High-power thyristor module with cooling system

Abstract

The utility model provides a high-power thyristor module with a cooling system, which belongs to the technical field of electronic devices and structurally comprises a thyristor and a liquid cooling bottom plate fixed below the thyristor, and the thyristor and the liquid cooling bottom plate are jointly packaged in the same packaging shell. A horizontally arranged liquid cooling cavity is formed in the liquid cooling bottom plate, one side of the liquid cooling cavity communicates with a cold liquid inlet pipe, and the other side of the liquid cooling cavity communicates with a cold liquid outlet pipe; non-uniformly distributed turbulent flow columns are distributed in the liquid cooling cavity; a cold liquid flow channel is formed in the liquid cooling cavity in the direction from the cold liquid inlet pipe to the cold liquid outlet pipe; in the horizontal direction of the cold liquid flow channel, the turbulent flow columns are arranged, distributed and unfolded in a matrix form; in the flowing direction of the cold liquid flow channel, rows and columns of the turbulent flow column matrix are arranged in a staggered mode, and the staggered arrangement mode of the rows and the columns is an arrangement mode of staggered arrangement of adjacent rows, staggered arrangement of adjacent columns or mixed staggered arrangement of adjacent rows and columns. Cooling liquid forms a complex flowing path in the bottom plate through the turbulent flow columns, the heat exchange efficiency is improved, and local overheating is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic device technical field, concretely is a kind of high-power thyristor module with cooling system. BACKGROUND

[0002] Generally, high-power thyristor is the core device of high-voltage direct current transmission, flexible alternating current transmission and other power electronic devices, and its reliability is directly related to the safe and reliable operation of the entire power system. During the operation of thyristor, a large amount of heat will be generated due to the action of current and voltage, resulting in the increase of junction temperature. The thyristor converter valve is the core equipment for realizing AC-DC power conversion in the high-voltage direct current transmission system, and is also the main loss source in the DC system. Generally, the loss of the thyristor converter valve in full-power operation accounts for about 20% to 40% of the total equipment loss of the converter station. Therefore, accurate calculation of the converter valve loss is not only the premise and basis for evaluating the operation efficiency of the DC system and equipment, but also the main basis for designing the converter valve and its cooling system. Semiconductor theory and experimental research show that the electrical characteristics and service life of thyristor are directly related to the junction temperature and its change.

[0003] In order to effectively control the junction temperature of thyristor, water cooling method with strong heat dissipation capacity is usually used to remove the heat generated by loss. As the key component for achieving this goal, the water-cooled radiator has become increasingly prominent with the development of power electronic technology and the increasing power density of power semiconductor devices such as thyristor. Traditional cooling methods such as air cooling and natural cooling have been difficult to meet the cooling needs of high-power-density thyristors. Liquid cooling technology has become the key to solving this problem due to its high cooling performance. However, existing liquid cooling devices often have problems such as uneven flow of cooling liquid and low cooling efficiency, which affect the performance and service life of thyristor. SUMMARY

[0004] The technical task of the utility model is to solve the deficiency of prior art, provide a kind of high-power thyristor module with cooling system, adopt the design of the thyristor of integrated non-uniform turbulence column liquid cooling bottom plate, aim at improving the cooling efficiency by innovative non-uniform turbulence structure, guarantee the stable operation of thyristor under high power density.

[0005] The technical scheme of the utility model is realized in the following manner. The high-power thyristor module with cooling system of the utility model comprises a thyristor and a liquid cooling bottom plate fixed below the thyristor, and the two are packaged in the same packaging shell.

[0006] The liquid cooling bottom plate is provided with a liquid cooling cavity arranged horizontally,

[0007] One side of the liquid cooling cavity is connected with a cold liquid inlet pipe, and the other side is connected with a cold liquid outlet pipe.

[0008] The liquid cooling cavity is provided with unevenly distributed turbulence columns;

[0009] Each turbulence column is arranged in a vertical direction,

[0010] In the liquid cooling cavity, a cold liquid flow channel is formed from the cold liquid inlet pipe to the cold liquid outlet pipe;

[0011] In the horizontal direction of the cold liquid flow channel, the turbulence columns are arranged in a matrix form;

[0012] In the flow direction of the cold liquid flow channel, the rows and columns of the turbulence column matrix are staggered with each other, and the row and column staggering adopts a staggering arrangement mode of adjacent row staggering, adjacent column staggering or adjacent row and column mixed staggering.

[0013] In the direction from the upstream to the downstream of the cold liquid flow channel, the diameter of the turbulence column monomer gradually increases in units of rows.

[0014] At the upstream end of the liquid cooling cavity, a flow divider is arranged close to the cold liquid inlet pipe.

[0015] The flow divider is composed of a flow dividing column located in the middle and flow guide plates on both sides of the flow dividing column;

[0016] The flow dividing column is arranged downstream of the pipe opening of the cold liquid inlet pipe;

[0017] The flow guide plates are arranged from both sides of the flow dividing column to the outside of the downstream direction.

[0018] The thyristor and the liquid cooling bottom plate are integrally formed and packaged.

[0019] The packaging shell of the thyristor is filled with a pouring gel;

[0020] The thyristor is a flat plate type thyristor;

[0021] The thyristor is provided with a power terminal, and the power terminal extends upwards and penetrates out of the packaging shell;

[0022] The thyristor is provided with two groups of metal pressing blocks, metal gaskets, silicon controlled rectifier elements and flat plate electrodes, each group is fixedly arranged on the power terminal, and a control electrode is further arranged on one side of the power terminal.

[0023] The turbulence column in the liquid cooling cavity of the liquid cooling bottom plate and the liquid cooling bottom plate adopt an integrated overall structure, and the turbulence column and the liquid cooling bottom plate both adopt a heat dissipation substrate.

[0024] A solder layer is welded between the power terminal and the liquid cooling bottom plate.

[0025] The cold liquid inlet pipe and the cold liquid outlet pipe are connected with a cold liquid circulating system.

[0026] Compared with the prior art, the utility model has the beneficial effects that:

[0027] The utility model discloses a high -power thyristor module with cooling system, establishes a liquid cooling flow channel below the thyristor, utilizes flowing refrigerant medium interwall heat exchange to take away the heat of thyristor, thereby to the heat dissipation of thyristor, reduces the working temperature of thyristor, prolongs the service life.

[0028] The utility model discloses a liquid cooling bottom plate inside is provided with the non-uniform distribution's turbulence column, through the guidance of turbulence column, makes the cooling liquid form complex flow path in the bottom plate inside, enhances the heat exchange efficiency, guarantees cooling liquid even distribution simultaneously, avoids local overheating.

[0029] The utility model greatly promotes the heat dissipation efficiency of thyristor, ensures stable operation under high power density, and avoids local overheating caused by uneven cooling liquid flow.

[0030] In liquid cooling cavity:

[0031] The turbulence column distribution is sparse near the upstream, the space between adjacent turbulence columns is large, and the cold liquid flow rate is relatively slow, so that the cold liquid has enough residence time to absorb the heat transmitted from the thyristor, and mainly absorbs the heat transmitted from the turbulence column;

[0032] The turbulence column distribution is dense near the downstream, the space between adjacent turbulence columns is small, and the cold liquid flow rate is relatively fast, so that the cold liquid carrying heat quickly flows out of the liquid cooling bottom plate, which is beneficial to quickly cooling and heat dissipation of the thyristor.

[0033] The turbulence columns in the liquid cooling bottom plate can be arranged in a matrix and gradually increased in diameter, or can be arranged in a uniform diameter size from upstream to downstream.

[0034] In this way, the maximum heat exchange efficiency is achieved under stable cold liquid circulation flow.

[0035] The utility model has a remarkable effect on improving the heat dissipation efficiency of the thyristor, and can maximize and stably reduce the working temperature of the thyristor, prolong the working and service life of the thyristor.

[0036] The utility model discloses a non-uniform turbulence column design, realizes the uniform distribution of cooling liquid, and avoids local overheating. Its structure is compact, and the integrated design simplifies the installation and maintenance process.

[0037] The configuration of the liquid cooling bottom plate on the thyristor has high heat dissipation efficiency, precise temperature control, good uniformity of temperature distribution and low noise level.

[0038] The liquid cooling bottom plate uses refrigerant liquid as the heat conduction medium, and its heat conduction efficiency and specific heat capacity are much higher than air, so it can more effectively absorb heat from the heat source and dissipate it to the external environment, providing higher heat dissipation efficiency. The liquid cooling system can quickly take away heat, helping to reduce the energy consumption of the equipment and improve its energy use efficiency.

[0039] In addition, the liquid cooling bottom plate can achieve more precise temperature control, helping to prevent overheating of the equipment and ensure its operation within a safe temperature range, thereby prolonging its service life. The heat conduction characteristics of the liquid make the temperature distribution more uniform, helping to improve the stability and reliability of the equipment.

[0040] Compared with traditional air cooling heat dissipation technology, the noise of the liquid cooling bottom plate during operation is significantly reduced, which is very suitable for occasions that require a low-noise environment.

[0041] The high-power thyristor module with a cooling system has the advantages of reasonable design, simple structure, safety and reliability, easy use and maintenance, and good popularization and use value. BRIEF DESCRIPTION OF DRAWINGS

[0042] FIG. 1 is a schematic diagram of the overall structure of the utility model; Figure 1

[0043] FIG. 2 is a schematic diagram of the partial perspective structure of the utility model; Figure 2

[0044] FIG. 3 is a schematic diagram of the top layout structure of the liquid cooling bottom plate of the utility model; Figure 3

[0045] FIG. 4 is a schematic diagram of the three-dimensional layout structure of the liquid cooling bottom plate of the utility model; Figure 4

[0046] FIG. 5 is a schematic diagram of the front view structure of the liquid cooling bottom plate of the utility model; Figure 5

[0047] FIG. 6 is a schematic diagram of the partial perspective structure of the utility model. Figure 6

[0048] The marks in the drawings respectively represent:

[0049] 1, thyristor, 2, liquid cooling bottom plate, 3, packaging shell,

[0050] 4, liquid cooling cavity,

[0051] 5, cold liquid inlet pipe, 6, cold liquid outlet pipe,

[0052] 7, turbulence column,

[0053] 8, cold liquid flow channel,

[0054] ​​​​​​9, row, 10, column,

[0055] 11, shunt, 12, shunt column, 13, deflector,

[0056] 14, filling gel, 15, power terminal, 16, metal briquet, 17, metal gasket, 18, silicon controlled rectifier, 19, flat plate type electrode, 20, control electrode,

[0057] 21, heat dissipation substrate,

[0058] 22, cold liquid circulation system. DETAILED DESCRIPTION

[0059] The high-power thyristor module with a cooling system will be described in detail below in combination with the drawings.

[0060] As shown in the drawings, the high-power thyristor module with a cooling system comprises a thyristor and a liquid cooling bottom plate fixed below the thyristor, and the two are jointly packaged in the same packaging shell.

[0061] The liquid cooling bottom plate is provided with a horizontally arranged liquid cooling cavity,

[0062] One side of the liquid cooling cavity is communicated with a cold liquid inlet pipe, and the other side is communicated with a cold liquid outlet pipe.

[0063] The liquid cooling cavity is distributed with non-uniformly distributed turbulence columns;

[0064] Each turbulence column is arranged in a vertical direction,

[0065] In the liquid cooling cavity, the direction from the cold liquid inlet pipe to the cold liquid outlet pipe constitutes a cold liquid flow channel;

[0066] In the horizontal direction of the cold liquid flow channel, the turbulence columns are arranged and distributed in a matrix form;

[0067] In the flow direction of the cold liquid flow channel, the rows and columns of the turbulence column matrix are staggered with each other, and the row and column staggering adopts an arrangement mode of adjacent row staggered staggering, adjacent column staggered staggering, or adjacent row and column mixed staggered staggering.

[0068] In the direction from the upstream to the downstream of the cold liquid flow channel, the diameter of the turbulence column monomer gradually increases in units of rows.

[0069] At the upstream end of the liquid cooling cavity, close to the cold liquid inlet pipe, a shunt is further arranged.

[0070] The shunt is composed of a shunt column located in the middle and deflector plates on both sides thereof;

[0071] The shunt column is arranged downstream of the pipe opening of the cold liquid inlet pipe;

[0072] The guide vanes spread out from both sides of the flow splitter column to the outside in the downstream direction.

[0073] Both the thyristor and the liquid-cooled base plate are integrally formed.

[0074] The packaging shell of the thyristor is filled with a pouring gel;

[0075] The thyristor adopts a flat plate thyristor;

[0076] The thyristor is configured with power terminals that extend upward and penetrate out of the packaging shell;

[0077] The thyristor is configured with two groups of metal clamps, metal gaskets, silicon-controlled rectifier elements, and flat plate electrodes, each group being fixedly configured on the power terminal, and the power terminal on one side is also provided with a control electrode.

[0078] The flow splitter column in the liquid-cooled cavity of the liquid-cooled base plate adopts an integrated overall structure with the liquid-cooled base plate, and the body of both the flow splitter column and the liquid-cooled base plate adopts a heat dissipation substrate. A solder layer is welded between the power terminal and the liquid-cooled base plate. The cold liquid inlet pipe and the cold liquid outlet pipe are connected with a cold liquid circulation system. The structural characteristics of the utility model are as follows:

[0079] Liquid-cooled base plate structure:

[0080] The base plate is integrally formed with high thermal conductivity materials such as copper or aluminum to ensure good heat conduction performance.

[0081] The internally non-uniformly distributed flow splitter columns are made of the same material as the base plate and are formed through precision machining. The height, diameter, and spacing of the flow splitter columns vary according to a specific rule inside the base plate, forming a complex flow path.

[0082] Non-uniform flow splitter column design:

[0083] The flow splitter columns are arranged in a non-uniform manner inside the base plate, forming multiple flow channels in different directions. This design not only enhances the heat exchange between the cooling liquid and the base plate, but also ensures the uniform distribution of the cooling liquid.

[0084] The height, diameter, and spacing of the flow splitter columns are optimized according to the cooling liquid flow characteristics and heat exchange requirements to achieve the best heat dissipation effect.

[0085] Cooling liquid circulation system:

[0086] The cooling liquid enters through the inlet at one end of the base plate, passes through the complex flow path formed by the flow splitter columns, and flows out from the outlet at the other end, forming a closed cooling loop.

[0087] The cooling liquid circulation system includes a pump, a radiator, a pipeline, and other components for maintaining the circulation and temperature control of the cooling liquid.

[0088] Installation and maintenance:

[0089] The thyristors are fixed on the liquid cooling base by heat-conducting glue or bolts to ensure good thermal contact.

[0090] The cooling liquid circulation system is connected with the liquid cooling base through connecting pipes to form a complete heat dissipation system.

[0091] The turbulence columns are vertically arranged in the liquid cooling cavity, and a gap is arranged between the bottom end of each turbulence column and the bottom surface of the liquid cooling cavity. The gap area constitutes a straight-through space for the straight-through flow of the cooling liquid flow channel, and the area disturbed by the turbulence columns constitutes a turbulence space for the cooling liquid flow channel. The cooperation of the turbulence space and the straight-through space can also enhance the turbulence and heat dissipation.

[0092] The arrangement of the cooling liquid circulation system: the cooling medium is powered by the water pump to flow out of the constant temperature water tank, pass through the switch valve, the flow regulating valve, the electronic turbine flowmeter and the pressure sensor in sequence, enter the liquid cooling base from the cooling liquid inlet pipe, and then flow back to the constant temperature water tank through the cooling liquid outlet pipe after being heated by the liquid cooling base and the turbulence columns. The constant temperature water tank reduces the return cooling medium to the initial temperature. A parallel cooling liquid cooling system can also be configured to cool the overheated cooling liquid to ensure the liquid cooling effect.

Claims

1. A high-power thyristor module with a cooling system, characterized in that... It includes a thyristor and a liquid-cooled base plate fixed below the thyristor, both of which are encapsulated in the same package housing; The liquid-cooled base plate has horizontally arranged liquid-cooled cavities. One side of the liquid cooling chamber is connected to a cold liquid inlet pipe, and the other side is connected to a cold liquid outlet pipe; The liquid cooling cavity contains non-uniformly distributed turbulence columns; Each baffle column is installed vertically. Inside the liquid cooling chamber, the direction from the liquid inlet pipe to the liquid outlet pipe forms the liquid flow channel; In the horizontal direction of the coolant flow channel, the turbulence columns are arranged and distributed in a matrix form; In the flow direction of the coolant channel, the rows and columns of the turbulence column matrix are arranged in an alternating manner, with the alternation of adjacent rows, adjacent columns, or adjacent rows and columns being mixed and alternating.

2. The high-power thyristor module with a cooling system according to claim 1, characterized in that: From upstream to downstream of the coolant flow channel, the turbulence columns are arranged in rows, with the diameter of each individual turbulence column increasing progressively.

3. The high-power thyristor module with a cooling system according to claim 1, characterized in that: At the upstream end of the liquid cooling chamber, near the liquid inlet pipe, there is also a distributor.

4. The high-power thyristor module with a cooling system according to claim 3, characterized in that: The splitter consists of a split column in the middle and guide plates on both sides of it; The flow divider column is located downstream of the inlet of the cold liquid inlet pipe; The guide vanes extend outwards from both sides of the flow divider towards the downstream direction.

5. The high-power thyristor module with a cooling system according to claim 1, characterized in that: The thyristor and the liquid-cooled base plate are integrated into a single package.

6. The high-power thyristor module with a cooling system according to claim 1, characterized in that: The thyristor's packaging housing is filled with a gel. The thyristor is a planar thyristor; The thyristor is equipped with a power terminal that extends upward and penetrates the package housing; The thyristor is equipped with two sets of metal pressure blocks, metal gaskets, silicon controlled rectifier elements, and flat plate electrodes. Each set is fixedly configured on the power terminal, and a control electrode is also provided on one side of the power terminal.

7. The high-power thyristor module with a cooling system according to claim 1, characterized in that: The turbulence column inside the liquid cooling cavity of the liquid cooling base plate adopts an integrated structure with the liquid cooling base plate. Both the turbulence column and the liquid cooling base plate are made of heat dissipation substrate.

8. The high-power thyristor module with a cooling system according to claim 1, characterized in that: A solder layer is welded between the power terminals and the liquid-cooled base plate.

9. The high-power thyristor module with a cooling system according to claim 1, characterized in that: The coolant inlet pipe and coolant outlet pipe are connected to a coolant circulation system.

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