Resonator dispensing structure

Abstract

The utility model relates to a wafer base assembled with a wafer, in particular to a wafer base for fixing the wafer, wherein dispensing positions of the wafer base are distributed diagonally. According to the resonator dispensing structure, a wafer base comprises a wafer carrying platform, and the resonator dispensing structure is characterized in that the wafer carrying platform comprises a first wafer carrying platform and a second wafer carrying platform, and the first wafer carrying platform and the second wafer carrying platform are distributed diagonally; and conductive silver adhesives are adhered to the first wafer carrying platform and the second wafer carrying platform. According to the wafer pedestal provided by the utility model, the two wafer carrying platforms in which the conductive silver adhesives are adhered are designed to be in a diagonal relationship, so that the wafers adhered on the conductive silver adhesives are in a more stable fixed connection relationship with the wafer pedestal; according to the resonator dispensing structure, the wafer can still be fixed on the wafer base without falling off or breaking the electrical connection relation between the wafer base and the wafer base when vibration occurs in the outside.

Description

Technical Field

[0001] This utility model relates to a dispensing structure on a wafer substrate in which a wafer is assembled within a resonator. Background Technology

[0002] A resonator is an electronic component that generates a resonant frequency. When a resonator is installed in a vehicle such as a car, the high-intensity, high-frequency vibrations generated during the car's movement can cause the chip on the resonator to detach from its electrical connection to the chip substrate. To fix the chip to the substrate, a common method is to adhere conductive silver paste to the substrate, with a mounting bracket at the other end. The chip is then directly fixed to the substrate by the adhesive of the conductive silver paste, which electrically connects the chip's electrodes to the substrate's contacts. However, this method means that when external vibrations occur, the end of the chip mounted on the mounting bracket will also be affected, causing the chip to vibrate relative to the substrate. This can lead to the chip detaching from the substrate, making it impossible to maintain the electrical connection, and rendering the vehicle, such as the car, equipped with the resonator unusable. Utility Model Content

[0003] The chip base provided by this utility model has two chip mounting platforms with conductive silver paste attached therein arranged in a diagonal relationship. This design allows the chips attached to the conductive silver paste to obtain a more stable fixed connection with the chip base. This ensures that when there is external vibration, the chips can still be fixed to the chip base without falling off or breaking the electrical connection. This is a resonator dispensing structure.

[0004] This utility model discloses a resonator dispensing structure. The wafer base includes a wafer mounting platform for mounting wafers. The wafer mounting platform comprises a first wafer mounting platform and a second wafer mounting platform, which are diagonally distributed. Conductive silver paste is adhered to both the first and second wafer mounting platforms. This diagonal distribution of the conductive silver paste on the wafer base ensures that the fixing points between the wafer and the wafer base are also diagonally distributed, providing a more stable mounting structure for the wafer. When excessive external vibration occurs, the vibration force is transmitted to the wafer base and then to the wafer. Because the fixing points are diagonally distributed, the vibration force is distributed evenly across the two corners of the wafer, further weakening the vibration and making it difficult for the wafer to detach from the wafer base.

[0005] Preferably, both the first and second wafer mounting platforms are provided with grooves, and the conductive silver paste is placed on the grooves. When the wafer is mounted on the wafer base, the conductive silver paste on the wafer mounting platform is pressed by the wafer, and the conductive silver paste adhering to the groove is squeezed to the inside of the groove. This avoids the situation where excessive conductive silver paste is squeezed out of the wafer mounting platform due to the wafer's low mounting height, which could cause the wafer to easily fall off or result in poor conductivity.

[0006] Preferably, the wafer substrate is further provided with a sealing ring, which is tightly attached to the lower end face of the upper cover when the wafer substrate is covered with a top cover. The top of the sealing ring may be coated with adhesive. When the wafer substrate is covered with a top cover, the tight fit between the top cover and the sealing ring can create a sealed space inside the wafer substrate, preventing external air from contaminating the wafer and the wafer mounting platform located inside the wafer substrate.

[0007] Compared with existing technologies, the fixing points between the wafer and the wafer base are diagonally distributed, thereby providing a structure that can fix the wafer and the wafer base together, so that the wafer is less likely to vibrate or wobble relative to the wafer base when subjected to external vibration. Attached Figure Description

[0008] Figure 1 This is a structural diagram of a wafer base 1 for a resonator dispensing structure according to this utility model.

[0009] Figure 2 This is a structural diagram of a resonator dispensing structure according to the present invention, in which the wafer 4 is installed in the wafer base 1.

[0010] Reference numerals: 1-Chip base, 21-First chip mounting platform, 22-Second chip mounting platform, 23-Third chip mounting platform, 3-Conductive silver paste, 4-Chip, 5-Sealing ring. Detailed Implementation

[0011] The present invention will now be described in further detail with reference to the accompanying drawings.

[0012] refer to Figure 1-2 This utility model discloses a resonator dispensing structure. The wafer base 1 includes a wafer mounting platform for mounting wafers. The wafer mounting platform comprises a first wafer mounting platform 21 and a second wafer mounting platform 22, which are diagonally distributed. Both the first and second wafer mounting platforms 21 and 22 are coated with conductive silver paste 3. Additionally, there may be other wafer mounting platforms on the wafer base 1 without conductive silver paste 3, which are collectively referred to as a third wafer mounting platform 23.

[0013] In this invention, two diagonally opposite wafer mounting platforms are selected on the wafer base 1, and grooves for storing conductive silver paste are machined on them. After the conductive silver paste is filled, the wafer 4 is "attached" to the inside of the wafer base 1. Two diagonally opposite corners of the wafer 4 are bonded to the conductive silver paste as fixed connection points with the wafer base 1. When subjected to external vibration, the vibration force ultimately transmitted to the wafer can be greatly reduced, making it difficult for the wafer to loosen its fixed connection with the wafer base.

[0014] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present utility model, and these all fall within the protection scope of the present utility model.

Claims

1. A resonator dispensing structure, comprising a wafer base (1) and a wafer (4), wherein the wafer base (1) is covered with a top cover, the wafer base (1) includes a wafer mounting platform, and the wafer (4) is mounted on the wafer mounting platform, characterized in that, The wafer mounting platform includes a first wafer mounting platform (21) and a second wafer mounting platform (22). The first wafer mounting platform (21) and the second wafer mounting platform (22) are diagonally distributed. Both the first wafer mounting platform (21) and the second wafer mounting platform (22) are coated with conductive silver paste (3).

2. The resonator dispensing structure according to claim 1, characterized in that, Both the first wafer mounting platform (21) and the second wafer mounting platform (22) are provided with grooves, and the conductive silver paste (3) is placed on the grooves.

3. The resonator dispensing structure according to claim 1, characterized in that, The wafer base (1) is also provided with a sealing ring (5), which is in close contact with the lower end face of the upper cover when the wafer base (1) is covered with a top cover.

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