Rapid cooling device of SMT reflow soldering machine

Abstract

The utility model discloses a rapid cooling device of an SMT reflow soldering machine, and relates to the technical field of soldering machine cooling devices. The device comprises a base, a lower air outlet box and a lifting mechanism are fixedly installed on the top face of the base, and an electric conveying roller is fixedly installed on the top face of the lower air outlet box. According to the utility model, the lower air outlet box is matched with the air blowing mechanism, air cooling is carried out on the PCB after reflow soldering from the upper side and the lower side, and the liquid storage box is driven to ascend and descend in cooperation with the lifting mechanism, so that the flexible high-temperature-resistant film on the bottom surface of the liquid storage box is flexibly attached to the surface of the high-temperature PCB; the liquid storage tank and the flexible high-temperature-resistant film are arranged, so that cooling liquid contained in the liquid storage tank and the flexible high-temperature-resistant film in a sealed mode makes flexible contact with the surface of the PCB and is blocked by the flexible high-temperature-resistant film, the cooling liquid can rapidly absorb heat of the PCB, the liquid cooling function is achieved while the waterproof function is achieved, the air cooling function and the liquid cooling function are achieved at the same time, cooling of the PCB is more efficient, and the service life of the PCB is prolonged. The subsequent processing of the PCB can be carried out more quickly, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of welding machine cooling devices, specifically to a rapid cooling device for an SMT reflow soldering machine. Background Technology

[0002] SMT reflow soldering machines are devices that provide a heating environment to melt solder paste, thereby reliably bonding surface mount components and PCB pads together through the solder paste alloy. It is an important step in the SMT process, used to complete the soldering of surface mount components. After the PCB board is soldered by the SMT reflow soldering machine, the PCB board temperature is high, so a cooling device is needed to quickly cool the PCB board to allow for a quick transition to subsequent PCB board processing steps.

[0003] Since the electronic components on the PCB board cannot come into contact with water, air cooling is currently used to cool them. However, the cooling efficiency achieved by air cooling alone is very limited, especially in the hot summer. Therefore, air cooling alone has the problem of long cooling time, and the cooling efficiency needs to be further improved.

[0004] Therefore, a rapid cooling device for SMT reflow soldering machines is proposed. Utility Model Content

[0005] The purpose of this utility model is to provide a rapid cooling device for an SMT reflow soldering machine in order to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0007] A rapid cooling device for an SMT reflow soldering machine includes a base. A lower air outlet box and a lifting mechanism are fixedly installed on the top surface of the base. An electric conveyor roller is fixedly installed on the top surface of the lower air outlet box. A blower mechanism is fixedly connected to the side of the lower air outlet box. The air outlet of the blower mechanism is located directly above the electric conveyor roller. A liquid storage tank is fixedly installed on the surface of the lifting mechanism. The liquid storage tank includes a box body. A flexible high-temperature resistant film made of polyimide material is fixedly installed on the bottom surface of the inner wall of the box body. A stirring mechanism is provided on the top wall surface of the box body.

[0008] Furthermore, the electric conveying roller includes an electric drive mechanism and roller bodies, wherein there are several roller bodies with uniformly distributed gaps.

[0009] Furthermore, the blower mechanism includes a side box, which is fixedly installed on the side of the lower air outlet box and communicates with the interior of the lower air outlet box. A fan body and a dustproof plate are fixedly installed on the side wall surface of the side box, and the dustproof plate overlaps with the fan body. An upper air outlet box is fixedly installed on the top surface of the side box, and the upper air outlet box is located directly above the electric conveyor roller. Both the bottom wall of the upper air outlet box and the top wall of the lower air outlet box have through holes. The side box, the upper air outlet box, and the lower air outlet box are interconnected. There are two blower mechanisms, which are respectively located on the front and rear sides of the liquid storage tank.

[0010] Furthermore, the lifting mechanism includes columns, which are fixedly installed on the top surface of the base. There are two columns arranged symmetrically on the left and right sides. Lifting grooves are opened on the opposite surfaces of the two columns. Lifting sliders are slidably installed on the inner wall surface of the lifting grooves. A sliding rod is fixedly installed between the top and bottom surfaces of the inner wall of one side of the lifting groove. A first motor is fixedly installed on the top surface of the column on the other side. A threaded rod is fixedly connected to the output end of the first motor. The threaded rod is rotatably connected to the inner wall surface of the column. The lifting slider on one side is slidably fitted onto the surface of the sliding rod. The lifting slider on the other side is threaded onto the surface of the threaded rod. The housing is fixedly installed between the opposite surfaces of the two lifting sliders.

[0011] Furthermore, an inlet pipe and an outlet pipe are fixedly installed on the top surface of the housing.

[0012] Furthermore, the stirring mechanism includes a second motor, which is fixedly installed on the top surface of the housing. A rotating shaft is fixedly connected to the output end of the second motor, and the rotating shaft is rotatably connected to the top wall of the housing. A stirring paddle is fixedly installed on the surface of the rotating shaft.

[0013] The beneficial effects of this utility model are as follows:

[0014] By coordinating the bottom air box and the blower mechanism, the reflow soldered PCB board is cooled by air from both the top and bottom. Simultaneously, the lifting mechanism moves the liquid reservoir up and down, allowing the flexible high-temperature resistant film on the bottom of the reservoir to flexibly adhere to the high-temperature PCB board surface. This allows the coolant, contained within the reservoir and the flexible high-temperature resistant film, to flexibly contact the PCB board surface while being blocked by the film. The coolant can quickly absorb the heat from the PCB board, achieving liquid cooling while being waterproof. This combination of air cooling and liquid cooling functions makes the cooling of the PCB board more efficient, allowing for faster subsequent processing and improved production efficiency. The stirring mechanism agitates the coolant inside the tank, maintaining a high degree of temperature uniformity and preventing temperature fluctuations that could affect the cooling effect. Attached Figure Description

[0015] Figure 1 This is an isometric view of the three-dimensional structure of this utility model;

[0016] Figure 2 This is a cross-sectional view of the blower mechanism of this utility model;

[0017] Figure 3 This is a three-dimensional sectional view of the present invention;

[0018] Reference numerals: 1. Base; 2. Lower air outlet box; 3. Electric conveyor roller; 4. Blower mechanism; 401. Side box; 402. Fan body; 403. Dustproof sheet; 404. Upper air outlet box; 5. Lifting mechanism; 501. Column; 502. Lifting groove; 503. Lifting slider; 504. Slide rod; 505. First motor; 506. Threaded rod; 6. Liquid storage tank; 601. Box body; 602. Liquid inlet pipe; 603. Liquid outlet pipe; 7. Flexible high-temperature resistant membrane; 8. Stirring mechanism; 801. Second motor; 802. Rotating shaft; 803. Stirring paddle; 9. Temperature sensor. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0023] In the description of the embodiments of this utility model, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] like Figures 1 to 3 As shown, a rapid cooling device for an SMT reflow soldering machine includes a base 1. A lower air outlet box 2 and a lifting mechanism 5 are fixedly installed on the top surface of the base 1. An electric conveying roller 3 is fixedly installed on the top surface of the lower air outlet box 2. A blower mechanism 4 is fixedly connected to the side of the lower air outlet box 2. The air outlet of the blower mechanism 4 is located directly above the electric conveying roller 3. A liquid storage tank 6 is fixedly installed on the surface of the lifting mechanism 5. The liquid storage tank 6 includes a box body 601. A flexible high-temperature resistant film 7 is fixedly installed on the bottom of the inner wall surface of the box body 601. The flexible high-temperature resistant film 7 is made of polyimide material. A stirring mechanism 8 is provided on the top wall surface of the box body 601.

[0025] More specifically, the bottom air box 2 and the blower mechanism 4 work together to air cool the reflow soldered PCB board from both the top and bottom. At the same time, the lifting mechanism 5 moves the liquid storage tank 6 up and down, so that the flexible high-temperature resistant film 7 on the bottom of the liquid storage tank 6 flexibly adheres to the surface of the high-temperature PCB board. This allows the coolant contained in the liquid storage tank 6 and the flexible high-temperature resistant film 7 to flexibly contact the PCB board surface while being blocked by the flexible high-temperature resistant film 7. The coolant can quickly absorb the heat of the PCB board, achieving liquid cooling while being waterproof. It combines air cooling and liquid cooling functions, making the cooling of the PCB board more efficient and allowing for faster subsequent processing of the PCB board, thus improving production efficiency. The stirring mechanism 8 agitates the coolant in the tank 601, keeping the temperature of the coolant highly uniform and preventing the temperature of the coolant from fluctuating and affecting the cooling effect.

[0026] The electric conveyor roller 3 includes an electric drive mechanism and roller bodies, and the number of roller bodies is several with uniformly distributed gaps.

[0027] Specifically, the rollers with uniformly distributed gaps allow the air blown by the blower mechanism 4 to pass through the gaps and cool the PCB board from below. At the same time, the rollers are driven to rotate by an electric drive mechanism, which can automatically transfer the high-temperature PCB board.

[0028] The blower mechanism 4 includes a side box 401, which is fixedly installed on the side of the lower air outlet box 2 and communicates with the interior of the lower air outlet box 2. A fan body 402 and a dustproof plate 403 are fixedly installed on the side wall surface of the side box 401. The dustproof plate 403 overlaps with the fan body 402. An upper air outlet box 404 is fixedly installed on the top surface of the side box 401. The upper air outlet box 404 is located directly above the electric conveyor roller 3. The bottom wall of the upper air outlet box 404 and the top wall of the lower air outlet box 2 are both provided with through holes. The side box 401, the upper air outlet box 404 and the lower air outlet box 2 are interconnected. There are two blower mechanisms 4, which are respectively located on the front and rear sides of the liquid storage tank 6.

[0029] Specifically, when the fan body 402 is turned on, air is blown from the outside into the side box 401 and transmitted to the upper air box 404 and lower air box 2, which are connected to the side box 401. Finally, the air is blown out through the through holes on the bottom surface of the upper air box 404 and the through holes on the top surface of the lower air box 2, so as to cool the high-temperature PCB board from the top and bottom sides, which is more efficient. At the same time, the dustproof sheet 403 prevents the outside air from being blown onto the PCB board surface during the blowing process, thus avoiding affecting the function of the electronic components on the PCB board surface.

[0030] The lifting mechanism 5 includes two columns 501, which are fixedly installed on the top surface of the base 1. The columns 501 are arranged symmetrically on the left and right. Lifting grooves 502 are opened on the opposite surfaces of the two columns 501. Lifting sliders 503 are slidably installed on the inner wall surface of the lifting grooves 502. A sliding rod 504 is fixedly installed between the top and bottom surfaces of the inner wall of one side of the lifting groove 502. A first motor 505 is fixedly installed on the top surface of the other column 501. A threaded rod 506 is fixedly connected to the output end of the first motor 505. The threaded rod 506 is rotatably connected to the inner wall surface of the column 501. The lifting slider 503 on one side is slidably fitted onto the surface of the sliding rod 504. The lifting slider 503 on the other side is threaded onto the surface of the threaded rod 506. The housing 601 is fixedly installed between the opposite surfaces of the two lifting sliders 503.

[0031] Specifically, the output end of the first motor 505 drives the threaded rod 506 to rotate, causing the lifting slider 503, whose threads are installed on the surface of the threaded rod 506 and slidably installed on the inner wall surface of the lifting groove 502, to rise and fall. This causes the housing 601, which is fixedly installed on the surface of the lifting slider 503, and the lifting slider 503 on the other side to rise and fall synchronously. When the housing 601 descends, the flexible high-temperature resistant film 7 can be attached to the surface of the PCB board for liquid cooling. During the rising and falling of the housing 601, the lifting slider 503 on one side slides up and down along the surface of the slide bar 504. The lateral support and limit of the slide bar 504 for the lifting slider 503 further ensures the stability of the rising and falling of the housing 601.

[0032] An inlet pipe 602 and a drain pipe 603 are fixedly installed on the top surface of the housing 601. The inlet pipe 602 and the drain pipe 603 are connected to the external water supply and drainage equipment. A temperature sensor 9 is fixedly installed on the inner wall surface of the housing 601. The temperature sensor 9 is electrically connected to the external control equipment.

[0033] Specifically, the temperature sensor 9 senses the temperature of the coolant contained in the housing 601. When the temperature of the coolant rises to the set value after repeated use, the cooling effect is poor. At this time, the external control device will send a signal to the water supply and drainage device to discharge the coolant in the housing 601 through the drain pipe 603, and then send the coolant with a lower temperature into the housing 601 through the inlet pipe 602 to realize timely replacement of the coolant and ensure the liquid cooling effect.

[0034] The stirring mechanism 8 includes a second motor 801, which is fixedly installed on the top surface of the housing 601. The output end of the second motor 801 is fixedly connected to a rotating shaft 802, which is rotatably connected to the top wall of the housing 601. A stirring paddle 803 is fixedly installed on the surface of the rotating shaft 802.

[0035] Specifically, since the coolant on the lower side of the housing 601 is close to the surface of the high-temperature PCB board, the coolant temperature on the lower side is higher. The output of the second motor 801 drives the rotating shaft 802 and the stirring paddle 803 to rotate, which stirs the coolant in the housing 601, so that the temperature of the coolant is kept more uniform. This not only improves the reliability of the temperature value detected by the temperature sensor 9, but also avoids the coolant temperature from being higher at the top and lower at the bottom, which would affect the cooling effect.

[0036] In summary: By cooperating with the bottom air box 2 and the blower mechanism 4, the PCB board after reflow soldering is cooled by air from both the top and bottom. At the same time, the lifting mechanism 5 moves the liquid storage tank 6 up and down, so that the flexible high-temperature resistant film 7 on the bottom surface of the liquid storage tank 6 flexibly adheres to the surface of the high-temperature PCB board. This allows the coolant contained in the liquid storage tank 6 and the flexible high-temperature resistant film 7 to flexibly contact the surface of the PCB board while being blocked by the flexible high-temperature resistant film 7. The coolant can quickly absorb the heat of the PCB board, achieving liquid cooling while being waterproof. It combines air cooling and liquid cooling functions, making the cooling of the PCB board more efficient and allowing for faster subsequent processing of the PCB board, thus improving production efficiency. The stirring mechanism 8 agitates the coolant in the tank 601, keeping the temperature of the coolant highly uniform and avoiding temperature fluctuations that would affect the cooling effect.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A rapid cooling device for an SMT reflow soldering machine, characterized in that, The system includes a base (1), on which a lower air outlet box (2) and a lifting mechanism (5) are fixedly installed on the top surface. An electric conveying roller (3) is fixedly installed on the top surface of the lower air outlet box (2). A blower mechanism (4) is fixedly connected to the side of the lower air outlet box (2). The air outlet of the blower mechanism (4) is located directly above the electric conveying roller (3). A liquid storage tank (6) is fixedly installed on the surface of the lifting mechanism (5). The liquid storage tank (6) includes a box body (601). A flexible high-temperature resistant membrane (7) is fixedly installed on the bottom of the inner wall surface of the box body (601). The flexible high-temperature resistant membrane (7) is made of polyimide material. A stirring mechanism (8) is provided on the top wall surface of the box body (601).

2. The rapid cooling device for an SMT reflow soldering machine according to claim 1, characterized in that, The electric conveyor roller (3) includes an electric drive mechanism and roller bodies, and the number of roller bodies is several and the gaps are evenly distributed.

3. The rapid cooling device for an SMT reflow soldering machine according to claim 2, characterized in that, The blower mechanism (4) includes a side box (401), which is fixedly installed on the side of the lower air outlet box (2) and communicates with the interior of the lower air outlet box (2). A fan body (402) and a dustproof plate (403) are fixedly installed on the side wall surface of the side box (401). The dustproof plate (403) overlaps with the fan body (402). An upper air outlet box (404) is fixedly installed on the top surface of the side box (401). The upper air outlet box (404) is located directly above the electric conveyor roller (3). The bottom wall of the upper air outlet box (404) and the top wall of the lower air outlet box (2) are both provided with through holes. The side box (401), the upper air outlet box (404) and the lower air outlet box (2) are interconnected. There are two blower mechanisms (4), which are respectively located on the front and rear sides of the liquid storage tank (6).

4. The rapid cooling device for an SMT reflow soldering machine according to claim 1, characterized in that, The lifting mechanism (5) includes two columns (501) fixedly installed on the top surface of the base (1). The columns (501) are arranged symmetrically on the left and right sides. Each of the two columns (501) has a lifting groove (502) on its opposite side. A lifting slider (503) is slidably installed on the inner wall surface of the lifting groove (502). A sliding rod (504) is fixedly installed between the top and bottom surfaces of the inner wall of one side of the lifting groove (502). The other column (501)... 1) A first motor (505) is fixedly installed on the top surface. A threaded rod (506) is fixedly connected to the output end of the first motor (505). The threaded rod (506) is rotatably connected to the inner wall surface of the column (501). One side of the lifting slider (503) is slidably fitted onto the surface of the slide rod (504). The other side of the lifting slider (503) is threaded onto the surface of the threaded rod (506). The box (601) is fixedly installed between the opposite surfaces of the two lifting sliders (503).

5. The rapid cooling device for an SMT reflow soldering machine according to claim 1, characterized in that, The top surface of the housing (601) is fixedly equipped with an inlet pipe (602) and a drain pipe (603), which are connected to external water supply and drainage equipment. A temperature sensor (9) is fixedly installed on the inner wall surface of the housing (601), and the temperature sensor (9) is electrically connected to external control equipment.

6. The rapid cooling device for an SMT reflow soldering machine according to claim 5, characterized in that, The stirring mechanism (8) includes a second motor (801), which is fixedly installed on the top surface of the box (601). The output end of the second motor (801) is fixedly connected to a rotating shaft (802), which is rotatably connected to the top wall of the box (601). A stirring paddle (803) is fixedly installed on the surface of the rotating shaft (802).

Images