Heat dissipation frame for electric equipment and electric equipment

Abstract

The utility model relates to a heat dissipation frame for electric equipment and the electric equipment. The electric equipment is provided with a heating component. The heat dissipation frame comprises a siphon sintering heat pipe (20) and a heat dissipation device (30), wherein the siphon sintering heat pipe (20) is provided with at least one hollow pipe body (22); the heat dissipation pressing plate (30) is detachably connected to the siphon sintering heat pipe (20) and is suitable for pressing the siphon sintering heat pipe (20) against the heating component; the radiating fin (40) is provided with a hole opening (42) and a plurality of fins, the hole opening (42) is used for containing the pipe body (22) of the siphon sintering heat pipe (20), the fins are connected to the outer side of the hole opening (42), and the inner wall of the hole opening (42) is tightly attached to the outer wall of the pipe body (22).

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electrical equipment, and in particular to heat dissipation racks for electrical equipment and electrical equipment. Background Technology

[0002] Electrical engineering and metallurgical engineering utilize a large number of electrical devices. These devices generate heat during operation, but some components have high thermal resistance, hindering rapid heat dissipation. Prolonged heat accumulation can cause these heat-generating components to exceed standard temperatures, leading to unstable operation or even damage. To address this, heat-generating components are typically equipped with heat dissipation structures, such as heat sink fins. However, a problem arises where the heat from the heat-generating components may not be quickly transferred to the heat dissipation structure, resulting in ineffective heat dissipation.

[0003] Therefore, there is a certain demand in the industry for improving the heat dissipation structure to quickly transfer the heat from the heat-generating components to the heat sink. Summary of the Invention

[0004] The present invention aims to provide a heat dissipation bracket for electrical equipment, which can at least solve some of the above-mentioned technical problems.

[0005] This invention also aims to provide an electrical device that utilizes the improved heat sink described above.

[0006] According to one aspect of the present invention, a heat sink is provided for an electrical device having a heating element. The heat sink includes: a siphon sintered heat pipe having at least one hollow tube body; a heat dissipation plate detachably joined to the siphon sintered heat pipe and adapted to press the siphon sintered heat pipe against the heating element; and heat dissipation fins having an opening for accommodating the tube body of the siphon sintered heat pipe and a plurality of fins connected to the outside of the opening, wherein the inner wall of the opening is in close contact with the outer wall of the tube body.

[0007] The heat sink provided in this solution utilizes the excellent thermal conductivity of siphon-sintered heat pipes to rapidly conduct heat generated by the heat-generating components to the connected heat sinks for dissipation. This allows the heat from the heat-generating components to dissipate quickly and operate continuously within the normal temperature range. This heat sink solution reduces the current-carrying area of ​​the busbar while meeting temperature rise requirements, and also reduces weight and saves costs.

[0008] In some embodiments, the siphon sintered heat pipe includes a base from which the pipe body extends, wherein the heat dissipation plate has two back-to-back surfaces, one of which has a groove formed to receive the base, and the pipe body extends from the other surface.

[0009] In some embodiments, the groove wall profile of the heat dissipation plate is conformal to the outer peripheral profile of the base.

[0010] In some embodiments, the heat dissipation plate has a receiving hole extending between the two plate surfaces, through which the tube body of the siphon sintered heat pipe extends from the other plate surface.

[0011] In some embodiments, the siphon sintered heat pipe is a single integral component.

[0012] In some embodiments, the tube body of the siphon sintered heat pipe is housed within the orifice of the heat sink, and the end face of the tube body is recessed relative to the end of the orifice.

[0013] In some embodiments, the tube body of the siphon sintered heat pipe and the orifice of the heat sink are interference fit.

[0014] In some embodiments, the fins of the heat sink include an inner sheet and an epoxy resin shell enclosing the sheet.

[0015] In some embodiments, the heat sink is constructed as an integral part including the plurality of fins by an integral molding process, and the epoxy resin shell is wrapped around the outer surface of the integral part by a vulcanization process.

[0016] According to another aspect of the present invention, an electrical device is provided, including a heating element and a heat sink frame close to the heating element, wherein the heat sink frame is the aforementioned heat sink frame, and the heat sink plate is connected to the heating element and presses the siphon sintered heat pipe against the heating element.

[0017] Other features and advantages of this invention will partly be apparent to those skilled in the art upon reading this application, and partly will be described below in conjunction with the accompanying drawings in the detailed description. Attached Figure Description

[0018] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings, wherein:

[0019] Figure 1 This is a schematic diagram of a heat sink according to an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the heat sink according to an embodiment of the present invention from another angle;

[0021] Figure 3 This is a partial top sectional view of a heat sink according to an embodiment of the present invention;

[0022] Figure 4This is a half-sectional schematic diagram of a heat sink according to an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of a siphon sintered heat pipe according to an embodiment of the present invention;

[0024] Figure 6 This is a half-sectional schematic diagram of a siphon sintered heat pipe according to an embodiment of the present invention;

[0025] Figure 7 This is a schematic diagram of a heat dissipation plate at one angle according to an embodiment of the present utility model;

[0026] Figure 8 This is a schematic diagram of the heat dissipation pressure plate according to an embodiment of the present utility model from another angle;

[0027] Figure 9 This is a schematic diagram of a heat sink according to an embodiment of the present invention.

[0028] Explanation of reference numerals in the attached figures

[0029] 10-Heat sink; 20-Siphon sintered heat pipe; 21-Base; 22-Pipe body; 23-Through hole; 30-Heat sink plate; 31-Receiving hole; 32-Through hole; 33-Protrusion; 34-Groove; 40-Heat sink fin; 41-Centered section; 42-Orifice; 43-Through hole; 44-First set of fins; 45-Second set of fins; 46-Sheet; 47-Epoxy resin shell Detailed Implementation

[0030] The schematic solutions of the technical solutions disclosed in this utility model are now described in detail with reference to the accompanying drawings. Although the drawings are provided to illustrate some embodiments of this utility model, the drawings are not necessarily drawn to the dimensions of the specific embodiments, and certain features may be enlarged, removed, or partially cut to better illustrate and explain the disclosure of this utility model. Some components in the drawings may be repositioned according to actual needs without affecting the technical effect. The phrase "in the drawings" or similar terms appearing in the specification do not necessarily refer to all drawings or examples.

[0031] Certain directional terms used in the description of the accompanying drawings below, such as “inner,” “outer,” “above,” “below,” and other directional terms, will be understood to have their normal meaning and refer to those directions as normally viewed in the accompanying drawings. Unless otherwise specified, the directional terms used in this specification are generally in accordance with the conventional directions understood by those skilled in the art.

[0032] The terms “first,” “first,” “second,” “second,” and similar terms used in this utility model do not indicate any order, quantity, or importance, but are used to distinguish one component from other components.

[0033] Figures 1 to 4 The structure of the heat sink 10 is illustrated exemplarily. This heat sink 10 is applicable to electrical engineering equipment, such as high and low voltage power equipment, switch contacts, busbar trunking, and power distribution equipment, as well as metallurgical engineering equipment, such as ultra-high current electrolytic smelting equipment for metal smelting, electroplating, and caustic soda production. As shown, the heat sink 10 includes a siphon sintered heat pipe 20, a heat dissipation plate 30, and a heat sink 40, which are detachably assembled together. The heat dissipation plate 30 can stably press the siphon sintered heat pipe 20 against the heat-generating components of the electrical equipment, such as the top of the heating electrode of a circuit breaker, so that the siphon sintered heat pipe 20 can quickly conduct the heat generated by the heat-generating components to the heat sink 40 tightly connected to it, preventing heat accumulation and contributing to the long-term stable operation of the electrical equipment.

[0034] Figure 5 and Figure 6 The structure of a siphon sintered heat pipe 20 is illustrated. As shown, the siphon sintered heat pipe 20 includes a base 21 and four tube bodies 22 extending from the base 21. The base 21 is shown as a flat plate, which facilitates close contact with the heating element and the formation of good contact. Furthermore, the flat base 21 also increases the contact area with the heating element, which is beneficial for rapid heat dissipation. In other embodiments, the base 21 can also be configured to adapt to other configurations of the heating element, such as a curved plate. The tube bodies 22 are hollow tubes joined to the base 21 and are closed at the end away from the base 21. In one embodiment, the tube bodies 22 are formed by sintering heat pipes inside a copper tube.

[0035] In the illustrated embodiment, the base 21 has concave arcs at its four corners and a through hole 23 at approximately the center. Four tubes 22 are connected to the base 21 at even intervals around the through hole 23. The tubes 22 can be integrally formed with the base 21, in which case the base 21 can be made of the same material as the tubes 22. Alternatively, the tubes 22 can be fixed to the base 21 by a suitable connection method, such as welding, in which case the base 21 can be made of other metal materials, the same as or different from the tubes 22. The siphon sintered heat pipe 20 has the ability to quickly transfer the heat generated by the heating element to the heat sink, effectively preventing heat from accumulating around the heating element.

[0036] Although the figure shows four tubes 22 surrounding the through hole 23, those skilled in the art will understand that the number of tubes 22 and their arrangement on the base 21 can be adjusted as needed. For example, one, two, three, five, six, or even more tubes 22 can be arranged around the through hole 23. Alternatively, the through hole 23 can be omitted, and only multiple tubes 22 can be arranged on the base 21.

[0037] The heat dissipation plate 30 is used to stably press the siphon sintered heat pipe 20 against the heat-generating component and serves as the mounting base for the entire heat sink 10. Figure 7 and Figure 8 In the embodiment shown, the heat dissipation plate 30 is a thin plate in shape, including a first plate surface and a second plate surface that are opposite to each other. After being assembled into the heat dissipation frame 10, the first plate surface faces the heat sink 40, while the second plate surface faces away from the heat sink 40, and the base 21 of the siphon sintered heat pipe 20 is sandwiched between the second plate surface of the heat dissipation plate 30 and the heat-generating component.

[0038] The heat dissipation plate 30 can be fixedly mounted to the heating element of an electrical device. For example, multiple holes can be formed in the heat dissipation plate 30, allowing it to be detachably fixed to the heating element using connecting rods. Suitable connecting rods can be bolts or pins. By fixing the heat dissipation plate 30 to a predetermined position on the heating element and pressing the base 21 of the siphon sintered heat pipe 20 between the heat dissipation plate 30 and the heating element, the siphon sintered heat pipe 20 can be stably contacted with the heating element, facilitating rapid heat dissipation.

[0039] The heat dissipation plate 30 can be made of metal, such as steel. A metal heat dissipation plate 30 can more stably press down on the siphon sintered heat pipe 20.

[0040] like Figure 8 As shown, a protrusion 33 protruding away from the first plate surface is formed on the second plate surface of the heat dissipation plate 30, which is used to press down the siphon sintered heat pipe 20. This protrusion 33 can occupy most of the area of ​​the heat dissipation plate 30. The thickness of the heat dissipation plate 30 at the protrusion 33 is correspondingly increased. The surface of the protrusion 33 is also flat, which facilitates close contact with the surface of the heat-generating component. A groove 34 is formed at the protrusion 33 to accommodate the base 21 of the siphon sintered heat pipe 20. When the base 21 of the siphon sintered heat pipe 20 is inserted into the groove 34 of the heat dissipation plate 30, the surface of the base 21 does not protrude from the protrusion 33, or in other words, the surface of the base 21 is flush with the surface of the protrusion 33. Figure 2 and Figure 4 As shown. In addition, the groove wall profile of the groove 34 can be adapted to the peripheral profile of the base 32 of the siphon sintered heat pipe 20 to prevent the siphon sintered heat pipe 20 from shifting relative to the heat dissipation plate 30.

[0041] The heat dissipation plate 30, which is adapted to the tube body 22 of the siphon sintered heat pipe 20, has four receiving holes 31. Each receiving hole 31 extends continuously between the first and second surfaces of the heat dissipation plate 30 to form a through hole. When installing the siphon sintered heat pipe 20, the tube bodies 22 are inserted into the receiving holes 31 of the heat dissipation plate 30 one by one, and the base 21 is embedded in the groove 34. In this way, after the heat dissipation plate 30 is fixed to the heating element, the base 21 of the siphon sintered heat pipe 20 is pressed against the heating element by the heat dissipation plate 30. When the siphon sintered heat pipe 20 has tube bodies 22 of other numbers and arrangements, the number and position of the receiving holes 31 of the heat dissipation plate 30 must also be adjusted accordingly. In addition, the heat dissipation plate 30 may also have through holes 32 aligned with the through holes 23 of the siphon sintered heat pipe 20.

[0042] The tube body 22 of the siphon sintered heat pipe 20 passes through the receiving hole 31 and extends from the first plate surface of the heat dissipation pressure plate 30 for mounting the heat sink 40. Figure 9 The structure of the heat sink 40 is illustrated exemplarily. As shown, the heat sink 40 is composed of multiple fins, with heat dissipation channels formed between the fins. Specifically, the heat sink 40 has multiple orifices 42 formed in its central portion 41. The number and position of these orifices 42 are adapted to the number and arrangement of the tube bodies 22 of the siphon sintered heat pipe 20. By passing the tube bodies 22 through the corresponding orifices 42, the heat sink 40 can be installed onto the siphon sintered heat pipe 20. Furthermore, the inner wall of the orifices 42 of the heat sink 40 is in close contact with the outer wall of the tube bodies 22 of the siphon sintered heat pipe 20, so as to facilitate the rapid conduction of heat from the siphon sintered heat pipe 20 to the heat sink 40 and finally the heat sink 40 dissipates it into the surrounding environment, achieving rapid cooling of the heat-generating component.

[0043] A through hole 43 aligned with the through hole 23 of the siphon sintered heat pipe 20 can also be formed in the central portion 41 of the heat sink 40. Thus, after the heat sink 10 is assembled, a through hole extends from the base 21 of the siphon sintered heat pipe 20 all the way to the top surface of the heat sink 40.

[0044] like Figure 4 As shown, after the tube body 22 of the siphon sintered heat pipe 20 is inserted into the orifice 42 of the central portion 41 of the heat sink 40, the end face of the tube body 22 away from the base 21 does not protrude from the orifice 42, but is recessed relative to the orifice 42. This recessed configuration can achieve good insulation effect of the heat sink.

[0045] Still for reference Figure 9Multiple fins are arranged around a central portion 41. In the illustrated embodiment, these fins are divided into two groups according to their configuration and arrangement. The first group of fins 44 includes multiple parallel and spaced-apart flat fins. One end of these flat fins is connected to the central portion 41, and the opposite end extends away from the central portion. Multiple groups of the first group of fins 44 can be arranged spaced around the central portion 41. The figure shows four groups of the first group of fins 44 arranged at 90-degree intervals around the central portion 41.

[0046] The second group of fins 45 includes multiple parallel and spaced arc-shaped fins arranged layer by layer outward from the central portion 41. The figure shows four groups of second group fins 45, where the second group of fins 45 in each group is connected between two adjacent groups of first group fins 44.

[0047] Although the figure shows one configuration of the heat sink 40, it is conceivable that the structure of the heat sink 40 is not limited to this and can be adjusted as needed, as long as the heat sink 40 has an opening that can accommodate the tube body 22 of the siphon sintered heat pipe 20 and the inner wall of the opening is in close contact with the outer wall of the tube body 22. In one embodiment, the opening of the heat sink 40 and the tube body 22 of the siphon sintered heat pipe 20 are interference fit.

[0048] The heat sink 40 is a single piece formed by encasing an internal sheet 46 in an epoxy resin shell 47. First, a base comprising multiple sheets 46 is integrally cast using copper or aluminum, these sheets 46 being arranged in a desired configuration (e.g., Figure 9 The configuration shown is cast to form the inner layer of the fins. Then, an insulating outer shell is formed on the integrally cast substrate by vulcanizing epoxy resin; this epoxy resin shell 47 is the outer layer of the fins. The sheet-like heat dissipation fins of the heat sink achieve excellent heat dissipation through a large surface area, reducing the temperature of the heat-generating components and enabling them to operate stably within the allowable temperature range for extended periods. Furthermore, the heat sink reduces the amount of copper used and decreases the overall volume, thereby reducing the current-carrying area of ​​the busbar while meeting temperature rise requirements, reducing weight, and saving costs.

[0049] It should be understood that although this specification describes various embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0050] The above description is merely an illustrative embodiment of this utility model and is not intended to limit the scope of this utility model. Any equivalent changes, modifications, and combinations made by those skilled in the art without departing from the concept and principles of this utility model should fall within the protection scope of this utility model.

Claims

1. A heat sink for electrical equipment, the electrical equipment having a heat-generating component, characterized in that, The heat sink includes: Siphon sintered heat pipe (20) has at least one hollow tube body (22); A heat dissipation plate (30) is detachably joined to the siphon sintered heat pipe (20) and is adapted to press the siphon sintered heat pipe (20) against the heat-generating component; The heat sink (40) has an opening (42) for accommodating the tube body (22) of the siphon sintered heat pipe (20) and a plurality of fins connected to the outside of the opening (42), wherein the inner wall of the opening (42) is in close contact with the outer wall of the tube body (22).

2. The heat sink according to claim 1, characterized in that, The siphon sintered heat pipe (20) includes a base (21) from which the pipe body (22) extends, wherein the heat dissipation plate (30) has two back-to-back plates, one of which is formed with a groove (34) for receiving the base (21), and the pipe body (22) extends from the other plate.

3. The heat sink according to claim 2, characterized in that, The groove (34) of the heat dissipation plate (30) has a groove wall profile that conforms to the outer peripheral profile of the base (21).

4. The heat sink according to claim 2, characterized in that, The heat dissipation plate (30) has a receiving hole (31) extending between the two plate surfaces, and the tube body (22) of the siphon sintered heat pipe (20) extends from the other plate surface through the receiving hole (31).

5. The heat sink according to claim 1, characterized in that, The siphon sintered heat pipe (20) is an integrally formed component.

6. The heat sink according to claim 1, characterized in that, The tube body (22) of the siphon sintered heat pipe (20) is housed within the orifice (42) of the heat sink (40), and the end face of the tube body (22) is recessed relative to the end of the orifice (42).

7. The heat sink according to claim 1, characterized in that, The tube body (22) of the siphon sintered heat pipe (20) and the orifice (42) of the heat sink (40) are interference fit.

8. The heat sink according to claim 1, characterized in that, The fins of the heat sink (40) include an inner sheet (46) and an epoxy resin shell (47) that encloses the sheet (46).

9. The heat sink according to claim 8, characterized in that, The heat sink (40) is constructed into an integral part including the multiple fins by an integral molding process, and the epoxy resin shell (47) is wrapped around the outer surface of the integral part by a vulcanization process.

10. An electrical device, comprising a heating element and a heat sink adjacent to said heating element, characterized in that, The heat sink is the heat sink according to any one of claims 1 to 9, and the heat sink plate (30) is connected to the heating element and presses the siphon sintered heat pipe (20) against the heating element.

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