Vapor chamber, power module, heat dissipation system and electronic equipment

Abstract

The utility model provides a vapor chamber, a power module, a heat dissipation system and electronic equipment, and relates to the technical field of electrics. A cavity is defined by a shell of the vapor chamber, an outer protruding structure protruding in the direction away from the cavity is formed on the outer wall face of the shell, a sunken structure sunken in the direction away from the cavity is formed on the inner wall face of the cavity, and the position of the sunken structure corresponds to the position of the outer protruding structure. And the convex structure is connected with a heat source. The reliability of connection between the vapor chamber and a heat source can be ensured by ensuring the precision of the convex structure; the concave structure which is arranged in a concave mode in the direction away from the cavity is formed in the position, on the inner wall face of the cavity, of the shell, the position of the concave structure corresponds to the position of the outwards-protruding structure, the situation that due to the fact that the shell is provided with the outwards-protruding structure, the weight of the shell is too large can be avoided, the volume of the cavity can be increased, and the evaporation space of the phase-change medium can be increased; the heat dissipation efficiency of the vapor chamber to a heat source is improved, and the use performance of the vapor chamber is improved.

Description

Technical Field

[0001] This disclosure relates to the field of electrical technology, and more specifically, to a heat spreader, a power module, a heat dissipation system, and electronic equipment. Background Technology

[0002] Vapor chambers are typically connected to heat sources such as chip units to dissipate heat. However, currently, vapor chambers are usually designed with relatively small thickness dimensions. On the one hand, the precision of the surface on the vapor chamber used for connecting to the heat source is difficult to guarantee, affecting the reliability of the connection and heat transfer between the vapor chamber and heat sources such as chip units. On the other hand, vapor chambers are prone to deformation due to heat, further affecting the reliability of the connection and heat transfer between the vapor chamber and heat sources such as chip units. Therefore, the performance of vapor chambers needs to be improved. Utility Model Content

[0003] This disclosure aims to address, to some extent, the issue of how to improve the performance of vapor chambers in related technologies.

[0004] To at least partially address at least one aspect of the aforementioned problems, in a first aspect, this disclosure provides a heat spreader, including a housing, the housing enclosing a cavity, the housing having an outwardly convex structure protruding away from the cavity on its outer wall surface, and a recessed structure recessed away from the cavity on its inner wall surface, the position of the recessed structure corresponding to the position of the outwardly convex structure; the outwardly convex structure is used for connection with a heat source.

[0005] Optionally, the set wall plate of the cavity protrudes in a direction away from the cavity, and the protrusion of the set wall plate forms the recessed structure and the convex structure.

[0006] Optionally, the thickness of the set wall panel is consistent at least at each location of the convex structure.

[0007] Optionally, the heat spreader further includes a capillary structure; the capillary structure is disposed within the cavity and connected to the inner wall surface; part of the capillary structure is located within the region corresponding to the recessed structure, and part of it is located outside the region corresponding to the recessed structure.

[0008] Optionally, the temperature distribution plate further includes a support column structure disposed within the cavity.

[0009] Optionally, at least one of the support column structures is provided with columnar capillary structures inside or outside.

[0010] Optionally, the inner wall surface is provided with the columnar capillary structure at least within the range corresponding to the recessed structure.

[0011] Optionally, the vapor chamber further comprises a capillary structure, and the capillary structure is arranged in the cavity.

[0012] When the capillary structure only comprises the columnar capillary structure, two ends of the columnar capillary structure are connected with the inner wall surface respectively.

[0013] When the capillary structure comprises the wall-adhering capillary structure and the columnar capillary structure, the wall-adhering capillary structure is combined with the inner wall surface, one end of the columnar capillary structure is connected with the wall-adhering capillary structure or the inner wall surface, and the other end of the columnar capillary structure is connected with the wall-adhering capillary structure or the inner wall surface.

[0014] Optionally, when the capillary structure comprises the wall-adhering capillary structure,

[0015] Two ends of at least one of the support column structures are connected with the wall-adhering capillary structure respectively, and / or two ends of at least one of the support column structures are connected with the inner wall surface respectively.

[0016] In a second aspect, the present disclosure provides a power module, comprising a chip unit and the vapor chamber according to any one of the first aspect, and an outer convex structure of the vapor chamber is connected with the chip unit.

[0017] Optionally, the chip unit comprises a chip and an insulating module, the insulating module has a first metal layer facing the chip and a second metal layer facing the outer convex structure, the first metal layer is connected with the chip, and the second metal layer is connected with the outer convex structure through solder.

[0018] Optionally, a part of the outer convex structure facing the chip unit is a first surface, a cross-sectional area of the second metal layer is greater than or equal to an area of the first surface, and when the second metal layer is connected with the first surface through solder, the second metal layer covers the first surface.

[0019] Optionally, a part of the outer convex structure facing the chip unit is a first surface, the outer convex structure further has a solder collection groove, the solder collection groove forms a groove opening at the first surface, and the first surface is connected with the chip unit through solder along both sides of the groove opening in a width direction of the groove.

[0020] Optionally, at least one end of the solder collection groove in an extension direction is formed with a communication opening.

[0021] And / or, a contour line of a circumferential edge of the first surface is enclosed in a rectangular shape, and the solder collection groove is arranged obliquely with respect to two adjacent sides of the rectangle respectively.

[0022] In a third aspect, the present disclosure provides a heat dissipation system, comprising the vapor chamber according to the first aspect.

[0023] In a fourth aspect, the present disclosure provides an electronic device comprising the power module according to any one of the second aspect, or comprising the heat dissipation system according to any one of the third aspect.

[0024] In the heat spreader, the power module, the heat dissipation system and the electronic device of the present disclosure, the shell of the heat spreader is provided with an outward protruding structure at the outer wall surface, which protrudes away from the cavity, facilitating the connection of the heat spreader with the heat source, and the sudden change in the profile shape of the outer wall surface can also improve the anti-deformation performance of the shell at the outward protruding structure to some extent. In this case, the reliability of the connection of the heat spreader with the heat source can be ensured by ensuring the accuracy of the outward protruding structure. The shell is provided with a recessed structure at the inner wall surface of the cavity, which is recessed away from the cavity, and the position of the recessed structure corresponds to the position of the outward protruding structure. Without affecting the occupation of the external space by the heat spreader, the weight of the shell can be prevented from being too large due to the provision of the outward protruding structure, and the volume of the cavity can be improved. When there is a phase change medium of gas-liquid two-phase in the cavity, the provision of the recessed structure can improve the evaporation space of the phase change medium, which is conducive to improving the heat dissipation efficiency of the heat spreader to the heat source. Overall, the heat spreader has high performance and can meet the lightweight design requirements and the performance requirements of the connection and heat transfer with the heat source. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 FIG. 1 is a cross-sectional structure schematic diagram of the heat spreader in the first embodiment of the present disclosure;

[0026] Figure 2 FIG. 2 is a top view structure schematic diagram of the heat spreader in the second embodiment of the present disclosure;

[0027] Figure 3 FIG. 3 is a cross-sectional structure schematic diagram of the heat spreader in the second embodiment of the present disclosure; Figure 2

[0028] Figure 4 FIG. 4 is a cross-sectional structure schematic diagram of the heat spreader in the second embodiment of the present disclosure; Figure 2

[0029] Figure 5 FIG. 5 is an exploded structure schematic diagram of the heat spreader in the second embodiment of the present disclosure;

[0030] Figure 6 FIG. 6 is a structure schematic diagram of the power module in the embodiment of the present disclosure;

[0031] Figure 7 FIG. 7 is a cross-sectional structure schematic diagram of the chip unit in the embodiment of the present disclosure;

[0032] Figure 8 FIG. 8 is a structure schematic diagram of the outward protruding structure provided with a solder collection groove in the embodiment of the present disclosure.

[0033] ​​Reference Signs List:

[0034] 1 - housing; 11 - first shell; 12 - second shell; 13 - cavity; 14 - outer wall surface; 15 - inner wall surface; 111 - setting wall plate; 111A - first area; 101 - outer convex structure; 102 - concave structure; S1 - first surface; 103 - solder collection groove; 2 - capillary structure; 21 - columnar capillary structure; 22 - wall-adhering capillary structure; 221 - first wall-adhering capillary structure; 222 - second wall-adhering capillary structure; 3 - support column structure; 31 - first support column structure; 32 - second support column structure; 4 - chip unit; 41 - chip; 42 - insulating module; 421 - first metal layer; 422 - insulating layer; 423 - second metal layer; 43 - plastic package module; 5 - copper sheet. DETAILED DESCRIPTION

[0035] In order to make the above objectives, features and advantages of the present disclosure more obvious and easy to understand, specific embodiments of the present disclosure are described in detail below with reference to the drawings. Although some embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms, and should not be interpreted as being limited to the embodiments described herein, but rather, these embodiments are provided to more thoroughly and completely understand the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes, and are not intended to limit the scope of protection of the present disclosure.

[0036] Those skilled in the art should understand that, unless otherwise explicitly indicated in the context, or known from the context, it should be understood that the term "comprising" and its variants used herein are open-ended, i.e. "including but not limited to"; the term "based on" is "at least partially based on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiment"; the concepts of "first", "second" and the like are only used to distinguish different devices, modules or units, and are not intended to limit the functions performed by these devices, modules or units, nor to indicate or imply a sequential or mutual dependency, nor to indicate or imply relative importance or implicitly indicate the number of technical features indicated. The features limited by "first", "second" can explicitly or implicitly include at least one of the features.

[0037] In addition, in the present specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or implementation. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or implementations in a suitable manner.

[0038] In the attached figures, the Z-axis represents the vertical direction, i.e., the up-down position, and the positive direction of the Z-axis (i.e., the direction the arrow points) indicates up, and the negative direction of the Z-axis indicates down; the X-axis represents the front-back position, and the positive direction of the X-axis (i.e., the direction the arrow points) indicates the front, and the negative direction of the X-axis indicates the back; the Y-axis represents the horizontal direction and is designated as the left-right position, and the positive direction of the Y-axis (i.e., the direction the arrow points) indicates the right, and the negative direction of the Y-axis indicates the left. It should be noted that the aforementioned representations of the Z-axis, Y-axis, and X-axis are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0039] In related technologies, vapor chambers are typically connected to heat sources such as chip units to dissipate heat. However, currently, the thickness dimension of vapor chambers is usually designed to be small. On the one hand, the precision of the surface on the vapor chamber used for connection with the heat source is difficult to guarantee, affecting the reliability of the connection and heat transfer between the vapor chamber and heat sources such as chip units. On the other hand, vapor chambers are prone to deformation due to heat, further affecting the reliability of the connection and heat transfer between the vapor chamber and heat sources such as chip units. Therefore, the performance of vapor chambers needs to be improved.

[0040] To address the problems existing in the aforementioned related technologies, the first aspect of this embodiment provides a heat spreader, including a housing 1, which encloses a cavity 13. The housing 1 has an outwardly protruding structure 101 on its outer wall surface 14, which protrudes away from the cavity 13, and a recessed structure 102 on its inner wall surface 15, which is recessed away from the cavity 13. The position of the recessed structure 102 corresponds to the position of the outwardly protruding structure 101. The outwardly protruding structure 101 is used to connect to a heat source.

[0041] like Figures 1 to 3 As shown, Figure 1 This is a schematic cross-sectional view of the heat exchange plate in the first embodiment of this disclosure; Figure 2 This is a top view of the heat spreader in the second embodiment of this disclosure; Figure 3 for Figure 2 A schematic cross-sectional view at section AA.

[0042] It should be understood that the molding method of the shell 1 is not a limitation, as long as it can enclose and form the cavity 13 and form the above-mentioned recessed structure 102 and convex structure 101.

[0043] Specifically, a certain region, such as the first region 111A, is located on the inner wall surface 15 of the cavity 13. Figure 3The first region 111A and the region around the first region 111A are recessed in the direction away from the cavity 13, so that there is a profile change between the first region 111A and the region around the first region 111A on the inner wall surface 15, and thus the inner wall surface 15 forms a recessed structure 102 in the first region 111A. Similarly, a region such as the first region 111A on the outer wall surface 14 of the shell 1 is convex in the direction away from the cavity 13, so that there is a profile change between the first region 111A and the region around the first region 111A on the outer wall surface 14, and thus the outer wall surface 14 forms an outer convex structure 101 in the first region 111A.

[0044] The heat sink is connected to the heat source through the outer convex structure 101, and the structure of the heat source is not limited. The positions of the recessed structure 102 and the outer convex structure 101 correspond to each other, that is, the region of the shell 1 used to form the outer convex structure 101 is at least partially used to form the recessed structure 102, so that the overall material of the shell 1 is less without affecting the overall space occupation of the heat sink, and the volume of the cavity 13 can be increased.

[0045] In this embodiment, the outer shell of the heat sink forms the outer convex structure 101 on the outer wall surface 14, which is convex in the direction away from the cavity 13, so that the heat sink is connected to the heat source through the outer convex structure 101, and the profile change of the outer wall surface 14 can also improve the anti-deformation performance of the shell 1 at the outer convex structure 101 to a certain extent. In this case, the reliability of the connection between the heat sink and the heat source can be ensured by ensuring the accuracy of the outer convex structure 101. The shell 1 forms the recessed structure 102 on the inner wall surface 15 of the cavity 13, which is recessed in the direction away from the cavity 13. The position of the recessed structure 102 corresponds to the position of the outer convex structure 101, so that the weight of the shell 1 due to the outer convex structure 101 can be avoided without affecting the space occupation of the heat sink, and the volume of the cavity 13 can be increased. When there is a phase change medium of gas-liquid two-phase in the cavity, the setting of the recessed structure 102 can increase the evaporation space of the phase change medium, which is beneficial to improve the heat dissipation efficiency of the heat sink to the heat source. Therefore, in general, the heat sink of the present embodiment has high performance, and can meet the lightweight design requirements and the performance requirements of heat transfer connection with the heat source.

[0046] In addition, as described below, when the outer convex structure 101 is connected to the chip unit 4, the setting of the outer convex structure 101 is beneficial to increase the electrical clearance and meet the safety distance requirements. For example, when the chip unit 4 uses a bonded chip 41 such as IGBT using a copper sheet 5, it is beneficial to meet the safety distance requirements of the pins of the chip 41 connected to the copper sheet 5.

[0047] Optionally, the set wall plate 111 of the cavity 13 is protrudedly arranged in a direction away from the cavity 13, and the recessed structure 102 and the outward protruding structure 101 are formed by the protruded arrangement of the set wall plate 111.

[0048] As shown in FIG. 1 and FIG. 2, in the first embodiment of the present disclosure, the top wall of the cavity 13 constitutes the set wall plate 111, and the set wall plate 111 is protrudedly arranged in a direction away from the cavity 13 in the first area 111A, so that the set wall plate 111 in the first area 111A can form the recessed structure 102 at the inner wall surface 15 of the cavity 13 and form the outward protruding structure 101 at the outer wall surface 14 of the shell 1. Figure 2 Figure 3 As shown in FIG. 1 and FIG. 2, in the first embodiment of the present disclosure, the top wall of the cavity 13 constitutes the set wall plate 111, and the set wall plate 111 is protrudedly arranged in a direction away from the cavity 13 in the first area 111A, so that the set wall plate 111 in the first area 111A can form the recessed structure 102 at the inner wall surface 15 of the cavity 13 and form the outward protruding structure 101 at the outer wall surface 14 of the shell 1.

[0049] In some scenarios, the set wall plate 111 can form the outward protruding structure 101 and the recessed structure 102 by stamping or other means.

[0050] In this way, the formation of the outward protruding structure 101 and the recessed structure 102 is simple and practical.

[0051] As shown in FIG. 1 and FIG. 2, in the first embodiment of the present disclosure, the top wall of the cavity 13 constitutes the set wall plate 111, and the set wall plate 111 is protrudedly arranged in a direction away from the cavity 13 in the first area 111A, so that the set wall plate 111 in the first area 111A can form the recessed structure 102 at the inner wall surface 15 of the cavity 13 and form the outward protruding structure 101 at the outer wall surface 14 of the shell 1. Figure 3

[0052] It should be understood that the thickness described herein refers to the thickness of the material. Taking the outward protruding structure 101 at a certain point on the outer wall surface 14 as an example, a tangent plane of the outer wall surface 14 at the point is passed through the point, and a normal line of the tangent plane is also passed through the point. The thickness of the set wall plate 111 at the point is the size of the overlapping part of the set wall plate 111 and the normal line.

[0053] In this way, the set wall plate 111 after forming the outward protruding structure 101 is consistent with the shape profile of the inner wall surface 15 in the first area 111A. The structure of the set wall plate 111 is simple and practical. When the uniform temperature plate is connected to the heat source through the outward protruding structure 101, the heat transfer performance of the outward protruding structure 101 at different positions tends to be consistent, and the structure is simple and practical.

[0054] Further, the thickness of the set wall plate 111 at different positions is consistent.

[0055] For example, before the set wall plate 111 is protrudedly arranged in a direction away from the cavity 13 in the first area 111A and forms the outward protruding structure 101 and the recessed structure 102, the set wall plate 111 is a plate body with uniform plate thickness. The set wall plate 111 is formed by stamping to form the outward protruding structure 101 and the recessed structure 102. In this case, the set wall plate 111 can be made of a plate member with uniform thickness, which is convenient for processing and manufacturing and reduces production costs. ​​

[0056] As Figure 3 shown, in an alternative of the shell 1, the shell 1 comprises a first shell 11 and a second shell 12, the first shell 11 and the second shell 12 enclose a cavity 13.

[0057] Further, the first shell 11 is manufactured by a plate member in a manner such as stamping, and the second shell 12 is manufactured by a plate member in a manner such as stamping.

[0058] The first shell 11 and the second shell 12 can be connected by welding or the like to ensure the sealing performance of the cavity 13. In addition, it should be understood that in some scenarios, the shell 1 can be provided with a process hole for the need of arranging the phase change medium in the cavity 13, and after arranging the phase change medium through the process hole, the process hole is plugged, which can adopt related technologies and will not be described in detail here.

[0059] As Figure 3 shown, in the above embodiments, the vapor chamber optionally further comprises a capillary structure 2; the capillary structure 2 is arranged in the cavity 13.

[0060] Specifically, during the operation of the vapor chamber, the outward convex structure 101 is the side close to the heat source (evaporation zone), which absorbs heat and causes the liquid phase change medium to evaporate into vapor; the vapor rapidly spreads to the area with lower temperature (condensation zone) under the action of internal pressure, and condenses back to liquid state after releasing heat; then, the liquid phase change medium is drawn back to the evaporation zone by the action of the capillary structure 2, forming a cycle.

[0061] During this process, the capillary structure 2 has one or more of the following functions. Liquid return: the capillary structure 2 provides the necessary capillary force to bring the condensed liquid from the condensation zone back to the evaporation zone, ensuring the recycling of the phase change medium and thus maintaining the continuous operation of the vapor chamber. Uniform heat dissipation: the capillary structure 2 helps to distribute the phase change medium throughout the vapor chamber, allowing heat to be more evenly transferred from the heat source to the entire heat dissipation surface, improving the heat dissipation efficiency. Enhanced heat transfer performance: a good capillary structure 2 design can increase the contact area between liquid and vapor, speed up the phase change process (i.e., the speed of liquid evaporation and vapor condensation), and thus improve the overall heat transfer performance of the vapor chamber. Adapt to different installation angles: since the capillary force is not affected by gravity, even if the vapor chamber is not installed horizontally, the capillary structure 2 can still ensure the effective return of the liquid, enhancing the application flexibility of the vapor chamber. Stability: the presence of the capillary structure 2 also increases the stability of the system, preventing the possible dryout phenomenon (i.e., the evaporation zone does not have enough liquid for evaporation), and ensuring the long-term stable operation of the vapor chamber.

[0062] As Figure 3As shown, specifically, part of the capillary structure 2 is located within the region corresponding to the recessed structure 102, and part is located outside the region corresponding to the recessed structure 102.

[0063] Thus, the capillary structure 2 can effectively reflux the liquid phase change medium back to the recessed structure 102 through capillary action.

[0064] The specific arrangement of the capillary structure 2 is not a limitation and will be explained in detail later with reference to specific embodiments.

[0065] like Figures 3 to 5 As shown, optionally, the heat spreader also includes a support column structure 3, which is disposed within the cavity 13.

[0066] The structural form of the support column structure 3 is not limited, as long as it can support the two opposite wall plates of the shell 1.

[0067] Optionally, the capillary structure 2 includes a columnar capillary structure 21, which is provided inside or outside at least one support column structure 3.

[0068] like Figure 3 As shown, the support column structure 3 is a first support column structure 31, and the first support column structure 31 is a hollow column with a columnar capillary structure 21 inside. In this case, the columnar capillary structure 21 can shorten the circulation path of the phase change medium, thereby improving the efficiency of the phase change heat cycle in the cavity 13.

[0069] Of course, it should be understood that the exterior of the first support column structure 31 may also be provided with a hollow columnar capillary structure 21, which is not shown in this diagram.

[0070] Optionally, the inner wall surface 15 is provided with columnar capillary structures 21 at least within the range corresponding to the recessed structure 102.

[0071] like Figure 3 As shown, for example, there are multiple first support column structures 31, some of which are set in the first region 111A, and some of which are set in the region outside the first region 111A. Each first support column structure 31 is respectively provided with columnar capillary structure 21.

[0072] Thus, the columnar capillary structure 21 in the first region 111A is conducive to increasing the circulation rate of the phase change medium in the space corresponding to the first region 111A, thereby improving the efficiency of the phase change heat cycle in the cavity 13 and improving the efficiency of the heat spreader in dissipating heat from the heat source.

[0073] In the above embodiments, optionally, when the capillary structure 2 includes only the columnar capillary structure 21, the two ends of the columnar capillary structure 21 are connected to the inner wall surface 15 respectively.

[0074] For example, the columnar capillary structure 21 guides the liquid phase change medium at one end to the other end through capillary action, for example, the other end is connected to the inner wall surface 15 at the recessed structure 102.

[0075] In the above embodiments, the capillary structure 2 may optionally include a wall-attached capillary structure 22 and a columnar capillary structure 21.

[0076] In this configuration, the wall-mounted capillary structure 22 is attached to the inner wall surface 15, and one end of the columnar capillary structure 21 is connected to the wall-mounted capillary structure 22 or the inner wall surface 15, while the other end of the columnar capillary structure 21 is also connected to the wall-mounted capillary structure 22 or the inner wall surface 15. For example, one end of the columnar capillary structure 21 is connected to the wall-mounted capillary structure 22 or the inner wall surface 15 at the recessed structure 102, and the other end is connected to the wall-mounted capillary structure 22 or the inner wall surface 15 at a position opposite to the set wall panel 111.

[0077] like Figure 3 As shown, it illustrates the situation where one end of the first support column structure 31 and its corresponding columnar capillary structure 21 is connected to the wall-mounted capillary structure 22 at the top wall, and the other end is connected to the wall-mounted capillary structure 22 at the bottom wall.

[0078] like Figure 3 and 5 As shown, in this embodiment, the wall-mounted capillary structure 22 may include a first wall-mounted capillary structure 221 and a second wall-mounted capillary structure 222, which are respectively disposed corresponding to the first shell 11 and the second shell 12.

[0079] In the above embodiments, optionally, at least one support column structure 3 is connected to the inner wall surface 15 at both ends.

[0080] like Figure 2 and Figure 4 As shown, for example, the support column structure 3 includes a second support column structure 32, and the two ends of the second support column structure 32 are respectively connected to the inner wall surface 15.

[0081] In some scenarios, the support column structure 3 includes a first support column structure 31 and a second support column structure 32. The second support column structure 32 can strengthen the support of two relatively arranged parts of the inner wall surface 15 to ensure the structural stability of the shell 1. The first support column structure 31 can strengthen the support of two relatively arranged parts of the wall-mounted capillary structure 22 to ensure the support stability of the wall-mounted capillary structure 22 and the shell 1.

[0082] In the above embodiments, it should be understood that the height of the protrusion of the outer convex structure 101 relative to the top surface can be set according to specific needs. Depending on the number and layout of heat sources, multiple protrusions of the outer convex structure 101 can also be set as needed, which will not be described in detail here. For example, the dimensions of the first shell 11 and the second shell 12 in the Z-axis direction are both greater than or equal to 0.6 mm, and the height of the protrusion of the outer convex structure 101 relative to the top surface of the shell can be greater than the thickness of the set wall panel 111.

[0083] In the above embodiments, the specific structural configuration of the capillary structure 2 is not limited, and it may include one or more of the following: a network structure and a copper powder sintering structure.

[0084] like Figure 6 As shown, the second aspect of this embodiment provides a power module, which includes a chip unit 4 and a heat spreader as described in the first aspect above. The heat spreader is connected to the chip unit 4 through an outward protrusion structure 101.

[0085] Specifically, the specific structure of chip unit 4 is not limited. Chip unit 4 generates heat when it is working, that is, chip unit 4 forms a heat source when it is working. The heat spreader is connected to chip unit 4 through its protruding structure 101. The heat spreader will accelerate the heat dissipation of chip unit 4 and improve the heat dissipation performance of the power module.

[0086] refer to Figure 7 As shown, optionally, the chip unit 4 includes a chip 41 and an insulating module 42; the insulating module 42 has a first metal layer 421 facing the chip 41 and a second metal layer 423 facing the protruding structure 101, the first metal layer 421 is connected to the chip 41, and the second metal layer 423 is connected to the protruding structure 101 by solder.

[0087] In this embodiment, the technical solution of this disclosure is illustrated by taking the insulating module 42 as a directly bonded copper substrate, which includes a first metal layer 421, an insulating layer 422, and a second metal layer 423 from top to bottom. However, it should be understood that it is not limited to this. The number of layers in the insulating module 42 can be increased as needed, and this is not a limitation. The chip unit 4 typically also includes a molding compound structure to encapsulate the chip 41, achieving waterproofing and dustproofing of the chip 41, which will not be described in detail here.

[0088] The connection method between the first metal layer 421 and the chip 41 is not limited. For example, the first metal layer 421 can be soldered to the chip 41 to fix the chip 41 to the insulating module 42.

[0089] In this way, the second metal layer 423 is connected to the protruding structure 101 by solder, which can ensure the heat transfer performance of the chip 41 when it is connected to the protruding structure 101 via the insulating module 42. Its structure is simple and highly practical.

[0090] In the above embodiments, optionally, the portion of the convex structure 101 facing the chip unit 4 is the first surface S1; the cross-sectional area of ​​the second metal layer 423 is greater than or equal to the area of ​​the first surface S1, and when the second metal layer 423 is connected to the first surface S1 by solder, the second metal layer 423 covers the first surface S1.

[0091] Specifically, the first surface S1 is the surface of the heat spreader that is connected to the chip unit 4, that is, the first surface S1 is the surface of the heat spreader that is connected to the second metal layer 423.

[0092] It should be understood that in power modules, chip unit 4 is typically soldered to a vapor chamber using solder paste or similar materials. Specifically, solder paste is applied to the first surface S1 of the vapor chamber, chip unit 4 is placed on it, and the vapor chamber and chip unit 4 are then clamped together and placed in a soldering device for soldering. However, in some cases, uneven solder layer thickness may occur between different locations within the connection area between the vapor chamber and chip unit 4. This can lead to several consequences: Reduced heat conduction efficiency: In power modules, uneven solder paste thickness can affect heat conduction efficiency, thus impacting the module's heat dissipation performance. Weak solder joints or missing solder points: Insufficient solder paste thickness can lead to weak solder joints or missing solder points, affecting connection reliability. High void ratio: In IGBT module packaging, uneven solder paste thickness can increase the void ratio, affecting the module's electrical and thermal performance.

[0093] In this embodiment, the cross-sectional area of ​​the second metal layer 423 is greater than or equal to the area of ​​the first surface S1. When the second metal layer 423 is connected to the first surface S1, the second metal layer 423 can cover the first surface S1. For example, the minimum distance between the circumferential edge of the second metal layer 423 and the circumferential edge of the first surface S1 is greater than or equal to 0.2 mm. In this way, during the soldering process between the chip unit 4 and the heat dissipation structure, excess molten solder can flow downward from the circumferential edge of the first surface S1, reducing the possibility of excess molten solder accumulating on the insulating layer 422, ensuring the flatness of the soldering of the chip unit 4, and ensuring its soldering quality.

[0094] refer to Figure 8 As shown in the above embodiment, optionally, the portion of the convex structure 101 facing the chip unit 4 is the first surface S1; the convex structure 101 also includes a solder collection groove 103, the solder collection groove 103 forms a groove opening at the first surface S1, and the first surface S1 is connected to the chip unit 4 by solder on both sides of the groove opening along the width direction of the groove.

[0095] For example, a solder collection groove 103 is formed in the recess of the first surface S1 of the heat spreader, and the solder collection groove 103 is connected to the outside through the groove opening of the first surface S1.

[0096] It should be understood that the number of solder collection tanks 103 can be one or more. Each of the solder collection tanks 103 has a length direction and a width direction, the length direction being the direction in which the solder collection tank 103 extends, and the width direction being the direction perpendicular to the length direction and the depth of the tank.

[0097] It should be understood that, for any of the solder collection tanks 103, the first surface S1 is used to connect to the chip unit 4 via solder at positions on both sides of the slot opening along the width direction of the slot. That is, when the connection structure is soldered to the chip unit 4, the projection of the chip unit 4 onto the first surface S1 is partially located within the area corresponding to the slot opening, and partially located on both sides of the area corresponding to the slot opening. It should be understood that, in this case, the dimension of the solder collection tank 103 along its length direction can be larger than, smaller than, or equal to, the dimension of the chip unit 4; this is not a limitation.

[0098] Thus, in this embodiment, during the welding process, excess solder can be collected through the solder collection tank 103, which helps to reduce the possibility of uneven solder layer thickness caused by solder buildup, helps to ensure the uniformity of solder layer thickness after welding, and reduces welding internal stress. Furthermore, in this case, the air bubbles generated by the flux during the welding process are easier to squeeze out, which helps to reduce the void rate of the welding, improve the welding quality, and facilitate the control of consistency in batch welding.

[0099] Furthermore, the solder collection tank 103 has a communication port at at least one end in the extending direction.

[0100] In this way, exhaust gases can be discharged through the solder collection tank 103 and its connecting port, such as bubbles generated by flux. It also facilitates heat and air exchange between the solder collection tank 103 and the external environment, which helps to reduce the possibility of heat concentration between the chip unit 4 and the heat dissipation structure at the solder collection tank 103 and improves the heat dissipation performance of the power module.

[0101] refer to Figure 8 As shown, in a further alternative embodiment, the outline of the circumferential edge of the first surface S1 is arranged in a rectangle; the solder collection tank 103 is inclined relative to the two adjacent sides of the rectangle.

[0102] In this way, the solder collection tank 103 can be prevented from affecting the structural stability of the heat spreader shell 1 at the first surface S1, thus ensuring the structural performance of the shell 1. Of course, it should be understood that it is not limited to this, and will not be explained in detail below.

[0103] In the above embodiments, it should be understood that the size, shape, etc. of the solder collection tank 103 can be determined according to actual needs and in conjunction with experiments, and will not be described in detail here.

[0104] Thirdly, this disclosure provides a heat dissipation system, including the vapor chamber described in the first aspect. This heat dissipation system dissipates heat from the heat source through the vapor chamber, thereby improving the heat dissipation performance of the system.

[0105] Fourthly, this disclosure provides an electronic device that includes the power module as described in the second aspect above, or the heat dissipation system as described in the third aspect above.

[0106] For example, electronic devices can be photovoltaic energy storage converters, inverters, etc., which will not be described in detail here.

[0107] While the above disclosure is provided, the scope of protection of this disclosure is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of this disclosure, and all such changes and modifications will fall within the scope of protection of this disclosure.

Claims

1. A heat spreader, characterized in that, The device includes a housing (1) that encloses a cavity (13). The housing (1) has an outwardly protruding structure (101) on its outer wall surface (14) that protrudes away from the cavity (13), and a recessed structure (102) on its inner wall surface (15) that recesses away from the cavity (13). The position of the recessed structure (102) corresponds to the position of the outwardly protruding structure (101). The outwardly protruding structure (101) is used to connect to a heat source.

2. The temperature distribution plate as described in claim 1, characterized in that, The set wall plate (111) of the cavity (13) protrudes in a direction away from the cavity (13), and the protrusion of the set wall plate (111) forms the recessed structure (102) and the convex structure (101).

3. The temperature distribution plate as described in claim 2, characterized in that, The set wall panel (111) has a consistent thickness at least at each location of the convex structure (101).

4. The heat spreader as described in any one of claims 1 to 3, characterized in that, The temperature distribution plate also includes a capillary structure (2); the capillary structure (2) is disposed in the cavity (13) and is connected to the inner wall surface (15); part of the capillary structure (2) is located within the area corresponding to the recessed structure (102) and part of it is located outside the area corresponding to the recessed structure (102).

5. The temperature distribution plate as described in any one of claims 1 to 3, characterized in that, The temperature distribution plate also includes a support column structure (3), which is disposed in the cavity (13).

6. The temperature distribution plate as described in claim 5, characterized in that, At least one of the support column structures (3) is provided with columnar capillary structures (21) inside or outside.

7. The temperature distribution plate as described in claim 6, characterized in that, The inner wall surface (15) is provided with the columnar capillary structure (21) at least within the range corresponding to the recessed structure (102).

8. The temperature distribution plate as described in claim 6, characterized in that, The temperature distribution plate also includes a capillary structure (2), which is disposed in the cavity (13); When the capillary structure (2) includes only the columnar capillary structure (21), the two ends of the columnar capillary structure (21) are respectively connected to the inner wall surface (15); When the capillary structure (2) includes a wall-mounted capillary structure (22) and a columnar capillary structure (21), the wall-mounted capillary structure (22) is attached to the inner wall surface (15), one end of the columnar capillary structure (21) is connected to the wall-mounted capillary structure (22) or the inner wall surface (15), and the other end of the columnar capillary structure (21) is connected to the wall-mounted capillary structure (22) or the inner wall surface (15).

9. The temperature distribution plate as described in claim 8, characterized in that, When the capillary structure (2) includes the wall-adherent capillary structure (22); At least one of the support column structures (3) has its two ends connected to the wall-mounted capillary structure (22), and / or, at least one of the support column structures (3) has its two ends connected to the inner wall surface (15).

10. A power module, characterized in that, It includes a chip unit (4) and a heat spreader as described in any one of claims 1 to 9, wherein the convex structure (101) of the heat spreader is connected to the chip unit (4).

11. The power module as described in claim 10, characterized in that, The chip unit (4) includes a chip (41) and an insulating module (42); the insulating module (42) has a first metal layer (421) facing the chip (41) and a second metal layer (423) facing the protruding structure (101), the first metal layer (421) is connected to the chip (41), and the second metal layer (423) is connected to the protruding structure (101) by solder.

12. The power module as described in claim 11, characterized in that, The portion of the convex structure (101) facing the chip unit (4) is the first surface (S1); the cross-sectional area of ​​the second metal layer (423) is greater than or equal to the area of ​​the first surface (S1), and when the second metal layer (423) is connected to the first surface (S1) by solder, the second metal layer (423) covers the first surface (S1).

13. The power module as described in claim 10, characterized in that, The portion of the protruding structure (101) facing the chip unit (4) is a first surface (S1); the protruding structure (101) also has a solder collection groove (103), the solder collection groove (103) forms a groove opening at the first surface (S1), and the first surface (S1) is connected to the chip unit (4) by solder on both sides of the groove opening along the width direction of the groove.

14. The power module as described in claim 13, characterized in that, The solder collection tank (103) has a communication port at at least one end in the extending direction; And / or, the outline of the circumferential edge of the first surface (S1) is arranged in a rectangle, and the solder collection groove (103) is inclined relative to the two adjacent sides of the rectangle.

15. A heat dissipation system, characterized in that, Including the heat spreader as described in any one of claims 1 to 9.

16. An electronic device, characterized in that, It includes the power module as described in any one of claims 10 to 14, or the heat dissipation system as described in claim 15.

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