Packaging substrate with heat dissipation structure

Abstract

The utility model relates to a packaging substrate with a heat radiation structure, which belongs to the technical field of printed circuit boards, and comprises a substrate main body, a packaging surface is arranged on the front surface of the substrate main body, a heat conduction copper pipe is arranged on the outer side of the packaging surface, and a heat radiation fin is arranged on one side of the substrate main body far away from the packaging surface. Connecting assemblies are arranged between the cooling fins and the heat conduction copper pipes. The connecting assembly comprises a connecting piece and a fixing plate, and the connecting piece is fixedly connected with the outer wall of the heat conduction copper pipe. According to the packaging substrate with the heat dissipation structure, the heat dissipation effect of the substrate body is improved through the heat conduction copper pipes arranged on the periphery of the packaging face and the heat dissipation fins arranged on the back face of the substrate body, and rapid installation of the heat conduction copper pipes and the heat dissipation fins is achieved through cooperation of the connecting pieces, the fixing plates and the limiting rods; and through cooperation of a sleeve, a spring, a connecting rod and an adjusting rod, the position of a limiting rod can be elastically adjusted, the heat conduction copper pipe and the cooling fins can be rapidly disassembled, and maintenance is convenient.

Description

TECHNICAL FIELD

[0001] The utility model relates to printed wiring board technical field, concretely is a kind of packaging substrate with heat dissipation structure. BACKGROUND

[0002] Packaging substrate is the carrier of semiconductor chip packaging, with the characteristics of high density, high precision, high performance, miniaturization and light thin, can provide support, heat dissipation and protection for chip, while also providing electrical connection and physical support between chip and PCB motherboard, and flexible chip on film packaging substrate is a kind of die soft film packaging technology that integrates circuit is fixed on flexible circuit board, which uses soft additional circuit board as packaging chip carrier, combines chip and soft substrate circuit, forms highly integrated, miniaturized and light thin packaging structure, COF technology not only can improve product functionality, high packaging density and light thin small, but also can improve the added value of product.

[0003] The existing packaging substrate has poor heat dissipation effect during use, and the internal heat is difficult to dissipate quickly under long-term use, and the high heat can cause the chip to be damaged, shorten the service life of the packaging substrate and affect use, so a packaging substrate with heat dissipation structure is proposed to solve the above problems. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of the prior art, the utility model provides a packaging substrate with heat dissipation structure, which has the advantages of convenient heat dissipation, solves the problem of poor heat dissipation effect of the existing packaging substrate during use, and the internal heat is difficult to dissipate quickly under long-term use, and the high heat can cause the chip to be damaged, shorten the service life of the packaging substrate and affect use.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: a packaging substrate with heat dissipation structure, comprising a substrate main body, the front surface of the substrate main body is provided with a packaging surface, the outer side of the packaging surface is provided with a heat-conducting copper pipe, the side of the substrate main body away from the packaging surface is provided with a cooling fin, and a connecting assembly is arranged between the cooling fin and the heat-conducting copper pipe.

[0006] The connecting assembly comprises a connecting sheet and a fixed plate, the connecting sheet is fixedly connected with the outer wall of the heat-conducting copper pipe, and the connecting sheet penetrates the inner side of the substrate main body, the fixed plate is fixedly connected with the side of the cooling fin, and the inner side of the fixed plate is elastically provided with an adjusting rod, the side of the adjusting rod close to the connecting sheet is fixedly connected with a limiting rod, and the limiting rod penetrates the inner side of the connecting sheet.

[0007] Further, the heat-conducting copper pipe is in the shape of a rectangular ring, one side of the heat-conducting copper pipe is provided with a liquid injection port, and a sealing cover is screw-mounted on the outer side of the liquid injection port.

[0008] Furthermore, the heat sink is made of aluminum alloy and is attached to the outer wall of the substrate body.

[0009] Furthermore, the number of connecting pieces is set to two, and the two connecting pieces are symmetrically distributed on both sides of the heat-conducting copper pipe.

[0010] Furthermore, the number of fixing plates is set to two, and the two fixing plates are symmetrically distributed on both sides of the heat sink.

[0011] Furthermore, a sleeve is fixedly installed inside the fixing plate, and a spring is provided inside the sleeve. One end of the spring is fixedly connected to a connecting rod, which extends to the outside of the sleeve. The side of the adjusting rod away from the limiting rod is fixedly connected to the connecting rod.

[0012] Furthermore, one end of the adjusting rod extends to the outside of the fixed plate, and the end of the adjusting rod located inside the fixed plate is fixedly connected to a slider. The fixed plate has a groove inside that matches the slider, and the slider is slidably connected to the inside of the groove.

[0013] Compared with the prior art, the present invention provides a packaging substrate with a heat dissipation structure, which has the following advantages:

[0014] This packaging substrate with a heat dissipation structure improves the heat dissipation effect of the substrate body through the heat-conducting copper pipes arranged around the periphery of the packaging surface and the heat sinks arranged on the back of the substrate body. The heat-conducting copper pipes and heat sinks can be quickly installed through the cooperation of connecting pieces, fixing plates and limiting rods. The position of the limiting rods can be flexibly adjusted through the cooperation of sleeves, springs, connecting rods and adjusting rods, which facilitates quick disassembly of heat-conducting copper pipes and heat sinks and makes maintenance convenient. It solves the problem that the heat dissipation effect of existing packaging substrates is poor during use. Under long-term use, the internal heat is difficult to dissipate quickly, and excessive heat can easily damage the chip, shorten the service life of the packaging substrate and affect its use. Attached Figure Description

[0015] Figure 1 This is a front view of the structure of this utility model;

[0016] Figure 2 This is a side sectional view of the structure of this utility model;

[0017] Figure 3 This utility model Figure 2 A magnified structural diagram of structure A is shown below;

[0018] Figure 4 This is a three-dimensional view of the structure of the heat-conducting copper tube of this utility model.

[0019] In the diagram: 1. Substrate body; 2. Encapsulation surface; 3. Thermally conductive copper tube; 4. Liquid injection port; 5. Sealing cap; 6. Connecting piece; 7. Heat sink; 8. Fixing plate; 9. Sleeve; 10. Spring; 11. Connecting rod; 12. Adjusting rod; 13. Limiting rod; 14. Slider; 15. Slide groove. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1:

[0022] Please see Figures 1 to 4 In this embodiment, a packaging substrate with a heat dissipation structure includes a substrate body 1, and a packaging surface 2 is provided on the front side of the substrate body 1.

[0023] In this embodiment, a heat-conducting copper pipe 3 is provided on the outer side of the encapsulation surface 2, and a heat sink 7 is provided on the side of the substrate body 1 away from the encapsulation surface 2. The heat sink 7 is made of aluminum alloy and is in contact with the outer wall of the substrate body 1. A connecting assembly is provided between the heat sink 7 and the heat-conducting copper pipe 3. The connecting assembly includes a connecting piece 6 and a fixing plate 8. The connecting piece 6 is fixedly connected to the outer wall of the heat-conducting copper pipe 3 and passes through the inner side of the substrate body 1. The fixing plate 8 is fixedly connected to the side of the heat sink 7, and an adjusting rod 12 is elastically provided on the inner side of the fixing plate 8. A limiting rod 13 is fixedly connected to the side of the adjusting rod 12 near the connecting piece 6. The limiting rod 13 passes through the inner side of the connecting piece 6. The cooperation between the limiting rod 13 and the connecting piece 6 facilitates the fixing of the heat-conducting copper pipe 3 and the heat sink 7.

[0024] The heat-conducting copper tube 3 is in the shape of a rectangular ring. A liquid injection port 4 is provided on one side of the heat-conducting copper tube 3. A sealing cap 5 is threaded on the outside of the liquid injection port 4. The sealing cap 5 can keep the liquid injection port 4 sealed. The liquid injection port 5 makes it easy to add coolant into the heat-conducting copper tube 3, thereby improving the heat dissipation performance.

[0025] It should be noted that there are two connecting pieces 6, which are symmetrically distributed on both sides of the heat-conducting copper pipe 3. There are also two fixing plates 8, which are symmetrically distributed on both sides of the heat sink 7.

[0026] It should be added that one end of the adjusting rod 12 extends to the outside of the fixed plate 8, and the end of the adjusting rod 12 located inside the fixed plate 8 is fixedly connected to the slider 14. The fixed plate 8 has a groove 15 that matches the slider 14. The slider 14 is slidably connected to the inside of the groove 15. The cooperation between the slider 14 and the groove 15 can guide the adjusting rod 12, thereby improving the stability of the structure.

[0027] Example 2:

[0028] Please see Figures 2 to 3 Based on Embodiment 1, a sleeve 9 is fixedly installed inside the fixing plate 8. A spring 10 is installed inside the sleeve 9. A connecting rod 11 is fixedly connected to one end of the spring 10. The connecting rod 11 extends to the outside of the sleeve 9. The side of the adjusting rod 12 away from the limiting rod 13 is fixedly connected to the connecting rod 11. The sleeve 9, spring 10 and connecting rod 11 are designed to facilitate the elastic adjustment of the position of the adjusting rod 12, thereby achieving the elastic adjustment of the position of the limiting rod 13, which is convenient for installation and disassembly.

[0029] The working principle of the above embodiments is as follows:

[0030] In use, this utility model improves the heat dissipation effect of the substrate body 1 by using the heat-conducting copper pipe 3 arranged around the outer periphery of the encapsulation surface 2 and the heat sink 7 arranged on the back of the substrate body 1. The heat-conducting copper pipe 3 and the heat sink 7 can be quickly installed by the cooperation of the connecting piece 6, the fixing plate 8 and the limiting rod 13. The position of the limiting rod 13 can be elastically adjusted by the cooperation of the sleeve 9, the spring 10, the connecting rod 11 and the adjusting rod 12, which facilitates the quick disassembly of the heat-conducting copper pipe 3 and the heat sink 7 and makes maintenance convenient.

[0031] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical methods, and can be implemented as long as they can achieve their beneficial effects. It should be noted that the orientation or positional relationship indicated herein is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging substrate with a heat dissipation structure, comprising a substrate body (1), wherein a packaging surface (2) is provided on the front side of the substrate body (1), characterized in that: A heat-conducting copper pipe (3) is provided on the outer side of the encapsulation surface (2), and a heat sink (7) is provided on the side of the substrate body (1) away from the encapsulation surface (2). A connecting component is provided between the heat sink (7) and the heat-conducting copper pipe (3). The connecting assembly includes a connecting piece (6) and a fixing plate (8). The connecting piece (6) is fixedly connected to the outer wall of the heat-conducting copper pipe (3) and the connecting piece (6) penetrates the inner side of the substrate body (1). The fixing plate (8) is fixedly connected to the side of the heat sink (7) and an adjusting rod (12) is elastically provided on the inner side of the fixing plate (8). A limiting rod (13) is fixedly connected to the side of the adjusting rod (12) near the connecting piece (6) and the limiting rod (13) penetrates the inner side of the connecting piece (6).

2. The packaging substrate with a heat dissipation structure according to claim 1, characterized in that: The heat-conducting copper tube (3) is rectangular and has an injection port (4) on one side. A sealing cap (5) is threaded onto the outside of the injection port (4).

3. The packaging substrate with a heat dissipation structure according to claim 1, characterized in that: The heat sink (7) is made of aluminum alloy and is attached to the outer wall of the substrate body (1).

4. The packaging substrate with a heat dissipation structure according to claim 1, characterized in that: The number of connecting pieces (6) is set to two, and the two connecting pieces (6) are symmetrically distributed on both sides of the heat-conducting copper pipe (3).

5. A packaging substrate with a heat dissipation structure according to claim 1, characterized in that: The number of the fixing plates (8) is set to two, and the two fixing plates (8) are symmetrically distributed on both sides of the heat sink (7).

6. The packaging substrate with a heat dissipation structure according to claim 1, characterized in that: A sleeve (9) is fixedly installed inside the fixed plate (8). A spring (10) is provided inside the sleeve (9). A connecting rod (11) is fixedly connected to one end of the spring (10). The connecting rod (11) extends to the outside of the sleeve (9). The side of the adjusting rod (12) away from the limiting rod (13) is fixedly connected to the connecting rod (11).

7. A packaging substrate with a heat dissipation structure according to claim 1, characterized in that: One end of the adjusting rod (12) extends to the outside of the fixed plate (8). The end of the adjusting rod (12) located inside the fixed plate (8) is fixedly connected to a slider (14). The fixed plate (8) has a groove (15) inside that is adapted to the slider (14). The slider (14) is slidably connected to the inside of the groove (15).

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