Ejector pin device
By designing a limiting structure and using a wear-resistant ejector pin material, combined with ejector pin caps and machine adjustments, the problems of shaking and inconsistent height of the ejector pin device during chip packaging were solved, improving chip ejection effect and product quality.
Patent Information
- Application Number
- CN202520145183.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-01-21
AI Technical Summary
Existing ejector pin devices have problems such as easy pin wobbling, inconsistent positioning, uneven lifting force, and difficulty in control during chip packaging, which increases the risk of chip damage and affects product quality.
Design an ejector device including a needle plate assembly, an ejector base, a first limiting structure, and a second limiting structure. The limiting structure ensures the positional stability and height consistency of the ejector. The ejector is made of tungsten steel to improve wear resistance, and an ejector cap is used to increase the force-bearing area. Combined with the height adjustment structure of the machine tool, precise lifting can be achieved.
It effectively solves the problems of shaking and inconsistent height of ejector pins during chip packaging, reduces the risk of chip damage, improves ejection effect and product quality, and simplifies the ejector pin arrangement process.
Smart Images
Figure CN223829807U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a ejector pin device. BACKGROUND
[0002] In the process of semiconductor packaging, the chip needs to be lifted from the carrier (such as blue film) so that the grabbing head can easily adsorb and transfer the chip to the next process. Therefore, the ejector pin with a unique arrangement position is set to facilitate the chip to be separated from the blue film through the subsequent precise lifting action.
[0003] In the existing chip packaging technology, the ejector pin device is usually assembled in a split type. For different chips, the position of the ejector pin needs to be changed, which requires the ejector pin to be disassembled and then arranged and implanted into the needle disc hole. However, this uniform distribution method has some problems in actual operation. The ejector pin is prone to shaking during uniform distribution, which not only affects the accurate position of the ejector pin, but also may cause uneven contact between the ejector pin and the chip during the lifting process, thereby increasing the risk of chip damage. In addition, due to the complexity of split assembly, it is difficult to ensure that the ejector pin has a uniform vertical height after manual arrangement. This height difference will cause uneven force on the ejector pin when lifting the chip, and some ejector pins may lift the chip excessively and damage it, while other ejector pins may not lift the chip sufficiently, affecting the separation effect of the chip. At the same time, the ejecting pressure and impact of the ejector pin device are difficult to control uniformly, and different ejector pins may exert different forces during the lifting process, which not only affects the ejecting effect of the chip, but also may cause unnecessary impact on the chip, thereby affecting the overall quality of the product. These problems, combined together, are prone to cause damage to the chip during the packaging process, and the ejecting effect is not ideal, ultimately affecting the overall quality of the product.
[0004] Therefore, it is crucial to improve the design of the ejector pin device to improve the stability and consistency of the ejector pin, which is the key to improving the quality and efficiency of chip packaging. UTILITY MODEL CONTENTS
[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide an ejector pin device to solve the problem of easy shaking and inconsistent height of each ejector pin caused by repeated arrangement of the ejector pin in the prior art.
[0006] To achieve the above-mentioned purposes and other related purposes, the utility model provides an ejector pin device, which comprises a needle disc assembly, an ejector pin base, a first limiting structure and a second limiting structure.
[0007] The needle disc assembly comprises a needle disc and a plurality of ejector pins; each ejector pin is embedded in the needle disc and exposed from the upper surface of the needle disc; the upward opening of the ejector pin base accommodates the embedding of the needle disc assembly;
[0008] The first limiting structure and the second limiting structure are arranged between the needle disc assembly and the thimble base respectively, the needle disc assembly is horizontally limited based on the first limiting structure, and the needle disc assembly is vertically limited based on the second limiting structure.
[0009] Optionally, the heights of the thimbles exposed from the needle disc are equal.
[0010] Optionally, the thimble device further comprises a thimble cap; the thimbles all penetrate the thimble cap and are exposed from above the thimble cap.
[0011] Optionally, the cross section of the thimble cap in the direction perpendicular to the thimbles is circular.
[0012] Optionally, the first limiting structure is a limiting boss; the second limiting structure is a spring piece; the spring piece is embedded in the thimble base, the spring piece is exposed from the upper surface of the thimble base; the limiting boss is arranged on the upper end of the two sides opposite to the opening and extends to the opposite side.
[0013] Optionally, a buffer gasket is further arranged between the spring piece and the thimble base.
[0014] Optionally, the thimble device further comprises a third limiting structure; the third limiting structure comprises a first groove and a second groove; the first groove is arranged on the two sides of the lower end surface of the needle disc; the second groove is arranged on the part of the thimble base contacting the needle disc and corresponds to the first groove.
[0015] Optionally, the thimble device further comprises a machine table; the machine table is arranged below the thimble base.
[0016] Optionally, the needle disc and the thimbles are fixedly connected.
[0017] Optionally, the machine table further comprises a height adjusting structure, the height of the thimble device is adjusted based on the height adjusting structure.
[0018] As described above, the thimble device has the following beneficial effects:
[0019] 1. The thimble device can replace the corresponding needle disc assembly according to different products, reduce the thimble arrangement time, solve the problems of easy shaking and non-uniform height of the thimbles during work, avoid the tilted chip caused by the thimble, and avoid the risk of uneven stress during suction and chip damage.
[0020] 2. The thimble device uses the first limiting structure and the second limiting structure to limit the position respectively, ensures the smoothness of the disassembly process, and reduces the disassembly time of the thimble assembly. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 A structure diagram of a first ejector pin device of the present application is shown.
[0022] Figure 2 A structure diagram of a dial assembly of the present application is shown.
[0023] Figure 3 A structure diagram of an ejector pin base of the present application is shown.
[0024] Figure 4 A structure diagram of a second ejector pin device of the present application is shown.
[0025] Figure 5 A top view of an ejector pin cap of the present application is shown.
[0026] Figure 6 A side view of the ejector pin device of the present application is shown. Figure 4
[0027] Explanation of element reference numerals
[0028] 1 ejector pin device
[0029] 11 dial assembly
[0030] 110 ejector pin
[0031] 111 dial
[0032] 12 ejector pin base
[0033] 13 limiting boss
[0034] 14 spring member
[0035] 15 machine table
[0036] 16 ejector pin cap
[0037] 161 ejector pin hole
[0038] 17 third limiting structure
[0039] 171 first groove
[0040] 172 second groove DETAILED DESCRIPTION
[0041] The embodiments of the present application will be described in detail by specific examples below, and other advantages and effects of the present application can be easily understood by those skilled in the art from the content disclosed in the present specification. The present application can also be implemented or applied by other different specific embodiments, and various modifications or changes can be made to the details in the present specification based on different views and applications without departing from the spirit of the present application.
[0042] Please refer to Figures 1-6 It should be noted that the diagrams provided in the present embodiment only illustrate the basic concept of the present application in a schematic manner, and only the components related to the present application are shown in the diagrams, not the components number, shape and size when actually implemented. The actual implementation of each component may be changed arbitrarily, and the component layout may be more complex.
[0043] In the existing chip packaging technology, the top pin is easy to shake, which affects accurate positioning and uniform contact with the chip, and increases the risk of chip damage. At the same time, due to the complex assembly of the top pin device in a split type, it is difficult to ensure uniform vertical height by manual arrangement, which leads to uneven stress when the chip is lifted, and some top pins are damaged by excessive lifting, and some are not fully lifted, which affects separation. The pressure and impact of the lifting device are difficult to control uniformly, different top pins have different forces, which affects the ejection effect, causes unnecessary impact on the chip, and affects the quality. These problems are easy to cause damage to the chip packaging, poor ejection effect, and affect the product quality.
[0044] In order to solve the above problems, the present embodiment provides a top pin device 1, which can ensure that there are corresponding most accurate matching top pins for different products by quickly assembling and disassembling and replacing the needle disc assembly 11 between the top pin bases 12. At the same time, the needle disc assembly 11 can ensure that the positions of the top pins meet the requirements, especially the stress requirements, to ensure that the chip is separated according to the requirements, and chip damage can also be avoided. In addition, the top pin device 1 provided by the present embodiment is also provided with a top pin disc 16, which is used to prevent film rupture and other problems caused by excessive top pin pressure when lifting the chip.
[0045] As shown in Figures 1-6 The present embodiment provides a top pin device 1, which comprises a needle disc assembly 11, a top pin base 12, a first limiting structure and a second limiting structure.
[0046] As shown in Figure 1 and Figure 2 The needle disc assembly 11 comprises a needle disc 111 and a plurality of top pins 110; each top pin 110 is embedded in the needle disc 111 and exposed from the upper surface of the needle disc 111; the needle disc assembly 11 is embedded above the top pin base 12.
[0047] The needle device 1 is used for ejecting the chip from the wafer after cutting or ejecting the chip from other chip carriers. In this embodiment, the upper end surface of the exposed part of the needle 111 contacts the carrier where the chip is located, so as to eject the chip.
[0048] In this embodiment, in order to ensure that the chip is not damaged during the ejection process, the arrangement position of the plurality of needles of this embodiment needs to be uniformly distributed to avoid the gap position of the chip (the gap position generally refers to the cutting street or gap area between the chips, such as the connection position of the small chips in the composite chip). The stress concentration caused by the concentration of the needles in the GAP position can cause chip cracks or damage to the circuit structure or connection points contained in the gap position. At the same time, for different chips, this embodiment can install any number of needles 110 at any position as needed, which is suitable for chips of various sizes and is easy to demold the chip.
[0049] Specifically, the needle disc 111 and each needle 110 are fixedly connected, and the needle disc assembly 11 is taken as a whole for subsequent replacement. In this embodiment, the needle disc 111 and each needle 110 are integrally formed, so as to ensure that the arrangement position and the height of each needle 110 are more accurate, and also ensure the stability of the needle 110 during subsequent use, avoiding the shaking phenomenon.
[0050] In this embodiment, the needle disc assembly 11 is detachably arranged above the needle base 12, which is convenient for replacement. By replacing the whole needle disc assembly 11, the corresponding needle disc assembly 11 can be replaced according to different products, reducing the time required for arranging the needle position.
[0051] In this embodiment, the needle 110 is made of tungsten steel material, which has high hardness and high wear resistance, can reduce wear and damage, and thus improve the service life. At the same time, the upper end surface of the needle 110 is made of plastic material, and the end head is a circular arc surface, which can avoid piercing and penetrating the film, and reduce the damage to the chip.
[0052] As shown in Figure 4 , the upper part of the needle base 12 is opened, and the opening accommodates the embedding of the needle disc assembly 11.
[0053] Specifically, as shown in Figure 2 , the height of each needle 110 exposed from the needle disc 111 is equal, so as to ensure a uniform ejection height and avoid damage to the chip due to uneven stress.
[0054] As shown in Figure 4 , the needle device 1 further comprises a needle cap 16; each needle 110 penetrates the needle cap 16, and is exposed from the upper part of the needle cap 16.
[0055] Specifically, the cross section of the needle cap 16 perpendicular to the direction of the needle 110 is circular. The circular needle cap 16 is uniformly stressed during the lifting process. Compared with the action of lifting out only by the needle 110, the use of the needle cap 16 can increase the stress area of the corresponding position of the needle, avoid excessive local stress of the needle, effectively prevent the deformation of the needle cap, and thus avoid the chip from being crushed or damaged.
[0056] In the embodiment, as shown in Figure 5 and Figure 6 The needle cap 16 includes a needle hole 161 for placing the working needle. The needle lifts the chip through the needle hole to separate it from the film. Meanwhile, the outer periphery of the needle cap 16 is also provided with a fixing groove for fixing the needle cap 16 and the needle disc assembly 11. In the embodiment, the upper surface of the needle cap 16 is also provided with an adsorption hole to move the film during the needle operation process, ensuring the separation effect of the chip and the blue film.
[0057] As shown in Figure 1 The first limiting structure and the second limiting structure are respectively arranged between the needle disc assembly 11 and the needle base 12. The first limiting structure limits the needle disc assembly 11 in the horizontal direction, and the second limiting structure limits the needle disc assembly 11 in the vertical direction.
[0058] Specifically, the first limiting structure is a limiting boss 13, and the second limiting structure is a spring piece 14. The spring piece 14 is embedded in the needle base 12, and the spring piece 14 is exposed from the upper surface of the needle base 12. In the embodiment, the upper surface of the needle base 12 is provided with a plurality of through holes to fix one end of the spring in the through hole, and the other end is freely extended outward until it is exposed from the needle base 12. The limiting boss 13 is arranged on the upper end of the two sides opposite to the opening and extends to the opposite side to form a boss. In the embodiment, the limiting boss 13 extends to the opposite side to ensure that the embedded needle base 12 does not move left and right. At the same time, the spring piece 14 is embedded in the needle base 12 and partially exposed. When the needle disc 111 is embedded in the needle base 12, the upper end surface of the spring piece 14 will contact the lower surface of the needle disc 111, and the limiting boss 13 will cooperate to ensure that the embedded needle base 12 does not move up and down. The position of the needle disc 111 relative to the limiting boss 13 is provided with an inward groove, which is convenient for the limiting boss 13 to be embedded.
[0059] In the embodiment, the spring piece 14 is provided with at least n, n is an integer greater than or equal to 1. In fact, the preferred arrangement of the spring piece 12 is a central symmetric arrangement, and the center of symmetry is the middle of the needle disc.
[0060] In this embodiment, a buffer pad (not shown in the figure) is also provided between the spring member 14 and the ejector pin base 12 to ensure the stability of the spring during use and the stability of the needle plate 111 when it is embedded in the ejector pin base 12.
[0061] Specifically, the ejector device 1 also includes a third limiting structure 17; the third limiting structure 17 includes a first groove 171 and a second groove 172; the first groove 171 is disposed on both sides of the lower end face of the needle plate 12; the second groove 172 is disposed on the part of the ejector base 12 that contacts the needle plate 111, and is disposed corresponding to the first groove 171. The first groove 171 and the second groove 172 form the third limiting structure 17, which further restricts the needle plate 111 and the ejector base 12 from displacement in the horizontal direction, thereby improving the stability of the ejector device 1, especially the stability during operation. At the same time, by setting the first limiting structure 13 as a fastener, the process of detaching and installing the needle plate 111 from the ejector base 12 is quick and convenient.
[0062] It should be noted that the first and second limiting structures are not limited to this embodiment. Any setting that can guarantee horizontal limiting and vertical limiting of the needle plate assembly is within the protection scope of this embodiment. In this embodiment, it is preferred to use a spring component in conjunction with a snap-fit component for vertical and horizontal limiting. Compared to bolts or other limiting methods, this method ensures stability while facilitating disassembly. Furthermore, in this embodiment, horizontal and vertical limiting can be achieved using the first and second limiting structures. Adding a third limiting structure further enhances the limiting effect, ensuring stability during operation. Simultaneously, since both the first and third limiting structures employ snap-fit structures, they facilitate assembly and disassembly.
[0063] In this embodiment, the fastener includes a first groove embedded in the edge of the lower surface of the needle plate 111 and a second groove at the contact position between the ejector pin base 12 and the needle plate 111. The first groove and the second groove are correspondingly arranged to facilitate the first groove to be embedded in the second groove and to fix the needle plate 111 on the ejector pin base 12.
[0064] like Figure 1 As shown, the ejector device 1 also includes a machine base 15; the machine base 15 is located below the ejector base 12.
[0065] Specifically, the machine also includes a height adjustment structure (not shown in the figure), which adjusts the height of the ejector pin device 1 to ensure the automatic lifting and lowering of the ejector pin device 1; the machine 15 is fixedly connected to the ejector pin base 12, so that the machine 15 and the ejector pin base 12 can remain stable when the needle plate assembly 11 is installed and removed in an integrated manner.
[0066] In summary, the utility model provides a needle device, include: needle disc subassembly, needle base, first limit structure and second limit structure, needle disc subassembly includes needle disc and a plurality of needles, each needle is embedded needle disc and from the upper surface of needle disc exposes, the upward opening of needle base, the opening contains needle disc subassembly embedding, first limit structure and second limit structure are arranged between needle disc subassembly and needle base respectively, based on first limit structure to needle disc subassembly carries out horizontal direction limit, and, based on second limit structure to needle disc subassembly carries out vertical direction limit, the utility model can change corresponding needle disc subassembly according to different products, reduce needle arrangement time, at the same time solves each needle work and is easy to shake and the problem such as the height not unified, avoids the risk of the chip breakage caused by the uneven stress of the chip tilt when sucking. Therefore, the utility model effectively overcomes the various shortcomings in the prior art and has high industrial utilization value.
[0067] The above embodiments only exemplarily illustrate the principles and effects of the utility model, and are not used to limit the utility model. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.
Claims
1. A pin device, characterized in that, The ejector pin device includes at least: a needle plate assembly, an ejector pin base, a first limiting structure, and a second limiting structure; The needle plate assembly includes a needle plate and a plurality of ejector pins; each ejector pin is embedded in the needle plate and protrudes from the upper surface of the needle plate; the ejector pin base has an upward opening that accommodates the embedded needle plate assembly. The first limiting structure and the second limiting structure are respectively disposed between the needle plate assembly and the pin base. The first limiting structure limits the needle plate assembly in the horizontal direction, and the second limiting structure limits the needle plate assembly in the vertical direction.
2. The ejector pin device according to claim 1, characterized in that: The height of the portion of each pin protruding from the needle plate is equal.
3. The ejector pin device according to claim 2, characterized in that: The ejector device also includes an ejector cap; each ejector pin passes through the ejector cap and protrudes from above the ejector cap.
4. The ejector pin device according to claim 3, characterized in that: The cross-section of the pin cap perpendicular to the direction of penetration of each pin is circular.
5. The ejector pin device according to claim 1, characterized in that: The first limiting structure is a limiting boss; the second limiting structure is a spring; the spring is embedded in the ejector pin base and protrudes from the upper surface of the ejector pin base; the limiting boss is disposed on the upper ends of the two opposite sides of the opening and extends to the opposite side.
6. The ejector pin device according to claim 5, characterized in that: A buffer pad is also provided between the spring and the ejector pin base.
7. The ejector pin device according to claim 5 or 6, characterized in that: The ejector pin device further includes a third limiting structure; the third limiting structure includes a first groove and a second groove; the first groove is disposed on both sides of the lower end face of the needle plate; the second groove is disposed on the part of the ejector pin base that contacts the needle plate, and is disposed corresponding to the first groove.
8. The ejector pin device according to claim 1, characterized in that: The needle plate and each of the ejector pins are fixedly connected.
9. The ejector pin device according to claim 1, characterized in that: The ejector pin device also includes a machine base; the machine base is located below the ejector pin base.
10. The ejector pin device according to claim 9, characterized in that: The machine tool also includes a height adjustment structure, which is used to adjust the height of the ejector pin device.