramic heat dissipation layer fixedly mounted on both ends of the rear side of the aluminum sheet.

[0004] The aforementioned device improves heat dissipation efficiency by combining a ceramic heat sink with heat dissipation fins. However, the heat dissipation structure only diffuses the heat to the surroundings. As the ambient temperature increases, the heat transfer rate also decreases, resulting in passive heat dissipation. Furthermore, the heat dissipation effect decreases with increasing usage time, indicating room for improvement. Utility Model Content

[0005] The purpose of this invention is to provide a fast heat dissipation PCB circuit board to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a fast heat dissipation PCB circuit board, including a substrate, a heat dissipation component mounted on the bottom of the substrate, the heat dissipation component including an adhesive layer disposed on the outer wall of the bottom of the substrate, a heat-conducting plate disposed on the outer wall of the bottom of the adhesive layer, one or more heat sinks fixedly connected to the outer wall of the heat-conducting plate, and the one or more heat sinks being distributed at equal intervals, a common vent pipe fixedly connected to one side of the outer wall of one or more heat sinks, one or more vent holes being opened inside the vent pipe, and the one or more vent holes being located at the gaps between one or more heat sinks, and the one or more heat sinks being arranged in a wavy pattern.

[0007] As a further preferred embodiment of this technical solution, an air inlet plate is detachably connected to the outer wall of one end of the air outlet pipe by bolts, and the air inlet plate has one or more air inlets inside, and a filter bag is provided on the outer wall of the end of the air inlet plate near the air outlet pipe.

[0008] It can actively conduct and dissipate the heat generated by the circuit board to the outside, without waiting for the heat to be passively dissipated, thus greatly increasing the heat dissipation effect of the device. The heat is transferred to the heat-conducting plate through the adhesive layer, and finally to multiple heat sinks, and then dissipated to the outside. At the same time, the external cooling fan is activated, and the airflow enters the air outlet pipe through the air inlet of the air inlet plate, and then continues to diffuse after being filtered by the filter bag. Then it flows outward through the air outlet on the side of the air outlet pipe. When this airflow passes through the heat sink, the heat on it can be carried away more quickly.

[0009] As a further preferred embodiment of this technical solution, a clamping assembly is mounted on the top of the substrate, and the clamping assembly is located at the edge of the substrate.

[0010] As a further preferred embodiment of this technical solution, the clamping assembly includes a support frame fixedly connected to one end of the top outer wall of the substrate. Inside the support frame, two mounting rods are rotatably connected via bearings. Each of the two mounting rods has one or more clamping blocks on one end of its outer wall. Each of the two mounting rods has a gear fixed coaxially at one end of its rotating shaft, and the two gears mesh with each other.

[0011] As a further preferred embodiment of this technical solution, one end of the mounting rod shaft is coaxially fixed with a worm gear, and the other side of the support frame is fixedly connected to a horizontally arranged hinge seat. The hinge seat is rotatably connected to a worm through a bearing, and the worm meshes with the worm gear.

[0012] Pass each wire through the gap between the two mounting rods and place it between the two clamping blocks. Rotate the knob to drive the worm gear to rotate inside the worm. The worm gear, through meshing, drives the worm wheel to rotate. The worm wheel drives the top mounting rod to flip downwards. The mounting rod drives a gear connected to it to rotate synchronously. Through meshing, the gear drives another gear to rotate in the opposite direction. In turn, the other mounting rod will also flip downwards. Then, the two clamping blocks can firmly clamp the wires. If the wires are subjected to tensile force, the tensile force will be applied to the two clamping blocks to prevent the solder joint from coming loose.

[0013] As a further preferred embodiment of this technical solution, each of the above heat sinks has one or more through slots inside, and the above and more through slots are distributed at equal intervals.

[0014] As a further preferred embodiment of this technical solution, the adhesive layer is made of silver paste, and the heat-conducting plate and heat sink are both made of copper.

[0015] As a further preferred embodiment of this technical solution, each of the more than one clamping blocks has a groove in the middle, and the clamping blocks are made of rubber material.

[0016] This utility model provides a fast heat dissipation PCB circuit board, which has the following beneficial effects:

[0017] (1) By setting up heat dissipation components, this utility model can actively conduct and dissipate the heat generated by the circuit board to the outside without waiting for the heat to be passively dissipated to the outside, thereby greatly increasing the heat dissipation effect of the device. The heat is transferred to the heat conduction plate through the adhesive layer, and finally to multiple heat sinks, and then dissipated to the outside. At the same time, the external cooling fan is started, and the airflow enters the air outlet pipe through the air inlet of the air inlet plate, and then continues to diffuse after being filtered by the filter bag. Then it flows out through the air outlet on the side of the air outlet pipe. When these airflows pass through the heat sinks, the heat on them can be carried away more quickly.

[0018] (2) By setting up a clamping assembly, each wire passes through the gap between two mounting rods and is placed between two clamping blocks. By turning the knob, the worm gear is rotated inside the worm gear. The worm gear can drive the worm wheel to rotate through meshing. The worm wheel drives the top mounting rod to flip downward. The mounting rod drives a gear connected to it to rotate synchronously. Through meshing, it drives another gear to rotate in the opposite direction. Then the other mounting rod will also flip downward. Subsequently, the two clamping blocks can tightly clamp the wire. If the wire is subjected to a pulling force, the pulling force will be applied to the two clamping blocks to prevent the welding position from detaching. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall first-view structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the overall second-view structure of this utility model;

[0021] Figure 3 This is a partially enlarged structural diagram of the heat dissipation component of this utility model;

[0022] Figure 4 For the present utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0023] In the diagram: 1. Substrate; 2. Heat dissipation assembly; 3. Clamping assembly; 201. Adhesive layer; 202. Heat-conducting plate; 203. Heat sink; 204. Air outlet pipe; 205. Air inlet plate; 206. Filter bag; 207. Through slot; 301. Support frame; 302. Mounting rod; 303. Clamping block; 304. Gear; 305. Worm gear; 306. Hinge seat; 307. Worm. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0025] This utility model provides a technical solution: such asFigure 2 and Figure 3 As shown in this embodiment, a fast heat dissipation PCB circuit board includes a substrate 1. A heat dissipation component 2 is mounted on the bottom of the substrate 1. The heat dissipation component 2 includes an adhesive layer 201 disposed on the outer wall of the bottom of the substrate 1. A heat-conducting plate 202 is disposed on the outer wall of the bottom of the adhesive layer 201. One or more heat sinks 203 are fixedly connected to the outer wall of the heat-conducting plate 202. The heat sinks 203 are evenly distributed. The same air outlet pipe 204 is fixedly connected to the outer wall of one or more heat sinks 203. One or more air outlet holes are opened inside the air outlet pipe 204. The air outlet holes are respectively located at the gaps between the heat sinks 203. The heat sinks 203 are all arranged in a wave shape. Therefore, the airflow can directly impact their outer walls, thereby ensuring that more heat is carried away, which is beneficial to improving the heat dissipation effect.

[0026] An air inlet plate 205 is detachably connected to one end of the outer wall of the air outlet pipe 204 by bolts. The air inlet plate 205 has one or more air inlets. A filter bag 206 is provided on the outer wall of the end of the air inlet plate 205 near the air outlet pipe 204, which can prevent air from directly contacting the heat sink 203 and causing dust to adhere, thus helping to ensure the heat dissipation effect.

[0027] The heat generated by the components on the top of the substrate 1 during operation is transferred downwards, then through the adhesive layer 201 to the heat-conducting plate 202, and finally to multiple heat sinks 203. The heat is then dissipated to the outside, and at the same time, the external cooling fan is activated. The airflow enters the air outlet pipe 204 through the air inlet of the air inlet plate 205, and then continues to diffuse after being filtered by the filter bag 206. It then flows outwards through the air outlet on the side of the air outlet pipe 204. When this airflow passes through the heat sink 203, the heat on it can be carried away more quickly.

[0028] like Figure 2 and Figure 4 As shown, a clamping assembly 3 is mounted on the top of the substrate 1, and the clamping assembly 3 is located at the edge of the substrate 1.

[0029] The clamping assembly 3 includes a support frame 301 fixedly connected to one end of the top outer wall of the substrate 1. The support frame 301 has two mounting rods 302 rotatably connected inside by bearings. Each of the two mounting rods 302 has one or more clamping blocks 303 on one end of its outer wall. Each of the two mounting rods 302 has a gear 304 fixed coaxially at one end of its rotating shaft, and the two gears 304 mesh with each other.

[0030] One end of the shaft of one of the mounting rods 302 is coaxially fixed with a worm gear 305, and a horizontally set hinge seat 306 is fixedly connected to the outer wall of the other side of the support frame 301. The hinge seat 306 is rotatably connected to a worm 307 through a bearing. The worm 307 meshes with the worm gear 305, and the two have a self-locking property, thus ensuring that the positions of the two mounting rods 302 will not change arbitrarily after adjustment, thereby ensuring the clamping effect.

[0031] Each wire is passed through the gap between the two mounting rods 302 and positioned between the two clamping blocks 303. By turning the knob, the worm gear 307 is rotated inside the worm gear 307. The worm gear 307, through meshing, drives the worm wheel 305 to rotate. The worm wheel 305 causes the top mounting rod 302 to flip downwards. The mounting rod 302 drives a gear 304 connected to it to rotate synchronously. Through meshing, the gear 304 drives another gear 304 to rotate in the opposite direction. Consequently, the other mounting rod 302 also flips downwards. Then, the two clamping blocks 303 can tightly clamp the wires. If the wires are subjected to tensile force, the tensile force will be applied to the two clamping blocks 303 to prevent the solder joint from coming loose.

[0032] like Figure 2 and Figure 3 As shown, each of the heat sinks 203 has one or more through slots 207 inside, and the through slots 207 are distributed at equal intervals, which can increase the surface area of ​​the heat sink 203, thereby improving the heat dissipation effect. In addition, part of the airflow flowing between the two heat sinks 203 will pass through the heat sink 203, which can further increase the heat dissipation effect.

[0033] like Figure 1 and Figure 2 As shown, the adhesive layer 201 is made of silver paste, and the heat-conducting plate 202 and the heat sink 203 are both made of copper. Silver paste is a high thermal conductivity adhesive with a thermal conductivity of over 400 W / (m·K). Copper also has excellent thermal conductivity.

[0034] like Figure 1 and Figure 2 As shown, each of the clamping blocks 303 has a groove in the middle to prevent the wire from shifting. The clamping blocks 303 are made of rubber material, which allows them to deform, so that the device can adapt to clamping wires of different diameters.

[0035] This utility model provides a fast heat dissipation PCB circuit board, and its specific working principle is as follows:

[0036] When the device is in operation, the wires are soldered to the top of the pads on the top of the substrate 1, and then...

[0037] Each wire is passed through the gap between the two mounting rods 302 and positioned between the two clamping blocks 303. A knob is used to rotate the worm gear 307 inside the worm gear 307. The worm gear 307, through meshing, drives the worm wheel 305 to rotate. The worm wheel 305 causes the top mounting rod 302 to flip downwards. The mounting rod 302 drives a gear 304 connected to it to rotate synchronously. This gear, through meshing, drives another gear 304 to rotate in the opposite direction, causing the other mounting rod 302 to also flip downwards. The two clamping blocks 303 then tightly clamp the wires. If the wires are subjected to tensile force, the tensile force will be applied to the two clamping blocks 303 to prevent detachment at the solder joint.

[0038] The heat generated by the components on the top of the substrate 1 during operation is transferred downwards, then through the adhesive layer 201 to the heat-conducting plate 202, and finally to the multiple heat sinks 203. The heat is then dissipated outwards, simultaneously activating the external cooling fan. Airflow enters the exhaust pipe 204 through the air inlet of the air inlet plate 205, is filtered by the filter bag 206, and then continues to diffuse. Finally, it flows outwards through the air outlet on the side of the exhaust pipe 204. This airflow, as it passes over the heat sinks 203, allows the heat on them to be carried away more quickly.

[0039] Furthermore, because the heat sink 203 is wavy, airflow can directly impact its outer wall, ensuring that more heat is carried away and improving heat dissipation.

[0040] The through slots 207 inside the heat sink 203 can increase its surface area, thereby improving the heat dissipation effect. Furthermore, some of the airflow flowing between the two heat sinks 203 will pass through the heat sink 203, which can further increase the heat dissipation effect.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fast heat dissipation PCB circuit board, comprising a substrate (1), characterized in that: A heat dissipation assembly (2) is installed at the bottom of the substrate (1). The heat dissipation assembly (2) includes an adhesive layer (201) disposed on the outer wall of the bottom of the substrate (1). A heat-conducting plate (202) is disposed on the outer wall of the bottom of the adhesive layer (201). One or more heat sinks (203) are fixedly connected to the outer wall of the heat-conducting plate (202). The heat sinks (203) are evenly distributed. The outer wall of one or more heat sinks (203) is fixedly connected to the same air outlet pipe (204). One or more air outlet holes are opened inside the air outlet pipe (204). The air outlet holes are respectively located in the gaps between the heat sinks (203). The heat sinks (203) are all arranged in a wave shape.

2. The fast heat dissipation PCB circuit board according to claim 1, characterized in that: An air inlet plate (205) is detachably connected to one end of the outer wall of the air outlet pipe (204) by bolts, and the air inlet plate (205) has one or more air inlets. A filter bag (206) is provided on the outer wall of the air inlet plate (205) near the air outlet pipe (204).

3. The fast heat dissipation PCB circuit board according to claim 1, characterized in that: A clamping assembly (3) is mounted on the top of the substrate (1), and the clamping assembly (3) is located at the edge of the substrate (1).

4. The fast heat dissipation PCB circuit board according to claim 3, characterized in that: The clamping assembly (3) includes a support frame (301) fixedly connected to one end of the top outer wall of the base plate (1). The support frame (301) has two mounting rods (302) rotatably connected inside by bearings. Each of the two mounting rods (302) has one or more clamping blocks (303) on one end of its outer wall. Each of the two mounting rods (302) has a gear (304) fixed coaxially at one end of its rotating shaft, and the two gears (304) mesh with each other.

5. A fast heat dissipation PCB circuit board according to claim 4, characterized in that: One of the mounting rods (302) has a worm gear (305) fixed coaxially at one end of its shaft, and a horizontally arranged hinge (306) is fixedly connected to the outer wall of the other side of the support frame (301). A worm (307) is rotatably connected inside the hinge (306) through a bearing, and the worm (307) meshes with the worm gear (305).

6. The fast heat dissipation PCB circuit board according to claim 1, characterized in that: Each of the above heat sinks (203) has one or more through slots (207) inside, and the through slots (207) are distributed at equal intervals.

7. A fast heat dissipation PCB circuit board according to claim 1, characterized in that: The adhesive layer (201) is made of silver paste, and the heat-conducting plate (202) and the heat sink (203) are both made of copper.

8. A fast heat dissipation PCB circuit board according to claim 1, characterized in that: Each of the clamping blocks (303) has a groove in the middle, and the clamping blocks (303) are made of rubber material.

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